JP3447230B2 - Power converter - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power converter for supplying a variable frequency power source to an electric motor.

[0002]

2. Description of the Related Art Generally, a power converter for supplying a variable frequency power source to an electric motor converts a direct current power source into an alternating current having a predetermined frequency and supplies the alternating current to a load motor. When the DC power source cannot be obtained directly, a converter device is provided to obtain the DC power source from the AC power source.

In FIG. 8, the converter device 2 changes the power supply from the three-phase AC power supply 1 into a DC power supply, and the inverter device 4 converts the DC power supply into electric power of a predetermined frequency to drive the electric motor 5.
It is a block diagram of the power converter device which drives.

In the converter device 2, the R phase from the three-phase AC power supply 1 is used as a connection point between the semiconductor elements 2U and 2X, the S phase is used as a connection point between the semiconductor elements 2V and 2Y, and the T phase is used. The three-phase alternating current is converted into direct current by inputting to the connection points of the semiconductor element 2W and the semiconductor element 2Z, respectively. The direct current converted by the converter device 2 is taken out to the P bus and the N bus, smoothed by the smoothing capacitor 3 connected to the P bus and the N bus, and input to the inverter device 4.

In the inverter device 4, the converter device 2
Input the direct current converted by the P and N buses,
The U phase is obtained from the connection point between the semiconductor elements 4U and 4X, and the V phase is obtained from the connection point between the semiconductor elements 4V and 4Y.
The W phase is extracted from the connection point between the semiconductor element 4W and the semiconductor element 4Z, and is output to the electric motor 5 as a load. As the semiconductor element, for example, IG
BT is used.

Here, each of the semiconductor elements 2U to 2Z, 4
U to 4Z are generally composed of a plurality of semiconductor elements,
Various connection configurations have been adopted via connection conductors. FIG. 9 is an example of a configuration diagram of a semiconductor element (P-side element) 4U and a semiconductor element (N-side element) 4X for one phase of the inverter device 4. The semiconductor elements 4U and 4X shown in FIG.
Four semiconductor elements 4U1 to 4U4 and 4X1 to 4 respectively
It shows the one configured by connecting X4 in series.

Each of the semiconductor devices 4U1-4U4, 4X1
4X4 has an emitter terminal E, a collector terminal C, and a gate terminal G. In particular, in FIG. 9, a semiconductor element having a complementary structure in which the emitter terminal E and the collector terminal C are arranged in reverse to each other. Is shown.

That is, the semiconductor element (P-side element) 4U1
4U4 has an emitter terminal E adjacent to the gate terminal G, while the semiconductor elements (N-side elements) 4X1 to 4X4 have a collector terminal C adjacent to the gate terminal G. Therefore, these complementary semiconductor devices 4U and 4X can be arranged at the positions where the emitter terminal E and the collector terminal C face each other, so that the U-phase bus bar (load) which is taken out from the connection point between the P-side element 4U and the N-side element 4X. The busbar has an advantage that it can be taken out by one busbar. Also, the P bus is P
The emitter terminals E of the side elements 4U1 to 4U4 are connected in series and taken out, and the N bus bar is taken out by connecting the collector terminals C of the N side elements 4X1 to 4X4 in series.

FIG. 10 is an explanatory view of the case where the conventional power converter is housed in a box. Semiconductor elements 2U to 2Z of converter device 2 and semiconductor element 4 of inverter device 4
U-4Z are housed in the box body 6, and the semiconductor elements 2U-
The smoothing capacitor 3 is arranged below the 2Z and 4U to 4Z. A cooling device 7 is provided on the top of the box body 6 so as to supply a cooling medium to the semiconductor elements 2U to 2Z and 4U to 4Z to cool them. Also, the box 6
Air inlets 8 are provided in the upper and lower parts of the fan so that the heat from the smoothing condenser 3 and the heat from the cooling device 7 are discharged to the outside by the fan 9.

[0010]

By the way, in a power converter using a semiconductor device having a complementary structure as shown in FIG. 9, a U-phase bus bar is located in the central portion, and a P bus bar and an N bus bar are located on both sides thereof. Therefore, the P bus bar and the N bus bar are separated from each other, and the inductance increases.

Further, two kinds of semiconductor elements having different arrangements of the emitter terminal E and the collector terminal C are required, and an appropriate semiconductor element must be selected and arranged without error during the connection work. .

Since the smoothing capacitor 3 is installed in the lower part of the box body 6, a space for installing the smoothing capacitor 3 is required in the lower part of the box body 6, which not only increases the height of the power converter but also smooths the capacitor. The bus bar for connection from 3 to the semiconductor element becomes long. Since the bus bar becomes longer, the inductance also increases, and in order to suppress it, it is necessary to strengthen the snubber circuit and increase the size of the bus bar.

An object of the present invention is to obtain a power conversion device which can reduce the inductance and can also reduce the size of the device itself.

[0014]

According to a first aspect of the present invention, there is provided a power conversion device in which a plurality of semiconductor elements are connected in parallel to form a P-side element and an N-side element of each phase in an inverter device or a converter device. , A power conversion device configured by connecting the P-side element and the N-side element in series .
There are, connected to the collector terminal of each of the P-side element P bus of the DC bus, connects the emitter terminal of each of the N-side element to the N bus of the DC bus, Kore of each of the P-side element
Load busbars are taken out from the connecting conductors connecting the emitter terminals of the P-side elements and the collector terminals of the N-side elements across the junction terminals, and the P busbars and the N busbars are arranged in close proximity to each other. It is characterized by

In the power conversion device according to the first aspect of the present invention, the P side of each P side element is crossed over the collector terminal of each P side element.
Connect the emitter terminal of the element and the collector terminal of the N-side element
The load busbar is taken out from the connecting conductor, and the P busbar and the N busbar of the direct current busbar to which the P-side element and the N-side element of each phase connected in series in the inverter device or the converter device are connected are closely and parallel to each other. Will be placed. Therefore, comp
When using the same element that is not a
Also, the P bus bar and the N bus bar can be configured to cancel out the magnetic flux and reduce the inductance .

The power converter according to the invention of claim 2 is
In the invention of claim 1, a branch P provided for branching from the P bus bar for connecting to a positive pole of a smoothing capacitor.
A bus bar, and a branch N bus branching from the N bus and connected to the negative pole of the smoothing capacitor, wherein the branch P bus and the branch N bus are closely arranged in parallel. Is characterized by.

In the power converter according to the invention of claim 2, in addition to the function of the invention of claim 1, a branch P bus branching from the P bus and a branch N branching from the N bus are provided. The busbars are arranged closely and in parallel. Therefore,
The branch P bus and the branch N bus cancel each other's magnetic flux to reduce the inductance.

The power converter according to the invention of claim 3 is
One form of each phase P-side device and the N-side element in the inverter device or the converter device with a semiconductor element, conductive configured the P-side device and the N-side element connected in series
In the force converter, the collector terminal of the P-side element is connected to the P-bus of the DC bus, the emitter terminal of the N-side element is connected to the N-bus of the DC bus, and the collector of the P-side element is connected.
Across the terminals preparative load line from the connecting conductors for connecting the collector terminal of the emitter terminal and the N-side element of the P-side element
Ri out, characterized by being arranged in parallel in close proximity to said P bus and the N bus.

In the power converter according to the invention of claim 3, the P-side element and the N-side element of each phase in the inverter device or the converter device are formed as a single semiconductor element, and the single-configuration inverter device is formed. Alternatively, the collector end of the P-side element in the converter device
The emitter terminal of the P-side element and the collector of the N-side element across the child
The load busbar from the connecting conductor that connects the
In addition, the P busbar and the N busbar in this single-configuration inverter device or converter device are arranged in close proximity to each other. Therefore, it is not a complementary element
Even in the case of using the device, the P bus and the N bus to reduce the inductance cancel the magnetic flux from one another configuration
Can be

A power conversion device according to a fourth aspect of the invention is
In the invention according to claim 3, a branch P bus bar provided at an end of the P bus bar or branched to connect to a positive pole of a smoothing capacitor, and an end bus of the N bus bar or provided at a branch of the smoothing capacitor. It has a branch N bus bar for connecting to the negative pole, and the branch P bus bar and the branch N bus bar are arranged in close proximity to each other and in parallel.

In the electric power converter according to the invention of claim 4, in addition to the operation of the invention of claim 3, the branch P bus bar provided at the end of the P bus bar or at the branch is provided, and the end of the N bus bar or at the branch of the N bus bar. And the branch N bus bar provided in the vicinity are arranged in parallel with each other. Therefore, the branch P bus and the branch N bus cancel each other's magnetic flux to reduce the inductance.

The power converter according to the invention of claim 5 is
In the invention of claim 2 or claim 4, the smoothing capacitor is arranged laterally of the P-side element and the N-side element, and when the smoothing capacitor is connected in series,
Switch the positive and negative poles of the smoothing capacitor
The branch P busbar and the branch N.
The positive pole located on the bus bar side is connected to the branch P bus bar
The INUS pole is connected to the branch N bus bar and is connected to the branch P bus bar.
And a plus pole located on the opposite side of the branch N bus and
The negative pole is connected by a common bus
And

In the power converter according to the fifth aspect of the present invention, in addition to the function of the second or fourth aspect of the present invention, the smoothing capacitors are arranged in the lateral direction of the P-side element and the N-side element, and the smoothing capacitors are arranged in the height direction. Reduce size. Also, smooth condensate
Place the positive and negative poles on a straight line
To do. And located on the side of the branch P bus and the branch N bus
The positive pole is connected to the branch P bus, the negative pole is the branch N
Connect to the busbar. On the other hand, the branch P bus and the branch N bus
Positive and negative poles on the opposite side have a common bus bar
Connect with. Therefore, smoothing capacitor and DC bus (P bus
Line and N bus).

A power conversion device according to a sixth aspect of the invention is
The invention according to any one of claims 1 to 5
The P busbars of each phase of the inverter device are connected together.
Common P bus for an inverter for
The inverter provided in parallel with and near the common P bus bar for
Inverter for connecting N busbars of each phase of the device together
Common N bus bar for power supply and P bus bar for each phase of the converter device
A common P bus bar for the converter for connecting the
Before the converter is provided parallel to the common busbar for the converter.
The N bus of each phase of the converter device is connected together.
A common N bus bar for a converter for
The device and the converter device are connected by the inverter.
For common P bus, for inverter Common N bus, for converter
Performed via common P bus and common N bus for converter
It is characterized by having done.

According to a sixth aspect of the present invention, there is provided a power converter according to the first aspect of the present invention.
In addition to the connection between the inverter device and the converter device,
Continuing with the high-palon line, common P bus for inverter,
Common N busbar for inverter, common P busbar for converter, converter
This is done by connecting the common N bus bar for the barter.

[0026]

[0027]

[0028]

[0029]

[0030]

[0031]

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. FIG. 1 is a layout configuration diagram of a P-side element 4U and an N-side element 4X for one phase of an inverter device in a power conversion device of the present invention, FIG. 1 (a) is a plan view thereof, and FIG. 1 (b). FIG. 2 is a sectional view taken along line I-I of FIG.

The semiconductor elements 4U1 to 4U4 are P-side elements connected to the plus bus (P bus) side of the DC bus.
The semiconductor elements 4X1 to 4X4 are N-side elements connected to the negative bus (N bus) side of the DC bus. These P-side elements 4U1 to 4U4 and N-side elements 4X1 to 4X4 are
The semiconductor elements have the same structure, and each terminal is provided in the order of a gate terminal G, an emitter element E, and a collector element C.

The four P-side elements 4U1 to 4U4 are connected in parallel, and similarly, the four N-side elements 4X1 to 4X4 are also connected in parallel. The P-side element 4U1 and the N-side element 4X1 are connected in series, and similarly, the P-side element 4U2 and the N-side element 4X are connected.
2, P-side element 4U3 and N-side element 4X3, P-side element 4U4
And the N-side element 4X4 are connected in series. Also,
A load busbar (U busbar) is taken out from the connection conductor of the emitter terminal of each P side element 4U1-4U4, and the collector terminal of N side element 4X1-4X4.

A method of connecting the P-side elements 4U1 to 4U4 and the N-side elements 4X1 to 4X4 will be described below. First, each semiconductor element is arranged so that the gate terminal G is on the outside. That is, the collector terminals C of the P-side elements 4U1 to 4U4 and the collector terminals C of the N-side elements 4X1 to 4X4 are arranged close to each other.

The P-side elements 4U1-4 arranged in this way
The emitter terminal E of U4 and the collector terminals C of the N-side elements 4X1 to 4X4 are connected so as not to contact the collector terminals C of the P-side elements 4U1 to 4U4. The connecting conductor 10 has a hat-shaped cross section as shown in FIG. 1B, and is provided across the collector terminals C of the P-side elements 4U1 to 4U4. Therefore, the collector terminals C of the P-side elements 4U1 to 4U4 do not come into contact with each other.

A U bus which is a load bus is provided above the connection conductor 10, and the emitter terminals of the P side elements 4U1 to 4U4 and the N side elements 4X1 to 4X are provided.
The connection conductor 10 connected to the collector terminal of No. 4 is connected by this U bus. That is, all the elements are connected in parallel via the U bus. As a result, this U bus becomes a U-phase load bus.

Next, the collector terminals C of the P-side elements 4U1 to 4U4 are connected to the P bus of the DC bus via the connecting conductor 11. The P bus bar is located parallel to the lower side of the U bus bar. Also, the emitter terminals E of the N-side elements 4X1 to 4X4
Is connected to the N bus of the DC bus via the connecting conductor 12. This N bus bar is arranged in parallel below the P bus bar. That is, they are provided parallel to the U bus and the P bus.
That is, since the P bus and the N bus are provided close to each other and in parallel, the magnetic fluxes generated by each other are canceled out to reduce the inductance.

On the other hand, branching from the P bus and N bus,
Branch P bus P for connecting smoothing capacitor 3 of each phase
1 and a branch N bus N1 are provided. The branch bus P1 and the branch N bus N1 are provided in the middle of the semiconductor element stack, that is, branching from the P bus and the N bus between the P-side element 4U2 and the P-side element 4U3. The branch P bus P1 and the branch N bus N1 are also provided in close proximity to each other in parallel to cancel the magnetic fluxes generated by each other.

According to the first embodiment, since the P bus and the N bus of the DC bus of the inverter device or the converter device of the power converter are provided in close proximity to each other, the magnetic fluxes are canceled each other to reduce the inductance. be able to.

Next, a second embodiment of the present invention will be described. 2 is a layout configuration diagram of the P-side element 4U and the N-side element 4X for one phase of the inverter device in the power conversion device of the present invention, FIG. 2 (a) is a plan view thereof, and FIG. 2 (b). FIG. 2 is a sectional view taken along line II-II of FIG.

The second embodiment is different from the first embodiment shown in FIG. 1 in that the branch P busbar P1 and the branch N busbar N1 are planarly formed above the U busbar.
Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given to the same elements and duplicated description will be omitted.

In FIG. 2, the branch P bus P1 connected to the smoothing capacitor 3 is taken out in the vertical direction from the collector terminals C of the P-side elements 4U1 to 4U4 via the connecting conductors 11 and 13, and the connection on which the U bus is mounted. The conductor 10 is bent at a right angle in the upper portion and formed into a flat surface. Further, the branch N bus N1 is taken out in the vertical direction from the emitter terminals E of the N-side elements 4X1 to 4X4 through the connection conductor 14.
The connection conductor 10 having the U bus and the branch P bus P1 are bent at right angles to form a flat surface.
That is, the branch N bus bar N1 is configured to cover almost the entire semiconductor element stack.

Here, in order to increase the insulation distance between the planar branch P bus bar P1 and the planar branch N bus bar N1, an insulating sheet is sandwiched therebetween to form a close contact.
As a result, the overall size can be reduced.

Next, a third embodiment of the present invention will be described. FIG. 3 shows P-side elements 4U to 4U for three phases of an inverter device in a power conversion device according to a third embodiment of the present invention.
4 is a layout configuration diagram of W and N-side elements 4X to 4Z, and FIG.
3A is a plan view thereof, and FIG. 3B is III-I of FIG. 3A.
It is sectional drawing in the II line.

In the third embodiment, the P-side element and the N-side element of each phase in the inverter device are formed by one semiconductor element. That is, the P-side elements 4U to 4W and the N-side element 4X for three phases of the inverter device in the case of a single configuration in which only one semiconductor element is provided per arm
4Z is shown.

In FIG. 3, the emitter terminals E of the P-side elements 4U to 4W and the collector terminals C of the N-side elements 4X to 4Z are connected so as not to contact the collector terminals C of the P-side elements 4U to 4W. The connecting conductor 10 has a hat-shaped cross section as shown in FIG.
It is provided across the collector terminals C of U to 4 W. Therefore, the collector terminals C of the P-side elements 4U to 4W do not come into contact with each other.

The collector terminals C of the P-side elements 4U-4W are
It is connected to the P bus of the DC bus via the connecting conductor 11.
Further, the emitter terminals E of the N-side elements 4X to 4Z are connected to the N bus of the DC bus via the connecting conductor 12. This N
The bus bar is arranged parallel to the lower side of the P bus line. That is, since the P bus and the N bus are provided close to each other and in parallel, the magnetic fluxes generated by each other are canceled out to reduce the inductance.

The connection from these P bus and N bus to the smoothing capacitor 3 is such that the connection is made from the P bus and N bus ends located at the bottom of the semiconductor element stack, that is, below the P side element 4W. To do. In this case, the P bus bar and the N bus bar are arranged so that the branch P bus bar P1 and the branch N bus bar N1 are connected at a right angle at the bottom of the semiconductor element stack, and are taken out in the direction of the smoothing capacitor.

FIG. 4 is a layout diagram of P-side elements 4U to 4W and N-side elements 4X to 4Z for three phases showing another example of the third embodiment. In contrast to that shown in FIG. 3, the branch P bus P1 and the branch N bus N1 connected to the smoothing capacitor 3 are taken out from between the P-side elements 4V and 4W or between 4U and 4V.

According to the third embodiment, in the case of a single structure having only one semiconductor element per arm, P for three phases of the inverter device or the converter device is used.
Since the side element and the N side element are connected so that the common P bus and N bus can be taken close to and parallel to each other and the P bus and N bus are connected to the smoothing capacitor, the inductance is reduced. In addition, the device can be made compact.

Next, FIG. 5 is an explanatory diagram of the arrangement of the smoothing capacitors of the power converter according to the fourth embodiment of the present invention. FIG. 5A is an explanatory diagram of a box body 6 accommodating a semiconductor element stack, and FIG. 5B is an explanatory diagram and a diagram of how to connect the smoothing capacitor 3 to the branch P bus P1 and the branch N bus N1. 5 (c) is a side view of FIG. 5 (b).

Although not shown in FIG. 5 (a), the smoothing capacitor 3 is arranged in the lateral direction of the box body 6 accommodating the semiconductor element stack. The semiconductor element stack is formed by attaching the P-side element and the N-side element. Figure 5
In (a), P-side elements 2U to 2W and N-side elements 2X to 2Y forming a converter device on the left side, and P-side elements 4U to 4W and N-side element 4 forming an inverter device on the right side.
It shows that X to 4Y are arranged.

The branch P from the semiconductor device stack
Smoothing capacitor 3 is connected to bus P1 and branch N bus N1. FIG. 5B is an explanatory diagram of the connection method, and shows a case where two smoothing capacitors 3 are connected in series.

In FIG. 5 (b), when the smoothing capacitors 3 are connected in series and parallel, every other smoothing capacitor 3 is arranged on a straight line with the positive pole p and the negative pole n being alternately interchanged. The positive pole p located on the side of the branch P bus P1 and the branch N bus N1 is connected to the branch P bus P1. Further, the negative pole n located on the side of the branch P bus P1 and the branch N bus N1 is connected to the branch N bus N1.

On the other hand, the branch P bus P1 and the branch N bus N
The plus pole p and the minus pole n located on the opposite side of 1 are connected by a common bus 15. As a result, the two smoothing capacitors 3 are connected in series and parallel.

As shown in FIGS. 5 (b) and 5 (c), the smoothing capacitor 3 connected to the branch P-side bus P1 responds at high speed in the vicinity of any one of the plus poles p. Attach the Hall CT16. As a result, the current flowing therethrough is detected and used for monitoring.

As described above, according to the fourth embodiment, since the smoothing capacitor 3 is housed in the lateral direction of the box body 6 for housing the semiconductor element stack, the height of the box body 6 is increased. It is possible to avoid increasing the direction. In addition, the smoothing capacitor 3 and the branch P bus P1 from the semiconductor stack
The connection with the branch N bus N1 can be achieved by arranging the branch P bus P1 and the branch N bus N1 in the lateral direction, so that the distance between them can be shortened and the inductance can be reduced.

Next explained is the fifth embodiment of the invention. FIG. 6 is a layout configuration diagram of an inverter device and a converter device of a power conversion device according to a fifth embodiment of the present invention. In the fifth embodiment, an inverter device and a converter device are attached to both sides of a heat dissipation block 17 of a boiling cooler.

Both sides of the heat dissipation block 17 of the boiling cooler are
The semiconductor element stack is attachable, the semiconductor element stack constituting the inverter device is attached to one surface of the heat dissipation block 17, and the semiconductor stack constituting the converter device is attached to the other surface on the opposite side. In FIG. 6, the semiconductor element stack forming the inverter device is attached to the upper surface of the heat dissipation block 17, and the semiconductor element stack forming the converter device is attached to the lower surface of the heat dissipation block 17. 3 shows an inverter device and a converter device having the P-bus and N-bus configurations shown in FIG. 2.

In the boiling cooler, the cooling medium exchanges heat with a phase change between a gas phase and a liquid phase, becomes a liquid phase in the cooling part of the boiling cooler, and absorbs heat in the heat radiation block 17. Then it becomes a gas phase. The cooling medium in the vapor phase is sent to the cooling unit, becomes in the liquid phase, and is returned to the heat dissipation block 17 again. This boiling cooler is a heat-efficient cooler.

In the fifth embodiment, the inverter device and the converter device are arranged with the boiling cooler having good thermal efficiency interposed therebetween, and the smoothing capacitor is arranged beside the semiconductor element stack, so that the device can be made compact. . Moreover, since the P bus and the N bus are provided close to each other, the inductance can be reduced.

Next explained is the sixth embodiment of the invention. FIG. 7 is a layout configuration diagram of an inverter device and a converter device for three phases of a power conversion device according to a sixth embodiment of the present invention.

In FIG. 7, the semiconductor element stacks forming the converter device are box bodies 6a, 6b and 6c, respectively.
The semiconductor stacks arranged on the left side of the box and forming the inverter device are arranged on the right side of the boxes 6a, 6b, 6c, respectively.

That is, the R-phase portion of the converter device and the U-phase portion of the inverter device are housed in the box 6a, and the R-bus R, P-bus and N-bus of the R-phase, and further the U-phase U. The bus bar, P bus bar and N bus bar are taken out. Similarly, in the box 6b, the S
The phase part and the V phase part of the inverter device are housed,
S-phase S-bus, P-bus and N-bus, and V-phase V
The bus bar, P bus bar and N bus bar are taken out. Also,
The T-phase part of the converter device and the W-phase part of the inverter device are housed in the box 6c, and the T-phase T-bus, P-bus and N-bus, and further the W-phase W-bus, P-bus and N bus bar is taken out.

The P busbars of the respective phases of the inverter device taken out from the respective boxes 6a, 6b, 6c are collectively connected to the common P busbar 18 for the inverter. Similarly, the N buses of the respective phases of the inverter device are collectively put into a common N bus for the inverter.
It is connected to the bus bar 19. The common P busbar 18 for inverters and the common N busbar 19 for inverters are provided in parallel with each other. In FIG. 7, the common N bus bar 1 for inverters
Since 9 is located on the back surface of the common P busbar 18 for the inverter, it is expressed as overlapping.

Similarly, each box body 6a, 6b, 6
The P bus of each phase of the converter device extracted from c is
Collectively connected to converter common P bus bar 20. Similarly, the N buses of the respective phases of the converter device are collectively connected to the converter common N bus 21. Converter common P bus bar 20 and converter common N bus bar 21 are provided in close proximity to each other and in parallel. In FIG. 7, converter common N bus bar 21 is located behind the converter common P bus bar 20, and is therefore represented as being overlapped.

The connection between the inverter device and the converter device is made by connecting the common P bus line 18 for inverter, the common N bus line 19 for inverter, the common P bus line 20 for converter, and the common N bus line 21 for converter to the hyperon line 22. Connect and do.

[0069] In this case, the box 6a, 6b, the 6c, Inn
Each semiconductor element stack forming the burner device and the converter device is housed so that the mounting surface of the semiconductor element stack to the heat dissipation block of the boiling cooler is in the depth direction.

In addition, each phase (R phase, S phase, T phase, U phase, V
Phase, W phase) and the common P bus N and the common N bus 19 for the inverter, the common P bus 20 for the converter, and the common N bus 21 for the converter, respectively. is doing. Then, connection of the P bus and the N bus between the inverter device and the converter device is performed by the hyperon line 22.

The U-phase, V-phase, and W-phase common P busbars 18 for the inverter of the inverter device are formed by bending the P busbars emerging from the semiconductor element stack side at right angles so that they can be bolted from the front. . Similarly, the common N busbars 19 for U-phase, V-phase, and W-phase inverters of the inverter device are connected to the N busbars emerging from the semiconductor element stack side. The same applies to the R phase, S phase, and T phase of the converter device.

In the sixth embodiment, the common P bus bar and N bus bar are formed by putting together the three-phase P bus bar and N bus bar, so that the connection can be easily performed. Further, since the common P bus and N bus are provided close to each other in parallel, the inductance can be reduced.

[0073]

As described above, according to the present invention, P
Since the bus bar and the N bus bar are provided adjacent to each other in parallel, the inductance can be reduced. Moreover, since the P bus and the N bus connecting from the smoothing capacitor to the semiconductor element stack are branched from the midpoint of the semiconductor element stack in which the semiconductor elements are connected in parallel, the inductance can be equalized. .

Further, since the smoothing capacitors are mounted in the lateral direction of the semiconductor element stack, the height direction of the box can be reduced. Further, the smoothing capacitor can be easily connected to the P bus bar and the N bus bar of the semiconductor element stack. Further, since the semiconductor itself does not need to use the complementary element, it can be configured with only one type of element.

[Brief description of drawings]

FIG. 1 is a P-side element 4U for one phase of an inverter device in a power conversion device according to a first embodiment of the present invention.
FIG. 3 is an arrangement configuration diagram of the N-side element 4X.

FIG. 2 is a P-side element 4U for one phase of an inverter device in a power conversion device according to a second embodiment of the present invention.
FIG. 3 is an arrangement configuration diagram of the N-side element 4X.

FIG. 3 is a P-side element 4U for three phases of an inverter device in a power conversion device according to a third embodiment of the present invention.
4W and N-side elements 4X to 4Z are configuration diagrams.

FIG. 4 is a P diagram for three phases of an inverter device in a power conversion device according to another example of the third embodiment of the present invention.
It is a layout configuration diagram of side elements 4U to 4W and N side elements 4X to 4Z.

FIG. 5 is an explanatory diagram of an arrangement of smoothing capacitors of a power conversion device according to a fourth embodiment of the present invention.

FIG. 6 is a layout configuration diagram of an inverter device and a converter device of a power conversion device according to a fifth embodiment of the present invention.

FIG. 7 is a layout configuration diagram of an inverter device and a converter device for three phases of a power conversion device according to a sixth embodiment of the present invention.

FIG. 8 is a configuration diagram of a conventional power converter that supplies a variable frequency power source to an electric motor.

FIG. 9 is a layout configuration diagram of a P-side element 4U and an N-side element 4X for one phase of an inverter device in a conventional power conversion device.

FIG. 10 is an explanatory diagram of a case where the conventional power converter is housed in a box.

[Explanation of symbols]

1 3-phase AC power supply 2 converter device 3 smoothing capacitors 4 Inverter device 5 electric motor 6 boxes 7 cooler 8 air intake 9 fans 10, 11, 12, 13, 14 Connection conductor 15 common bus 16 Hall CT 17 Heat dissipation block 18 Common P bus bar for inverter 19 Common N bus bar for inverter 20 Common P bus bar for converter 21 Common N Bus for Converter 22 high pattern line

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 25/00-25/18

Claims (6)

(57) [Claims] 1. A plurality of semiconductor elements are connected in parallel to form a P-side element and an N-side element of each phase in an inverter device or a converter device, and the P-side element and the N-side element are connected in series. In the configured power converter
Te, the collector terminal of each of the P-side element of the DC bus P
Connected to the bus, it connects the emitter terminal of each of the N-side element to the N bus of the DC bus, collection of each of the P-side element
Load busbars are taken out from the connecting conductors connecting the emitter terminals of the P-side elements and the collector terminals of the N-side elements across the output terminals, and the P busbars and the N busbars are arranged in close proximity to each other. A power converter characterized by the above. 2. A branch P bus branched from the P bus for connecting to a positive pole of a smoothing capacitor, and a branch P branch branched from the N bus for connecting to a negative pole of the smoothing capacitor. The power conversion device according to claim 1, further comprising an N bus bar, wherein the branch P bus bar and the branch N bus bar are arranged close to each other in parallel. 3. A power converter configured by forming a P-side element and an N-side element of each phase in an inverter device or a converter device with one semiconductor element, and connecting the P-side element and the N-side element in series. in connects the collector terminal of the P-side element P bus of the DC bus, connects the emitter terminal of the N-side element to the N bus of the DC bus, the P-side
A load wire is taken out from a connecting conductor that connects the emitter terminal of the P-side element and the collector terminal of the N-side element across the collector terminal of the element, and the P bus bar and the N bus bar are arranged in close proximity to each other. A power converter characterized by the above. 4. A branched P busbar provided at an end of the P busbar or branched and connected to a positive pole of a smoothing capacitor, and a negative pole of the smoothing capacitor provided at an end of the N busbar or branched. The power conversion device according to claim 3, further comprising: a branch N bus bar for connecting to the above, and the branch P bus bar and the branch N bus line are arranged in close proximity to each other and in parallel. Wherein said smoothing capacitor is disposed in a lateral direction of the P-side element and the N-side device, the smoothing capacitor
When connecting the sensors in series, connect the smoothing capacitor
Swap the negative pole with the negative pole and place them on a straight line.
Plus pole is located in the branch P bus you and the branch N bus side
Is connected to the branch P bus and the negative pole is the branch N bus
To the opposite side of the branch P bus bar and the branch N bus bar.
The plus and minus poles on the side are connected by a common bus bar.
Claim 2 or claim characterized in that it is adapted to continue
Item 5. The power conversion device according to item 4 . Wherein said inverter for the common P bus for connecting together each phase P bus of the inverter device, is provided in parallel in the vicinity of the common P bus for the inverter of each phase of the inverter device N A common N busbar for the inverter for connecting the busbars together, a common P busbar for the converter for collectively connecting the Pbusbars of each phase of the converter device, and a parallel busbar provided in the vicinity of the common busbar for the converter A common N bus bar for the converter for collectively connecting the N bus bars of each phase of the converter device, and the inverter device and the converter device are connected by the common P bus bar for the inverter and the common N bus line for the inverter. 4. The method according to claim 1, wherein the operation is performed via the bus bar, the common P bus bar for the converter, and the common N bus bar for the converter.
Item 6. The power conversion device according to any one of items 5 .