CN1161833C - Mfg. method of electronic components - Google Patents
Mfg. method of electronic components Download PDFInfo
- Publication number
- CN1161833C CN1161833C CNB011226633A CN01122663A CN1161833C CN 1161833 C CN1161833 C CN 1161833C CN B011226633 A CNB011226633 A CN B011226633A CN 01122663 A CN01122663 A CN 01122663A CN 1161833 C CN1161833 C CN 1161833C
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- Prior art keywords
- cavity
- electronic component
- piezoelectric
- resin
- forms
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 229910000679 solder Inorganic materials 0.000 claims abstract description 36
- 230000004907 flux Effects 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 45
- 238000003466 welding Methods 0.000 claims description 43
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 24
- 238000000605 extraction Methods 0.000 claims description 14
- 230000003213 activating effect Effects 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000011247 coating layer Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 9
- 239000001993 wax Substances 0.000 description 8
- 230000004927 fusion Effects 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- -1 siloxanes Chemical class 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention provides a method for producing an electronic component having an outer resin layer formed by working the cavity in a part applied with a solder resist ink layer. Solder resist ink layers 9a, 9b and 9c are formed on a filter element 1, fluxes 10 and 11, with which wetness in respect to a solder resist ink is higher than that of the wax for cavity formation, a wax 12 for cavity formation is applied in a cavity forming area and afterwards, an outer resin A is applied and hardened by heating. The producing method of the present invention makes a wax for cavity formation hardly left inside a cavity.
Description
Technical field
Energy closes the manufacture method that is located at the electronic component of outer dress resin bed into the cavity of the such vibration of type piezo-electric resonator to the present invention relates to for example to be used for not hindering, and more particularly, relates to the manufacture method of formation method in cavity being carried out improved electronic component.
Background technology
In the past, be extensive use of energy as resonator or band pass filter and close piezoelectric resonant element into type.Close in the piezoelectric resonant element of type at energy, must formation do not hinder the encapsulation of the vibration of piezoelectric vibration portion.Therefore, outside having, in the piezoelectric resonant element of dress resin bed, adorn the cavity that is formed with the vibration usefulness that does not hinder piezoelectric vibration portion in the resin bed outside.
When manufacturing has the piezoelectric resonant element in above-mentioned cavity, at first, the extraction electrode that formation and vibrating electrode are connected with vibrating electrode on two interareas of piezoelectric substrate.Conductor terminal is connected in the piezoelectric resonant unit that is obtained like this.Then, apply wax in piezoelectric vibration portion.Then, apply outer dress resin, utilize heating to make its sclerosis.Should adorn resin outward when heat hardening, wax is adorned resin side outward and is absorbed and the formation cavity.
, in the piezoelectric resonant element, require the irregular of centre frequency reduced.Therefore, use the method for coating welding protection film (Solderresisting) on the vibrating electrode of piezoelectric resonant unit in order to carry out the frequency adjustment.
In the occasion that above-mentioned welding protection coating is coated on the vibrating electrode, after applying the welding protection coating, just the wax that forms empty usefulness can be coated on the welding protection coating.
As previously mentioned, the wax after the coating is melted when adorning the thermmohardening of resin outside, utilizes capillarity to be adorned resin outward and absorbs into.But, wax is coated on occasion on the welding protection coating, the wettability situation of molten wax and welding protection coating is bad, and wax is adorned being absorbed of resin side outside and is often become incomplete.Therefore, will outside adorn resin and carry out thermmohardening and form outer dress resin bed after, the part of wax remains on the vibrating electrode by the welding protection coating, often makes the electrical characteristic reduction.
The problems referred to above produce because of environmental variations and the outer change of adorning resin material self etc., owing to the ratio of the piezoelectric resonant element that applies the welding protection coating is higher, so become the main cause that the qualification rate of piezoelectric resonant element reduces.
Summary of the invention
Purpose of the present invention, it is the shortcoming that to eliminate in the above-mentioned conventional art, a kind of manufacture method of electronic component is provided, even this method is using welding to keep the organic material of coating etc. to carry out the occasion that frequency is adjusted, also can adorn outside on the resin bed and to absorb the cavity reliably and form material, can suppress the cavity effectively and form the residual of material.
Adopt the technical scheme of broadness of the present invention; provide a kind of manufacture method of electronic component; described electronic component comprises the outer dress resin bed in cavity; described cavity forms by absorbing cavity formation material when heat hardening; wherein; described manufacture method comprises following operation: the operation of preparing electronic component unit; on at least a portion of the outer peripheral face of described electronic component unit, form the operation of welding protection rete; on described welding protection rete; at least on the zone that forms described cavity; apply the operation that forms the high material of material with respect to the relative wettability of welding protection film than the cavity; being adorned resin bed when described material is adorned the resin thermmohardening outside outward absorbs; absorbed cavity forms the operation of material when adorning the resin thermmohardening outside being applied on the zone that forms described cavity; with after applying described cavity formation material; the outer dress of coating resin; so that the outer surface of overlay electronic cell; and the operation of utilizing heating to harden; relative wettability with respect to described welding protection film forms the material height than the cavity, and absorbed material is the solder flux that contains the halogen activating agent of nonionic when adorning the resin thermmohardening outside.
In addition, in the specific technical scheme of the present invention, above-mentioned electronic component unit is to comprise piezoelectric substrate and the piezoelectric resonant unit of the 1st, the 2nd vibrating electrode that relatively forms by piezoelectric substrate, 1st, the 2nd vibrating electrode is relative part constitutes energy and closes piezoelectric vibration portion into type, and above-mentioned cavity is formed the vibration that does not hinder described piezoelectric vibration portion.
In addition, in the another specific technical scheme of the present invention, further comprise the extraction electrode that is connected with vibrating electrode, welding keeps coating not only to be applied to piezoelectric vibration portion, also is applied to above-mentioned extraction electrode.
Description of drawings
Fig. 1 (a) and (b) are piezoelectric filter unit of representing in one embodiment of the invention respectively to be prepared and amplify shared part side cross sectional view along the part of A-A line in (a).
Fig. 2 is used to illustrate the ground plan of formed electrode structure on the accompanying drawing of piezoelectric filter unit in an embodiment of the present invention.
The (a) and (b) of Fig. 3 are to be used to illustrate that being coated with the space in an embodiment of the present invention forms the each several part that state behind the material and utilization add the state behind the thermosetting cavity and dissect amplification view.
Fig. 4 is used to illustrate conductor terminal and the outer stereogram of adorning the sketch map of resin bed that engages with the piezoelectric filter unit in an embodiment of the present invention.
Embodiment
Below, on one side attached with reference to figure, understand the present invention by the explanation specific embodiments of the invention on one side.
With reference to Fig. 1～Fig. 4, the manufacture method of the piezoelectric resonant element of one embodiment of the invention is described.
At first, the piezoelectric resonant unit 1 shown in the set-up dirgram 1 (a).Piezoelectric resonant unit 1 is the member that constitutes band pass filter, the piezoelectric substrate 2 with rectangular plate shape.Piezoelectric substrate 2 is made of the piezoelectricity single crystals of such piezoelectric ceramic of the plumbous system of zirconia titanate diamond stone pottery or crystal etc.
On piezoelectric substrate 2, constitute the 1st, the 2nd piezoelectric vibration portion 3,4.In piezoelectric vibration portion 3, on piezoelectric substrate 2, be separated with the compartment of terrain and forming a pair of the 1st vibrating electrode 3a, 3b.Shown in the ground plan of Fig. 2, below piezoelectric substrate 2, forming the 2nd vibrating electrode 3c in the position relative with vibrating electrode 3a, 3b.
Equally, in the 2nd piezoelectric vibration portion 4, on piezoelectric substrate 2, forming a pair of the 1st vibrating electrode 4a, 4b, below piezoelectric substrate 2, relatively forming the 2nd vibrating electrode 4c with vibrating electrode 4a, 4b.
Be formed with the extraction electrode 3d that is connected with vibrating electrode 3b.And vibrating electrode 3a, 4a utilize connection conductive part 5 to be electrically connected.On connection conductive part 5, be connected with capacitance electrode 6.
In the 2nd piezoelectric vibration portion 4, vibrating electrode 4a be connected conductive part and connect.And, be formed with the extraction electrode 4d that is connected with vibrating electrode 4b.
Below piezoelectric substrate 2, the 2nd vibrating electrode 3c, 4c utilize connection conductive part 7 to be electrically connected, and are connecting the electric capacitance electrode 8 that is connected with on the conductive part 7.Capacitance electrode 8 is relative with capacitance electrode 6 by piezoelectric substrate 2, constitutes relaying electric capacity thus.
In the present embodiment, at first, prepare on piezoelectric substrate 2 and below on the piezoelectric resonant unit 1 of above-mentioned each electrode of formation.
Then, in order to realize the frequency adjustment, make welding keep coating layer 9a, 9b to form the state of the piezoelectric vibration portion 3,4 of covering the 1st, the 2nd.Shown in Fig. 1 (a), welding keeps coating layer 9a, 9b to form the state of the piezoelectric vibration portion 3,4 of covering the 1st, the 2nd.And, below piezoelectric substrate 2, also form to cover the state of the 1st, the 2nd piezoelectric vibration portion, promptly as shown in Figure 2, form that welding keeps coating layer 9c, (Fig. 1 (b) is capped the state of vibrating electrode 3c, 4c to 9d.
Fig. 1 (b) is that expression will be amplified the rear section side cross sectional view along the part of arrow A-A of Fig. 1, and what be illustrated in piezoelectric substrate 2 forms state after welding keeps coating layer 9a, 9c up and down.
Then, on piezoelectric substrate 2, the halogen that absorbed material coating contains nonionic when forming material than cavity described later and keep the high and thermmohardening that adorn resin outside of the wettability of coating for welding is the solder flux 10a of activating agent.This solder flux 10a is coated on welding and keeps on coating layer 9a, the 9b.At this moment, solder flux 10a is owing to being the solder flux that is used as conductor terminal welding described later, so in the present embodiment, also be applied on extraction electrode 3d, 4d and the capacitance electrode 6, that is to say, not only solder flux is applied to piezoelectric vibration portion, but also is applied on extraction electrode 3d, the 4d.
Below piezoelectric substrate 2, keep the state of coating layer 9c, 9d being coated with solder flux 10b to cover welding too.In addition, the dispensing area of the solder flux 10b that goes up below is chosen to clip the piezoelectric substrate 2 ground state relative with the dispensing area of superincumbent solder flux 10a., also can make on piezoelectric substrate different with the dispensing area of following solder flux.
Then, keep in the welding that is coated with Fig. 1 on the zone of coating layer 9a, 9b, the cavity that is coated with paraffin, microcrystalline wax etc. on described solder flux 10a forms material.Below piezoelectric substrate 2, the coating cavity forms material on the solder flux 10b above the welding maintenance coating layer 9c too.Dissect amplification view with the part of Fig. 3 (a) and represent this state.In Fig. 3 (a), 12a, 12b represent that the cavity forms material.The cavity forms material 12a, 12b and is applied to the zone that forms the cavity.That is to say, be applied at least on the zone relative with resonance electrode 4a, 4b, 4c.
Then, shown in the stereogram of Fig. 4 sketch, connect conductor terminal 13～15 with welding.In addition, in Fig. 4, diagram is omitted welding and is kept coating layer 9a, 9b and solder flux 10a.Conductor terminal 13,15 is connected with extraction electrode 3d, 4d.The capacitance electrode 8 of conductor terminal 14 below piezoelectric substrate 2 is electrically connected.
This occasion also is applied on extraction electrode 3d, 4d and the capacitance electrode 8 owing to described solder flux 10a, 10b, so do not need the operation of other enforcement coating solder flux when welding.
In addition, adopt the piezoelectric resonant element, the coating scolder becomes the structure that suppresses unwanted vibration on the capacitance electrode 6 that constitutes relaying electric capacity, and this is that people know.Like this, on capacitance electrode 6, form the occasion of solder film, owing on capacitance electrode 6, be applied with solder flux 10a, so can form solder film easily.
That is to say that the solder flux apparatus for coating that is used to weld uses for example solder flux coating to use the drop trowel, can easily carry out the coating of solder flux 10a, 10b.Therefore, in order to prevent that the cavity from forming material 12a, 12b and remaining in welding and keep coating layer 9a, 9b, 9c last and to be coated with solder flux 10a, 10b and to be coated with solder flux in order welding and can easily carry out with same operation.
Then, after to conductor terminal 13～15 welding, the outer dress of coating resin shown in the chain-dotted line A of Fig. 4.Can use the suitable in the past thermmohardening type synthetic resin that utilizes heat hardening of epoxy resin geometric ratio of the adding filler of thermmohardening type as outer dress resin.
Also have, outside coating, behind the dress resin, make its sclerosis form outer dress resin bed A by heating.When this occasion was adorned the resin thermmohardening outside making, the cavity formed material 12a, 12b fusion and is adorned resin bed A outward and absorb.And, formation material in fusion cavity keeps the wettability of coating good with the wettability of solder flux 10a, 10b than the empty formation of fusion material and welding, because solder flux 10a, 10 forms the material while with the cavity and is adorned resin outward and absorb, so form the empty X shown in Fig. 3 (b) reliably in piezoelectric vibration portion 3,4.
Therefore, be difficult in the cavity, produce the cavity and form the residual of material, and also be difficult to produce the residual of solder flux 10a, 10b.Therefore, utilize welding to keep carrying out in the piezoelectric resonant unit 1 that frequency adjusts of coating layer 9a, 9c, can suppress the reduction of the electrical characteristic that the residual grade of the cavity formation material when forming in the space causes reliably.
Also have, in the present embodiment, although understand on piezoelectric substrate 2 manufacture method of the piezoelectric filter that constitutes the 1st, the 2nd piezoelectric vibration portion 3,4 and relaying capacitance part, but the present invention also closes manufacturing into the piezoelectric resonant element of type applicable to using energy to close various energy into the piezo-electric resonator of type etc.And, be not only the piezoelectric resonant element, generally also do not hinder the band of the use electronic component unit in the cavity that vibrates usefulness to adorn the electronic component of resin outward applicable to needs.
In addition, in the present embodiment, form material as the cavity and be to use solder flux, but also can be the sublimate of siloxanes or naphthalene etc.
In the manufacture method of electronic component of the present invention, after forming welding maintenance membrane layers, at least apply in the zone that forms the cavity and form material than the cavity and keep for welding adorning the material that resin bed absorbs outside the high quilt of the wettability of coating, absorbed cavity forms material when adorning the resin thermmohardening outside the zone that forms the cavity is applied to, dress resin outside the coating after applying this cavity to form material utilizes heating to make outer dress hardening of resin.Therefore, when adorning the heat hardening of resin outside, the fusion of empty formation material, it is to keep the wettability material higher than the cavity formation material of fusion of coating also can be adorned the resin side absorption reliably outward for described welding that the cavity of fusion forms material.Therefore, form welding protection coating layer and carrying out for example adjusted occasion of frequency, also can control the cavity reliably and form material residual in the cavity, can provide electrical characteristic stable electronic component reliably.
Than the cavity form material for the wettability of welding protection coating during high and thermmohardening that adorn resin outside absorbed material to adopt at the halogen that contains nonionic be the occasion of the solder flux of activating agent; owing to also can be used as the solder flux when welding such as conductor terminal, so electronic component of the present invention is provided with can not can increasing manufacturing process.
Though the present invention is used for adorning outside the manufacturing that resin must be provided with the various electronic components in cavity, but be used as the occasion of electronic component unit in the piezoelectric resonant unit that will have the relative piezoelectric vibration portion of the 1st, the 2nd vibrating electrode, according to the present invention, can form the cavity of the vibration usefulness that does not hinder piezoelectric vibration portion reliably, the piezoelectric resonant element of stability of characteristics can be provided.
Also have the extraction electrode that is connected with vibrating electrode, not only be applied to piezoelectric vibration portion but also be applied to the occasion of extraction electrode, utilize solder flux also can easily carry out the welding of conductor terminal to extraction electrode at described solder flux.
Claims (3)
1. the manufacture method of an electronic component, described electronic component comprise the outer dress resin bed in cavity, and described cavity forms material and forms by absorbing the cavity when heat hardening, it is characterized in that described manufacture method comprises following operation:
The operation of preparation electronic component unit,
On at least a portion of the outer peripheral face of described electronic component unit, form the welding protection rete operation,
On described welding protection rete, forming on the zone in described cavity at least, apply with respect to the relative wettability of welding protection film and form the operation of the high material of material than the cavity, adorned outward when described material is adorned the resin thermmohardening outside resin bed absorb,
When on forming the zone in described cavity, being applied to outer dress resin thermmohardening the operation of absorbed cavity formation material and
After applying described cavity formation material, the outer dress of coating resin, so that the outer surface of overlay electronic cell, and utilize and heat the operation of hardening,
Relative wettability with respect to described welding protection film forms the material height than the cavity, and absorbed material is the solder flux that contains the halogen activating agent of nonionic when adorning the resin thermmohardening outside.
2. the manufacture method of electronic component as claimed in claim 1 is characterized in that,
Described electronic component unit is to comprise piezoelectric substrate and the piezoelectric resonant unit of the 1st, the 2nd vibrating electrode that relatively forms by piezoelectric substrate,
1st, the part that the 2nd vibrating electrode is relative constitutes piezoelectric vibration portion,
And described cavity is formed and does not hinder the vibration of described piezoelectric vibration portion.
3. the manufacture method of electronic component as claimed in claim 2 is characterized in that,
Also comprise the extraction electrode that is connected with described vibrating electrode,
Described solder flux not only is applied to described piezoelectric vibration portion, but also is applied on the extraction electrode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP193298/2000 | 2000-06-27 | ||
| JP2000193298A JP3435637B2 (en) | 2000-06-27 | 2000-06-27 | Electronic component manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1331512A CN1331512A (en) | 2002-01-16 |
| CN1161833C true CN1161833C (en) | 2004-08-11 |
Family
ID=18692314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011226633A Expired - Fee Related CN1161833C (en) | 2000-06-27 | 2001-06-27 | Mfg. method of electronic components |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3435637B2 (en) |
| KR (1) | KR100394453B1 (en) |
| CN (1) | CN1161833C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3438709B2 (en) * | 2000-08-31 | 2003-08-18 | セイコーエプソン株式会社 | Piezoelectric device, method of manufacturing the same, and method of manufacturing piezoelectric oscillator |
| KR100667164B1 (en) * | 2004-07-06 | 2007-01-12 | (주)한국해외기술공사 | A Forming Method For PSC Beam in whieh Bars are Laid |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110760A (en) * | 1986-10-29 | 1988-05-16 | Murata Mfg Co Ltd | Electronic component and manufacture thereof |
| JPH04256209A (en) * | 1991-02-07 | 1992-09-10 | Murata Mfg Co Ltd | Forming method for electronic parts and armoring |
| JPH04337912A (en) * | 1991-05-14 | 1992-11-25 | Murata Mfg Co Ltd | Manufacture of piezoelectric equipment |
| JP3214212B2 (en) * | 1994-02-03 | 2001-10-02 | 株式会社村田製作所 | Electronic component manufacturing method |
-
2000
- 2000-06-27 JP JP2000193298A patent/JP3435637B2/en not_active Expired - Fee Related
-
2001
- 2001-06-26 KR KR10-2001-0036551A patent/KR100394453B1/en active IP Right Grant
- 2001-06-27 CN CNB011226633A patent/CN1161833C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100394453B1 (en) | 2003-08-14 |
| JP3435637B2 (en) | 2003-08-11 |
| JP2002016464A (en) | 2002-01-18 |
| CN1331512A (en) | 2002-01-16 |
| KR20020001606A (en) | 2002-01-09 |
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