JP3426913B2 - Resin sealing device for electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device for electronic parts.

[0002]

2. Description of the Related Art Conventionally, various types of resin sealing devices for electronic parts have been known. As a typical example thereof, a stencil positioned on an electronic part mounted on a substrate in a vacuum atmosphere. A predetermined amount of sealing resin liquid is supplied to the upper surface of the, then the squeegee is moved, and the resin is pushed into the resin pushing hole of the stencil to seal the electronic component, so-called vacuum stencil printing resin sealing A device is mentioned. Note that such a resin sealing device is disclosed in, for example, Japanese Patent Laid-Open No. 5-1
It is disclosed in Japanese Patent Publication No. 14620.

[0003]

However, in this conventional resin encapsulation device, the nozzle of the resin supply device for supplying the encapsulating resin liquid to the upper surface of the stencil, the stencil, the squeegee, etc. are always positioned in a vacuum atmosphere. On the other hand, since the board on which the electronic component is mounted is put in and taken out from the vacuum atmosphere, it has various drawbacks as follows.

That is, as one of them, since the nozzle of the resin supply device and the stencil are mounted in the vacuum chamber, the sealing resin liquid must be always supplied to the upper surface of the stencil at the same position. Therefore, it is difficult to change the supply position of the encapsulating resin liquid as needed, and since excess encapsulating resin liquid is likely to remain on the squeegee or stencil, the resin-encapsulated substrate is produced during production. However, the amount gradually increases, which hinders the production. Therefore, it is difficult to adopt the multi-row process and it is difficult to efficiently produce the resin-sealed substrate.

As another one, since the sealing resin liquid is a high-viscosity liquid, it is troublesome to replenish it in the vacuum chamber, and the nozzle of the resin supply device is mounted so as not to interfere with the moving squeegee. However, it was not practical.

As another one, since a squeegee, a nozzle of a resin supply device, a stencil, etc. are mounted in a vacuum chamber having a small opening, operation adjustment and maintenance are very troublesome, and the stencil Since the encapsulation resin liquid supplied to the upper surface is handled and the substrate is taken out and taken out at different locations, the series of operations is complicated and the vacuum chamber is enlarged to save energy. The loss was large and the processing time was long.

Therefore, in order to increase the productivity of the resin-sealed substrate, it is difficult to adopt this resin-sealed device in the case where the substrate is to be fed further in a shorter cycle. In addition,
There is also a drawback that the airtightness of the substrate loading / unloading port of the vacuum chamber for forming a vacuum atmosphere is troublesome, and an expensive airtight means is required to be attached.

The present invention has been invented in view of the above drawbacks, in which a sealing resin liquid is supplied to the upper surface of a stencil at atmospheric pressure, and the substrate is placed in a vacuum atmosphere together with the stencil. And to perform stencil printing here, that is, resin liquid supply under atmospheric pressure,
The present invention has been completed by discovering that the division of labor into stencil printing in a vacuum atmosphere allows the substrate to be rapidly fed to the subsequent process and further enhances the productivity of the resin-sealed substrate. Is.

[0009]

That is, a resin sealing device for an electronic component according to the present invention, as described in claim 1, seals an upper surface of a stencil positioned on an electronic component mounted on a substrate. A substrate moving device for moving the substrate to the stencil printing station together with the stencil to which the sealing resin liquid has been supplied, from a work station under atmospheric pressure for supplying the resin liquid for use, and the stencil printing device in the stencil printing station. Of a stencil printing station that has a squeegee that pushes the sealing resin liquid into a resin pushing hole to seal the electronic component, and that moves the squeegee prior to sealing the electronic component by the squeegee. And a vacuum chamber device that shuts off a predetermined space region from the outside air to make the atmosphere a vacuum.

The supply of the sealing resin liquid to the upper surface of the stencil at the work station may be performed manually, but it is preferable to attach a resin liquid supply device here.
Further, the substrate moving device supports the substrate and mounts a stencil moving means for moving the stencil toward and away from electronic components mounted on the substrate, and the work table between the work station and the stencil printing station. The table moving device is preferably configured to be reciprocally movable, and the table moving device is configured to be capable of intermittently moving in one direction so as to draw a circular locus while keeping the work table horizontal, or the work table. It is preferable to be constructed so that it can be linearly reciprocated while being kept horizontal.

In the vacuum chamber apparatus, the work table moved to the stencil printing station is pressed against the lower end opening of the vacuum chamber in which the squeegee is installed to move the chamber to shut off a predetermined space area of the stencil printing station from the outside air. It is preferable that the apparatus comprises an apparatus and a vacuum pump apparatus for evacuating from the inside of the vacuum chamber, and the chamber moving apparatus is capable of swinging or vertically moving the vacuum chamber to press and separate the lower end opening from the work table. It is preferable to configure.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Referring to FIGS.
This resin sealing device includes a resin liquid supply device 1, a substrate moving device 2, and a vacuum chamber device 3. However, in FIG. 1, the substrate 5 on which the electronic component 4 is mounted is not the substrate moving device 2.
Is shown moving to work station A under atmospheric pressure.

The substrate moving device 2 includes a rectangular work table 8 for supporting the substrate 5, a stencil moving means 7 mounted on the work table 8, and a work table 8 between the work station A and the stencil printing station B. And a table moving device 9 for reciprocating the table. The table moving device 9 is, in this example, a work table 8
It is configured so that it can be intermittently moved in one direction so as to draw a circular locus while keeping horizontal.

That is, the table moving device 9 is equipped with a disk 12 which is mounted on the shaft of the index 11 and which is intermittently rotated counterclockwise while being kept horizontal, and on the disk 12. , A plurality of work tables 8 are mounted at equal intervals so as to be located on the same circle. Further, the stencil moving means 7 is mounted on the work table 8 so that the stencil 6 can be swung via the actuator 13 as shown by an arrow so that the electronic component 4 mounted on the substrate 5 can be moved toward and away from the electronic component 4. There is. The stencil 6 is detachably attached to the work table 8.

Therefore, the stencil 6 swings from the retracted position in the vertical state shown in FIG. 1 to the position in the horizontal state shown in FIG. 2, that is, on the electronic component 4 mounted on the substrate 5. And is thereby positioned in a position suitable for stencil printing as described below. The swing control of the stencil 6 is performed at a position where the resin liquid supply device 1 does not interfere, and is moved to the work station A while being positioned on the electronic component 4 mounted on the substrate 5. Come on.

Then, the resin liquid supply device 1 is moved from the standby position to a position suitable for supplying the sealing resin to the right end portion of the stencil 6. This is performed via an actuator 15 mounted on a device frame (not shown), but the actuator 15 is mounted so that its piston rod can be horizontally retracted in the front-back direction in FIG. Also, the arm 1 is attached to the tip of the piston rod.
One end of 7 is fixed, and the other end of the arm 17 is fixed to the nozzle 16 of the resin liquid supply device 1.

Therefore, the resin liquid supply apparatus 1 can be moved in the front-back direction by controlling the piston rod of the actuator 15 to move in and out. At that time, the resin liquid supply apparatus 1 is mounted on an upper rail (not shown). It is mounted so that it can be guided and moved in the front-rear direction. Therefore, as shown in FIG. 2, a predetermined amount of the sealing resin liquid 18 can be supplied onto the stencil 6 from the nozzle 16 of the resin liquid supply device 1 in the work station putting A under atmospheric pressure. it can. When supplying such a resin liquid,
The resin liquid supply device 1 is moved below the height at the standby position, and the nozzle 16 is caused to approach the stencil 6 in a predetermined manner.

This is based on the fact that the installation height of the upper rail is made low at the work station A.
The resin liquid supply device 1 includes a tank 19 having a closed structure in which a sealing resin liquid 18 is stored, and a valve 2 at the bottom of the tank 19.
Nozzle 16 mounted through 0 and sealing resin liquid 18
An air supply unit 21 for supplying compressed air to the tank 19 when the air is discharged from the nozzle 16 is provided.

When a predetermined amount of the sealing resin liquid 18 can be supplied onto the horizontal stencil 6, the resin liquid supply device 1
Is moved to the standby position and the work table 8 is moved by the table moving device 9, that is, for example,
When four work tables 8 are mounted, the work tables 8 are intermittently moved by 90 degrees.

Therefore, the substrate 5 together with the stencil 6 to which the sealing resin liquid 18 has been supplied can be moved from the work station A to the stencil printing station B side one after another. While supplying a predetermined amount of the sealing resin liquid 18 on the stencil 6 in A,
In the stencil printing station B, stencil printing can be performed in a vacuum atmosphere.

FIG. 3 shows a state in which the stencil printing is completed in the vacuum atmosphere by the vacuum chamber device 3, but the vacuum chamber device 3 includes the vacuum chamber 23 having the squeegee 22 therein and the chamber moving device. Two
4 and a vacuum pump device 25 and the like. The vacuum chamber 23 has an open lower end (hereinafter,
It is called the lower end opening 26. ), And the squeegee 22 provided therein is screwed onto a screw shaft 28 that is rotated in the forward and reverse directions by an electric motor 27.

The chamber moving device 24 is constructed so as to swing the vacuum chamber 23 so that the lower end opening 26 can be pressed and separated from the work table 8. The vacuum pump device 25 includes a vacuum pump 30,
The switching valve 31, the exhaust hose 32, the air supply / exhaust hose 33, etc. are provided.

Therefore, when the work table 8 is intermittently moved by the table moving device 9 and the substrate 5 is moved to the stencil printing station B together with the stencil 6 to which the sealing resin liquid 18 is supplied. , Chamber moving device 24
The vacuum chamber 23 is swung counterclockwise (counterclockwise), and its lower end opening 26 is brought into pressure contact with the upper surface of the work table 8, whereby the lower end opening 26 of the vacuum chamber 23 is closed and the atmosphere in the chamber is closed. Is cut off from the outside air.

Then, evacuation by the vacuum pump device 25 is started and the inside of the vacuum chamber 23 is evacuated. That is, the switching valve 31 is controlled to open and close in a predetermined manner, and the air in the vacuum chamber 23 is exhausted through the air supply / exhaust hose 33, the exhaust hose 32, and the vacuum pump 30.

Further, subsequently to this, the screw shaft 28 is driven and rotated by the electric motor 27. Therefore, squeegee 22
Moves from the left side to the right side, and the sealing resin liquid 18 supplied onto the stencil 6 is leveled, whereby the sealing resin liquid 1
8 is pushed into a resin pushing hole (not shown) formed in the stencil 6 in a predetermined pattern. Since the stencil printing is performed in the vacuum atmosphere as described above, the electronic component 4 can be favorably resin-sealed, and the electronic component 4 can be quickly performed.

The actuator 1 of the stencil moving means 7
3 is arranged at a position where it does not interfere with the movement of the squeegee 22, and when the stencil printing is completed in a predetermined manner, the switching valves 31, 35 are controlled to be opened and closed in a predetermined manner so that the compressor 36 supplies the air supply hoses 37, 38 and. Via the air supply / exhaust hose 33,
The compressed air is supplied into the vacuum chamber 23, and the vacuum chamber 23 is swung clockwise (clockwise) by the chamber moving device 24. This state is shown in FIG.

When the squeegee 22 is moved from the left side to the right side by a predetermined stroke, the screw shaft 2 driven by the electric motor 27 is moved.
Although it is returned to the original position from the right side to the left side by the reverse rotation of 8, the reciprocating movement of the squeegee 22 is not limited to one time, and may be performed a plurality of times as necessary. Further, after performing the stencil printing in a vacuum atmosphere, the inside of the vacuum chamber 23 is temporarily set to a pressurized atmosphere of atmospheric pressure or higher, and then the vacuum chamber 23 is swung upward as shown in FIG. Good.

As a result, the electronic component 4 can be more favorably resin-sealed, that is, the sealing resin liquid can be sufficiently impregnated in every corner of the electronic component 4. In addition to this, for example, after performing stencil printing in a vacuum atmosphere, the vacuum chamber 23 is swung upward to temporarily bring it to atmospheric pressure, and then the table moving device 9 moves the work table 8 to another place. At the same time, the location may be controlled to a pressurized atmosphere of atmospheric pressure or higher.

After that, the stencil printing is completed in the vacuum atmosphere at the stencil printing station B, and the substrate 5 is moved from this station B to another place. As described above, according to the present resin sealing device, for example, the work station A → standby position (a position displaced 90 degrees from the work station A) →
Stencil printing station B (place displaced 90 degrees from standby position) → substrate unloading supply position (place displaced 90 degrees from stencil printing station B) → work station A, or work station A → stencil printing station B ( Work station A is displaced by 90 degrees. → Substrate take-out position (place where stencil printing station B is displaced by 90 degrees) → Substrate supply position (place where substrate is taken out by 90 degrees) → Work station A. The table 8 can be intermittently moved in one direction for resin sealing.

However, the present invention is not limited to this, and other examples such as
Work station A → stencil printing station B → work station A, or work station A → stencil printing station B → substrate unloading / feeding position → work station A, and so on. It can also be sealed.

The air supply means 21 for supplying compressed air into the tank 19 when the resin liquid supply device 1 supplies the sealing resin 18 onto the stencil 6 controls the switching valve 35 to open and close in a predetermined manner. The compressed air is supplied from 36 through the air supply hoses 37 and 40, while the valves 20 and 41 are opened. Further, the valve 20 is closed when the supply of the sealing resin 18 is stopped. Further, before the supply of the sealing resin 18, the sealing resin 18 in the tank 19 is deaerated,
This is to control the opening / closing of the switching valve 31 in a predetermined manner to control the exhaust hose 4
2, 32 and the vacuum pump 30 are evacuated. that time,
The valve 43 is opened.

The embodiment has been described above, that is, the embodiment in which the resin liquid supply device 1 is installed in the work station A. However, in the present invention, the work station A is placed on the stencil 6 manually by the operator. Sealing resin 1
8 may be supplied and they are selected as required.

The sealing resin 18 may be supplied onto the stencil 6 in any form such as coating, discharging and dropping, and the substrate moving device 2 is supplied with the sealing resin liquid 18. It may be of any type as long as it can move the substrate 5 with the stencil 6 from the work station A to the stencil printing station B. As a result, it is possible to divide the work into supplying the resin liquid under atmospheric pressure and performing stencil printing in a vacuum atmosphere.

An electronic component in which the substrate 5 is supported and the stencil 6 is mounted on the substrate 5 so that the substrate can be quickly sent to the subsequent process and the productivity of the resin-sealed substrate is further enhanced. A work table 8 equipped with a stencil moving means 7 for moving the work table 8 closer to and away from the work 4 and a table moving device 2 for moving the work table 8 back and forth between a work station A and a stencil printing station B. preferable. The table moving device 9 is configured to be intermittently movable in one direction so as to draw a circular locus while keeping the work table 8 horizontal, or
As shown in FIGS. 4 to 6, the work table 8 may be configured to be linearly reciprocated while being kept horizontal.

4 to 6, the table moving device 9 is shown.
Is composed of a screw shaft 52 horizontally mounted by the electric motor 51 so as to be able to rotate in the forward and reverse directions, and a work table 8 screwed to the screw shaft 52.
By the forward / reverse rotation control of 2, the work station A and the stencil printing station B are maintained while keeping the work table 8 horizontal.
It is possible to make a linear reciprocating motion between.

Therefore, according to the substrate moving device 2 provided with the table moving device 9 configured to reciprocate linearly while keeping the work table 8 horizontal, the stencil 6 to which the sealing resin liquid 18 is supplied. The substrate 5 can be moved from the work station A to the stencil printing station B together with, and after stencil printing under a vacuum atmosphere,
The substrate 5 together with the stencil 6 can be moved from the stencil printing station B to the work station A.

As described above, in the present invention, the substrate moving device 2 is provided with the table moving device 9 configured to be capable of linearly reciprocating while keeping the work table 8 horizontal.
Or to mount the substrate moving device 2 having the table moving device 9 configured to be intermittently moved in one direction so as to draw a circular locus while keeping the work table 8 horizontal. However, it is preferable to mount the latter (a substrate moving device having an index type table moving device) rather than the former (a substrate moving device having a screw shaft feed type table moving device).

This is because the former (substrate moving device provided with a screw shaft feed type table moving device) is inferior in productivity of the resin-sealed substrate. Therefore, when the productivity of the resin-sealed substrate is not considered to be a problem, for example, the former may be adopted when only a small number of resin-sealed substrates need to be produced.

Further, the chamber moving device 24 is preferably constructed so as to be able to oscillate the vacuum chamber 23 in view of the simplification of its structure, but other types of moving devices,
For example, while the vacuum chamber 23 is kept horizontal, the vacuum chamber 23 is moved up and down to move the work table 8 of the stencil printing station B.
On the other hand, it may be a moving device or the like in which the lower end opening 26 is pressed and separated. Further, instead of the disc 12 of the table moving device 9, an arm on which the work table 8 is attached may be radially attached to the shaft of the index 11 at its upper end.

Further, the shape of the work table 8 may be a shape other than a rectangular shape, and when the substrate moving device 2 equipped with the index type table moving device 9 is mounted, the number of the work tables 8 mounted. Are selected according to need. In addition, in the stencil printing, the vacuum chamber 2
The vacuum degree of 3 is maintained at a low vacuum degree of 10 toll or less.

[0041]

As described above, according to the present invention, a resin sealing apparatus for electronic parts can be divided into a resin liquid supply under atmospheric pressure and a stencil printing under a vacuum atmosphere, and a substrate for a subsequent process can be divided. The feeding can be performed quickly, and therefore the productivity of the resin-sealed substrate can be further improved.
Further, the maintenance can be facilitated and the size of the vacuum chamber can be reduced, and further the airtightness of the substrate loading / unloading port of the vacuum chamber can be facilitated.

[Brief description of drawings]

FIG. 1 is a front view showing a configuration of a resin sealing device for an electronic component.

FIG. 2 is a front view showing the resin liquid supply under atmospheric pressure and the stencil printing under a vacuum atmosphere in the resin sealing apparatus of FIG.

FIG. 3 is a front view of the resin sealing device of FIG. 1 showing a state in which stencil printing is completed in a vacuum atmosphere.

FIG. 4 is a front view showing another configuration of a resin sealing device for electronic components.

5 is a front view showing the resin liquid supply under atmospheric pressure in the resin sealing device of FIG.

6 is a front view showing stencil printing in a vacuum atmosphere in the resin sealing device of FIG.

[Explanation of symbols]

A work station B Stencil printing station 1 Resin liquid supply device 2 Substrate moving device 3 Vacuum chamber device 4 electronic components 5 substrates 6 stencil 7 Stencil moving means 8 work table 9 Table moving device 16 nozzles 18 Sealing resin 22 Squeegee 23 Vacuum chamber 24 Chamber moving device 25 Vacuum pump device 26 Bottom opening

Claims (7)

(57) [Claims] 1. A work station under atmospheric pressure for supplying a sealing resin liquid onto the upper surface of a stencil positioned on an electronic component mounted on a substrate, together with the stencil to which the sealing resin liquid is supplied. A substrate moving device that moves the substrate to a stencil printing station, and a squeegee that seals the electronic component by pushing the sealing resin liquid into a resin pushing hole of the stencil in the stencil printing station, and Prior to sealing the electronic component with a squeegee, a vacuum chamber device that shuts off a predetermined space region of the stencil printing station that moves the squeegee from the outside air to make the atmosphere a vacuum is provided. Parts resin sealing device. 2. The resin sealing device for electronic parts according to claim 1, wherein a resin liquid supplying device for supplying a sealing resin liquid to the upper surface of the stencil is mounted on the work station. 3. A substrate moving device supporting a substrate, and
A work table equipped with stencil moving means for moving the stencil toward and away from electronic components mounted on the substrate; and a table moving device for reciprocating the work table between a working station and a stencil printing station. The resin sealing device for an electronic component according to claim 1 or 2. 4. The resin sealing of electronic parts according to claim 3, wherein the table moving device is configured to be intermittently moved in one direction so as to draw a circular locus while keeping the work table horizontal. Stop device. 5. The resin-sealing device for an electronic component according to claim 3, wherein the table moving device is configured to be capable of linearly reciprocating while keeping the work table horizontal. 6. A vacuum chamber apparatus is moved to a stencil printing station, and a work table moved to a stencil printing station is pressed against a lower end opening of a vacuum chamber having a squeegee installed therein to shut off a predetermined space region of the stencil printing station from the outside air. 5. An apparatus and a vacuum pump apparatus for evacuating the inside of the vacuum chamber.
Or the resin sealing device of the electronic component as described in 5. 7. The chamber moving device is configured such that a vacuum chamber having a squeegee therein can be swung or moved up and down so that the lower end opening can be pressed and separated from the table. Resin encapsulation equipment for electronic components.