JP3429919B2 - Small container for surface mount components - Google Patents
Small container for surface mount componentsInfo
- Publication number
- JP3429919B2 JP3429919B2 JP24694695A JP24694695A JP3429919B2 JP 3429919 B2 JP3429919 B2 JP 3429919B2 JP 24694695 A JP24694695 A JP 24694695A JP 24694695 A JP24694695 A JP 24694695A JP 3429919 B2 JP3429919 B2 JP 3429919B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- container
- seam welding
- small container
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【発明の詳細な説明】
【０００１】
【産業上の利用分野】品質信頼性を向上させた表面実装
部品の小型容器に関する。
【０００２】
【従来の技術】コバール材を成形してなるベースとフタ
をシーム溶接で封止する際に、ベースが反ることなく、
シーム溶接の封止効果が最大限に得られる溶接条件を、
毎回のように調整して封止作業を行っていた。
【０００３】
【発明が解決しようとする課題】しかし、最善の注意を
図りながらもベースの反りがなく、シーム溶接の封止効
果が充分得られる溶接条件をその都度設定しても、僅か
ながらのベースの反りが発生する問題は避けられない。
ベースの反りを意識するあまり、シーム溶接の封止が不
十分で気密不良を起こしたり、またその逆に、気密を確
保するためにシーム溶接の封止熱を掛け過ぎたために、
ベースが大幅に反ってしまったり、クラック等が発生し
てしまうなどの課題がある。
【０００４】
【課題を解決するための手段】ベース自体に反りに対す
る強度を増すために、ベース裏面のハーメチック部分に
ベースと同じ材料で、ベースの長手方向に梁を設けるこ
とでシーム溶接時のベースの反りを改善し課題を解決し
た。
【０００５】
【背景】シーム溶接封止は、コバール材で成形したベー
スとフタとを、温度と圧力を掛けて両者を溶着する封止
方法である。半導体部品の気密容器として用いられるシ
ーム溶接は、気密性の高い封止方法のひとつでもある。
【０００６】本発明の小型容器に実装する電子部品は、
弾性表面波素子の搭載を考えて発明されたものである。
弾性表面波素子は素子を構成するアルミ電極が、大変湿
気を嫌うことから、容器の気密性には非常に厳しい信頼
性が要求される。そのためにシーム溶接での封止方法が
最も効果的として用いられている。
【０００７】現在のベースとフタを封止するシーム溶接
に挙げられる課題として、ベースの反りがある。図３に
示す容器の構成図のように、ベースは底板と側面板を銅
ロウ付けで貼り合わせた構造となっており、そのベース
とフタとをシーム溶接で封止して小型容器を構成する。
【０００８】ベースが反ってしまう原因としては、シー
ム溶接でベースとフタを封止する際、ベースとフタとの
接合部分の温度容量が、フタに対し、ベースの方が大き
いために、封止に必要な温度に達するまでの間に、ベー
スに多くの熱容量が蓄えられることになってしまう。そ
の結果、温め易く冷め易いフタに対し、温め難く冷め難
いベースがシーム溶接温度に達し封止された後、常温に
戻る際に、フタとベースの温度降下の違いから、フタに
引っ張られベースが反ってしまう現象が発生してしま
う。
【０００９】結局は、ベースの厚み強度不足によるベー
スのソリの発生が大きな原因ではあるが、表面実装部品
の容器の小型化を目的とした場合に、極力容器各部の寸
法、板厚を最小限に抑える必要がある。特にベース底板
の厚みを増すことでベースの反りは大幅に改善されるも
のの、ベース底板を厚くすることにより、容器の厚み方
向が厚くなってしまうことや、現行の容器厚みを維持し
ながらベース底板を厚くすることで、容器内容積が極端
に小さくなってしまう問題が考えられる。
【００１０】本発明では、ベースにコバール材の梁を付
けることで、現行の容器寸法（特に容器厚み方向）を全
く変更することなく、ベースの反りに対する強度を改善
することを特徴とする。
【００１１】
【実施例】以下、添付図面に従ってこの発明の実施例を
説明する。なお、各図において同一の符号は同様の対象
を示すものとする。凹部構造を持つベース１はコバール
材を成形してなり、フタ２もコバール材を成形してなっ
ている。
【００１２】図１に本発明のベース１底面から見た平面
図を示す。ベース１の底板１０の裏側のハーメチック端
子３を構成している面に、ベース１の中心部の長手方向
に、ベース１を構成する材質と同じコバール材で梁４を
設ける。
【００１３】梁４は、ベース１の中心部に構成される
が、その幅はハーメチック端子３上に配置されるリード
端子部１１と接触しない最大寸法までの許容寸法範囲い
っぱいまでの寸法となる。
【００１４】一方、図２に図１のＡ−Ａ’部断面で容器
の短手方向から見た断面図に示すように、梁４はハーメ
チック端子３と同一の高さにあり、容器全体の高さ（厚
み）は全く変わらない。また、梁４は、ベース１の底板
１０の裏側にベース側面板１２を貼り合わせるのと同様
に、銅ロウ付１３けで構成されても、底板１０を成形す
る時に梁４を同一成形しても構わない。
【００１５】なお、本発明の表面実装部品の容器に格納
する電子部品は、弾性表面波素子、圧電発振器、圧電振
動子、半導体など、表面実装が可能な全てに適応できる
ものである。
【発明の効果】本発明により、シーム溶接時のベースの
反りを大幅に少なく改善することで、製造工程の簡略
と、品質の向上、不良率の低減によるコスト削減の改善
が図れた。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized container for surface mounting parts with improved quality reliability. 2. Description of the Related Art When sealing a base and a lid formed of a Kovar material by seam welding, the base does not warp.
Welding conditions that maximize the sealing effect of seam welding
The sealing work was carried out by adjusting as usual. However, even if the welding conditions under which the base is not warped and the sealing effect of the seam welding can be sufficiently obtained are set each time with the utmost care, a slight The problem of warpage of the base is inevitable.
Too much awareness of base warpage, insufficient sealing of seam welding caused poor airtightness, and conversely, too much sealing heat of seam welding to ensure airtightness,
There are problems that the base is largely warped, cracks and the like occur. [0004] In order to increase the strength of the base itself against warping, a beam is provided in the longitudinal direction of the base on the hermetic portion on the back surface of the base using the same material as the base, so that the base during seam welding is provided. And solved the problem. [0005] Seam welding sealing is a sealing method in which a base and a lid formed of Kovar material are welded by applying temperature and pressure. Seam welding used as an airtight container for semiconductor components is also one of the highly airtight sealing methods. The electronic components mounted on the small container of the present invention are:
It was invented in consideration of mounting a surface acoustic wave element.
In the surface acoustic wave device, since the aluminum electrode constituting the device is extremely resistant to moisture, very tight reliability is required for the airtightness of the container. Therefore, the sealing method by seam welding is used most effectively. [0007] One of the problems in the current seam welding for sealing the base and the lid is warpage of the base. As shown in the configuration diagram of the container shown in FIG. 3, the base has a structure in which a bottom plate and a side plate are bonded by copper brazing, and the base and the lid are sealed by seam welding to form a small container. . [0008] The cause of the warpage of the base is that when the base and the lid are sealed by seam welding, the temperature capacity of the junction between the base and the lid is larger than that of the lid. Until the required temperature is reached, a large amount of heat capacity will be stored in the base. As a result, for the lid that is easy to warm and cool, the base that is difficult to warm and hard to cool reaches the seam welding temperature, is sealed, and then returns to room temperature. A warping phenomenon occurs. [0009] After all, the occurrence of warpage of the base due to insufficient strength of the thickness of the base is a major cause. However, in order to reduce the size of the surface mount component container, the dimensions and plate thickness of each part of the container are minimized as much as possible. Need to be suppressed. In particular, although increasing the thickness of the base bottom plate significantly improves the warpage of the base, increasing the thickness of the base bottom plate may increase the thickness of the container, or maintain the current container thickness while maintaining the current container thickness. By increasing the thickness, there is a problem that the volume inside the container becomes extremely small. The present invention is characterized by improving the strength against warping of the base by attaching a Kovar beam to the base without changing the existing container dimensions (particularly in the container thickness direction) at all. An embodiment of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. The base 1 having the concave structure is made of Kovar material, and the lid 2 is also made of Kovar material. FIG. 1 is a plan view of the base 1 of the present invention viewed from the bottom surface. A beam 4 made of the same Kovar material as the material forming the base 1 is provided in the longitudinal direction of the center of the base 1 on the surface of the bottom plate 10 of the base 1 that forms the hermetic terminal 3 on the back side. The beam 4 is formed at the center of the base 1, but has a width up to the maximum allowable dimension which does not come into contact with the lead terminal portion 11 arranged on the hermetic terminal 3. On the other hand, as shown in FIG. 2 which is a sectional view taken along the line AA 'of FIG. 1 and viewed from the lateral direction of the container, the beam 4 is at the same height as the hermetic terminal 3 and The height (thickness) does not change at all. In addition, similarly to the case where the base plate 1 is attached to the back side of the bottom plate 10 of the base 1, the beam 4 is formed with the copper brazing 13. No problem. The electronic components stored in the surface-mounted component container of the present invention can be applied to any surface-mountable device such as a surface acoustic wave device, a piezoelectric oscillator, a piezoelectric vibrator, and a semiconductor. According to the present invention, the manufacturing process can be simplified, the quality can be improved, and the cost reduction can be improved by reducing the defective rate by greatly reducing the warpage of the base during seam welding.
【図面の簡単な説明】
【図１】本発明のベースの梁形状を示す、ベース底板の
裏側から見た平面図である。
【図２】本発明の梁構造が、ハーメチック端子部と同一
高さであることを示すＡ−Ａ’部の断面図である。
【図３】ベースが底板と側面板から構成されていること
を示す側面図である。
【符号の説明】
１ ベース
２ フタ
３ ハーメチック端子
４ 梁BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a beam shape of a base according to the present invention, viewed from the back side of a base bottom plate. FIG. 2 is a cross-sectional view taken along the line AA ′ showing that the beam structure of the present invention has the same height as the hermetic terminal portion. FIG. 3 is a side view showing that a base includes a bottom plate and a side plate. [Description of Signs] 1 Base 2 Lid 3 Hermetic terminal 4 Beam
Claims (1)
ーム溶接で封止する表面実装部品の小型容器において、 該ベースの裏面に該ベースの反りに対する補強のため
に、該ベースの裏面の長手方向に２列に配置した複数個
のハーメチック端子の間に、該ベースの長手方向に該ベ
ースと同一の材料で梁を具備したことを特徴とする表面
実装部品の小型容器。(1) A small container of a surface mount component in which a base having a concave structure is covered with a lid and sealed by seam welding, on a back surface of the base to reinforce warping of the base. A surface mounting component characterized by comprising a beam of the same material as the base in the longitudinal direction of the base, between a plurality of hermetic terminals arranged in two rows in the longitudinal direction on the back surface of the base. Small container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24694695A JP3429919B2 (en) | 1995-08-31 | 1995-08-31 | Small container for surface mount components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24694695A JP3429919B2 (en) | 1995-08-31 | 1995-08-31 | Small container for surface mount components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0973932A JPH0973932A (en) | 1997-03-18 |
| JP3429919B2 true JP3429919B2 (en) | 2003-07-28 |
Family
ID=17156098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24694695A Expired - Fee Related JP3429919B2 (en) | 1995-08-31 | 1995-08-31 | Small container for surface mount components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3429919B2 (en) |
-
1995
- 1995-08-31 JP JP24694695A patent/JP3429919B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0973932A (en) | 1997-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8278801B2 (en) | Piezoelectric resonator device | |
| JP3390348B2 (en) | Quartz crystal resonator and manufacturing method thereof | |
| JP3429919B2 (en) | Small container for surface mount components | |
| US20020070387A1 (en) | Focusing cup on a folded frame for surface mount optoelectric semiconductor package | |
| JP2003318692A (en) | Piezoelectric device | |
| WO2020262472A1 (en) | Electronic component housing package, electronic device, and electronic module | |
| JP2002084159A (en) | Surface-mounted piezoelectric vibrator | |
| JP2002064354A (en) | Package for surface-mount piezoelectric vibrator and production method for the same | |
| JP3797061B2 (en) | Ceramic package sealing method and sealing structure | |
| JP2001024079A (en) | Electronic component sealing structure | |
| JP2001028518A (en) | Manufacture of piezo-oscillator | |
| JP2008182468A (en) | Manufacturing method of piezoelectric vibration device | |
| JPS63305604A (en) | Piezoelectric oscillator | |
| US5559668A (en) | Package-type solid electrolytic capacitor | |
| JP3374395B2 (en) | Package for electronic components | |
| JP4439143B2 (en) | Resin-sealed semiconductor device | |
| JPS62242405A (en) | Composite electronic parts | |
| JP2004357080A (en) | Piezoelectric diaphragm | |
| JP2002009570A (en) | Electronic component and its manufacturing method | |
| JPH0774576A (en) | Piezoelectric vibrator | |
| JP2001156193A (en) | Electronic component device | |
| JP2003273690A (en) | Piezoelectric vibration device | |
| JP2004304376A (en) | Chip piezoelectric vibrator | |
| JP2004006528A (en) | Container of electronic component | |
| JP2024001515A (en) | Piezoelectric device and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090516 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100516 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100516 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110516 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120516 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120516 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140516 Year of fee payment: 11 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |