JP3443019B2 - Manufacturing method of semiconductor device package and manufacturing die used therefor - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device package and a manufacturing die used therefor.

[0002]

2. Description of the Related Art FIG. 3 is a sectional view of a die for lead cutting by a conventional method, and FIG. 4 is a sectional view of a die for ejecting a package after lead cutting by a conventional method. Conventionally, in a package in which the leads are exposed on the back surface, as shown in FIG. 3, when the leads are cut, the entire back surface of the package 1 is placed on the die 50 under the mold and the punch 51 performs the lead cutting. In addition, as shown in FIG. 4, when lifting the product (package) 1 after lead cutting,
The central portion of the package 1 was partially lifted by the eject pin 53 while the lead exposed portion 1a on the back surface of the package 1 was supported by the die 52.

[0003]

However, when the entire back surface of the package 1 is in contact with the die 50 under the mold at the time of lead cutting as in the method of manufacturing a semiconductor device package shown in FIG. When foreign matter such as resin dust adheres near the center or near the center of the upper surface of the mold, stress concentrates on the place where the foreign matter adheres to the package 1. This causes a force to deform the package 1 into a convex shape at the time of lead cutting, and as a result, a package crack occurs and, in the worst case, a chip crack occurs.

Further, when the package 1 is lifted after lead cutting as in the method for manufacturing a semiconductor device package shown in FIG. 4 and the mold and the package are difficult to separate from each other, a part of the back surface of the package 1, particularly the package 1 If only the portion where the lead is not exposed in the central portion is ejected, a stress is temporarily generated in the lead exposed portion 1a. As a result, the interface between the lead and the resin is peeled off, and in the worst case, the lead and the resin are completely peeled off, and the reliability of the package 1 is significantly deteriorated.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a semiconductor device package which can prevent chip cracks from occurring during lead cutting and prevent interfacial peeling between the lead and resin when the package is lifted, and a manufacturing die used therefor. It is to be.

[0006]

In order to solve the above problems, a method of manufacturing a package for a semiconductor device according to a first aspect of the present invention is a package having an upper surface, a side surface and a back surface.
, Exposed on the back surface and protruding from the side surface.
That leads includes the step of cutting, characterized in that lead cutting while supporting only lead exposed portion of the <br/> backside package at the time of this process.

[0007] It more Thus, top, side and back side
Exposed on the back side of the package
Including the step of cutting the lead, the lead is cut with only the exposed lead on the backside of the package being supported during this step, so even if foreign matter such as resin adheres near the center of the backside of the package during lead cutting, the foreign matter It is possible to prevent the generation of package cracks and fatal chip cracks without the stress being concentrated on the areas where the cracks were attached.

A method of manufacturing a package for a semiconductor device according to a second aspect includes a step of lead-cutting a package whose leads are exposed on the back surface, and ejecting the package after the lead-cutting. The feature is that only the exposed part is lifted and ejected.

As described above, the method includes a step of lead-cutting the package in which the leads are exposed on the back surface and ejecting the package after the lead-cutting. At this time, only the lead-exposed portion on the back surface of the package is lifted and ejected. When the package is lifted after the lead cutting, even if the mold and the package are difficult to separate from each other, the package is not subjected to a force that causes interfacial peeling between the lead and the resin. Therefore, the problem that the lead and the resin are completely separated can be solved, and the reliability of the package can be improved.

A manufacturing die for a semiconductor device package according to a third aspect of the present invention is a package including a top surface, side surfaces and a back surface.
, Exposed on the back surface and protruding from the side surface.
A die for manufacturing a package for a semiconductor device capable of lead-cutting a package having a lead, which is characterized in that a package receiver for supporting only the lead exposed portion is provided.

Since the package receiver for supporting only the exposed portion of the lead is provided in this way, even if a foreign substance such as resin adheres to the vicinity of the center of the back surface of the package at the time of lead cutting, it can be manufactured by using this mold. It is possible to prevent the occurrence of chip cracks in the same manner as in claim 1, without stress being concentrated on the place where the foreign matter was attached.

According to a fourth aspect of the present invention, there is provided a die for manufacturing a semiconductor device package, which is capable of ejecting the package after lead-cutting a package having lead exposed portions in which leads are exposed on the back surface. A package receiver for lifting only the lead exposed portion is provided.

As described above, since the package receiver for lifting only the lead exposed portion is provided, when the package is manufactured using this mold, it is difficult to separate the mold from the package when the package is lifted after lead cutting. However, the package is not subjected to a force that causes interfacial peeling between the lead and the resin. Therefore, the reliability of the package can be improved as in the second aspect.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described with reference to FIG.

FIG. 1A is a sectional view of a die for lead cutting in the method of manufacturing a semiconductor device package according to the first embodiment of the present invention, and FIG. 1B is an enlarged view of a portion A in FIG. As shown in FIG. 1, the package 1 in which the leads are exposed on the back surface is lead-cut using a manufacturing die. The manufacturing die has a structure provided with a package receiver that supports only the lead exposed portion 1a where the leads are exposed on the back surface. In this case, a package receiver 3 capable of supporting only the lead exposed portion 1a is provided in the center of the die 2 below the die, and an opening 4 is provided outside thereof. The punch 5 on the upper part of the die has the same construction as the conventional one, and the cutting portion 6 enters the opening 4 of the die 2 so that lead cutting can be performed. Therefore,
3 is different from the conventional example in FIG. 3 in that the entire back surface of the package 1 is not in contact with the mold but only the lead exposed portion 1a is in contact. The area where the package 1 contacts is the lead exposed portion 1a of the package 1.
It is most effective if it is the same as or the inside is about 0.1 to 0.05 mm.

When manufacturing a package for a semiconductor device using the above-mentioned manufacturing die, in the step of lead cutting the package 1, the punch 5 is supported with only the lead exposed portion 1a of the package 1 supported by the package receiver 3. The cutting portion 6 is inserted into the opening 4 of the die 2 to perform lead cutting. At this time, even if foreign matter such as resin dust adheres to the vicinity of the center of the back surface of the package, the die 2 does not come into contact with the die 2, so that stress does not concentrate on the part of the package 1 where the foreign matter adheres.

As described above, according to this embodiment, the lead is cut while only the lead exposed portion 1a on the back surface of the package 1 is supported, so that the stress is concentrated on the package 1 by foreign matter such as resin scraps during the lead cutting. Without
It is possible to prevent the occurrence of package cracks and fatal chip cracks.

A second embodiment of the present invention will be described with reference to FIG.

FIG. 2 is a sectional view of a die for ejecting the package after lead cutting in the method for manufacturing a semiconductor device package according to the embodiment of the present invention. As shown in FIG. 2, the package 1 in which the leads are exposed on the back surface is lead-cut using a manufacturing die, and the package 1 is ejected after the lead-cut. The manufacturing die has a structure in which a package receiver is provided for supporting and lifting only the lead exposed portion 1a where the leads are exposed on the back surface. In this case, a package receiver 8 which also functions as an eject pin for supporting and lifting only the lead exposed portion 1a is provided in the center of the die 7 under the mold, and an opening 9 is provided outside thereof. The punch 5 on the upper part of the die has the same structure as the conventional and the first embodiment, so that the cutting portion 6 enters the opening 9 of the die 7 to perform lead cutting, and only the package receiver 8 moves up and down. Can be ejected. Therefore, what is different from the conventional example of FIG. 4 is a structure in which only the exposed lead portion 1a is ejected, instead of ejecting only a part of the back surface of the package 1, particularly the portion where the leads in the central portion of the package 1 are not exposed. This is about to happen. The area where the package 1 contacts is the same as the lead exposed portion 1a of the package 1 as in the first embodiment, or
It is most effective that the inner diameter is about 0.1 to 0.05 mm.

When manufacturing a package for a semiconductor device using the above-mentioned manufacturing die, in the process of lead-cutting the package 1 and ejecting the package 1 after the lead-cutting, only the lead exposed portion 1a of the package 1 is packaged. The cutting portion 6 of the punch 5 is inserted into the opening 9 of the die 2 while being supported by the receiver 8, and lead cutting is performed. After this, the package receiver 8 is raised and the package 1
Only the lead exposed portion 1a on the back surface is lifted and ejected. At this time, even if the die 7 and the package 1 are difficult to separate from each other, the package 1 is not subjected to a force that causes interfacial peeling between the lead and the resin.

As described above, according to this embodiment, since only the lead exposed portion 1a on the back surface of the package 1 is lifted up and ejected, even if the die 7 and the package 1 are difficult to separate after the lead cutting, the leads are removed. Therefore, the package 1 is not subjected to a force that causes interfacial peeling of the resin. Therefore, the problem that the lead and the resin are completely separated can be solved, and the reliability of the package can be improved.

[0022]

According to the method of manufacturing the semiconductor device package of the first aspect of the present invention, the upper surface, the side surface and the back surface are formed.
In a package consisting of
Even if a foreign substance such as resin adheres to the vicinity of the center of the backside of the package during lead cutting, the process includes cutting the protruding leads. The stress does not concentrate on the place where foreign matter had adhered,
It is possible to prevent the occurrence of package cracks and fatal chip cracks.

According to a second aspect of the present invention, there is provided a method of manufacturing a package for a semiconductor device, which includes a step of lead-cutting a package whose leads are exposed on the back surface and ejecting the package after the lead-cutting. Sometimes, only the exposed leads on the backside of the package are ejected to eject.Therefore, when the package is lifted after lead cutting, even if the mold and the package are difficult to separate from each other, a force such as interfacial peeling between the lead and the resin occurs. Never put it on the package. Therefore, the problem that the lead and the resin are completely separated can be solved, and the reliability of the package can be improved.

According to the manufacturing die of the semiconductor device package of the third aspect of the present invention, since the package receiver for supporting only the lead exposed portion is provided, the lead cutting is performed by using this die. Even when a foreign matter such as a resin adheres to the vicinity of the center of the back surface of the package, the stress is not concentrated on the place where the foreign matter adheres.
Similarly to, it is possible to prevent the occurrence of chip cracks.

According to the manufacturing die of the semiconductor device package of the fourth aspect of the present invention, since the package receiver for lifting only the lead exposed portion is provided, by manufacturing using this die, after lead cutting. When the package is lifted, even if the mold and the package are difficult to separate from each other, the package is not subjected to a force that causes interfacial peeling between the lead and the resin. Therefore, the reliability of the package can be improved as in the second aspect.

[Brief description of drawings]

FIG. 1A is a cross-sectional view of a die for lead cutting in a method for manufacturing a semiconductor device package according to a first embodiment of the present invention, and FIG. 1B is an enlarged view of part A in FIG.

FIG. 2 is a cross-sectional view of a die for ejecting the package after lead cutting in the method for manufacturing a semiconductor device package according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view of a mold for lead cutting by a conventional method.

FIG. 4 is a cross-sectional view of a mold for ejecting a package after lead cutting by a conventional method.

[Explanation of symbols]

1 package 1a Lead exposed part 2,7 die 3,8 package receiver 5 punches

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-129473 (JP, A) JP-A-10-163408 (JP, A) JP-A-61-214546 (JP, A) Actual Kaihei 2- 70832 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/50

Claims (4)

(57) [Claims] 1. A package comprising a top surface, side surfaces and a back surface.
In the above, exposed on the back surface and projected from the side surface.
Comprising the step of cutting the leads are, before the time of this step
A method of manufacturing a package for a semiconductor device, characterized in that the leads are cut while supporting only the exposed leads on the back surface of the package. 2. A step of lead-cutting a package in which leads are exposed on the back surface and ejecting the package after the lead-cutting, at the time of this step, only the lead-exposed portion on the back surface of the package is lifted and ejected. Method for manufacturing package for semiconductor device. 3. A package comprising a top surface, side surfaces and a back surface.
In the above, exposed on the back surface and projected from the side surface.
A die for manufacturing a semiconductor device package capable of lead cutting a package having a lead,
A mold for manufacturing a package for a semiconductor device, comprising a package receiver that supports only the exposed lead portion. 4. A manufacturing die for a semiconductor device package capable of ejecting a package after lead cutting a package having a lead exposed portion whose leads are exposed on the back surface, wherein the package receiver lifts only the lead exposed portion. A die for manufacturing a package for a semiconductor device, which is provided with.