JPS59197484A - Moistureproof mixture - Google Patents
Moistureproof mixtureInfo
- Publication number
- JPS59197484A JPS59197484A JP7274083A JP7274083A JPS59197484A JP S59197484 A JPS59197484 A JP S59197484A JP 7274083 A JP7274083 A JP 7274083A JP 7274083 A JP7274083 A JP 7274083A JP S59197484 A JPS59197484 A JP S59197484A
- Authority
- JP
- Japan
- Prior art keywords
- mixture
- polybutene
- thickener
- antioxidant
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
この発明は、通信ケーブルなどのケーブルの分岐部や接
続部を田封、防湿するために用いられる防湿用混和物に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a moisture-proofing mixture used for sealing and moisture-proofing branch parts and connecting parts of cables such as communication cables.
通常、通信ケーブルなどの接続点は、コネクタ接続した
部分に防湿を目的として防湿用混和物を注入し、史に挑
続部分を熱収縮性シート等によって核って保岐を図って
いる。このような用途に提供されている従来の混和物は
、流動パラフィンをベースコンパウンドとし、これに増
粘剤を添加してゼリー状にしたものであった。Normally, at connection points such as communication cables, a moisture-proofing compound is injected into the connector-connected part for the purpose of moisture-proofing, and the exposed part is covered with a heat-shrinkable sheet to protect it. Conventional mixtures provided for such uses have been made into a jelly-like compound by using liquid paraffin as a base compound and adding a thickener to this compound.
しかるに、上記従来の、混和物においては、次のような
問題を生じていた。However, the above-mentioned conventional mixtures have had the following problems.
■ 高温水が浸入すると、防水効果が著しく低下し、絶
縁不良を起こす場合がおる。■ If high-temperature water enters, the waterproofing effect will be significantly reduced and insulation failure may occur.
■−防湿用混和物に接している絶縁体の劣化を招く場合
がある。- It may lead to deterioration of the insulator in contact with the moisture-proofing mixture.
■ 接続点に用いられる他の充填用コンパウンドを浴融
させる場合がある。■ Other filling compounds used at connection points may be bath melted.
上記の項に示す問題点は、従来の混和物が粘着性に乏し
く、混和物とケーブル表面等との間が離間し易いため、
温水の没入が起こり易いことが原因と考えられる。また
、■及び■項に示す問題点は、ベースコンパウンドであ
る流動パラフィン中の低分子量成分が、絶縁体等を形成
する樹脂を膨潤さすることが原因と考えられる。The problem shown in the above section is that conventional mixtures have poor adhesiveness and tend to separate between the mixture and the cable surface, etc.
This is thought to be due to easy immersion in warm water. Furthermore, the problems shown in items (1) and (2) are thought to be caused by the low molecular weight components in the liquid paraffin, which is the base compound, swelling the resin forming the insulator and the like.
本発明は、上記事情に鑑みてなされたもので、高温水に
対しても尚い防湿幼果を発揮でき、接触している絶縁体
等の他の材料を劣化さぜることか無く、しかも常温で注
入可能な防湿用混和物を提供することを目的とする。The present invention has been made in view of the above circumstances, and is capable of exhibiting moisture-proof properties even in high-temperature water, without causing deterioration of other materials such as insulators in contact with it, and moreover, The purpose is to provide a moisture-proofing mixture that can be injected at room temperature.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
不発明による防湿用混和物は、ポリブテンまたは/およ
びポリブタシェフ100重墓部に対して、増粘剤2〜5
0ki部と酸化防止剤0.01〜2重散部とを混合して
なることを4’ji[とするものである。The moisture-proof mixture according to the invention contains 2 to 5 thickeners per 100 parts of polybutene or/and polybutashev.
The mixture of 0 ki part and 0.01 to 2 parts of an antioxidant is referred to as 4'ji[.
ここで用いられるポリブテンとしては、分子量が250
〜2500程度の範囲内にあるものが好ましい。かかる
分子量をもつポリブテンは、適度な粘稠性を有している
。また、ポリブタジェンとしては、分子量が240〜2
400の範囲内にあるものが使用できる。これらポリブ
テンとポリブタジェンとは、いずれか一方を単独で、ま
たは両者を混合してベースコンパウンドとして使用され
る。The polybutene used here has a molecular weight of 250
Preferably, it is within the range of about 2,500 to 2,500. Polybutene with such a molecular weight has appropriate viscosity. In addition, polybutadiene has a molecular weight of 240 to 2
Anything within the range of 400 can be used. These polybutene and polybutadiene are used alone or as a mixture of both as a base compound.
上記のベースコンパウンドは、適度な粘稠性を有し、従
って、これを用いて得られる混和物も粘着性をもつため
、コネクタ等の接続点に密着してこれを覆うことができ
る。また、従来用いられていた流動パラフィンに比べ、
分子量が大きい物買でおるため、これを用いた混オロ物
は、絶縁体等の劣化や他の充填用=ンパ、ウンドの溶融
等を引き起こすことがない。The above-mentioned base compound has a suitable viscosity, and therefore, the mixture obtained using it also has adhesiveness, so that it can adhere to and cover connection points such as connectors. In addition, compared to the liquid paraffin used conventionally,
Since it has a large molecular weight, mixtures made using it do not cause deterioration of insulators or melting of other filling materials such as pads and powders.
また、増粘剤としては、シリカ粉末が最も適しているが
、これに限らずクレー、タルク、亜鉛鏑、重炭酸カルシ
ウム、チタンホワイト、ホウ酸亜鉛、三酸化アンチ七ン
等の無機増粘剤を用いることができる。この増粘剤の粒
度は、200メツシュパス程度が好ましい。増粘剤の前
記ベースコンパウンド100重量部に対する混合斂は、
2〜50重量部が好適であり、2重量部未満では得られ
る混和物が軟かすぎて用をなさず、一方501i量部を
越えると混合が困難となシ、また粘稠性を有する混和物
が得られない。In addition, the most suitable thickener is silica powder, but is not limited to inorganic thickeners such as clay, talc, zinc oxide, calcium bicarbonate, titanium white, zinc borate, and anti-hetamine trioxide. can be used. The particle size of this thickener is preferably about 200 mesh pass. The mixing ratio of the thickener to 100 parts by weight of the base compound is:
2 to 50 parts by weight is preferred; if it is less than 2 parts by weight, the resulting mixture will be too soft to be useful, while if it exceeds 501 parts by weight, it will be difficult to mix, and the mixture will have viscosity. I can't get things.
また、酸化防止剤としては、一般のゴム用酸化防止剤、
BHTなどのフェノール系、フェニル−α−す7チ、ル
アミンなどのアミン系のものが適宜選択されて用いられ
る。酸化防止剤の添加量は、前記ベースコンパウンド1
00重量部に対して0.01〜2重量部が好適であって
、0.01重量部未満では、目的とする酸化防止作用が
充分得られず、また、2重置部を越えると必簀十分な添
加量を越えて、経済的に不利となる。In addition, as antioxidants, general antioxidants for rubber,
Phenol-based materials such as BHT, and amine-based materials such as phenyl-α-su7thi and luamine are appropriately selected and used. The amount of antioxidant added is based on the base compound 1.
The amount is preferably 0.01 to 2 parts by weight per 0.00 parts by weight, and if it is less than 0.01 parts by weight, the desired antioxidant effect cannot be obtained sufficiently, and if it exceeds 2 parts by weight, If the amount added exceeds a sufficient amount, it becomes economically disadvantageous.
爽に、不発明の混オl物は、通常は小袂であるが、稠度
調整のために必要に応じてワックスを添加してもよい。Refreshingly, the inventive mixture is usually coarse, but wax may be added if necessary to adjust the consistency.
用いるワックスとしては、マイクルクリスタリンワック
スが好適であり、ソのペースコンパウンド100重証部
に対するふ加量は、30重置部以下が好ましい。30重
量部を越えると得られる混和物の流動性が悪化し、ケー
ブル接続点への常温での注入が困難になる。The wax used is preferably microcrystalline wax, and the amount added is preferably 30 parts or less per 100 parts of the paste compound. If the amount exceeds 30 parts by weight, the fluidity of the resulting mixture deteriorates, making it difficult to inject it into the cable connection point at room temperature.
しかして、上記のポリブテンまたは/およびポリブタジ
ェンからなるペースコンバウントニ、増粘剤及び酸化防
止剤まだ必要に応じてワックスを配合して得られる防湿
用混和物は、ベースコンパウンドの物性から常温で可塑
性乞有すると共に、粘着性を有しており、従?て、ケー
ブル接続部への充填を常温で行なうことができ、また充
填後においては、その粘着性によって接触する材料に対
しての艮好な密着性が得られる。更には、ベースコンパ
ウンドが流動パラフィンのような樹脂な膨潤させる成分
を含まないため、充填後に接触する絶縁体や他の充填用
コンパウンドを劣化させることがなく、従って充填にあ
たっての作業性に区れ、かつ充填後の接続部に高い耐候
性及び長寿命を与えることができる。Therefore, the moisture-proofing mixture obtained by blending the above-mentioned pace combiner, thickener, and antioxidant with wax, which is made of polybutene and/or polybutadiene, is difficult to plasticize at room temperature due to the physical properties of the base compound. At the same time, it has adhesiveness and is sticky. Therefore, the cable connection portion can be filled at room temperature, and after filling, its tackiness provides excellent adhesion to the materials it comes into contact with. Furthermore, since the base compound does not contain resinous swelling components such as liquid paraffin, it does not deteriorate the insulators or other filling compounds that come into contact with it after filling, which improves the workability of filling. Moreover, high weather resistance and long life can be imparted to the connected portion after filling.
以下、実施例を示して本発明を良に具体的に説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples.
ベースコンパウンドとしてポリブテンとポリブタジェン
とを用い、これに増粘剤、酸化防止剤、ワックスを下表
に示す配合をもって混和した実施例の混和物を4g0A
PjHした。また、ベースコンパウンドとして流動パラ
フィンを用い、これに増粘剤、酸化防止剤、ワックスを
下表に示す配合をもって混和した比較例の混和物を2徳
類調製した。Using polybutene and polybutadiene as a base compound, 4g0A of the mixture of the example was prepared by mixing a thickener, an antioxidant, and a wax in the proportions shown in the table below.
I did PjH. Further, a comparative mixture was prepared by using liquid paraffin as a base compound and mixing a thickener, an antioxidant, and a wax with the proportions shown in the table below.
なお、ポリブテンとしては分子量が250〜2500の
ものを、ポリブタジェンとしては分子量が240〜24
00のものを用いた。またシリカの粒度は200メツシ
ユ、炭酸マグネシウムの粒度は200メツシユである。The polybutene has a molecular weight of 250 to 2500, and the polybutadiene has a molecular weight of 240 to 24.
00 was used. The particle size of silica is 200 mesh, and the particle size of magnesium carbonate is 200 mesh.
酸化防止剤としてはフェノール糸を、またワックスとし
てはマイクロクリスタリンワックスを用いた。Phenol thread was used as the antioxidant, and microcrystalline wax was used as the wax.
上記の各混オlJ物に対して、表中に示す物性及び性能
試験を施しだ。得られた結果を表中に示しである。The physical properties and performance tests shown in the table were performed on each of the above-mentioned mixtures. The results obtained are shown in the table.
(表の注記)
◆I JTS K 2561
申2 JTS K 2524,25℃−3J工s
c 2201
中4 底面の直径15間、高さ15龍の円錐形に成形し
、温度70℃で2時間処理し、流れを生じないこと。(Notes on the table) ◆I JTS K 2561 2 JTS K 2524, 25℃-3J
c 2201 Medium 4 Shape into a conical shape with a bottom diameter of 15 cm and a height of 15 dragons, and process at a temperature of 70°C for 2 hours without causing any flow.
中5 温丸80℃の温水で2週間処理後に測定。Medium 5: Measured after two weeks of treatment with warm water at 80°C.
116 絶縁体(pg製)を混和物中に埋め、温就60
℃に1ケ月保って後側足した。116 Insulator (made of PG) was buried in the mixture and heated for 60 minutes.
I kept it at ℃ for 1 month and added it to the rear.
申7 絶縁体(PE製)を自己径に巻き付けて混和物中
に埋め込み、温度80℃に保って4ケ月経過後にクラッ
クの有無を調べた。Example 7 An insulator (made of PE) was wrapped around its own diameter and embedded in the mixture, and the temperature was maintained at 80° C. After 4 months, the presence or absence of cracks was examined.
表中に示すように、本発明の混和物は、絶縁体を膨潤さ
?縞いことが確認され、また絶縁体の自己後巻付加熱試
験の結果から、絶縁体を劣化さきないことが確認された
。災には、本発明の混オロ物は、体積固有抵抗が流動パ
ラフィンを用いた従来品に比べ、2桁から3桁以上も大
きく、ケーブル接続部や分岐部の防湿用に好ましい物性
をもつことが分かった。As shown in the table, does the mixture of the present invention swell the insulator? It was confirmed that the insulator was striped, and the results of the self-post-rolling heat test of the insulator confirmed that the insulator did not deteriorate. Unfortunately, the volume resistivity of the mixed material of the present invention is two to three orders of magnitude higher than that of conventional products using liquid paraffin, and it has physical properties suitable for moisture proofing cable connections and branching sections. I understand.
出願人藤倉電線株式会社Applicant Fujikura Electric Wire Co., Ltd.
Claims (1)
に対して、増粘剤2〜50重量部と酸化防止剤0.01
〜2重量部とを混合してなる防湿用混触物。2 to 50 parts by weight of thickener and 0.01 part by weight of antioxidant per 100 parts by weight of polybutene or/and polybutadiene.
- 2 parts by weight of a moisture-proof mixture.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7274083A JPS59197484A (en) | 1983-04-25 | 1983-04-25 | Moistureproof mixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7274083A JPS59197484A (en) | 1983-04-25 | 1983-04-25 | Moistureproof mixture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59197484A true JPS59197484A (en) | 1984-11-09 |
JPH031356B2 JPH031356B2 (en) | 1991-01-10 |
Family
ID=13498053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7274083A Granted JPS59197484A (en) | 1983-04-25 | 1983-04-25 | Moistureproof mixture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59197484A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04149292A (en) * | 1990-10-12 | 1992-05-22 | Nippon Kouyu:Kk | Moisture-proof mixture for connector |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5235244A (en) * | 1975-09-13 | 1977-03-17 | Minoru Imanishi | Calking composition |
JPS5437159A (en) * | 1977-08-30 | 1979-03-19 | Showa Electric Wire & Cable Co Ltd | Fireproof putty |
-
1983
- 1983-04-25 JP JP7274083A patent/JPS59197484A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5235244A (en) * | 1975-09-13 | 1977-03-17 | Minoru Imanishi | Calking composition |
JPS5437159A (en) * | 1977-08-30 | 1979-03-19 | Showa Electric Wire & Cable Co Ltd | Fireproof putty |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04149292A (en) * | 1990-10-12 | 1992-05-22 | Nippon Kouyu:Kk | Moisture-proof mixture for connector |
Also Published As
Publication number | Publication date |
---|---|
JPH031356B2 (en) | 1991-01-10 |
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