JP3432071B2 - Resin composition for wire sealing casting and wire sealing method - Google Patents
Resin composition for wire sealing casting and wire sealing methodInfo
- Publication number
- JP3432071B2 JP3432071B2 JP07478896A JP7478896A JP3432071B2 JP 3432071 B2 JP3432071 B2 JP 3432071B2 JP 07478896 A JP07478896 A JP 07478896A JP 7478896 A JP7478896 A JP 7478896A JP 3432071 B2 JP3432071 B2 JP 3432071B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- casting
- resin composition
- wire sealing
- electric wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Insulating Bodies (AREA)
- Processing Of Terminals (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、複数本の組電線用
素線(電線またはケーブル)のジョイント端末相互を1
つの接続体内(注型容器)で接続処理してなる屋内用組
電線用の電線封止注型用樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to connecting joint ends of a plurality of assembled wires (electric wires or cables) to each other.
The present invention relates to an electric wire sealing casting resin composition for an indoor assembled electric wire, which is obtained by performing connection processing in one connected body (casting container).
【0002】[0002]
【従来の技術】電線やケーブル(以下、単に「電線」と
云う)の端部或いは接続部を絶縁するために封止する
際、図1に示すように複数の電線1の端部を硬質塩化ビ
ニル樹脂等の材質の注型容器2に入れ、これに樹脂組成
物3を注入し、硬化させる封止注型作業を行う。なお、
この図は、電線1の導体4をジョイント端子5で接続し
たものを封止している状態を示す。ここで、樹脂組成物
としてはエポキシ樹脂などの熱硬化性樹脂を用いる。す
なわち主剤と硬化剤とを混合注型機を用いて混合して注
型し、10数分から数時間で硬化の完了とともに封止作
業が完了する。なお、これら樹脂は硬化反応開始と共に
発熱するものが主として用いられる。また、内部の樹脂
の硬化後、注型容器2は樹脂部の保護を行うジョイント
キャップとなる。2. Description of the Related Art When sealing an end portion or a connecting portion of an electric wire or a cable (hereinafter, simply referred to as "electric wire") for insulation, as shown in FIG. A sealing casting operation is performed in which a casting container 2 made of a material such as vinyl resin is placed, and the resin composition 3 is injected into the casting container 2 and cured. In addition,
This figure shows a state in which the conductor 4 of the electric wire 1 is connected by a joint terminal 5 and is sealed. Here, a thermosetting resin such as an epoxy resin is used as the resin composition. That is, the main agent and the curing agent are mixed and cast using a mixing and casting machine, and the curing work is completed and the sealing work is completed in 10 minutes to several hours. It should be noted that these resins are mainly used that generate heat when the curing reaction starts. Further, after the resin inside is cured, the casting container 2 becomes a joint cap that protects the resin portion.
【0003】ここで、その樹脂硬化時の発熱が問題とな
っていた。すなわち、硬化により温度が注型容器内で9
0℃以上140℃近くまで上がるため、材質によっては
注型容器自体が変形して使えなくなるものもあり、ま
た、製品価値を著しく損なうことがあった。これに対し
て容器外部から冷却する等の手段も可能ではあるが、水
分の混入等による絶縁不良が懸念される上、コスト的、
設備的理由からも採用できなかった。Here, the heat generated when the resin is cured has been a problem. That is, curing causes the temperature to drop to 9
Since the temperature rises from 0 ° C to nearly 140 ° C, the casting container itself may be deformed and unusable depending on the material, and the product value may be significantly impaired. On the other hand, means such as cooling from the outside of the container is also possible, but there is concern about insulation failure due to mixing of water, etc.
It could not be adopted due to equipment reasons.
【0004】[0004]
【発明が解決しようとする課題】本発明は安価な硬質塩
化ビニル樹脂やポリオレフィン系樹脂などの耐熱性の低
い材質からなる注型容器を使用することが可能で、ま
た、注型容器の熱変形による商品価値の低下を未然に防
ぐことのできる電線封止注型用樹脂組成物を提供するこ
とを目的とする。DISCLOSURE OF THE INVENTION The present invention can use a casting container made of a material having low heat resistance such as inexpensive hard vinyl chloride resin or polyolefin resin, and the thermal deformation of the casting container can be used. An object of the present invention is to provide a resin composition for electric wire encapsulation casting, which can prevent a decrease in commercial value due to the above.
【0005】[0005]
【課題を解決するための手段】本発明の電線封止注型用
樹脂組成物は、請求項1に記載のように非通気性、非吸
湿性でかつ絶縁性の添加材として粒径が10μm以上1
2μm以下のビーズ状のガラスが添加されている構成を
有する。本発明の電線封止注型用樹脂組成物は、含有さ
れるベース樹脂成分が硬化により発熱しても、発熱に関
与しない添加材が混合しているため発熱量が少なくな
り、従って注型容器の変形等が未然に防止される。The electric wire sealing casting resin composition of the present invention has a particle diameter of 10 μm as a non-breathable, non-hygroscopic and insulating additive as described in claim 1. Above 1
It has a structure in which bead-shaped glass of 2 μm or less is added. The electric wire sealing casting resin composition of the present invention, even if the contained base resin component generates heat due to curing, the amount of heat generation is small because the additive material that does not participate in heat generation is mixed, and therefore the casting container Deformation and the like are prevented in advance.
【0006】[0006]
【発明の実施の形態】本発明において、添加材は絶縁性
を有することが必要である。また、水分等が内部に入り
込んで封止物内部の絶縁が失われたりすることのないよ
う、非通気性、非吸湿性であることが必要である。ま
た、電線封止注型用樹脂組成物のベース樹脂成分との密
着性に優れているものを選択する必要がある。このよう
なものとしては、ナイロン樹脂やフェノール樹脂等の樹
脂からなる粉体や球状体等、或いはガラス、シリカ等の
無機質からなる粉体や粒状体等を使うことができる。な
お、樹脂等に比べ、一般に熱膨張率が比較的少なく、か
つ、絶縁性の高い点でガラスからなるものであることが
望ましい。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the additive must have an insulating property. Further, in order to prevent moisture and the like from entering the inside and losing the insulation inside the sealed product, it is necessary to be non-air-permeable and non-hygroscopic. Further, it is necessary to select a resin composition for electric wire encapsulation casting which has excellent adhesion to the base resin component. As such a material, a powder or spherical body made of a resin such as a nylon resin or a phenol resin, or a powder or a granular body made of an inorganic material such as glass or silica can be used. It is preferable that the glass is made of glass because it generally has a relatively low coefficient of thermal expansion as compared with resin and has a high insulating property.
【0007】ここで、硬化後の樹脂の絶縁性(体積抵抗
率)が1012Ω・cm以上で、かつ、耐電圧性が15k
V以上であることが必要とされる。Here, the cured resin has an insulating property (volume resistivity) of 10 12 Ω · cm or more and a withstand voltage of 15 k.
It is required to be V or more.
【0008】また、添加材の形状としてはベース樹脂成
分との混合性に優れ、気泡等の「抱き込み」の少ない形
状を選択する必要がある。また、硬化後外部から電線端
部までに連続気泡等が生じない必要があるため、非繊維
状の形態であることが望ましい。なお、繊維状でも繊維
長が1mm程度以下のものは上記連続気泡等が生じにく
いので、予め検討した上で選択して可能である。なお、
ほぼ球状の添加材が絶縁性や混練性の点から最も良好で
ある。この場合、粒径は10μm以上12μm以下であ
ることが望ましい。10μm未満であるとベース樹脂成
分と均一に混合することが困難となって発熱量を下げる
ことができず、12μm超であると球状になりにくいか
らである。このような球状で適切な粒径を有するガラス
やシリカを得る方法として火炎燃焼法が知られている。
この方法によると良好な球状の粒子を得ることができ
る。Further, as the shape of the additive material, it is necessary to select a shape which is excellent in the mixing property with the base resin component and in which "embracing" of bubbles and the like is small. In addition, since it is necessary that continuous cells and the like do not occur from the outside to the end of the wire after curing, the non-fibrous form is preferable. It should be noted that even if it is fibrous and has a fiber length of about 1 mm or less, the above-mentioned open cells and the like are unlikely to occur, and therefore, it can be selected after examination in advance. In addition,
The substantially spherical additive is the best in terms of insulating property and kneading property. In this case, the particle size is preferably 10 μm or more and 12 μm or less. This is because if it is less than 10 μm, it is difficult to uniformly mix it with the base resin component and the amount of heat generation cannot be reduced, and if it is more than 12 μm, it is difficult to form a spherical shape. The flame combustion method is known as a method for obtaining such spherical and glass or silica having an appropriate particle diameter.
According to this method, good spherical particles can be obtained.
【0009】また添加材の添加量としては樹脂成分を1
40重量部としたときに5重量部以上100重量部以下
であることが望ましい。5重量部未満であると本発明の
効果が得られにくくなり、100重量部超であると、樹
脂と混合した場合に粘度が高くなりすぎて取扱性が低下
する。Further, the resin component is 1 as the additive amount of the additive material.
When the amount is 40 parts by weight, the amount is preferably 5 parts by weight or more and 100 parts by weight or less. If it is less than 5 parts by weight, the effect of the present invention is difficult to obtain, and if it exceeds 100 parts by weight, the viscosity becomes too high when mixed with a resin, and the handleability is deteriorated.
【0010】また、添加材と共に本発明の樹脂組成物を
構成するベース樹脂としては電線封止に用いられる通常
の樹脂を用いることができる。なお、特に成形性、絶縁
性及び耐電圧性に優れているため、エポキシ樹脂、或い
は、これを改良したエポキシ系樹脂を用いることが望ま
しい。添加材添加後の樹脂の粘度としては、25℃にお
いて100cP以上5000cP以下であることが望ま
しい。100cP未満であると硬化するまでに長時間を
要し、5000cP超であると流動性が低下し注型成形
性が著しく低下する。なお、エポキシ樹脂などに見られ
るように2液性の樹脂を用いる場合には、これら及び添
加材を混合した直後の粘度が上記範囲にあることが望ま
しい。As the base resin which constitutes the resin composition of the present invention together with the additive, a usual resin used for electric wire sealing can be used. It is desirable to use an epoxy resin or an epoxy resin obtained by improving the epoxy resin because it is particularly excellent in moldability, insulation and withstand voltage. The viscosity of the resin after the addition of the additive is preferably 100 cP or more and 5000 cP or less at 25 ° C. If it is less than 100 cP, it takes a long time to cure, and if it exceeds 5000 cP, the fluidity is lowered and the castability is remarkably lowered. When a two-component resin such as an epoxy resin is used, it is desirable that the viscosity immediately after mixing these and the additive is within the above range.
【0011】本発明の樹脂組成物の注型は従来行われて
いたようにギアポンプ式などの混合注型機を用いて行っ
ても良い。この場合には、添加材は均一に分散するの
で、高い効果が得られる。但し、添加材の混合した樹脂
成分の注型が混合注型機で応用できない場合には、予め
注型容器に添加材を入れておき、これに樹脂を注型した
のち攪拌しても良い。なお、後者の場合には気泡等の存
在により絶縁が損なわれることのないよう注意が必要で
ある。The casting of the resin composition of the present invention may be carried out using a gear pump type mixing casting machine as has been conventionally done. In this case, since the additive material is uniformly dispersed, a high effect can be obtained. However, when the casting of the resin component mixed with the additive material cannot be applied by the mixing casting machine, the additive material may be put in a casting container in advance, and the resin may be poured into the casting container and then stirred. In the latter case, care must be taken not to impair the insulation due to the presence of bubbles or the like.
【0012】[0012]
【実施例】表1及び表2に示すような添加材を混合した
ビスフェノール型エポキシ樹脂を用いて、平型ビニル電
線(11本)の端部の封止を行った。注型容器として
は、内径6cm、外径6.2cm、深さ8cmの硬質塩
化ビニル樹脂製容器を用い、上記電線の端部が底から
0.5cmになるように封止した。このときの注型容器
内部の温度を熱伝対を挿入して測定した。それぞれの結
果を、各樹脂の取扱性(注型性)の評価結果(優(エポ
キシ樹脂だけの場合と同様に取り扱うことができる)、
良(優より劣る)、可(取扱性が劣るものの使用が可能
である)及び不可(取扱性が劣悪で用いることができな
い)の四段階評価)と共に表1に併せて示す。なお、表
中、混合時添加とは混合注型機によって注型する際に予
め添加材を添加した樹脂を用いて注型した場合、容器内
添加とは予め注型容器内に添加材を入れ、これに樹脂を
注型した場合をそれぞれ示す。また硬化時間は注入直後
より測定した値である。Example A bisphenol type epoxy resin mixed with additives as shown in Tables 1 and 2 was used to seal the ends of flat vinyl electric wires (11 pieces). A hard vinyl chloride resin container having an inner diameter of 6 cm, an outer diameter of 6.2 cm, and a depth of 8 cm was used as the casting container, and the end of the electric wire was sealed so as to be 0.5 cm from the bottom. The temperature inside the casting container at this time was measured by inserting a thermocouple. Each of the results is evaluated as the handling property (casting property) of each resin (excellent (it can be handled in the same way as when only epoxy resin is used),
The results are shown in Table 1 together with the good (inferior to excellent), acceptable (use of inferior handleability can be used) and poor (inferior handleability and unusable) evaluation. In the table, `` addition at the time of mixing '' refers to the case of using a resin to which an additive material has been added when casting with a mixing casting machine, and adding in a container means adding the additive material in a casting container in advance. , And shows the case where a resin is cast into it. The curing time is the value measured immediately after injection.
【0013】なお、表1に示す混合比で均一に混合して
硬化させて得た樹脂ブロックについて、これらの体積抵
抗率をJIS・K6273に準拠し、また耐電圧をJI
S・K6911に準拠して測定した。また、主剤、硬化
剤及び添加材を混合させた直後の粘度をブルックフィー
ルド形粘度計を用いて25℃にて測定した。これら結果
も表1に併記する。また表1中用いたガラスビーズのう
ち、直径が10〜12μmのものは東芝バロティーニ製
EMB−20である。このものは良好な無方向性の球状
形態を有するものである。Regarding the resin blocks obtained by uniformly mixing and curing at the mixing ratios shown in Table 1, their volume resistivities are in accordance with JIS K6273 and their withstand voltage is JI.
It measured based on S * K6911. Further, the viscosity immediately after mixing the main agent, the curing agent and the additive was measured at 25 ° C. using a Brookfield viscometer. These results are also shown in Table 1. Further, among the glass beads used in Table 1, those having a diameter of 10 to 12 μm are EMB-20 manufactured by Toshiba Ballotini. It has a good non-oriented spherical morphology.
【0014】[0014]
【表1】 [Table 1]
【0015】[0015]
【表2】 [Table 2]
【0016】表1〜表2により、本発明の効果は明かで
ある。なお、直径が10μm以上12μm以下のガラス
ビーズを用いた場合、樹脂への均一分散が容易であるた
め最高発熱温度を低下させる効果が大きく、かつ、取扱
性(注型性)に優れている。なお、その添加量が5重量
部以上で最高発熱温度に対する効果が見られ、25重量
部以上添加した際には最高発熱温度が90℃以下となっ
て硬質塩化ビニル樹脂やポリオレフィン系樹脂等からな
る比較的低廉な注型容器を用いることができる。なお、
添加量が120重量部の場合には樹脂と混合したときの
粘度が高くなって取扱性が若干低下している。このよう
に直径が10μm以上12μm以下のガラスビーズを用
いた場合、取扱性と効果とのバランスから判断すると、
添加量が50重量部である実施例5で示した樹脂組成物
が最も優れていた。なお、表1及び表2より、ガラスビ
ーズ添加時の特徴として、シリカビーズの添加と比較す
ると、同量添加した場合に、発熱温度低下効果が大きい
にもかかわらず、硬化時間を短縮する効果が得られるこ
とが判る。このことはガラスビーズを添加した系でのみ
得られる特異効果である。The effects of the present invention are clear from Tables 1 and 2. When glass beads having a diameter of 10 μm or more and 12 μm or less are used, the effect of lowering the maximum exothermic temperature is large because they are easily uniformly dispersed in the resin, and the handleability (casting property) is excellent. It should be noted that, when the addition amount is 5 parts by weight or more, the effect on the maximum exothermic temperature is observed, and when the addition amount is 25 parts by weight or more, the maximum exothermic temperature becomes 90 ° C. or less, and it is made of a hard vinyl chloride resin or polyolefin resin. A relatively inexpensive casting container can be used. In addition,
When the addition amount is 120 parts by weight, the viscosity when mixed with the resin becomes high and the handleability is slightly lowered. Thus, when glass beads having a diameter of 10 μm or more and 12 μm or less are used, judging from the balance between handleability and effect,
The resin composition shown in Example 5 in which the added amount was 50 parts by weight was the most excellent. From Table 1 and Table 2, as a characteristic of adding glass beads, as compared with the addition of silica beads, the effect of reducing the curing time is large when the same amount is added, although the exothermic temperature lowering effect is large. It turns out that it can be obtained. This is a unique effect obtained only in the system in which glass beads were added.
【0017】[0017]
【発明の効果】本発明の樹脂組成物の構成により、冷却
のための設備を必要としたり、作業性・取扱性を損なう
ことなく、硬化時の発熱を低下させることができる。そ
のため、注型容器の材質の選択幅が広がり、また、耐熱
性の低い注型容器を用いた場合にも変形等の障害が生じ
ないため商品価値が損なわれることがなく、同時に、加
工歩留まりが向上する。The constitution of the resin composition of the present invention makes it possible to reduce heat generation during curing without requiring equipment for cooling or impairing workability and handleability. Therefore, the selection range of the material of the casting container is widened, and even when a casting container having low heat resistance is used, the product value is not impaired because defects such as deformation do not occur, and at the same time, the processing yield is high. improves.
【図1】注型時の作業の様子を示した図である。FIG. 1 is a diagram showing a state of work during casting.
1 電線 2 樹脂組成物 3 注型容器 4 導体 5 ジョイント端子 1 electric wire 2 resin composition 3 casting containers 4 conductors 5 joint terminals
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平3−296519(JP,A) 特開 平3−27710(JP,A) 特開 平2−10614(JP,A) 登録実用新案3005912(JP,U) ─────────────────────────────────────────────────── ─── Continued front page (56) Reference JP-A-3-296519 (JP, A) JP-A-3-27710 (JP, A) Japanese Patent Laid-Open No. 2-10614 (JP, A) Registered utility model 3005912 (JP, U)
Claims (5)
材として粒径が10μm以上12μm以下のビーズ状の
ガラスが添加されていることを特徴とする電線封止注型
用樹脂組成物。1. A resin composition for electric wire sealing casting, characterized in that bead-shaped glass having a particle size of 10 μm or more and 12 μm or less is added as a non-breathable, non-hygroscopic and insulating additive. object.
140重量部としたときに5重量部以上100重量部以
下であることを特徴とする請求項1に記載の電線封止注
型用樹脂組成物。2. The electric wire sealing casting according to claim 1, wherein the additive amount is 5 parts by weight or more and 100 parts by weight or less when the base resin component is 140 parts by weight. Resin composition.
分がエポキシ樹脂からなることを特徴とする請求項1ま
たは請求項2に記載の電線封止注型用樹脂組成物。3. A resin composition according to claim 1 base resin component is characterized by comprising the epoxy resin or
The resin composition for electric wire sealing casting according to claim 2 .
0000cP以下であることを特徴とする請求項1乃至
請求項3のいずれかに記載の電線封止注型用樹脂組成
物。4. The viscosity at 25 ° C. is 100 cP or more 5
It is 0000 cP or less, The electric wire sealing casting resin composition in any one of Claim 1 thru | or 3 characterized by the above-mentioned.
材として粒径が10μm以上12μm以下のビーズ状の
ガラスを電線封止注型用樹脂組成物に添加して電線封止
を行うことを特徴とする電線封止方法。5. A bead-like glass having a particle size of 10 μm or more and 12 μm or less is added to a wire sealing casting resin composition as a non-air-permeable, non-hygroscopic and insulating additive to seal a wire. A method for sealing an electric wire, which comprises:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07478896A JP3432071B2 (en) | 1996-03-28 | 1996-03-28 | Resin composition for wire sealing casting and wire sealing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07478896A JP3432071B2 (en) | 1996-03-28 | 1996-03-28 | Resin composition for wire sealing casting and wire sealing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09266614A JPH09266614A (en) | 1997-10-07 |
JP3432071B2 true JP3432071B2 (en) | 2003-07-28 |
Family
ID=13557388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP07478896A Expired - Fee Related JP3432071B2 (en) | 1996-03-28 | 1996-03-28 | Resin composition for wire sealing casting and wire sealing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3432071B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007317470A (en) * | 2006-05-25 | 2007-12-06 | Auto Network Gijutsu Kenkyusho:Kk | Sealing method of core wire joint |
JP6121660B2 (en) * | 2012-07-02 | 2017-04-26 | 矢崎総業株式会社 | Waterproof connector |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3005912U (en) | 1994-03-08 | 1995-01-17 | 西日本電線株式会社 | Housing wiring kit |
-
1996
- 1996-03-28 JP JP07478896A patent/JP3432071B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3005912U (en) | 1994-03-08 | 1995-01-17 | 西日本電線株式会社 | Housing wiring kit |
Also Published As
Publication number | Publication date |
---|---|
JPH09266614A (en) | 1997-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3432071B2 (en) | Resin composition for wire sealing casting and wire sealing method | |
EP1387860B1 (en) | Moulding composition for producing bipolar plates | |
JPH0834271B2 (en) | PPS sealed electronic parts | |
US467982A (en) | Incandescent electric lamp | |
CN219204074U (en) | Waterproof cable joint | |
JP5622241B2 (en) | Power cable aerial termination connection and method for manufacturing power cable aerial termination connection | |
JP2000086869A (en) | Epoxy resin composition and coil | |
JP2683270B2 (en) | Epoxy resin composition for casting | |
JPH09268222A (en) | Epoxy resin composition | |
JPH0155521B2 (en) | ||
WO2023053889A1 (en) | Insulated wire, wire harness, and production method for insulated wire | |
US3876559A (en) | Lamp basing cement | |
JP2005072399A (en) | Aluminum electrolytic capacitor device and epoxy resin sealer for sealing aluminum electrolytic capacitor | |
JPH0269596A (en) | Curable lubricating composition | |
JP2601512B2 (en) | Epoxy resin composition for casting | |
JPS59197484A (en) | Moistureproof mixture | |
JPH08295724A (en) | Epoxy resin composition and semiconductor device sealed therewith | |
JPH0925330A (en) | Epoxy resin composition and semiconductor device sealed therewith | |
JP2004027019A (en) | Unsaturated polyester resin composition for electrical or electronic part and its molded article | |
JPS60154408A (en) | Watertight compound composition for wire | |
JPS5818217A (en) | Cast epoxy resin item | |
KR950012922B1 (en) | Semiconductor mold epoxy resin and semiconductor device | |
CN117393256A (en) | Heat conducting filler for high-power resistor and filling method thereof | |
JPH0314050B2 (en) | ||
KR880001519B1 (en) | Composition of epoxy resin |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20000530 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080523 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090523 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100523 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110523 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120523 Year of fee payment: 9 |
|
LAPS | Cancellation because of no payment of annual fees |