JP3435637B2 - Electronic component manufacturing method - Google Patents
Electronic component manufacturing methodInfo
- Publication number
- JP3435637B2 JP3435637B2 JP2000193298A JP2000193298A JP3435637B2 JP 3435637 B2 JP3435637 B2 JP 3435637B2 JP 2000193298 A JP2000193298 A JP 2000193298A JP 2000193298 A JP2000193298 A JP 2000193298A JP 3435637 B2 JP3435637 B2 JP 3435637B2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- piezoelectric
- electronic component
- exterior resin
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 43
- 229910000679 solder Inorganic materials 0.000 claims description 41
- 230000004907 flux Effects 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 25
- 238000000605 extraction Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000013007 heat curing Methods 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 239000012190 activator Substances 0.000 claims description 4
- 238000001723 curing Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000001993 wax Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばエネルギー
閉じ込め型圧電共振子のような振動を妨げないための空
洞が外装樹脂層中に設けられている電子部品の製造方法
に関し、より詳細には、空洞形成方法が改良された電子
部品の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, such as an energy trapping type piezoelectric resonator, in which a cavity for preventing vibration is provided in an exterior resin layer, and more specifically, The present invention relates to a method for manufacturing an electronic component having an improved cavity forming method.
【０００２】[0002]
【従来の技術】従来、共振子や帯域フィルタとして、エ
ネルギー閉じ込め型の圧電共振部品が広く用いられてい
る。エネルギー閉じ込め型の圧電共振部品では、圧電振
動部の振動を妨げないようにパッケージを構成する必要
がある。そこで、外装樹脂層を有する圧電共振部品で
は、圧電振動部の振動を妨げないための空洞が外装樹脂
層内に形成されている。2. Description of the Related Art Conventionally, energy trap type piezoelectric resonance components have been widely used as resonators and bandpass filters. In the energy trap type piezoelectric resonance component, it is necessary to configure the package so as not to disturb the vibration of the piezoelectric vibrating portion. Therefore, in the piezoelectric resonance component having the exterior resin layer, a cavity for preventing the vibration of the piezoelectric vibrating portion is formed in the exterior resin layer.
【０００３】上記のような空洞を有する圧電共振部品の
製造に際しては、まず、圧電基板の両主面に振動電極及
び振動電極に連ねられた引出し電極を形成する。このよ
うにして得られた圧電共振素子に、リード端子を接合す
る。次に、圧電振動部に、ワックスを付与する。次に、
外装樹脂を付与し、加熱により硬化させる。この外装樹
脂の加熱硬化時に、ワックスが外装樹脂側に吸収され、
空洞が形成される。In manufacturing a piezoelectric resonance component having a cavity as described above, first, a vibrating electrode and a lead electrode connected to the vibrating electrode are formed on both main surfaces of a piezoelectric substrate. A lead terminal is bonded to the piezoelectric resonant element obtained in this way. Next, wax is applied to the piezoelectric vibrating portion. next,
An exterior resin is applied and cured by heating. At the time of heat curing of this exterior resin, the wax is absorbed by the exterior resin side,
A cavity is formed.
【０００４】ところで、圧電共振部品では、中心周波数
のばらつきを小さくすることが求められている。従っ
て、周波数調整を図るためにソルダーレジストインクな
どの有機材料を圧電共振素子の振動電極上に塗布する方
法が用いられている。By the way, in the piezoelectric resonance component, it is required to reduce the variation of the center frequency. Therefore, in order to adjust the frequency, a method of applying an organic material such as a solder resist ink on the vibrating electrode of the piezoelectric resonance element is used.
【０００５】上記ソルダーレジストインクを振動電極上
に塗布する場合には、空洞形成用のワックスはソルダー
レジストインクを付与した後にソルダーレジストインク
上に塗布されることになる。When the solder resist ink is applied on the vibrating electrode, the cavity forming wax is applied on the solder resist ink after applying the solder resist ink.
【０００６】[0006]
【発明が解決しようとする課題】前述したように、塗布
されたワックスは、外装樹脂の熱硬化時に溶融し、外装
樹脂に毛細管現象により吸収されていく。しかしなが
ら、ソルダーレジストインク上にワックスが塗布されて
いる場合には、溶融ワックスとソルダーレジストインク
との濡れ性が悪く、ワックスの外装樹脂側への吸収が不
完全となりがちであった。そのため、外装樹脂を熱硬化
し、外装樹脂層を形成した後において、ワックスの一部
がソルダーレジストインクを介して振動電極上に残留
し、電気的特性が低下することがあった。As described above, the applied wax is melted at the time of thermosetting of the exterior resin and absorbed by the exterior resin by the capillary phenomenon. However, when wax is applied on the solder resist ink, the wettability between the molten wax and the solder resist ink is poor, and the absorption of the wax on the exterior resin side tends to be incomplete. Therefore, after the exterior resin is thermoset to form the exterior resin layer, a part of the wax may remain on the vibrating electrode via the solder resist ink, and the electrical characteristics may deteriorate.
【０００７】上記のような問題は、環境の変動や外装樹
脂材料自体の変動等により生じるが、ソルダーレジスト
インクが付与された圧電共振部品の比率が高いため、圧
電共振部品の歩溜まりの低下の大きな原因となってい
た。The above-mentioned problems occur due to changes in the environment, changes in the exterior resin material itself, and the like. However, since the ratio of the piezoelectric resonance parts to which the solder resist ink is applied is high, the yield of the piezoelectric resonance parts is reduced. It was a big cause.
【０００８】本発明の目的は、上述した従来技術の欠点
を解消し、ソルダーレジストインクなどの有機材料を用
いて周波数調整を行った場合においても、外装樹脂層に
空洞形成材を確実に吸収させることができ、空洞形成材
の残留を効果的に抑制し得る電子部品の製造方法を提供
することにある。The object of the present invention is to solve the above-mentioned drawbacks of the prior art, and to ensure that the exterior resin layer absorbs the cavity forming material even when the frequency is adjusted using an organic material such as solder resist ink. An object of the present invention is to provide a method for manufacturing an electronic component, which is capable of effectively suppressing the residual cavity forming material.
【０００９】[0009]
【課題を解決するための手段】本発明の広い局面によれ
ば、加熱硬化時に空洞形成材を吸収することにより形成
された空洞を有する外装樹脂層を備える電子部品の製造
方法であって、電子部品素子を用意する工程と、前記電
子部品素子の外周面の少なくとも一部にソルダーレジス
トインク層を形成する工程と、前記ソルダーレジストイ
ンク層上において、少なくとも前記空洞が形成される領
域にソルダーレジストインクに対する濡れ性が空洞形成
材よりも高く、外装樹脂の熱硬化時に外装樹脂層に吸収
される材料を付与する工程と、前記空洞が形成される領
域において外装樹脂の熱硬化に際して吸収される空洞形
成材を付与する工程と、前記空洞形成材を付与した後
に、電子部品素子の外表面を覆うように外装樹脂を塗布
し、加熱により硬化させる工程とを備えることを特徴と
する、電子部品の製造方法が提供される。According to a broad aspect of the present invention, there is provided a method of manufacturing an electronic component comprising an exterior resin layer having a cavity formed by absorbing a cavity forming material during heat curing. A step of preparing a component element, a step of forming a solder resist ink layer on at least a part of an outer peripheral surface of the electronic component element, and a step of forming a solder resist ink on at least a region where the cavity is formed on the solder resist ink layer. A step of applying a material having a higher wettability to the exterior resin layer than the cavity-forming material when the exterior resin is heat-cured, and forming a cavity that is absorbed during the heat-curing of the exterior resin in the region where the cavity is formed. Step of applying the material, and after applying the cavity forming material, apply the exterior resin so as to cover the outer surface of the electronic component element, and cure by heating. Characterized in that it comprises a step of manufacturing method of an electronic component is provided.
【００１０】本発明の特定の局面では、ソルダーレジス
トインクに対する濡れ性が空洞形成材よりも高く、かつ
外装樹脂の熱硬化に際して吸収される材料として、非イ
オン性のハロゲン系活性剤を含むフラックスが用いられ
る。このような非イオン性のハロゲン性活性剤として
は、例えば、ハロゲン化芳香族炭化水素などをを挙げる
ことができる。In a particular aspect of the present invention, the wettability with respect to the solder resist ink is higher than that of the cavity forming material, and a flux containing a nonionic halogen-based activator is used as the material that is absorbed when the exterior resin is thermally cured. Used. Examples of such nonionic halogen activator include halogenated aromatic hydrocarbons.
【００１１】また、本発明の特定の局面では、上記電子
部品素子が、圧電基板と、圧電基板を介して対向するよ
うに形成された第１，第２の振動電極とを備える圧電共
振素子であり、第１，第２の振動電極が対向している部
分がエネルギー閉じ込め型の圧電振動部を構成してお
り、該圧電振動部の振動を妨げないように上記空洞が形
成される。Further, according to a particular aspect of the present invention, the electronic component element is a piezoelectric resonance element including a piezoelectric substrate and first and second vibrating electrodes formed so as to face each other with the piezoelectric substrate interposed therebetween. The portion where the first and second vibrating electrodes face each other constitutes an energy trap type piezoelectric vibrating portion, and the cavity is formed so as not to interfere with the vibration of the piezoelectric vibrating portion.
【００１２】また、本発明のさらに、特定の局面では、
振動電極に連ねられた引出し電極がさらに備えられてお
り、ソルダーレジストインクが、圧電振動部だけでな
く、上記引出し電極にも至るように付与される。Further, in a further specific aspect of the present invention,
A lead electrode connected to the vibrating electrode is further provided, and the solder resist ink is applied so as to reach the lead electrode as well as the piezoelectric vibrating portion.
【００１３】[0013]
【発明の実施の形態】以下、図面を参照しつつ、本発明
の具体的な実施例を説明することにより、本発明を明ら
かにする。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.
【００１４】図１〜図４を参照して、本発明の一実施例
に係る圧電共振部品の製造方法を説明する。まず、図１
（ａ）に示す圧電共振素子１を用意する。圧電共振素子
１はバンドパスフィルタを構成するものであり、矩形板
状の圧電基板２を有する。圧電基板２は、チタン酸ジル
コンサ鉛系セラミックスのような圧電セラミックス、あ
るいは水晶などの圧電単結晶により構成される。A method of manufacturing a piezoelectric resonance component according to an embodiment of the present invention will be described with reference to FIGS. First, Fig. 1
The piezoelectric resonance element 1 shown in (a) is prepared. The piezoelectric resonance element 1 constitutes a bandpass filter, and has a rectangular plate-shaped piezoelectric substrate 2. The piezoelectric substrate 2 is composed of piezoelectric ceramics such as lead zirconsa titanate-based ceramics or piezoelectric single crystals such as quartz.
【００１５】圧電基板２の上面には、第１，第２の圧電
振動部３，４が構成されている。圧電振動部３では、圧
電基板２の上面において、ギャップを隔てて、一対の第
１の振動電極３ａ，３ｂが形成されている。図２に底面
図で示すように、圧電基板２の下面には、振動電極３
ａ，３ｂと対向する位置に、第２の振動電極３ｃが形成
されている。First and second piezoelectric vibrating portions 3 and 4 are formed on the upper surface of the piezoelectric substrate 2. In the piezoelectric vibrating portion 3, a pair of first vibrating electrodes 3a and 3b are formed on the upper surface of the piezoelectric substrate 2 with a gap therebetween. As shown in the bottom view of FIG. 2, the vibrating electrode 3 is formed on the lower surface of the piezoelectric substrate 2.
A second vibrating electrode 3c is formed at a position facing a and 3b.
【００１６】同様に、第２の圧電振動部４においては、
圧電基板２の上面に一対の第１の振動電極４ａ，４ｂが
形成されており、圧電基板２の下面に振動電極４ａ，４
ｂと対向するように第２の振動電極４ｃが形成されてい
る。Similarly, in the second piezoelectric vibrating section 4,
A pair of first vibrating electrodes 4a and 4b are formed on the upper surface of the piezoelectric substrate 2, and vibrating electrodes 4a and 4b are formed on the lower surface of the piezoelectric substrate 2.
A second vibrating electrode 4c is formed so as to face b.
【００１７】振動電極３ｂに連ねられた引出し電極３ｄ
が形成されている。また、振動電極３ａ，４ａは、接続
導電部５により電気的に接続されている。接続導電部５
には、容量電極６が接続されている。Extraction electrode 3d connected to vibration electrode 3b
Are formed. Further, the vibrating electrodes 3a and 4a are electrically connected by the connection conductive portion 5. Connection conductive part 5
The capacitor electrode 6 is connected to the.
【００１８】第２の圧電振動部４では、接続導電部５に
振動電極４ａが接続されている。また、振動電極４ｂに
連ねられた引出し電極４ｄが形成されている。圧電基板
２の下面においては、第２の振動電極３ｃ，４ｃが接続
導電部７により電気的に接続されており、かつ接続導電
部７に容量電極８が電気的に接続されている。容量電極
８は、圧電基板２を介して容量電極６と対向されてお
り、それによって中継容量を構成している。In the second piezoelectric vibrating portion 4, the vibrating electrode 4a is connected to the connecting conductive portion 5. Further, an extraction electrode 4d connected to the vibrating electrode 4b is formed. On the lower surface of the piezoelectric substrate 2, the second vibrating electrodes 3c and 4c are electrically connected by the connecting conductive portion 7, and the capacitive electrode 8 is electrically connected to the connecting conductive portion 7. The capacitance electrode 8 is opposed to the capacitance electrode 6 via the piezoelectric substrate 2, and thereby constitutes a relay capacitance.
【００１９】本実施例では、まず、圧電基板２の上面及
び下面に上記各電極が形成された圧電共振素子１を用意
する。次に、周波数調整を図るために、第１，第２の圧
電振動部３，４を覆うようにソルダーレジストインク層
９ａ，９ｂを形成する。図１（ａ）に示すように、ソル
ダーレジストインク層９ａ，９ｂは、第１，第２の圧電
振動部３，４を被覆するように形成されている。また、
圧電基板２の下面においても、第１，第２の圧電振動部
を被覆するように、すなわち図２に示した振動電極３
ｃ，４ｃを被覆するようにソルダーレジストインク層９
ｃ，９ｄ（図１（ｂ））が形成される。In this embodiment, first, the piezoelectric resonance element 1 having the above-mentioned electrodes formed on the upper surface and the lower surface of the piezoelectric substrate 2 is prepared. Next, in order to adjust the frequency, solder resist ink layers 9a and 9b are formed so as to cover the first and second piezoelectric vibrating portions 3 and 4. As shown in FIG. 1A, the solder resist ink layers 9a and 9b are formed so as to cover the first and second piezoelectric vibrating portions 3 and 4. Also,
Also on the lower surface of the piezoelectric substrate 2, the vibrating electrode 3 shown in FIG. 2 is formed so as to cover the first and second piezoelectric vibrating portions.
c, 4c so as to cover the solder resist ink layer 9
c and 9d (FIG. 1B) are formed.
【００２０】図１（ｂ）は、図１の矢印Ａ−Ａに沿う部
分を拡大して示す部分切欠断面図であり、圧電基板２の
上下において、ソルダーレジストインク層９ａ，９ｃが
形成されている状態が示されている。FIG. 1 (b) is a partially cutaway sectional view showing an enlarged portion along the arrow AA of FIG. 1, in which solder resist ink layers 9a and 9c are formed above and below the piezoelectric substrate 2, respectively. The state is shown.
【００２１】次に、圧電基板２の上面において、ソルダ
ーレジストインクに対する濡れ性が、後述の空洞形成材
よりも高く、かつ外装樹脂の熱硬化に際して吸収される
材料として、非イオン性のハロゲン系活性剤を含むフラ
ックス１０ａが塗布される。このフラックス１０ａは、
ソルダーレジストインク層９ａ，９ｂ上に塗布される。
この場合、フラックス１０ａは、後述のリード端子の半
田付けに際してのフラックスとしても用いられるもので
あるため、本実施例では、引出し電極３ｄ，４ｄ及び容
量電極６上にも至るように、すなわち圧電振動部だけで
なく、引出し電極３ｄ，４ｄにも至るように付与されて
いる。Next, on the upper surface of the piezoelectric substrate 2, the wettability with respect to the solder resist ink is higher than that of the cavity forming material described later, and a nonionic halogen-based active material is used as a material that is absorbed when the exterior resin is thermally cured. The flux 10a containing the agent is applied. This flux 10a is
It is applied on the solder resist ink layers 9a and 9b.
In this case, the flux 10a is also used as a flux at the time of soldering the lead terminals, which will be described later. Therefore, in this embodiment, the flux 10a reaches the lead electrodes 3d and 4d and the capacitor electrode 6, that is, the piezoelectric vibration. Not only the portions but also the extraction electrodes 3d and 4d are provided.
【００２２】圧電基板２の下面においても、同様に、ソ
ルダーレジストインク層９ｃ，９ｄ上を覆うようにフラ
ックス１０ｂが塗布される。なお、下面におけるフラッ
クス１０ｂの塗布領域は、上面におけるフラックス１０
ａの塗布領域と圧電基板２を介して対向するように選択
されている。もっとも、圧電基板の上面及び下面におい
てフラックスの塗布領域は異なっていてもよい。On the lower surface of the piezoelectric substrate 2, the flux 10b is similarly applied so as to cover the solder resist ink layers 9c and 9d. The application area of the flux 10b on the lower surface is the flux 10b on the upper surface.
It is selected so as to face the coating area of a via the piezoelectric substrate 2. However, the flux application regions may be different on the upper surface and the lower surface of the piezoelectric substrate.
【００２３】次に、図１のソルダーレジストインク層９
ａ，９ｂが塗布されている領域上において、前述したフ
ラックス１０ａ上に、パラフィンワックス、マイクロク
リスタリンワックスなどの空洞形成材を塗布する。圧電
基板２の下面においても、同様に、ソルダーレジストイ
ンク層９ｃの上方においてフラックス１０ｂ上に空洞形
成材を塗布する。この状態を、図３（ａ）に部分切欠拡
大断面図で示す。図３（ａ）において、１２ａ，１２ｂ
は空洞形成材を示す。空洞形成材１２ａ，１２ｂは、空
洞を形成する領域に付与されている。すなわち、少なく
とも、共振７極４ａ，４ｂ，４ｃが対向している領域に
付与される。Next, the solder resist ink layer 9 shown in FIG.
A cavity forming material such as paraffin wax or microcrystalline wax is applied on the above-mentioned flux 10a in the regions where a and 9b are applied. Similarly, on the lower surface of the piezoelectric substrate 2, a cavity forming material is applied on the flux 10b above the solder resist ink layer 9c. This state is shown in FIG. In FIG. 3A, 12a and 12b
Indicates a cavity forming material. The cavity forming materials 12a and 12b are provided in the region forming the cavity. That is, at least the resonance 7 poles 4a, 4b, and 4c are provided in the region facing each other.
【００２４】しかる後、図４に略図的斜視図で示すよう
に、リード端子１３〜１５を半田付けにより接合する。
なお、図４では、ソルダーレジストインク層９ａ，９ｂ
及びフラックス１０ａは図示が省略されている。リード
端子１３，１５は、引出し電極３ｄ，４ｄに接続され、
リード端子１４は圧電基板２の下面の容量電極８に電気
的に接続される。Then, as shown in the schematic perspective view of FIG. 4, the lead terminals 13 to 15 are joined by soldering.
In FIG. 4, the solder resist ink layers 9a and 9b are used.
The illustration of the flux 10a and the flux 10a is omitted. The lead terminals 13 and 15 are connected to the extraction electrodes 3d and 4d,
The lead terminal 14 is electrically connected to the capacitive electrode 8 on the lower surface of the piezoelectric substrate 2.
【００２５】この場合、前述したフラックス１０ａ，１
０ｂが引出し電極３ｄ，４ｄ及び容量電極８上にも付与
されているので、半田付けに際してフラックスを塗布す
る工程を別途実施する必要はない。In this case, the above-mentioned fluxes 10a, 1
Since 0b is also provided on the extraction electrodes 3d and 4d and the capacitor electrode 8, it is not necessary to separately perform the step of applying flux during soldering.
【００２６】また、圧電共振部品によっては、中継容量
を構成する容量電極６上に、半田を塗布し、不要振動を
抑制する構造も知られている。このように、容量電極６
上に半田膜を形成する場合にも、容量電極６上にフラッ
クス１０ａが付与されているので、半田膜を容易に形成
することができる。Also, depending on the piezoelectric resonance component, a structure is known in which solder is applied on the capacitance electrode 6 forming the relay capacitance to suppress unnecessary vibration. In this way, the capacitive electrode 6
Even when a solder film is formed on the solder film, since the flux 10a is provided on the capacitor electrode 6, the solder film can be easily formed.
【００２７】すなわち、半田付けのためのフラックス塗
布装置、例えばフラックス塗布用点滴コテを用いて、フ
ラックス１０ａ，１０ｂの塗布を容易に行うことができ
る。従って、ソルダーレジストインク層９ａ，９ｂ，９
ｃ上に空洞形成材１２ａ，１２ｂが残留することを防止
するためのフラックス１０ａ，１０ｂの塗布と、半田付
けのためのフラックスの塗布と同じ工程で容易に行うこ
とができる。That is, it is possible to easily apply the fluxes 10a and 10b by using a flux applying apparatus for soldering, for example, a flux applying dipped iron. Therefore, the solder resist ink layers 9a, 9b, 9
The application of the fluxes 10a and 10b for preventing the cavity forming materials 12a and 12b from remaining on the c and the application of the flux for soldering can be easily performed in the same process.
【００２８】次に、リード端子１３〜１５を接合した
後、図４の一点鎖線Ａで示すように外装樹脂を塗布す
る。外装樹脂としては、熱硬化型のフィラー入りのエポ
キシ樹脂など、従来より加熱により硬化される適宜の熱
硬化型合成樹脂を用いることができる。Next, after the lead terminals 13 to 15 are joined, the exterior resin is applied as shown by the chain line A in FIG. As the exterior resin, an appropriate thermosetting synthetic resin that is conventionally cured by heating, such as a thermosetting epoxy resin containing a filler, can be used.
【００２９】さらに、外装樹脂を塗布した後、加熱し、
硬化させることにより、外装樹脂層Ａが形成される。こ
の場合、外装樹脂の熱硬化に際し、空洞形成材１２ａ，
１２ｂが溶融し、外装樹脂層Ａに吸収される。しかも、
溶融空洞形成材とフラックス１０ａ，１０ｂとの濡れ性
が溶融空洞形成材とソルダーレジストインクとの濡れ性
よりも良好であり、フラックス１０ａ，１０ｂが空洞形
成材と共に外装樹脂に吸収されるので、圧電振動部３，
４においては、図３（ｂ）に示す空洞Ｘが確実に形成さ
れる。Further, after coating the exterior resin, it is heated,
The exterior resin layer A is formed by curing. In this case, when thermosetting the exterior resin, the cavity forming material 12a,
12b is melted and absorbed by the exterior resin layer A. Moreover,
Since the wettability between the melt cavity forming material and the fluxes 10a and 10b is better than the wettability between the melt cavity forming material and the solder resist ink, and the fluxes 10a and 10b are absorbed by the exterior resin together with the cavity forming material. Vibration part 3,
In 4, the cavity X shown in FIG. 3 (b) is reliably formed.
【００３０】よって、空洞における空洞形成材の残留が
生じ難く、かつフラックス１０ａ，１０ｂの残留も生じ
難い。よって、ソルダーレジストインク層９ａ，９ｃに
よる周波数調整を行っている圧電共振素子１において、
空洞形成に際しての空洞形成材の残留等に起因する電気
的特性の低下を確実に抑制することができる。Therefore, the cavity forming material is unlikely to remain in the cavity, and the fluxes 10a and 10b are unlikely to remain. Therefore, in the piezoelectric resonance element 1 in which the frequency is adjusted by the solder resist ink layers 9a and 9c,
It is possible to reliably suppress the deterioration of the electrical characteristics due to the remaining of the cavity forming material when forming the cavity.
【００３１】なお、本実施例では、圧電基板２に第１，
第２の圧電振動部の，４と中継容量部とが構成されてい
る圧電フィルタの製造方法につき説明したが、本発明
は、エネルギー閉じ込め型の圧電共振子を用いた圧電発
振子などのさまざまなエネルギー閉じ込め型の圧電共振
部品の製造に適用することができる。また、圧電共振部
品だけでなく、振動を妨げないための空洞が必要とされ
る電子部品素子を用いた樹脂外装付きの電子部品に一般
的に適用することができる。In this embodiment, the first and second piezoelectric substrates 2 are formed.
The method of manufacturing the piezoelectric filter having the second piezoelectric vibrating section 4 and the relay capacitance section has been described. However, the present invention is applicable to various piezoelectric oscillators using an energy trapping type piezoelectric resonator. It can be applied to manufacture of an energy trap type piezoelectric resonance component. Further, it can be generally applied not only to the piezoelectric resonance component but also to an electronic component with a resin exterior using an electronic component element that requires a cavity for not hindering vibration.
【００３２】また、本実施例においては、空洞形成材と
して、ワックスを用いたが、シロキサンやナフタリンな
どの昇華性物質であってもよい。Although wax is used as the cavity forming material in this embodiment, it may be a sublimable substance such as siloxane or naphthalene.
【００３３】[0033]
【発明の効果】本発明に係る電子部品の製造方法では、
ソルダーレジストインク層を形成した後、少なくとも空
洞が形成される領域に、ソルダーレジストインクに対す
る濡れ性が空洞形成材よりも高く、外装樹脂層に吸収さ
れる材料が付与され、空洞が形成される領域において外
装樹脂の熱硬化に際して吸収される空洞形成材が付与さ
れ、該空洞形成材付与後に外装樹脂を塗布し、加熱によ
り外装樹脂が硬化される。従って、外装樹脂の加熱によ
る硬化時に、空洞形成材が溶融し、溶融空洞形成材が、
前記ソルダーレジストインクに対する濡れ性が溶融空洞
形成材よりも高い材料とともに外装樹脂側に確実に吸収
される。よって、ソルダーレジストインク層を形成して
例えば周波数調整を行った場合においても、空洞形成材
の空洞における残留を確実に抑制することができ、電気
的特性の安定な電子部品を確実に提供することができ
る。According to the method of manufacturing the electronic component of the present invention,
After forming the solder resist ink layer, a region where a cavity is formed by providing a material having a higher wettability to the solder resist ink than the cavity forming material and absorbed by the exterior resin layer in at least a region where the cavity is formed. In the above, a cavity forming material that is absorbed when the exterior resin is thermally cured is applied, the exterior resin is applied after the cavity forming material is applied, and the exterior resin is cured by heating. Therefore, when the exterior resin is cured by heating, the cavity forming material is melted, and the molten cavity forming material is
The wettability with respect to the solder resist ink is surely absorbed by the exterior resin together with the material having a higher wettability than the melt cavity forming material. Therefore, even when the solder resist ink layer is formed and the frequency is adjusted, for example, it is possible to reliably suppress the cavity forming material from remaining in the cavity, and to reliably provide an electronic component with stable electrical characteristics. You can
【００３４】ソルダーレジストインクに対する濡れ性が
空洞形成材よりも高く、かつ外装樹脂の熱硬化に際して
吸収される材料が、非イオン性のハロゲン系活性剤を含
むフラックスである場合には、リード端子等の半田付け
に際してのフラックスとしても利用し得るので、製造工
程を増加させることなく、本発明に係る電子部品を提供
することができる。When the wettability with respect to the solder resist ink is higher than that of the cavity forming material and the material absorbed when the exterior resin is thermally cured is a flux containing a nonionic halogen-based activator, lead terminals, etc. Since it can also be used as a flux for soldering, the electronic component according to the present invention can be provided without increasing the number of manufacturing steps.
【００３５】本発明は、外装樹脂中に空洞を設ける必要
があるさまざまな電子部品の製造に用いるが、電子部品
素子として第１，第２の振動電極が対向されている圧電
振動部を有する圧電共振素子を用いた場合には、本発明
に従って、圧電振動部の振動を妨げないための空洞を確
実に形成することができ、特性の安定な圧電共振部品を
提供することができる。The present invention is used for manufacturing various electronic parts in which a cavity is required to be provided in the exterior resin, but a piezoelectric vibrating portion having the first and second vibrating electrodes facing each other is used as an electronic part element. When the resonant element is used, according to the present invention, it is possible to surely form a cavity for preventing the vibration of the piezoelectric vibrating portion, and it is possible to provide a piezoelectric resonant component having stable characteristics.
【００３６】振動電極に連ねられた引出し電極がさらに
備えられており、前記フラックスが、圧電振動部だけで
なく引出し電極にも至るように付与されている場合に
は、該フラックスを利用してリード端子の引出し電極へ
の半田付けを容易に行うことができる。A lead-out electrode connected to the vibrating electrode is further provided, and when the flux is applied so as to reach not only the piezoelectric vibrating portion but also the lead-out electrode, the lead is formed by utilizing the flux. The terminal can be easily soldered to the lead electrode.
【図１】（ａ），（ｂ）は、本発明の一実施例において
用意される圧電フィルタ素子及び（ａ）におけるＡ−Ａ
線に沿う部分を拡大して占めす部分切欠断面図。1A and 1B are piezoelectric filter elements prepared in an embodiment of the present invention and AA in FIG.
The partial notch sectional view which expands and occupies the portion along a line.
【図２】本発明の一実施例において圧電フィルタ素子の
図面に形成される電極構造を説明するための底面図。FIG. 2 is a bottom view for explaining the electrode structure formed in the drawing of the piezoelectric filter element according to the embodiment of the present invention.
【図３】（ａ），（ｂ）は、本発明の一実施例におい
て、空洞形成材を塗布した状態及び加熱により空洞が形
成された状態を説明するための各部分切欠拡大断面図。3 (a) and 3 (b) are enlarged partial cross-sectional views for explaining a state in which a cavity forming material is applied and a state in which a cavity is formed by heating, in one embodiment of the present invention.
【図４】本発明の一実施例において、圧電フィルタ素子
に接合されるリード端子及び外装樹脂層を説明するため
の略図的斜視図。FIG. 4 is a schematic perspective view for explaining a lead terminal and an exterior resin layer bonded to the piezoelectric filter element in the embodiment of the present invention.
１…電子部品素子としての圧電フィルタ素子 ２…圧電基板 ３，４…第１，第２の圧電振動部 ３ａ，３ｂ…第１の振動電極 ３ｃ…第２の振動電極 ３ｄ…引出し電極 ４ａ，４ｂ…第１の振動電極 ４ｃ…第２の振動電極 ４ｄ…引出し電極 ６…容量電極 ８…容量電極 ９ａ，９ｂ，９ｃ，９ｄ…ソルダーレジストインク層 １０ａ，１０ｂ…フラックス １２ａ，１２ｂ…空洞形成材 １３〜１５…リード端子 Ａ…外装樹脂層 Ｘ…空洞 1 ... Piezoelectric filter element as electronic component element 2 ... Piezoelectric substrate 3, 4 ... First and second piezoelectric vibrating portions 3a, 3b ... First vibrating electrode 3c ... Second vibrating electrode 3d ... Extraction electrode 4a, 4b ... First vibrating electrode 4c ... Second vibrating electrode 4d ... Extraction electrode 6 ... Capacitance electrode 8 ... Capacitance electrode 9a, 9b, 9c, 9d ... Solder resist ink layer 10a, 10b ... Flux 12a, 12b ... Cavity forming material 13 to 15 ... Lead terminal A ... Exterior resin layer X ... cavity
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H03H 3/00 - 3/10 H03H 9/00 - 9/215 H01L 21/56 H01L 23/28 - 23/31 Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H03H 3/00-3/10 H03H 9/00-9/215 H01L 21/56 H01L 23/28-23/31
Claims (4)
により形成された空洞を有する外装樹脂層を備える電子
部品の製造方法であって、 電子部品素子を用意する工程と、 前記電子部品素子の外周面の少なくとも一部にソルダー
レジストインク層を形成する工程と、 前記ソルダーレジストインク層上において、少なくとも
前記空洞が形成される領域にソルダーレジストインクに
対する濡れ性が空洞形成材よりも高く、外装樹脂の熱硬
化時に外装樹脂層に吸収される材料を付与する工程と、 前記空洞が形成される領域において外装樹脂の熱硬化に
際して吸収される空洞形成材を付与する工程と、 前記空洞形成材を付与した後に、電子部品素子の外表面
を覆うように外装樹脂を塗布し、加熱により硬化させる
工程とを備えることを特徴とする、電子部品の製造方
法。1. A method of manufacturing an electronic component including an exterior resin layer having a cavity formed by absorbing a cavity-forming material at the time of heat curing, the method comprising: preparing an electronic component element; A step of forming a solder resist ink layer on at least a part of the outer peripheral surface, and a wettability with respect to the solder resist ink is higher than that of the cavity forming material on at least a region where the cavity is formed on the solder resist ink layer, and an exterior resin The step of applying a material that is absorbed into the exterior resin layer during the heat curing of the step, the step of applying a cavity forming material that is absorbed during the heat curing of the exterior resin in the region where the cavity is formed, and the step of applying the cavity forming material. After that, a step of applying an exterior resin so as to cover the outer surface of the electronic component element, and curing the resin by heating, Method of manufacturing a child parts.
れ性が空洞形成材よりも高く、かつ外装樹脂の熱硬化に
際して吸収される材料が、非イオン性のハロゲン系活性
剤を含むフラックスである，請求項１に記載の電子部品
の製造方法。2. The flux having a higher wettability with respect to the solder resist ink than that of the cavity-forming material and absorbed when the exterior resin is thermally cured is a flux containing a nonionic halogen-based activator. A method of manufacturing an electronic component as described in.
基板を介して対向するように形成された第１，第２の振
動電極とを備える圧電共振素子であり、第１，第２の振
動電極が対向している部分が圧電振動部を構成してお
り、該圧電振動部の振動を妨げないように前記空洞が形
成される、請求項１または２に記載の電子部品の製造方
法。3. The piezoelectric resonance element, wherein the electronic component element includes a piezoelectric substrate and first and second vibrating electrodes formed to face each other with the piezoelectric substrate interposed therebetween. The method for manufacturing an electronic component according to claim 1, wherein the portions where the vibrating electrodes face each other constitute a piezoelectric vibrating portion, and the cavity is formed so as not to interfere with the vibration of the piezoelectric vibrating portion.
さらに備え、前記フラックスが、前記圧電振動部だけで
なく、引出し電極にも至るように付与されている、請求
項３に記載の電子部品の製造方法。4. The electronic component according to claim 3, further comprising an extraction electrode connected to the vibrating electrode, wherein the flux is applied not only to the piezoelectric vibrating portion but also to the extraction electrode. Manufacturing method.
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| JPS63110760A (en) * | 1986-10-29 | 1988-05-16 | Murata Mfg Co Ltd | Electronic component and manufacture thereof |
| JPH04256209A (en) * | 1991-02-07 | 1992-09-10 | Murata Mfg Co Ltd | Forming method for electronic parts and armoring |
| JPH04337912A (en) * | 1991-05-14 | 1992-11-25 | Murata Mfg Co Ltd | Manufacture of piezoelectric equipment |
| JP3214212B2 (en) * | 1994-02-03 | 2001-10-02 | 株式会社村田製作所 | Electronic component manufacturing method |
-
2000
- 2000-06-27 JP JP2000193298A patent/JP3435637B2/en not_active Expired - Fee Related
-
2001
- 2001-06-26 KR KR10-2001-0036551A patent/KR100394453B1/en active IP Right Grant
- 2001-06-27 CN CNB011226633A patent/CN1161833C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020001606A (en) | 2002-01-09 |
| JP2002016464A (en) | 2002-01-18 |
| CN1331512A (en) | 2002-01-16 |
| CN1161833C (en) | 2004-08-11 |
| KR100394453B1 (en) | 2003-08-14 |
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