JP3406586B2 - Liquid crystal display - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device having a light guide plate arranged under a liquid crystal display panel and a fluorescent tube arranged near a side surface of the light guide plate, and more particularly to a light guide plate and a liquid crystal display panel. Related to the pressing structure.

[0002]

2. Description of the Related Art An active matrix type liquid crystal display device is provided with a non-linear element (switching element) corresponding to each of a plurality of pixel electrodes arranged in a matrix. Since the liquid crystal in each pixel is theoretically always driven (duty ratio 1.0), the active system has better contrast than the so-called simple matrix system, which employs the time-division driving system, and especially the color liquid crystal display device. Then it is becoming an indispensable technology. A typical example of the switching element is a thin film transistor (TFT).

In a liquid crystal display device, for example, two transparent glass substrates are overlapped with a predetermined gap so that the surfaces on which the display pixel electrodes made of a transparent conductive film and the alignment film are laminated face each other. A frame-shaped sealing material is provided on the edge between both substrates, and both substrates are bonded together, and liquid crystal is sealed inside the sealing material between both substrates from the liquid crystal sealing opening provided in part of the sealing material. And a liquid crystal display panel (liquid crystal display element) formed by installing or adhering polarizing plates on the outer sides of both substrates, and a circuit board arranged outside the outer peripheral portion of the liquid crystal display panel and having a liquid crystal driving circuit formed thereon. An intermediate frame that is a molded product that holds each of these members, a metal shield case that houses each of these members and has a liquid crystal display window opened, and a liquid crystal display panel that is arranged below the liquid crystal display panel. Light on It is configured to include a backlight or the like for feeding.

An active matrix type liquid crystal display device using thin film transistors is disclosed in, for example, Japanese Patent Application Laid-Open No. 63-309921, "1.
2.5-inch active matrix color LCD ", Nikkei Electronics, pages 193-210, 1986 12
Known on the 15th of March, published by Nikkei McGraw-Hill, Inc.

[0005]

In the prior art, since the light guide plate of the backlight and the liquid crystal display panel are firmly held in the device, there is a problem that the external size of the device becomes large.

In addition, two lamp cables each having one end connected to each end of a fluorescent tube which constitutes a backlight are provided.
When pulling out in a direction, in the conventional technology, there is no space for passing the lamp cable, the lamp cable protrudes from the liquid crystal display device, and a large space is required to store the lamp cable, and the device can be made smaller and lighter. Was difficult. Further, the conventional rubber bush which holds the fluorescent tube holds only the fluorescent tube.

Further, since the conventional light guide plate of the backlight has a lot of useless area for holding in order to hold down the light guide plate in the device, it is formed to be much larger than the size of the effective light emitting portion. There is a problem that the device is large and the weight of the device is heavy.

Further, conventionally, after the liquid crystal display device is assembled, the weight of the liquid crystal display panel, the light guide plate, and the like causes the mold case (frame-shaped body) formed by integral molding to move vertically from the upper surface to the lower surface. There was a problem that the bottom surface of the molded case swells due to the applied force. In order to suppress this bulge, the thickness of the mold case must be increased, and the liquid crystal display device cannot be made thin and lightweight.

Further, in the conventional liquid crystal display device, the cable of the fluorescent tube of the backlight passes through the outer side surface of the device, and the cable or the inverter connected to the tip of the cable protrudes to the outside of the device, and the external dimensions are substantially the same. There was a problem that became large.

A first object of the present invention is to provide a liquid crystal display device capable of securely holding the light guide plate and the liquid crystal display panel in the device and reducing the size and weight.

A second object of the present invention is to provide a liquid crystal display device in which the fluorescent tube cable does not stick out from the liquid crystal display device and can be made compact and lightweight.

A third object of the present invention is to provide a small-sized and lightweight liquid crystal display device that efficiently holds the light guide plate in the device and reduces the size of the light guide plate as much as possible.

A fourth object of the present invention is to suppress the bulging of the bottom surface of the mold case due to the weight of the liquid crystal display panel, the light guide plate, etc., and to reduce the thickness of the mold case. Another object of the present invention is to provide a liquid crystal display device that can be reduced in weight.

A fifth object of the present invention is to provide a small and lightweight liquid crystal display device in which a cable and an inverter do not protrude outside the device.

[0015]

In order to solve the first problem, the present invention provides a liquid crystal display panel, a light guide plate disposed under the liquid crystal display panel, and a light guide plate disposed near a side surface of the light guide plate. A fluorescent tube, at least one optical sheet arranged on the upper surface of the light guide plate, and a case containing the light guide plate and the fluorescent tube, and at least one optical sheet. A side edge of the light guide plate is projected from the side edge of the light guide plate and placed on the side wall of the case, and a rubber cushion or the like is provided between the optical sheet on the side wall and the liquid crystal display panel. The elastic body is provided.

Further, the elastic body is provided between the optical sheet on the side wall and the lower surface of the upper transparent glass substrate of the liquid crystal display panel.

At least one of the liquid crystal display panel, the circuit board arranged on the outer peripheral portion of the liquid crystal display panel, the light guide plate arranged under the liquid crystal display panel, and at least one of the light guide plates.
A fluorescent tube arranged near the side surface, at least one optical sheet arranged on the upper surface of the light guide plate, a metal shield case containing the liquid crystal display panel and the circuit board, the light guide plate and the light guide plate. In a liquid crystal display device having a molded case formed by integrally molding that contains a fluorescent tube, at least one of the four sides of at least one of the optical sheets is provided with an end of the light guide plate. Is placed on the side wall of the mold case so as to protrude from the end portion of the mold case, an elastic body is interposed between the optical sheet on the side wall and the lower surface of the upper transparent glass substrate of the liquid crystal display panel, and the shield case It is characterized in that fitting parts provided respectively for the mold case and the mold case are fitted and integrated.

Further, the optical sheet is a diffusion sheet provided on the upper surface of the light guide plate and a prism sheet provided on the upper surface of the diffusion sheet.

In order to solve the second problem, the present invention holds both a fluorescent tube and a cable in a liquid crystal display device having a backlight including a fluorescent tube and a cable for the fluorescent tube. It is characterized by having a holder made of an elastic body.

Further, there is provided a backlight including a fluorescent tube and two cables, one end of which is connected to each end of the fluorescent tube, and the other ends of the two cables are drawn out in the same direction. In the liquid crystal display device, the fluorescent tube and
The present invention is characterized by having a holder provided with at least one of one or a plurality of holes and grooves for holding both the book and the two cables.

In order to solve the third problem, the present invention accommodates a light guide plate of a backlight arranged below a liquid crystal display panel and a fluorescent tube arranged near a side surface of the light guide plate in a case. In the liquid crystal display device described above, the movement of the light guide plate toward the fluorescent tube is prevented by a minute protrusion provided on the inner surface of the case between the light guide plate and the fluorescent tube. .

The case is a molded case formed by integral molding.

Further, the light guide plate has a substantially rectangular shape.

Further, the size of the light guide plate is as close as possible to the size of the effective light emitting portion.

Further, the protrusion is provided integrally with the case.

Further, two projections are provided near both ends of the fluorescent tube.

Further, three sides other than one side of the light guide plate on the side of the fluorescent tube are held by the inner wall of the light guide plate storage portion formed in the case along the substantially rectangular shape of the light guide plate. Characterize.

In order to solve the above-mentioned fourth problem, the liquid crystal display device of the present invention is characterized in that an opening is provided in the central portion of the case which holds the light guide plate except the frame-shaped portion.

Further, in a liquid crystal display device in which a liquid crystal display panel and a light guide plate arranged below the liquid crystal display panel are housed in a molded case formed by integral molding and a metal shield case, a central portion excluding the frame-shaped portion of the mold frame. It is characterized in that an opening is provided in.

The liquid crystal display panel further includes a metal shield case for containing the liquid crystal display panel and a molded case formed by integral molding for containing the light guide plate disposed under the liquid crystal display panel. An elastic body is interposed between the display panel and the light guide plate, the shield case is pushed toward the inside of the device, and the fitting portions provided with the shield case and the mold case are fitted and integrated with each other. In the liquid crystal display device having the above structure, an opening is provided in the central portion of the mold case excluding the frame-shaped portion.

In order to solve the fifth problem, the liquid crystal display device of the present invention is characterized in that the cable of the backlight is housed in the groove provided in the case.

In addition, in a liquid crystal display device having a fluorescent tube and a molded case formed by integrally molding the fluorescent tube, two cables connected to both ends of the fluorescent tube are integrated into the molded case. It is characterized by being stored in the groove provided in the.

At least one of the liquid crystal display panel, the circuit board arranged on the outer periphery of the liquid crystal display panel, the light guide plate arranged under the liquid crystal display panel, and at least one of the light guide plates.
A fluorescent tube arranged on a side surface, a metal shield case that houses the liquid crystal display panel and the circuit board, and a molded case formed by integral molding that houses the light guide plate and the fluorescent tube. In the liquid crystal display device having the shield case and the mold case integrated with each other, two cables, one end of each of which is connected to both ends of the fluorescent tube, are integrally provided on a side wall of the mold case. Characterized by being stored in a groove.

Further, the first cable connected to the first end of the fluorescent tube is housed in a groove provided on the side wall of the mold case along the fluorescent tube.

Further, the first cable connected to the first end of the fluorescent tube is housed in a groove provided on the side wall of the mold case along the fluorescent tube, and The first cable after the second end and the second cable connected to the second end are substantially perpendicular to the direction before the second end of the first cable. It is characterized by being pulled out in the direction.

The first cable after the second end of the fluorescent tube and the second cable connected to the second end are attached to the mounting hole of the mold case and the liquid crystal display. It is characterized in that it is drawn out from the circuit board arranged on the outer peripheral portion of the short side of the panel.

Further, the inverter connected to each of the other ends of the cables is housed in a housing portion outside the light guide plate provided in the mold case without protruding from the mold case. .

[0038]

In the liquid crystal display device of the present invention, the side edge of at least one optical sheet such as a diffusion sheet or a prism sheet arranged on the light guide plate is guided by protruding from the side edge of the light guide plate. The light guide plate and the liquid crystal display are placed on the side wall of the case that houses the light plate, and an elastic body such as a rubber cushion is interposed between the optical sheet and the liquid crystal display panel on the side wall and firmly pressed by the case. The panel can be firmly pressed and fixed in the device.
Further, the holding structure can reduce the size and weight of the device without increasing the outer dimensions of the device. It should be noted that the elastic body such as a rubber cushion is arranged between the optical sheet on the side wall of the case and the lower surface of the upper transparent glass substrate of the two transparent glass substrates constituting the liquid crystal display panel. Because only is pressurized
It is effective in preventing display unevenness due to changes in the gap between both substrates.

Further, in the liquid crystal display device of the present invention, both the fluorescent tube and the cable of the fluorescent tube are held by a holding member such as a rubber bush made of an elastic body, so that the cable is not protruded from the liquid crystal display device. Since the liquid crystal display device can be housed without being required, the liquid crystal display device can be made smaller and lighter, and the manufacturing cost can be reduced.

Further, in the liquid crystal display device of the present invention, the size of the light guide plate of the backlight is made as close as possible to the size of the effective light emitting portion and is made as small as possible, so that the space occupied by the conventional light guide plate is filled with electronic components. Can be mounted, and the light guide plate can be held in a small space by holding the light guide plate by the minute protrusions provided on the inner surface of the housing of the light guide plate, so that the device can be downsized. The weight can be reduced, and the manufacturing cost can be reduced.

Further, in the liquid crystal display device of the present invention, a large opening is provided in the central portion of the bottom surface of the mold case excluding the peripheral frame portion, so that the liquid crystal display panel is assembled after the liquid crystal display device is assembled. It is possible to prevent the bottom surface of the mold case from bulging due to a force applied vertically to the bottom surface of the mold case from the top surface to the bottom surface due to the weight and internal pressure of the mold case, and to suppress the maximum thickness. Therefore, the thickness of the mold case can be reduced, and the liquid crystal display device can be reduced in thickness and weight.

Further, in the liquid crystal display device according to the present invention, the two cables connected to both ends of the fluorescent tube of the backlight are housed in the groove provided in the case, and the inverter is provided in the mold case. By storing the cable in the storage portion outside the device, the cable and the inverter can be stored without protruding to the outside of the device. Therefore,
The liquid crystal display device can be reduced in size and weight, and the manufacturing cost can be reduced.

[0043]

The invention, further objects of the invention and further features of the invention will be apparent from the following description with reference to the drawings. << Active Matrix Liquid Crystal Display Device >> An embodiment in which the present invention is applied to an active matrix color liquid crystal display device will be described below. In the drawings described below, components having the same function are designated by the same reference numeral, and repeated description thereof will be omitted. << Outline of Matrix Section >> FIG. 2 is a plan view showing one pixel and its periphery of an active matrix type color liquid crystal display device to which the present invention is applied, and FIG. 4 is a sectional view taken along the line 4-4 in FIG. Further, FIG. 5 shows a plan view when a plurality of pixels shown in FIG. 2 are arranged.

As shown in FIG. 2, each pixel has two adjacent scanning signal lines (gate signal lines or horizontal signal lines) GL.
And an adjacent two video signal lines (drain signal line or vertical signal line) DL are intersected with each other (in a region surrounded by four signal lines). Each pixel includes a thin film transistor TFT, a transparent pixel electrode ITO1 and a storage capacitor element Cadd. The scanning signal lines GL extend in the column direction and are arranged in the row direction. The video signal lines DL extend in the row direction and a plurality of video signal lines DL are arranged in the column direction.

As shown in FIG. 3, a thin film transistor TFT is provided on the lower transparent glass substrate SUB1 side based on the liquid crystal LC.
The transparent pixel electrode ITO1 is formed, and the color filter FIL and the light-shielding black matrix pattern BM are formed on the upper transparent glass substrate SUB2 side. The lower transparent glass substrate SUB1 has a thickness of, for example, about 1.1 mm. In addition, the transparent glass substrates SUB1 and S
A silicon oxide film SIO formed by dipping or the like is provided on both surfaces of the UB2. Therefore, even if there are sharp scratches on the surfaces of the transparent glass substrates SUB1 and SUB2, the sharp scratches can be covered with the silicon oxide film SIO, so that the scanning signal line G deposited on the scratches can be covered.
The film quality of L, the light shielding film BM, etc. can be kept uniform.

On the inner surface (liquid crystal LC side) of the upper transparent glass substrate SUB2, a light shielding film BM and a color filter FI are provided.
L, protective film PSV2, common transparent pixel electrode ITO2 (CO
M) and the upper alignment film ORI2 are sequentially stacked. << Outline of matrix area >> FIG. 17 shows the upper and lower glass substrates S.
FIG. 18 is a plan view of a main part around a matrix (AR) of a display panel PNL including UB1 and SUB2, FIG. 18 is a plan view exaggerating the peripheral part, and FIG. It is a figure which shows the enlarged plane near the part SL. Further, in FIG. 20, the cross section of FIG. 3 is centered, the cross section taken along the line 19a-19a of FIG.
It is a figure which shows the cross section near M. Similarly, FIG. 21 is a diagram showing a cross section near the external connection terminal GTM to which the scanning circuit is to be connected on the left side, and a cross section near the seal portion where there is no external connection terminal on the right side.

[0047] Any For this panel In the manufacture of, if small size divided from simultaneously processing a plurality fraction of the device in one glass substrate for increased throughput, manufacturing facilities if large size shared In each type, a glass substrate having a standardized size is processed, and then the size is reduced to a size suitable for each type. In any case, the glass is cut after going through one step. 17 to 19 show the latter example. In both of FIGS. 17 and 18, the upper and lower substrates SUB are shown.
19 shows the state after the cutting of the substrates 1 and SUB2, and FIG. 19 shows the state before the cutting, LN indicates the edges of the two substrates before cutting, and CT1 and CT2 indicate the positions of the substrates SUB1 and SUB2 to be cut, respectively. In either case, in the completed state, the external connection terminal group T
g and Td (subscript omitted) exist (upper side and left side in the figure)
The upper substrate SUB2 is limited in size to the inside of the lower substrate SUB1 so as to expose them. The terminal groups Tg and Td are respectively those of a tape carrier package TCP (FIG. 22 and FIG. 23) in which a scanning circuit connecting terminal GTM, a video signal circuit connecting terminal DTM, and their lead-out wiring portions, which will be described later, are mounted on an integrated circuit chip CHI. This is the name given to multiple units collectively. The lead wiring from the matrix portion of each group to the external connection terminal portion is inclined toward both ends. This is to match the terminals DTM and GTM of the display panel PNL with the arrangement pitch of the package TCP and the connection terminal pitch of each package TCP.

Between the transparent glass substrates SUB1 and SUB2, along the edge thereof, except for the liquid crystal filling port INJ, the liquid crystal LC
A seal pattern SL is formed so as to seal the. The sealing material is made of epoxy resin, for example. The common transparent pixel electrode ITO2 on the upper transparent glass substrate SUB2 side is connected to at least one of the lead wirings INT formed on the lower transparent glass substrate SUB1 side by the silver paste material AGP at four corners of the panel in this embodiment. ing. The lead wiring INT is formed in the same manufacturing process as a gate terminal GTM and a drain terminal DTM described later.

The orientation films ORI1 and ORI2, the transparent pixel electrode ITO1, the common transparent pixel electrode ITO2, and the respective layers are formed inside the seal pattern SL. Polarizing plate P
OL1 and POL2 are lower transparent glass substrates SUB, respectively.
1. Formed on the outer surface of the upper transparent glass substrate SUB2. The liquid crystal LC is enclosed in a region partitioned by a seal pattern SL between a lower alignment film ORI1 and an upper alignment film ORI2 that set the orientation of liquid crystal molecules. The lower alignment film ORI1 is a protective film P on the lower transparent glass substrate SUB1 side.
It is formed on top of SV1.

In this liquid crystal display device, various layers are separately stacked on the lower transparent glass substrate SUB1 side and the upper transparent glass substrate SUB2 side, and the seal pattern SL is provided on the substrate SUB2.
Formed on the side, the lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2 are overlapped, the liquid crystal LC is injected from the opening INJ of the sealing material SL, and the injection port INJ is sealed with epoxy resin or the like to form the upper and lower substrates. It is assembled by cutting. << Thin Film Transistor TFT >> Thin Film Transistor TFT
Operates such that when a positive bias is applied to the gate electrode GT, the channel resistance between the source and the drain decreases, and when the bias is zero, the channel resistance increases.

The thin film transistor TFT of each pixel is divided into two (plural) in the pixel and is composed of thin film transistors (divided thin film transistors) TFT1 and TFT2. Each of the thin film transistors TFT1 and TFT2 has substantially the same size (channel length and channel width are the same). Each of the divided thin film transistors TFT1 and TFT2 is an i-type semiconductor made of a gate electrode GT, a gate insulating film GI, an i-type (intrinsic, conductivity type determination impurity-undoped) amorphous silicon (Si). It has a layer AS, a pair of source electrodes SD1 and a drain electrode SD2. It should be understood that the source and drain are originally determined by the bias polarity between them, and the polarity is inverted during operation in the circuit of this liquid crystal display device, so it should be understood that the source and drain are switched during operation. However, in the following description, for convenience, one is fixed as the source and the other is fixed as the drain. << Gate Electrode GT >> The gate electrode GT is shown in FIG.
As shown in the plan view in which only the conductive film g2 and the i-type semiconductor layer AS are drawn), the direction perpendicular to the scanning signal line GL (see FIG.
And a shape projecting upward (in FIG. 6) (branched into a T shape). Gate electrode GT
Are projected so as to exceed the active regions of the thin film transistors TFT1 and TFT2. Thin film transistor T
The gate electrodes GT of the FT1 and the TFT2 are integrally formed (as a common gate electrode) and are formed continuously with the scanning signal line GL. In this example, the gate electrode GT is formed of the single-layer second conductive film g2. The second conductive film g2 is, for example, an aluminum (Al) film formed by sputtering, and is formed to have a film thickness of about 1000 to 5500 Å. An Al anodic oxide film AOF is provided on the gate electrode GT.

As shown in FIGS. 2, 3 and 6, this gate electrode GT is formed larger than it so as to completely cover the i-type semiconductor layer AS (as viewed from below).
Therefore, when the backlight BL such as a fluorescent tube is attached below the lower transparent glass substrate SUB1, the gate electrode GT made of this opaque Al becomes a shadow and the i-type semiconductor layer AS is exposed to the backlight light. Therefore, the conduction phenomenon due to the light irradiation, that is, the deterioration of the off-characteristics of the thin film transistor TFT is less likely to occur. The original size of the gate electrode GT is the minimum required to extend between the source electrode SD1 and the drain electrode SD2 (including the alignment margin between the gate electrode GT, the source electrode SD1 and the drain electrode SD2). ) Has a width and its depth length that determines the channel width W is the ratio of the distance (channel length) L between the source electrode SD1 and the drain electrode SD2, that is, the factor W / L that determines the mutual conductance gm. It depends on what you do. Gate electrode G in this liquid crystal display device
The size of T is, of course, larger than the original size described above. << Scanning Signal Line GL >> The scanning signal line GL is composed of the second conductive film g2. The second conductive film g2 of the scanning signal line GL
Are formed in the same manufacturing process as the second conductive film g2 of the gate electrode GT and are integrally formed. Also, an Al anodic oxide film AOF is provided on the scanning signal line GL. << Insulating Film GI >> The insulating film GI is a thin film transistor TFT.
1, used as a gate insulating film for each of the TFTs 2. The insulating film GI includes the gate electrode GT and the scanning signal line GL.
Is formed in the upper layer. For the insulating film GI, for example, a silicon nitride film formed by plasma CVD is used, and 1200
~ 2700Å film thickness (2000
It is formed with a film thickness of about Å. The gate insulating film GI is shown in FIG.
As shown in FIG. 7, the matrix portion AR is formed so as to surround the whole, and the peripheral portion is removed so as to expose the external connection terminals DTM and GTM. << i-Type Semiconductor Layer AS >> The i-type semiconductor layer AS is, as shown in FIG. 6, divided into a plurality of thin film transistors TFT1,
It is used as a channel forming region of each of the TFTs 2. The i-type semiconductor layer AS is formed of an amorphous silicon film or a polycrystalline silicon film and has a film thickness of 200 to 2200Å (in this liquid crystal display device, a film thickness of about 2000Å).

This i-type semiconductor layer AS is continuously formed by the same plasma CVD as the formation of the insulating film GI used as a gate insulating film made of Si ₃ N ₄ by changing the components of the supply gas.
It is formed by the apparatus without being exposed to the outside from the plasma CVD apparatus. Further, phosphorus (P) for ohmic contact is doped with 2.5% of N ⁺ type semiconductor layer d.
0 (FIG. 3) is similarly continuously formed with a film thickness of 200 to 500 Å (in this liquid crystal display device, a film thickness of about 300 Å). After that, the lower transparent glass substrate SUB1 is CV
After being taken out of the D device, the N ⁺ type semiconductor layer d0 and the i type semiconductor layer AS are patterned into independent islands as shown in FIGS. 2, 3 and 6 by a photo processing technique.

As shown in FIGS. 2 and 6, the i-type semiconductor layer AS is also provided between both the intersections (crossover portions) of the scanning signal lines GL and the video signal lines DL. The i-type semiconductor layer AS at the intersection reduces the short circuit between the scanning signal line GL and the video signal line DL at the intersection. << Transparent Pixel Electrode ITO1 >> The transparent pixel electrode ITO1 constitutes one of the pixel electrodes of the liquid crystal display section.

The transparent pixel electrode ITO1 is the source electrode SD1 of the thin film transistor TFT1 and the thin film transistor T.
It is connected to both source electrodes SD1 of FT2. Therefore, even if a defect occurs in one of the thin film transistors TFT1 and TFT2, if the defect causes a side effect, an appropriate portion is cut by laser light or the like, and if not, the other thin film transistor operates normally. You can leave it alone because it does. It is rare that defects occur simultaneously in the two thin film transistors TFT1 and TFT2, and the probability of point defects or line defects can be extremely reduced by such a redundancy system. Transparent pixel electrode ITO
1 is composed of the first conductive film d1.
The conductive film d1 is made of a transparent conductive film (Indium-Tin-Oxide ITO: Nesa film) formed by sputtering.
The film thickness of 00 to 2000 Å (in this liquid crystal display device, 14
The film thickness is about 00Å). << Source Electrode SD1, Drain Electrode SD2 >> The source electrode SD1 and the drain electrode SD2 of each of the thin film transistors TFT1 and TFT2 divided into a plurality of layers are shown in FIG.
As shown in FIGS. 3 and 7 (plan views showing only the first to third conductive films d1 to d3 of FIG. 2), they are provided separately on the i-type semiconductor layer AS.

Each of the source electrode SD1 and the drain electrode SD2 is formed by sequentially superposing a second conductive film d2 and a third conductive film d3 from the lower layer side in contact with the N ⁺ type semiconductor layer d0. The second conductive film d2 of the source electrode SD1
The third conductive film d3 is formed in the same manufacturing process as the second conductive film d2 and the third conductive film d3 of the drain electrode SD2.

The second conductive film d2 is a chromium (Cr) film formed by sputtering and is formed to have a film thickness of 500 to 1000 Å (in this liquid crystal display device, a film thickness of about 600 Å).
Since the stress increases when the Cr film is formed thicker, the Cr film is formed within the range of about 2000 Å.
The Cr film has good contact with the N ⁺ type semiconductor layer d0. C
The r film constitutes a so-called barrier layer that prevents Al of the third conductive film d3 described later from diffusing into the N ⁺ type semiconductor layer d0. As the second conductive film d2, a refractory metal (Mo, Ti, Ta, W) film or a refractory metal silicide (MoSi ₂ , TiSi ₂ , TaSi ₂ , WSi ₂ ) film may be used instead of the Cr film.

The third conductive film d3 has a thickness of 3000 to 5000 Å by sputtering Al (in this liquid crystal display device,
The film thickness is about 4000Å). The Al film has less stress than the Cr film, can be formed to have a thick film thickness, and is configured to reduce the resistance values of the source electrode SD1, the drain electrode SD2, and the video signal line DL. As the third conductive film d3, an Al film containing silicon or copper (Cu) as an additive may be used in addition to the pure Al film.

After patterning the second conductive film d2 and the third conductive film d3 with the same mask pattern, using the same mask or the second conductive film d2 and the third conductive film d3 as a mask, the N ⁺ type semiconductor layer is formed. d0 is removed. That is, i
The N ⁺ type semiconductor layer d0 remaining on the type semiconductor layer AS is self-aligned except for the second conductive film d2 and the third conductive film d3. At this time, since the N ⁺ type semiconductor layer d0 is etched so that the entire thickness thereof is removed,
The surface of the i-type semiconductor layer AS is slightly etched, but the degree thereof may be controlled by the etching time.

The source electrode SD1 is the transparent pixel electrode ITO1.
It is connected to the. The source electrode SD1 includes the step of the i-type semiconductor layer AS (the thickness of the second conductive film g2, the thickness of the anodic oxide film AOF, the thickness of the i-type semiconductor layer AS, and the N ⁺ -type semiconductor layer d).
It is configured along a step corresponding to the film thickness obtained by adding the film thickness of 0). Specifically, the source electrode SD1 is the second conductive film d2 formed along the step of the i-type semiconductor layer AS.
And the third conductive film d formed on the second conductive film d2.
3 and 3. The third conductive film d3 of the source electrode SD1 cannot be formed thick due to the increased stress of the Cr film of the second conductive film d2 and cannot overcome the step shape of the i-type semiconductor layer AS. Is configured for. That is, the step coverage is improved by forming the third conductive film d3 thick. Since the third conductive film d3 can be formed thick, it greatly contributes to the reduction of the resistance value of the source electrode SD1 (the same applies to the drain electrode SD2 and the video signal line DL). << Protective Film PSV1 >> A protective film PSV1 is provided on the thin film transistor TFT and the transparent pixel electrode ITO1. The protective film PSV1 is mainly formed to protect the thin film transistor TFT from moisture and the like, and a film having high transparency and good moisture resistance is used. The protective film PSV1 is formed of, for example, a silicon oxide film or a silicon nitride film formed by a plasma CVD apparatus, and has a film thickness of about 1 μm.

As shown in FIG. 19, the protective film PSV1 is formed so as to surround the entire matrix portion AR, and the peripheral portion is removed so as to expose the external connection terminals DTM and GTM.
In addition, the common electrode COM of the upper substrate SUB2 is connected to the lower substrate SU.
The portion connected to the lead wire INT for external connection terminal connection of B1 with the silver paste AGP is also removed. Protective film PSV
Regarding the thickness relationship between 1 and the gate insulating film GI, the former is made thicker in consideration of the protection effect, and the latter is made thin in the transconductance gm of the transistor. Therefore, as shown in FIG. 19, the protective film PSV1 having a high protective effect is formed to be larger than the gate insulating film GI so as to protect the peripheral portion over as wide a range as possible. << Light-Shielding Film BM >> On the upper transparent glass substrate SUB2 side, external light (light from above in FIG. 3) is prevented from entering the i-type semiconductor layer AS used as a channel formation region.
The light-shielding film BM is provided, and the light-shielding film BM has a pattern as shown by hatching in FIG. 8 is shown in FIG.
FIG. 6 is a plan view illustrating only a first conductive film d1 made of an ITO film, a color filter FIL, and a light shielding film BM in FIG. The light-shielding film BM is formed of, for example, an aluminum film or a chrome film having a high light-shielding property, and in this liquid crystal display device, the chrome film is formed by sputtering to have a film thickness of about 1300 Å.

Therefore, the thin film transistors TFT1 and TF
The i-type semiconductor layer AS of T2 is sandwiched by the upper and lower light-shielding films BM and the large gate electrode GT,
That part is not exposed to external natural light or backlight. As shown by the hatched portion in FIG. 8, the light-shielding film BM is formed around the pixels, that is, the light-shielding film BM is formed in a grid shape (black matrix), and the effective display area of one pixel is partitioned by this grid. . Therefore, the contour of each pixel is made clear by the light shielding film BM, and the contrast is improved. That is, the light blocking film BM has two functions of blocking the i-type semiconductor layer AS and serving as a black matrix.

A portion facing the edge portion of the transparent pixel electrode ITO1 on the base side in the rubbing direction (the lower right portion in FIG. 2).
Since the light is shielded by the light shielding film BM, even if a domain is generated in the above portion, the domain cannot be seen, so that the display characteristics are not deteriorated.

The backlight may be attached to the upper transparent glass substrate SUB2 side and the lower transparent glass substrate SUB1 may be the observation side (externally exposed side).

The light-shielding film BM is also formed in the peripheral portion in a frame-shaped pattern as shown in FIG. 18, and the pattern is formed continuously with the pattern of the matrix portion shown in FIG. Has been done. As shown in FIGS. 18 to 21, the light-shielding film BM in the peripheral portion is extended to the outside of the seal portion SL to prevent leakage light such as reflected light caused by a mounting machine such as a personal computer from entering the matrix portion. . On the other hand, this light-shielding film BM is about 0.3-1.
It is held inside by about 0 mm and formed so as to avoid the cutting region of the substrate SUB2. << Color Filter FIL >> The color filter FIL is configured by coloring a dyeing base material formed of a resin material such as acrylic resin with a dye. The color filter FIL is formed in a stripe shape at a position facing the pixel (FIG. 9) and is dyed separately (FIG. 9 shows only the first conductive film d1, the light shielding film BM and the color filter FIL in FIG. 5). Then, the B, R, and G color filters FIL are hatched at 45 ° and 135 °, respectively. As shown in FIGS. 8 and 9, the color filter FIL is formed to have a large size so as to cover the entire transparent pixel electrode ITO1, and the light shielding film BM overlaps the edge portions of the color filter FIL and the transparent pixel electrode ITO1.
It is formed inside the peripheral portion of TO1.

The color filter FIL can be formed as follows. First, a dyeing base material is formed on the surface of the upper transparent glass substrate SUB2, and the dyeing base material other than the red filter forming region is removed by a photolithography technique. After that, the dyed substrate is dyed with a red dye and a fixing process is performed to form a red filter R. Next, the green filter G and the blue filter B are sequentially formed by performing the same process. << Protective film PSV2 >> The protective film PSV2 is a color filter F.
It is provided in order to prevent the dyes obtained by dyeing the ILs in different colors from leaking to the liquid crystal LC. The protective film PSV2 is formed of a transparent resin material such as acrylic resin or epoxy resin. << Common Transparent Pixel Electrode ITO2 >> Common Transparent Pixel Electrode ITO
2 is opposed to the transparent pixel electrode ITO1 provided for each pixel on the lower transparent glass substrate SUB1 side, and the optical state of the liquid crystal LC is the same as each pixel electrode ITO1 and the common transparent pixel electrode IT.
It changes in response to a potential difference (electric field) with O2. A common voltage Vcom is applied to the common transparent pixel electrode ITO2. In the present embodiment, the common voltage Vcom is set to an intermediate potential between the low level drive voltage Vdmin and the high level drive voltage Vdmax applied to the video signal line DL. If it is desired to reduce the power supply voltage to about half, an AC voltage may be applied. The common transparent pixel electrode ITO2
Please refer to FIG. 18 and FIG. 19 for the planar shape of FIG. << Gate Terminal Portion >> FIG. 10 is a diagram showing a connection structure from the scanning signal line GL of the display matrix to its external connection terminal GTM, where (A) is a plane and (B) is BB of (A).
The cross section at the cutting line is shown. Note that FIG.
Corresponding to the vicinity of the lower part, the diagonal wiring portion is shown as a straight line for convenience.

AO is a mask pattern for photographic processing, in other words, a photoresist pattern for selective anodic oxidation. Therefore, this photoresist is removed after anodization,
The pattern AO shown in the figure does not remain as a finished product, but since the oxide film AOF is selectively formed on the gate line GL as shown in the cross-sectional view, its locus remains. In the plan view, with respect to the photoresist boundary line AO, the left side is a region covered with the resist and not anodized, and the right side is a region exposed from the resist and anodized. Anodized A
The oxide Al ₂ O ₃ film AOF is formed on the surface of the L layer g2, and the volume of the conductive portion below is reduced. Of course, the anodic oxidation is performed by setting an appropriate time and voltage so that the conductive portion remains. The mask pattern AO does not intersect with the scanning line GL by a single straight line, but is bent in a crank shape and intersects.

In the figure, the AL layer g2 is hatched for easy understanding, but the region which is not anodized is patterned in a comb shape. This is because whiskers are generated on the surface when the width of the Al layer is wide. Therefore, by narrowing the width of each one and arranging a plurality of them in parallel, whiskers can be prevented and wire breakage can be prevented. The aim is to minimize the probability of and the sacrifice of conductivity. Therefore, in this example, the portion corresponding to the base of the comb is also displaced along the mask AO.

The gate terminal GTM has a good adhesion to the silicon oxide SIO layer and a Cr layer g1 having a higher electric contact resistance than Al or the like.
Further, the surface thereof is protected and is composed of a transparent conductive layer d1 of the same level (same layer, simultaneously formed) as the pixel electrode ITO1.
In addition, the conductive layers d2 and d3 formed on the gate insulating film GI and on the side surfaces thereof have their regions so that the conductive layers g2 and g1 are not etched together due to pinholes or the like during the etching of the conductive layers d3 and d2. It remains as a result of being covered with photoresist. In addition, the ITO layer d1 which extends over the gate insulating film GI and extends rightward is one in which the same measures are taken more thoroughly.

In the plan view, the gate insulating film GI is formed on the right side of the boundary line and the protective film PSV1 is formed on the right side of the boundary line, and the terminal portion GTM located at the left end is formed.
Are exposed from them to allow electrical contact with external circuitry. In the figure, only one pair of the gate line GL and the gate terminal is shown, but in reality, a plurality of such pairs are arranged vertically as shown in FIG.
(FIGS. 18 and 19), and the left end of the gate terminal is
In the manufacturing process, it extends beyond the cutting region CT1 of the substrate and is short-circuited by the wiring SHg. Such a short-circuit line SHg in the manufacturing process is used for power supply during anodization and for the orientation film OR.
Useful for preventing electrostatic damage during I1 rubbing. << Drain Terminal DTM >> FIG. 11 is a diagram showing a connection from the video signal line DL to the external connection terminal DTM thereof.
(A) shows the plane, (B) shows the cross section in the BB cutting line of (A). 19 corresponds to the vicinity of the upper right of FIG. 19, and although the orientation of the drawing is changed for convenience, the right end direction corresponds to the upper end (or lower end) of the substrate SUB1.

TSTd is an inspection terminal, which is not connected to an external circuit, but is wider than the wiring portion so that a probe needle or the like can come into contact therewith. Similarly, the drain terminal D
The width of the TM is also wider than that of the wiring portion so that the TM can be connected to an external circuit. The inspection terminals TSTd and the external connection drain terminals DTM are alternately arranged in a zigzag pattern in the vertical direction, and the inspection terminals TSTd terminate without reaching the end portion of the substrate SUB1 as shown in the figure, but the drain terminal DTM.
Is a terminal group Td (subscript omitted) as shown in FIG. 19 and is further extended beyond the cutting line CT1 of the substrate SUB1.
During the manufacturing process, all of them are short-circuited to each other by the wiring SHd to prevent electrostatic breakdown. The drain connection terminal is connected to the opposite side of the matrix of the video signal lines DL in which the inspection terminal TSTd exists, and conversely, the drain connection terminal DTM.
The inspection terminal is connected to the opposite side of the matrix of the video signal lines DL in which is present.

The drain connection terminal DTM has the Cr layer g1 and the ITO layer d1 for the same reason as the above-mentioned gate terminal GTM.
Is formed of two layers, and is connected to the video signal line DL at a portion where the gate insulating film GI is removed. The semiconductor layer AS formed on the end portion of the gate insulating film GI is for etching the edge of the gate insulating film GI in a tapered shape. The protective film PSV1 is, of course, removed on the terminal DTM to connect to an external circuit. AO is the anodizing mask described above, and its boundary line is formed so as to largely surround the entire matrix. In the figure, the left side of the boundary line is covered with the mask, but the layer g2 is covered in the part not covered in this figure. This pattern is not directly relevant as it does not exist.

The lead-out wiring from the matrix portion to the drain terminal portion DTM is as shown in FIG.
The layers d2 and d3 having the same level as the video signal line DL are laminated to the middle of the seal pattern SL just above the layers d1 and g1 having the same level as the drain terminal portion DTM. Is to be minimized, and the Al layer d3, which is easy to contact with electricity, is protected as much as possible by the protective film PSV1 and the seal pattern SL. << Structure of Storage Capacitance Element Cadd >> Transparent Pixel Electrode ITO1
Is formed so as to overlap the adjacent scanning signal line GL at the end opposite to the end connected to the thin film transistor TFT. As is clear from FIG. 2 and FIG. 4, this superimposition is performed by connecting the transparent pixel electrode ITO1 to one electrode P
A storage capacitance element (electrostatic capacitance element) Cadd having L2 and the adjacent scanning signal line GL as the other electrode PL1 is configured.
The dielectric film of the storage capacitor element Cadd is composed of an insulating film GI used as a gate insulating film of the thin film transistor TFT and an anodized film AOF.

As is clear from FIG. 6, the storage capacitor element Cadd is formed in a portion where the width of the second conductive film g2 of the scanning signal line GL is widened. The second conductive film g2 at the portion intersecting the video signal line DL is thinned in order to reduce the probability of short circuit with the video signal line DL.

Even if the transparent pixel electrode ITO1 is broken at the step portion of the electrode PL1 of the storage capacitor Cadd, the second conductive film d2 and the third conductive film d2 formed so as to cross the step.
The defect is compensated by the island region formed of the conductive film d3. << Equivalent Circuit of Entire Display Device >> FIG. 12 shows a wiring diagram of the equivalent circuit of the display matrix portion and its peripheral circuits. Although the figure is a circuit diagram, it is drawn corresponding to the actual geometrical arrangement. AR is a matrix array in which a plurality of pixels are two-dimensionally arranged.

In the figure, X means a video signal line DL, and subscripts G, B and R are added corresponding to green, blue and red pixels, respectively. Y represents the scanning signal line GL, and subscripts 1, 2, 3, ..., End are added according to the order of scanning timing.

The video signal line X (subscript omitted) is connected to the upper video signal drive circuit He. That is, the video signal line X is similar to the scanning signal line Y in the liquid crystal display panel PNL.
The terminal is pulled out to only one side of.

The scanning signal line Y (subscript omitted) is connected to the vertical scanning circuit V.

The SUP is a TFT liquid crystal display device that displays information for a CRT (cathode ray tube) from a power supply circuit or a host (upper processing unit) for obtaining a stabilized voltage source obtained by dividing a plurality of voltages from one voltage source. It is a circuit including a circuit for exchanging information for use. << Equivalent Circuit of Retaining Capacitance Element Cadd and Its Operation >> FIG. 13 shows an equivalent circuit of the pixel shown in FIG. In FIG. 13, Cgs is a parasitic capacitance formed between the gate electrode GT and the source electrode SD1 of the thin film transistor TFT.
The dielectric film having the parasitic capacitance Cgs is the insulating film GI and the anodic oxide film AOF. Cpix is a transparent pixel electrode ITO1 (PI
X) is a liquid crystal capacitor formed between the common transparent pixel electrode ITO2 (COM). The dielectric film of the liquid crystal capacitance Cpix is the liquid crystal LC, the protective film PSV1, and the alignment films ORI1 and OR.
It is I2. Vlc is the midpoint potential.

The storage capacitor element Cadd functions to reduce the influence of the gate potential change ΔVg on the midpoint potential (pixel electrode potential) Vlc when the thin film transistor TFT switches. This can be expressed by the following equation.

ΔVlc = {Cgs / (Cgs + Cadd + Cpix)} × ΔVg Here, ΔVlc represents a change amount of the midpoint potential due to ΔVg. This variation ΔVlc causes a direct current component applied to the liquid crystal LC, but the value can be reduced as the holding capacitance Cadd is increased. In addition, the storage capacitor element C
The add also has the effect of lengthening the discharge time, and accumulates image information for a long time after the thin film transistor TFT is turned off. The reduction of the direct current component applied to the liquid crystal LC can improve the life of the liquid crystal LC and reduce so-called burn-in in which the previous image remains when the liquid crystal display screen is switched.

As described above, since the gate electrode GT is made large enough to completely cover the i-type semiconductor layer AS, the overlap area with the source electrode SD1 and the drain electrode SD2 is increased, and thus the parasitic capacitance Cgs is increased. The reverse effect is that the midpoint potential Vlc is easily affected by the gate (scanning) signal Vg. However, this demerit can be eliminated by providing the storage capacitor element Cadd.

The holding capacitance of the holding capacitance element Cadd is 4 to 8 times (4.C
pix <Cadd <8 · Cpix), 8 to 3 for parasitic capacitance Cgs
Set to a value about twice (8 · Cgs <Cadd <32 · Cgs). << Connection Method of Storage Capacitance Element Cadd Electrode Line >> First stage scanning signal line GL (Y ₀ ) used only as a storage capacitance electrode line
Is a common transparent pixel electrode ITO2, as shown in FIG.
Set to the same potential as (Vcom). In the example of FIG. 19, the scanning signal line at the first stage is short-circuited to the common electrode COM through the terminal GT0, the lead wire INT, the terminal DT0 and the external wiring. Alternatively, the storage capacitor electrode line Y ₀ in the first stage is the scanning signal line Y in the last stage.
It may be connected to end, connected to a DC potential point (AC ground point) other than Vcom, or connected to receive one extra scanning pulse Y ₀ from the vertical scanning circuit V. << Connection Structure with External Circuit >> FIG. 22 shows a scanning signal drive circuit V
The integrated circuit chip CHI, which constitutes the video signal drive circuits He and Ho, is a flexible wiring board (commonly called TAB, Tape).
FIG. 23 is a diagram showing a cross-sectional structure of a tape carrier package TCP mounted on an Automated Bonding), and FIG. 23 shows it in a liquid crystal display panel, in this example, a video signal circuit terminal DT.
It is a principal part sectional view which shows the state connected to M.

In the figure, TB is an input terminal / wiring part of the integrated circuit CHI, and TM is an output terminal / wiring part of the integrated circuit CHI, which is made of, for example, Cu and has inner ends (commonly called inner leads). ) Is the integrated circuit CHI
Bonding pads PAD are connected by a so-called face-down bonding method. Outer end portions (commonly called outer leads) of the terminals TB and TM respectively correspond to inputs and outputs of the semiconductor integrated circuit chip CHI, and are soldered or the like to the CRT / TFT conversion circuit / power supply circuit SUP.
The anisotropic conductive film ACF connects the liquid crystal display panel PNL. The tip of the package TCP is a panel P
The connection terminal DTM on the NL side is connected to the panel so as to cover the exposed protective film PSV1. Therefore, the external connection terminal DTM (GTM) is the protective film PSV1 or the package TC.
Since it is covered by at least one of P, it becomes strong against electric contact.

BF1 is a base film made of polyimide or the like, and SRS is a solder resist film for masking the solder so that it will not stick to an unnecessary place during soldering. The gap between the upper and lower glass substrates outside the seal pattern SL is protected by an epoxy resin EPX or the like after cleaning, and a silicone resin SIL is further filled between the package TCP and the upper substrate SUB2 for multiple protection. << Manufacturing Method >> Next, the substrate SU of the liquid crystal display device described above.
The manufacturing method on the B1 side will be described with reference to FIGS. In the figure, the letters in the center are abbreviations of process names, the left side shows the pixel portion shown in FIG. 3, and the right side shows the processing flow as seen in the sectional shape near the gate terminal shown in FIG.
Except for the step D, steps A to I are divided corresponding to each photographic process, and all the cross-sectional views of each process show the stage after the photo process is finished and the photoresist is removed. In this description, the photographic processing means a series of operations from the application of the photoresist to the selective exposure using the mask to the development thereof, and the repetitive description will be omitted. A description will be given below according to the divided steps.

Step A, FIG. 14 A silicon oxide film SIO is provided on both surfaces of a lower transparent glass substrate SUB1 made of 7059 glass (trade name) by dip processing, and then baked at 500 ° C. for 60 minutes. The film thickness is 1100Å on the lower transparent glass substrate SUB1.
The first conductive film g1 made of chromium is provided by sputtering, and after the photographic processing, the first conductive film g1 is selectively etched with a cerium ammonium nitrate solution as an etching solution. Thereby, the gate terminal GTM, the drain terminal DTM, the anodized bus line SHg connecting the gate terminal GTM, the bus line SHd shorting the drain terminal DTM, and the anodized pad (not shown) connected to the anodized bus line SHg. To form.

Step B, FIG. 14 Al-Pd, Al-Si, Al-S having a film thickness of 2800Å
The second conductive film g2 made of i-Ti, Al-Si-Cu, or the like
Are provided by sputtering. After the photographic processing, the second conductive film g2 is selectively etched with a mixed acid solution of phosphoric acid, nitric acid and glacial acetic acid.

Step C, FIG. 14 After photographic processing (after forming the above-mentioned anodic oxidation mask AO), 3
Substrate SUB1 is immersed in an anodizing solution consisting of a solution prepared by diluting 1% of tartaric acid with ammonia to pH 6.25 ± 0.05 with ethylene glycol solution, and the formation current density is 0.5 mA / cm. ² so as to adjust (constant current Kasei). Next, anodic oxidation is performed until the formation voltage 125 V required to obtain a predetermined Al ₂ O ₃ film thickness is reached. After that, it is desirable to hold this state for several tens of minutes (constant voltage formation). This is important for obtaining a uniform Al ₂ O ₃ film. Thereby, the conductive film g2 is anodized, and the scanning signal line GL, the gate electrode GT, and the electrode P are formed.
Step D in which an anodized film AOF having a film thickness of 1800 Å is formed on L1, FIG. 15 Ammonia gas, silane gas, and nitrogen gas are introduced into the plasma CVD apparatus to provide a 2000 Å film of a silicon nitride nitride film, and plasma CVD Silane gas and hydrogen gas are introduced into the apparatus to form an i-type amorphous Si film having a film thickness of 2000Å, and then hydrogen gas and phosphine gas are introduced into the plasma CVD apparatus to form an N ⁺ type film having a film thickness of 300Å. An amorphous Si film is provided.

Step E, FIG. 15 After photo processing, SF ₆ and CC are used as dry etching gas.
By selectively etching the N ⁺ type amorphous Si film and the i type amorphous Si film using l ₄ , the i type semiconductor layer A
Form an island of S.

Step F, FIG. 15 After the photographic processing, SF ₆ is used as a dry etching gas to selectively etch the Si nitride film.

Step G, FIG. 16 A first conductive film d1 made of an ITO film having a film thickness of 1400Å is provided by sputtering. After the photographic processing, the first conductive film d1 is selectively etched with a mixed acid solution of hydrochloric acid and nitric acid as an etching solution, whereby the uppermost layers of the gate terminal GTM and the drain terminal DTM and the transparent pixel electrode ITO1.
To form.

Step H, FIG. 16: A second conductive film d2 made of Cr and having a film thickness of 600 Å is provided by sputtering.
Pd, Al-Si, Al-Si-Ti, Al-Si-C
A third conductive film d3 made of u or the like is provided by sputtering. After the photographic processing, the third conductive film d3 is etched with the same liquid as the process B, and the second conductive film d2 is etched with the same liquid as the process A to form the video signal line DL, the source electrode SD1, and the drain electrode SD2. To do. Next, CCl ₄ and SF ₆ were introduced into the dry etching apparatus to remove the N ⁺ type amorphous S.
By etching the i film, the N ⁺ type semiconductor layer d0 between the source and the drain is selectively removed.

Step I, FIG. 16 Ammonia gas, silane gas, and nitrogen gas are introduced into the plasma CVD apparatus to form a Si nitride film having a thickness of 1 μm. After the photo processing, the protective film PSV1 is formed by selectively etching the Si nitride film by the photo-etching technique using SF ₆ as a dry etching gas. << Overall Configuration of Liquid Crystal Display Module >> FIG. 1 is an exploded perspective view of the liquid crystal display module MDL, and the specific configurations of the respective components are shown in FIGS.

SHD is a shield case made of a metal plate (also called a metal frame), WD is a display window and INS1.
3 to 3 are insulating sheets, PCBs 1 to 3 are circuit boards (PCB1
Is the drain side circuit board, PCB2 is the gate side circuit board,
PCB3 is an interface circuit board), JN is a joiner that electrically connects the circuit boards PCB1 to PCB3, T
CP1, TCP2 are tape carrier packages, PNL
Is a liquid crystal display panel, GC is a rubber cushion, ILS is a light-shielding spacer, PRS is a prism sheet, SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflection sheet, and MCA is a lower case (molded case) formed by integral molding. , LP is a fluorescent tube, LPC is a lamp cable, and GB is a rubber bush that supports the fluorescent tube LP, and the liquid crystal display module MDL is assembled by stacking the members in a vertical arrangement relationship as shown in the figure.

The module MDL includes a lower case MCA,
The shield case SHD has two types of storage / holding members. Insulation sheets INS1-3, circuit boards PCB1-3,
By combining the metal shield case SHD, which houses and fixes the liquid crystal display panel PNL, and the lower case MCA, which houses the backlight BL composed of the fluorescent tube LP, the light guide plate GLB, the prism sheet PRS, etc., the module MDL is assembled. Can be assembled.

Hereinafter, each member will be described in detail. << Metal Shield Case SHD >> FIG. 25 is a diagram showing the upper surface, front side surface, rear side surface, right side surface, and left side surface of the shield case SHD. FIG. Shown.

Shield case (metal frame) SHD
Is manufactured by punching and bending a single metal plate by a pressing technique. WD is a display panel PN
An opening that exposes L to the visual field is shown, and is hereinafter referred to as a display window.

NL is a fixing claw (12 in total) between the shield case SHD and the lower case MCA, and HK is a fixing hook (4 in total).
It is integrated with HD. The fixing claw NL shown in FIG. 1 and FIG. 25 is in a state before being bent, and is the circuit board PCB1.
After housing 3 to 3 in the shield case SHD, each is bent inward and inserted into a square fixing recess NR (see side views of FIG. 37) provided in the lower case MCA. The fixing hooks HK are fitted to fixing protrusions HP (see the side view of FIG. 37) provided on the lower case MCA. Accordingly, the liquid crystal display panel PNL and the circuit board P
Shield case SHD that holds and stores CB1 to 3 etc.
And the lower case MCA that holds and stores the light guide plate GLB, the fluorescent tube LP, and the like are firmly fixed. Further, thin and elongated rectangular rubber cushions GC (also referred to as rubber spacers; see FIGS. 1 and 43) are provided around the four edges that do not affect the display on the lower surface of the display panel PNL. The rubber cushion GC is interposed between the display panel PNL and the light guide plate GLB. By using the elasticity of the rubber cushion GC to push the shield case SHD toward the inside of the device, the fixing hook HK is caught by the fixing protrusion HP, and the fixing claw NL is bent and inserted into the fixing recess NR. Then, each fixing member functions as a stopper, the shield case SHD and the lower case MCA are fixed, and the entire module is integrally and firmly held, and other fixing members are unnecessary. Therefore, the assembly is easy and the manufacturing cost can be reduced. Further, the mechanical strength is high, the vibration and shock resistance is high, and the reliability of the device can be improved. Further, since the fixing claw NL and the fixing hook HK can be easily removed (only by extending the bending of the fixing claw NL and removing the fixing hook HK), it is easy to disassemble and assemble the two members, so that the repair is easy. , Backlight BL fluorescent tube LP
Can be easily replaced. Further, in the present embodiment, as shown in FIG. 25, one side is mainly fixed by the fixing hook HK,
Since the other side facing each other is fixed by the fixing claws NL, it is possible to disassemble by simply removing a part of the fixing claws NL without removing all the fixing claws NL. Therefore, it is easy to repair and replace the backlight.

CH is a common through hole which is provided in the same plane position in common with the circuit boards PCB1 to PCB3, and the shield case SHD and the circuit board PCB are fixed to pins that are fixed at the time of manufacture.
By mounting the common through-holes CH by inserting 1 to 3 in order, the relative positions of the two can be set accurately. Further, when the module MDL is mounted on an applied product such as a personal computer, the common through hole CH can be used as a positioning reference.

FGN is a total of 12 frame ground claws integrally formed with the metal shield case SHD.
The shield case SHD is formed by a “U” -shaped opening formed in the side surface, in other words, an elongated protrusion extending into a square opening. This elongated protrusion, that is, the nail FG
A frame ground pad FG, N of which is bent at the root in a direction toward the inside of the device and is connected to the ground wiring (not shown) of the circuit boards PCB1 to PCB3.
P (see FIGS. 24 and 27) is connected by soldering. Since the claw FGN is provided on the side surface of the shield case SHD, the work of bending the claw FGN into the device and soldering it to the frame ground pad FGP is performed by the circuit boards PCB1 to PCB3 integrated with the liquid crystal display panel PNL. After being stored in the shield case SHD and fixed, the inner surface (lower surface) of the shield case SHD
The workability is good as it can be performed with the upside down.
Further, when the claw FGN is bent, the claw FGN does not contact the circuit boards PCB1 to PCB3, so that the bending workability is good. Further, in the soldering work, since the soldering iron can be applied from the inner surface side of the opened shield case SHD, the workability of soldering is good. Therefore, the nail FGN
The connection reliability between the frame ground pad FGP and the frame ground pad FGP can be improved.

SH1 to SH4 are four mounting holes provided in the shield case SHD for mounting the module MDL as a display unit in an information processing device such as a personal computer or a word processor. The shield case SH is also attached to the lower case MCA.
Mounting holes MH1 to MH4 corresponding to the mounting holes SH1 to D4 of D are formed (see FIGS. 37 and 38), and the mounting holes are fixed and mounted on the information processing apparatus by screws or the like. By the way, when the mounting hole is provided at the corner of the metal shield case SHD, a drawn portion of the mounting hole (a parallel surface which is integral with the metal plate constituting the metal shield case SHD and whose height is different from that of the metal plate) is used. The portion formed by drawing) can be made into a quarter circular shape. However, due to the arrangement of the mounting components on the circuit board PCB3 and the circuit board P
Due to the electrical connection between CB1 and PCB2, it is not necessary to provide the mounting holes SH at the corners, but when it is desired to provide the mounting holes SH at an intermediate portion that is a predetermined distance from the corners, the drawn portion D of the mounting holes SHD
The shape of R cannot be made a quarter circular shape due to the drawing work, but becomes a half circular shape, and the area required as a mounting hole becomes large. Therefore, as shown in FIG. 25, the area between the drawn portion DR and the metal plate adjacent to the drawn portion DR
By providing the notch L in the circular radius part of / 4,
Easy drawing process, drawing part DR of mounting hole SH1
Can be made into a 1/4 circular shape, and the area required for the mounting hole can be reduced. Therefore, the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced. In other words, the module MDL
The mounting holes SH are mounted on the module MDL while realizing the miniaturization of
It can be provided in the middle part which is a predetermined distance from the corner. << Circuit boards PCB1 to 3 >> FIG. 26 shows a display panel PNL.
24 is a bottom view showing the state in which the circuit boards PCB1 to PCB3 are mounted on the outer periphery of each of the display panels PNL and the circuit boards PCB1 to PCB3 are housed in the shield case SHD.
27 is a bottom view showing the mounted state and each cross-sectional view, and FIG. 27 is a bottom view of the circuit boards PCB1 to PCB3 (a state in which TCP is not mounted on PCB1 and PCB2, and PCB3 is shown in FIGS.
29A is a bottom view of the circuit board PCB3 with no electronic components mounted, FIG. 29B is a bottom view with the electronic components mounted, and FIG. 31 is the circuit board PCB.
1 is a bottom view (showing a state where TCP is not mounted), and FIG. 32 is a bottom view of the circuit board PCB2 (showing a state where TCP is not mounted).

CHI1 and CHI2 are drive IC (integrated circuit) chips for driving the display panel PNL (the lower five in FIG. 26 are drive IC chips on the vertical scanning circuit side, and the left side is 10).
Each is a drive IC chip on the video signal drive circuit side. T
CP1 and TCP2 are tape carrier packages in which the driving IC chip CHI is mounted by the tape automated bonding method (TAB) as described in FIGS. 22 and 23, and TCP and capacitors CDS are mounted in PCB1 and PCB2, respectively. PCB (printed
Circuit board). FGP
Is a frame ground pad, JN3 is a joiner for electrically connecting the drain side circuit board PCB1 and the gate side circuit board PCB2, and JN1 and JN2 are joiners for electrically connecting the drain side circuit board PCB1 and the interface circuit board PCB3. is there. Joiner J shown in FIG.
N1 to N3 are formed by sandwiching and supporting a plurality of lead wires (phosphor bronze material plated with Sn) with a striped polyethylene layer and a polyvinyl alcohol layer. The JN1 to 3 can also be configured by using an FPC (flexible printed circuit).

That is, the circuit boards PCB1 to PCB3 of the display panel PNL are arranged in a "U" shape on the outer peripheral portions of the display panel PNL on three sides. Display panel PNL 1
The display panel P is provided on the outer periphery of the two long sides (left side in FIG. 24).
A drain side circuit board PCB1 on which a plurality of tape carrier packages TCP1 each mounting a drive IC chip (driver) CHI1 for supplying a drive signal to the video signal line (drain signal line) of the NL are mounted is arranged. Further, a plurality of tape carriers each having a driving IC chip CHI2 for supplying a driving signal to a scanning signal line (gate signal line) of the display panel PNL are provided on the outer peripheral portion of the short side (lower side of FIG. 24) of the display panel PNL. A gate side circuit board PCB2 on which the package TCP2 is mounted is arranged. Further, an interface circuit board (also referred to as a control circuit board or a converter circuit board) PCB3 is provided on the outer peripheral portion of the other short side (upper side in FIG. 24) of the display panel PNL.
Are arranged.

Since the circuit boards PCB1 to PCB3 are divided into three substantially rectangular shapes, the circuit board PCB1 is caused by the difference in the coefficient of thermal expansion between the display panel PNL and the circuit boards PCB1 to PCB3.
The stress (stress) generated in the major axis direction of ~ 3 is Joiner J
The output leads (TTM in FIGS. 22 and 23) of the tape carrier package TCP, which is absorbed in the areas N1 to N3 and has a weak connection strength, and the external connection terminals of the liquid crystal display panel PNL (FIG. 2).
2, peeling of DTM (GTM) in FIG. 23 can be prevented,
Further, it contributes to the stress relaxation of the input lead of the tape carrier package TCP, and the reliability of the module against heat can be improved. Such a board division method is
Compared to a single U-shaped substrate, each has a simple rectangular shape, so a large number of substrates PCB1 to PCB3 can be obtained from a single substrate material, increasing the utilization rate of printed circuit board materials. The cost of parts and materials can be reduced (in the case of this embodiment, the cost can be reduced to about 50%). The circuit boards PCB1 to PCB3 are PCs made of glass epoxy resin or the like.
When a flexible FPC (Flexible Printed Circuit) is used instead of B (Printed Circuit Board), the FPC bends and the lead peeling prevention effect can be further enhanced. It is also possible to use an integrated "U" -shaped PCB that is not divided. In that case, the man-hours can be reduced, the manufacturing process management can be simplified by reducing the number of parts, and the reliability can be improved by eliminating the joiner between circuit boards. effective.

As shown in FIG. 27, the frame ground pads FGP connected to the respective ground wirings of the three circuit boards PCB1 to PCB3 are respectively provided at five pieces, four pieces, and three pieces, for a total of 12 pieces. . When the circuit board is divided into a plurality of parts, no electrical problem occurs if at least one part of the drive circuit board is connected to the frame ground in terms of direct current, but there are few such parts in the high frequency region. Due to the reflection of electric signals and the fluctuation of the potential of the ground wiring due to the difference in the characteristic impedance of each drive circuit board, the generation potential of unnecessary radiated radio waves causing EMI (electromagnetic interference) becomes high. In particular, in an active matrix type module MDL using thin film transistors, it is difficult to take measures against EMI because a high-speed clock is used. In order to prevent this, the ground wiring (AC ground potential) is connected to a common frame having a sufficiently low impedance (that is, the shield case SHD) at at least one location for each of the plurality of divided circuit boards. This strengthens the ground wiring in the high frequency area, so
Compared to the case where only 12 parts are connected to the shield case SHD, the electric field intensity of radiation is 5 in the case of 12 parts of this embodiment.
An improvement of more than dB was seen.

As described above, the frame ground claw FGN of the shield case SHD is composed of a metal elongated protrusion, and can be easily bent to easily form the circuit boards PCB1 to PCB1.
3 can be connected to the frame ground pad FGP, and a special wire (lead wire) for connection is unnecessary. Also, the nail F
Shield case SHD and circuit board PCB1 via GN
3 to 3 can be mechanically connected, the circuit board PCB1
The mechanical strength of ~ 3 can also be improved.

Conventionally, in order to suppress the generation of unnecessary radiated radio waves that cause EMI, a plurality of resistors / capacitors for blunting the signal waveform are provided near the signal source integrated circuit,
Alternatively, they are distributed and arranged in the middle of a signal transmission path. Therefore, several spaces for providing the resistor and the capacitor are required near the signal source integrated circuit or between the tape carrier packages, so that the dead space becomes large and electronic parts can be mounted at high density. There wasn't. In this embodiment, as shown in FIG.
A signal source integrated circuit TC provided on the interface circuit board PCB3 with a plurality of capacitors and resistors CR for I countermeasures.
Signal flow of a plurality of drive IC chips CHI1 farther from ON (which will be described in detail later) and farther than the drive IC chip CHI1 of the drain side circuit board PCB1 that receives a signal from the signal source integrated circuit TCON. The drain side circuit board PCB1 on the downstream side in the direction is concentrated. Therefore, the dead space can be reduced and electronic components can be mounted at a high density as compared with the case where they are arranged in a distributed manner. Therefore, the module MD can be reduced in size and weight, and the manufacturing cost can be reduced. << Drain side circuit board PCB1 >> Drain side circuit board P
As shown in FIG. 24, only one CB1 is arranged on only one side (the left side in FIG. 24) of the long side of the display panel PNL. That is, the video signal line DL is the scanning signal line GL.
Similarly, the terminals are drawn out only on one side of the liquid crystal display panel PNL. Therefore, as compared with the configuration in which the video signal lines are alternately drawn out to the two long sides facing each other of the display panel PNL and the drain side circuit boards are arranged outside the respective long sides, a so-called frame portion around the display portion is formed. Since the area can be reduced, the external dimensions of the liquid crystal display module MDL and the information processing device (see FIG. 47) such as a personal computer or word processor in which the liquid crystal display module MDL is incorporated as a display unit can be reduced, and thus the weight can be reduced. be able to. As a result, the material can be reduced, and the manufacturing cost can be reduced. The side on which the drain side circuit board PCB1 is arranged is a position arranged on the upper side of the screen when the module MDL is mounted on a personal computer, a word processor or the like, as shown in FIG. For this reason, in notebook type PCs and word processors,
At the bottom of the screen, a space is needed to provide a hinge for attaching the display to the keyboard, so by arranging the drain side circuit board at the top of the screen,
The vertical position of the screen is appropriate. In addition, in FIG.
JP11 is a pad to which the joiner JN1 is connected, JP1
Reference numeral 2 is a pad to which the joiner JN2 is connected, and JP13 is a pad to which the joiner JN3 is connected.

In the conventional module in which the video signal lines are alternately drawn out above and below the liquid crystal display panel, and the two drain side circuit boards are arranged on both the upper and lower sides of the outer peripheral portion of the liquid crystal display panel, an external personal computer or the like is used. Since the electronic components are arranged along the flow of signals coming in and flowing in the module, a connector for connecting to a personal computer or the like and a signal source integrated circuit TC are provided in the central portion of the interface circuit board.
ON was placed. When the drain side circuit board PCB1 is arranged on one side of the liquid crystal display panel PNL as in the present embodiment, when the electronic parts are arranged along the signal flow as in the conventional method, the drain side circuit of the interface circuit board PCB3 is arranged. The connector CT is arranged at the end farthest from the board PCB1, that is, the end closest to the corner of the shield case SHD (see FIG. 24. In this embodiment, it is not arranged at the corner of the shield case SHD. ), And then the signal source integrated circuit TCON is arranged next to the direction away from the corner. Here, if the connector CT is to be arranged at the outermost end of the circuit board PCB3, that is, at the corner of the shield case SHD, the upper part of the connector CT is connected to a personal computer or the like, and therefore cannot be covered with the lower case MCA ( The notch MLC of the lower case MCA shown in FIG. 37 is located above the connector CT), and the corners of the shield case SHD having the mounting holes SH4 are aligned with the mounting holes MH4.
Can not be covered with the lower case MCA having
The mechanical strength is reduced. Therefore, in this embodiment,
As shown in FIG. 24, a signal source integrated circuit TCO having a low height
N is arranged on the outermost end of the circuit board PCB3, that is, on the circuit board PCB3 near the corner of the shield case SHD, so that the vicinity of the corner can be covered with the lower case MCA, and the N is adjacent to the direction away from the corner. The connector CT is arranged. That is, since the vicinity of the corner of the shield case SHD having the mounting hole SH4 is covered by the lower case MCA having the matching mounting hole MH4, when the module MDL is mounted on an information processing device such as a personal computer, the shield of the module MDL is shielded. The corners of the case SHD and lower case MCA are both mounting holes SH4.
Further, since it is firmly pressed and fixed by a screw or the like through the mounting hole MH4, the mechanical strength is improved and the reliability of the product is improved. As shown in FIG. 47, a signal coming from a personal computer or the like first goes from the connector CT to the signal source integrated circuit TCON and then flows toward the drive IC chip CHI1 of the drain side circuit board PCB1. Therefore, since the signal flow is adjusted, useless signal flow can be eliminated, so that useless wiring can be reduced and the area of the circuit board can be reduced.

Further, in the embodiment shown in FIG. 24, the signal source integrated circuit TCON and the connector CT are on the interface circuit board PCB3 and on the opposite side to the connection side (the side where the joiners JN1 and JN2 are) with the drain side circuit board PCB1. It is provided in. Therefore, as shown in FIG.
The liquid crystal display module MDL is connected to the drain side circuit board P.
By mounting it on a personal computer, a word processor, etc., with the side without CB1 facing the hinge, the connection cable with the host can be shortened. As a result, it is possible to reduce noise that enters from the connection cable between the host and the liquid crystal display module MDL. Further, since the connection between the host and the signal source integrated circuit TCON can be made the shortest, it is possible to further strengthen against the intrusion of noise. Furthermore, it is strong against the rounding delay of the waveform. << Gate-side circuit board PCB2 >> FIG.
It is a top view (bottom surface) of B2. JP23 is Joiner JN
3 is a pad to be connected. << Tape Carrier Package TCP >> FIG. 33 is a plan (bottom) view of the tape carrier package TCP on which the integrated circuit chip CHI is mounted.

Regarding the structure of the tape carrier package TCP and the connection structure with the liquid crystal display panel PNL,
The connection structure with an external circuit has already been described with reference to the sectional views of FIGS. 22 and 23.

The planar shape of the package TCP is shown in FIG. The small outer widths of the terminal portions TM and TB correspond to the narrower terminal pitch. That is, the display panel PNL
The size of the output terminal portion TM connected to the input terminal portion TB connected to the circuit board PCB1 or PCB2 is the same as the size of the input terminal portion TB connected to the circuit board PCB1 or PCB2. It is adjusted to the pitch of the output terminals of the board PCB1 or PCB2.

The width of either the output terminal portion TM or the input terminal portion TB may be smaller than the outermost width.

FIG. 34 is a plan (bottom) view and a side view showing a state in which a plurality of tape carrier packages TCP are mounted on the circuit boards PCB1 and PCB2. << Interface Circuit Board PCB3 >> FIG. 29A is a top view of the interface circuit board PCB3 (a diagram in which the connector CT and the hybrid integrated circuit HI are mounted),
(B) is a signal source integrated circuit TCON, IC, capacitor,
Top view with parts such as resistors mounted (connector C in dotted line)
T, a hybrid integrated circuit HI is implemented).
The interface circuit board PCB3 includes a power circuit for obtaining a stabilized voltage source obtained by dividing a plurality of voltage components from one voltage source, as well as electronic components such as an IC, a capacitor, and a resistor.
CRT (cathode ray tube) from host (upper processor)
A circuit for converting information for use in the TFT liquid crystal display device is mounted (see FIG. 12). CT is a connector connected to an information processing device such as a personal computer in which the module MD is mounted, and TCON is a signal source integrated circuit, which processes image information sent from the host and converts it into liquid crystal driving signals. , A timing pulse is generated, the gate side circuit board PCB2 and the drain side circuit board PCB1 are drive-controlled, and data is displayed on the liquid crystal display device. JP3
Reference numeral 1 is a connecting portion to which the joiner JN1 is connected, and JP32 is a connecting portion to which the joiner JN2 is connected. << Electrical connection between circuit boards PCB1 to PCB3 >> Fig. 36
FIG. 4A is a plan view and a side view showing a state in which joiners JN1 and JN2 for electrically connecting the drain side circuit board PCB1 and the interface circuit board PCB3 are mounted in a two-tier stack.

In recent years, as the number of color liquid crystal display devices has become multicolored, the number of video signal lines for designating the gradations of red, green, and blue has increased, and the number of gradation voltages has also increased. As a result, a portion having an interface function between the set side such as a personal computer in which the module is incorporated and the module is complicated, and particularly electrical connection between the drain side circuit board and the interface circuit board is becoming difficult. In addition to the increase in the number of video signal lines that accompanies the rapid increase in the number of colors in liquid crystal display devices, the grayscale voltage, clock, and power supply voltage that increase in proportion to the number of colors are also connected, so the number of connection lines is extremely low. Is increasing.

As shown in FIG. 24, in the corner of the shield case SHD where the two drain side circuit boards PCB1 and interface circuit board PCB3 are adjacent to each other,
The connection lines are drawn out to the adjacent ends of the circuit board PCB1 and the circuit board PCB3, and a large number of terminals arranged in four rows of two rows are stacked in two layers in the thickness direction of the circuit board. It is electrically connected using the two joined joiners JN1 and JN2. In this way, in order to connect the circuit boards to each other, the space in the thickness direction of the module MDL is effectively utilized, and by using the joiners provided in multiple stages, the connection can be made in a small space even if the number of connection line terminals is large. The module MDL can be reduced in size and weight, and the manufacturing cost can be reduced. Figure 3
6, JT1 is a terminal of the joiner JN1, JT2 is a terminal of the joiner JN2, PT1 is a connection terminal of the circuit board PCB1, and PT3 is a connection terminal of the circuit board PCB3.

The number of joiners arranged in multiple stages is not limited to two, and three or more stages are also possible. The electrical connection between the drain-side circuit board PCB1 and the gate-side circuit board PCB2 uses one joiner JN3 (see FIG. 1), but this is also connected by a plurality of joiners arranged in multiple stages. You may.

The mounting holes of the module MDL are usually arranged at the corners of the module MDL. But,
When an electric connection between the circuit boards PCB1 and PCB3 is attempted to be made by using the joiner JN, the shape of one circuit board PCB3 is not a quadrangle shape but a special shape having a protruding portion, as shown in FIG. With such a shape, the board cutting efficiency of the circuit board is poor, and the material cost of the circuit board is improved. Therefore, in this embodiment, as shown in FIG. 24, as shown in FIG. 24, the mounting holes SH1 and SH2 of the shield case SHD (and the corresponding mounting holes MH1 and MH of the lower case MCA).
2) Module MDL, that is, shield case SHD
By shifting it from the corner of the circuit board, the space for connecting the joiner JN is provided to the circuit boards PCB1, PCB2,
Since it is possible to secure the PCB 3 in a substantially quadrangular shape (the circuit board PCB 3 is provided with a notch for the mounting hole SH1), the board cutting efficiency of the circuit board is good, and the material cost of the circuit board is low. It can be reduced. << Hybrid integrated circuit HI and electronic parts EP mounted on the interface circuit board PCB3 in two stories >>
FIG. 4A is a side view and a front side view of the hybrid integrated circuit HI mounted on the interface circuit board PCB3.

The hybrid integrated circuit HI shown in FIG.
Is a hybrid circuit in which a part of the circuit is integrated, and a plurality of integrated circuits and electronic parts are mounted on the upper surface and the lower surface of a small circuit board.
One is mounted on top. As shown in FIG. 30, the leads HL of the hybrid integrated circuit HI are formed long, and a plurality of electronic components EP are also mounted on the circuit board PCB3 between the circuit board PCB3 and the hybrid integrated circuit HI. Conventionally, when the number of components is large, the circuit boards on which the components are mounted are stacked in multiple stages, and the circuit boards are connected to each other by using a joiner. It is possible to reduce the number of electronic components and to reduce the material cost because a separate circuit board and a joiner are not necessary (the lead HL of the hybrid integrated circuit HI corresponds to the joiner). Moreover, the number of working steps can be reduced. Therefore, the manufacturing cost can be reduced and the reliability of the product can be improved. << Insulation Sheet INS >> Insulation sheets INS1 to INS3 shown in FIG. 28 are arranged between the metal shield case SHD and the circuit boards PCB1 to PCB3 for insulation between the two.
LT is an insulating sheet INS1-3 and a liquid crystal display panel PN
Double-sided adhesive tape that adheres to L, ST is insulating sheet IN
A double-sided adhesive tape for adhering S1 to 3 and the shield case SHD. << Lower Case MCA >> FIG. 37 is a top view, an upper side view, a rear side view, a right side view, a left side view, and FIG. 3 of the lower case MCA.
8 is a bottom view of the lower case MCA.

Lower case M formed by molding
CA is a fluorescent tube LP, a lamp cable LPC, a light guide plate G
A holding member such as LB, that is, a backlight storage case, which is made by integrally molding a synthetic resin in one mold. The lower case MCA is a << shield case SH
As described in detail in "D", the metal shield case SHD, the fixing members, and the elastic body firmly combine them, so that the vibration resistance and the heat shock resistance of the module MDL can be improved and the reliability can be improved. Can be improved.

On the bottom surface of the lower case MCA, a large opening MO occupying more than half the area of the surface is formed in the central portion excluding the peripheral frame-shaped portion. As a result, after the module MDL is assembled, the liquid crystal display panel PNL and
Due to the repulsive force of the rubber cushion GC (see FIG. 42) between the light guide plates GLB, a force is applied to the bottom surface of the lower case MCA in the vertical direction from the upper surface to the lower surface.
The bottom surface of the CA can be prevented from bulging and the maximum thickness can be suppressed. Therefore, in order to suppress the bulge,
Since it is not necessary to increase the thickness of the lower case and the thickness of the lower case can be reduced, the module MDL can be made thinner and lighter.

MLC is an interface circuit board PC
The heat generating component B3, in this embodiment, a notch provided in the lower case MCA at a location corresponding to a mounting portion of a power supply circuit (DC-DC converter) which is a hybrid IC (for connecting the connector CT shown in FIG. 27). Including notches). In this way, the heat generating portion on the circuit board PCB3 is connected to the lower case MC.
By providing the notch without covering with A, it is possible to improve the heat dissipation of the heat generating portion of the interface circuit board PCB3. That is, currently, thin film transistor TF
In order to improve the performance and ease of use of a liquid crystal display device using T, it is required to have multiple gradations and a single power source. The circuit to achieve this consumes a large amount of power,
If the circuit means is to be compactly mounted, high-density mounting is required and heat generation becomes a problem. Therefore, by providing the lower case MCA with the notch MLC corresponding to the heat generating portion, it is possible to improve the high-density mounting property and compactness of the circuit. In addition to this, the signal source integrated circuit TCO
N is considered to be a heat-generating component, and the lower case MCA above this may be cut out.

Reference numerals MH1 to MH4 are four mounting holes for mounting the module MD on an application device such as a personal computer. Even in the metal shield case SHD, the lower case MC
Mounting holes SH1 to SH4 corresponding to the mounting holes MH1 to MH4 of A are formed, and are fixed and mounted on the applied product by using screws or the like. << Backlight BL >> Backlight BL is shown in FIG.
Is a main part top view of the fluorescent tube LP, the lamp cables LPC1 and LPC2, and the rubber bushes GB1 and GB2, and FIG.

The backlight BL which supplies light to the display panel PNL includes a cold cathode fluorescent tube LP, lamp cables LPC1 and LPC2 of the fluorescent tube LP, rubber bushes GB1 and G for holding the fluorescent tube LP and the lamp cable LPC.
B2, the light guide plate GLB, the diffusion sheet SPS arranged in contact with the entire upper surface of the light guide plate GLB, the reflection sheet RFS arranged in the entire lower surface of the light guide plate GLB, and the prism sheet arranged in contact with the entire upper surface of the diffusion sheet SPS. It is composed of PRS.

In the module MDL, the elongated fluorescent tube LP is arranged in the space below the drain side circuit board PCB1 and the tape carrier package TCP1 mounted on one of the long sides of the liquid crystal display panel PNL.
As a result, the outer dimensions of the module MDL can be reduced, so that the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced.

The rubber bushes GB1 and GB2 hold both one cold cathode fluorescent lamp LP and the lamp cables LPC1 and LPC2. That is, the fluorescent tube LP has a hole H formed in the rubber bushes GB1 and GB2 (a substantially keyhole shape as shown in FIG. 40B in which a hole having a large inner diameter and a hole having a small inner diameter are connected) GBH having a larger inner diameter. Lamp cable L inserted into _L and held, and connected to one end of fluorescent tube LP
PC1 is inserted and held in the groove GBD provided in the rubber bush GB2, and further, the lamp cable LPC
Lamp cable LPC2 pulled out in the same direction as 1
It is inserted into the inner diameter of smaller hole H _S of the hole GBH rubber bushing GB2 cable pulling out side is held. Although the main part of the holes GBH does not penetrate through the rubber bushes GB1, GB2, at least in the cable lead-out side of the rubber bushing GB2, to bring out the lamp cable LPC2 rubber bushing GB2, holes perforated GBH small _{H S}
A through hole having a small inner diameter is formed so as to communicate with the. With such a configuration, when the two lamp cables are pulled out in one direction, in the conventional technique, there is no space for passing the lamp cable and the lamp cable does not pass through the rubber bush, so the lamp cable protrudes from the module. In the present embodiment, since the lamp cable LPC1 does not protrude from the lower case MCA, it is possible to save the space of the module MDL, reduce the size and weight of the module MDL, and reduce the manufacturing cost. You can Moreover, since both the fluorescent tube LP and the lamp cable LPC are held by the rubber bushes GB1 and GB2, the fluorescent tube L is held by the holding force of the lamp cable LPC.
Since the rubber bushes GB1 and GB2 holding P are held, the holding property of the fluorescent tube LP can be improved. The rubber bush GB1 holds the fluorescent tube LP and one lamp cable LPC1, and the rubber bush GB2 holds the fluorescent tube LP and two lamp cables LPC1 and LPC2.
However, in order to reduce the number of types of parts, the rubber bush GB1 shares the same shape as the rubber bush GB2.

Fluorescent tube LP and lamp cable LPC
The shape of the hole or groove provided in the rubber bushes GB1 and GB2 for holding is not limited to that shown in the figure. For example, the holes or grooves for holding the fluorescent tube LP and the two lamp cables LPC may be provided independently, or the holes or grooves of the fluorescent tube LP and the one or two lamp cables LPC may be commonly used. Good. The rubber bush GB1 is a fluorescent tube LP and a lamp cable LPC1.
The rubber bush GB2 has a hole or groove for holding the fluorescent lamp LP and two lamp cables LPC1 and LPC2.
The rubber bush GB1 and the rubber bush GB2 may have different shapes, such as a hole or a groove for holding. << Fluorescent tube LP, lamp cable LPC, rubber bush G
39. Housing of B in lower case MCA >> FIG. 39 (A) shows a backlight BL (fluorescent tube LP, lamp cable LPC, rubber bush GB, light guide plate GLB) in the lower case MCA.
Is a top view showing a state in which is stored and mounted, (B) is (A)
Is a cross-sectional view taken along the line B-B of FIG.
It is sectional drawing in the C cutting line.

In FIG. 37 showing the inner surface (upper surface) of the lower case MCA, MB is a holding portion for the light guide plate GLB, ML is a storage portion for the fluorescent tube LP, MG is a storage portion for the rubber bush GB, and
MC1 is a housing portion for the lamp cable LPC1, and MC2 is a housing portion for the lamp cable LPC2.

The backlight BL is shown in FIG.
As shown in (C), it is stored in the lower case MCA which is a backlight storage case. That is, the fluorescent tube LP
Rubber bush GB holding the lamp cable and LPC
37, the rubber bushes GB1, GB2 are fitted into the storage portion MG shown in FIG. 37 in which the rubber bushes GB1, GB2 are fitted, and the fluorescent tube LP is stored in the storage portion ML without contacting the lower case MCA. Lamp cable LPC1, LC
2 is accommodated in the accommodating portions MC1 and MC2 formed of grooves formed in the lower case MCA so as to follow the shape of the lamp cables LPC1 and 2 almost exactly. Near the tip connected to the inverter IV, that is, the rubber bush GB
Lamp cable LPC1 and lamp cable L after 2
PC2 is the circuit board P from the long axis direction of the circuit board PCB2.
The direction is changed substantially perpendicular to the major axis direction of CB2 (see FIGS. 1 and 3).
9), mounting hole MH3 (see FIG. 37) and circuit board PC
It is stored in the space between B2. Lamp cable L
An inverter IV is connected to the tip ends of the PC1 and LP2, and the inverter IV is housed in an inverter housing MI provided beside the circuit board PCB2, as shown in FIG. 39 (A). Thus, when the module MD is incorporated into an applied product such as a personal computer, the lamp cable LPC does not pass through the outer side surface of the module, the inverter IV does not protrude to the outside of the module MD, and the fluorescent tube LP of the backlight BL, The lamp cable LPC, the rubber bush GB, and the inverter IV can be compactly housed and mounted, the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced.

Although one fluorescent tube LP is arranged in the present embodiment, two or more fluorescent tubes LP may be arranged, and the installation place may be installed on the short side of the light guide plate GLB. << Stored in lower case MCA of light guide plate GLB >>
FIG. 4 is a sectional view of relevant parts of a lower case MCA, a light guide plate GLB, a fluorescent tube LP, a lamp cable LPC and the like.

The conventional light guide plate has many useless areas for holding in the module and is much larger than the size of the effective light emitting portion, but the light guide plate GLB of this embodiment is shown in FIG. 39 (A). The light guide plate G has a quadrangular shape (rectangular shape).
The overall size of the LB is as close as possible to the size of the light emitting portion. The three sides of the light guide plate GLB are held by the inner wall of the light guide plate storage portion of the lower case MCA formed so as to fit almost exactly, and the remaining one of the light guide plate GLB on the fluorescent tube LP side is retained.
The side is a lower case M between the light guide plate GLB and the fluorescent tube LP.
Near the rubber bush GB on the inner surface (upper surface) of the CA,
It is held by two minute projections (claws) PJ formed integrally with the lower case MCA. The protrusion PJ prevents the light guide plate GLB from moving to the fluorescent tube LP side, and
The LB is prevented from hitting the fluorescent tube LP and damaging the fluorescent tube LP. The lamp reflection sheet LS has a rectangular shape before being attached, and after attachment, the long side end of the lamp reflection sheet LS is adhered to the lower surface end of the reflection sheet RFS, so that the fluorescent tube LP extends over the entire length. And the other long side end is placed and held on the upper end of the prism sheet PRS. The lamp reflection sheet LS has a U-shaped cross section and is formed in such a length as to be arranged inside the protrusion PJ. The protrusion PJ is formed as small as possible in order to reduce the utilization efficiency of light as much as possible.

By thus making the size of the light guide plate GLB as close as possible to the size of the effective light emitting portion and making it as small as possible, electronic parts can be mounted in the space occupied by the conventional light guide plate, and By holding the light guide plate GLB by the projection PJ provided integrally with the lower case MCA, the light guide plate GLB can be held in a small space, so that the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced. Can be reduced. In other words, it is possible to improve the luminous efficiency of the light guide plate GLB while realizing the miniaturization of the module MDL.

The projection PJ is not always the lower case M.
The CA does not have to be provided integrally with the CA, and the protrusion formed of another member such as metal may be attached to the lower case MCA. << Diffusion Sheet SPS >> The diffusion sheet SPS is a light guide plate BL.
It is placed on B, diffuses the light emitted from the upper surface of the light guide plate GLB, and uniformly illuminates the liquid crystal display panel PNL. << Prism Sheet PRS >> The prism sheet PRS is placed on the diffusion sheet SPS, the lower surface is a smooth surface, and the upper surface is a prism surface. The prism surface is composed of, for example, a plurality of grooves having V-shaped cross-sections, which are linearly arranged in parallel with each other. The prism sheet PRS can improve the brightness of the backlight BL by collecting the light diffused from the diffusion sheet SPS over a wide angle range in the normal direction of the prism sheet PRS. Therefore, it is possible to reduce the power consumption of the backlight BL, and as a result, it is possible to reduce the size and weight of the module MDL and reduce the manufacturing cost. << Reflective Sheet RFS >> The reflective sheet RFS is a light guide plate GL.
It is arranged under B and reflects the light emitted from the lower surface of the light guide plate GLB toward the liquid crystal display panel PNL. << Pressure Structure of Light Guide Plate GLB and Liquid Crystal Display Panel PNL >> FIG. 42 shows the light guide plate GLB and the liquid crystal display panel PN.
It is a principal part sectional view of module MDL which shows the pressing structure of L.

As shown in FIG. 42, the prism sheet PR
The size of S and the diffusion sheet SPS is larger than the size of the light guide plate GLB, and the ends of the prism sheet PRS and the diffusion sheet SPS extend out from the ends of the light guide plate GLB (overhang), and the side wall of the lower case MCA is Rests on top.
A rubber cushion GC and a light-shielding spacer ILS made of rubber are arranged on the overhang portions of the prism sheet PRS and the diffusion sheet SPS and the side wall of the lower case MCA, and the upper transparent glass substrate SUB of the liquid crystal display panel PNL is provided.
2 is pressed and held (see << Pressing structure of liquid crystal display panel PNL >> and FIG. 44 described later). As a result, both the prism sheet PRS and the diffusion sheet SPS or the diffusion sheet SPS enters the gap between the light guide plate GLB and the lower case MCA to prevent the light guide plate GLB from sticking and the light guide plate GLB to be the module MDL. Firmly retained within. With the structure shown in FIG. 42, the pressure of the rubber cushion GC and the light-shielding spacer ILS is applied to the lower case MCA via the prism sheet PRS and the diffusion sheet SPS, and the liquid crystal display panel PNL is securely held in the module MDL, and the light guide plate. The holding power of the GLB, the liquid crystal display panel PNL, etc. is improved, and the reliability of the product can be improved.

Here, both the prism sheet PRS and the diffusion sheet SPS are made to overhang from the light guide plate GLB, but either one may be made to overhang.
Further, here, the light guide plate GLB is made to overhang all around the four sides, but it is not always necessary to overhang all around the four sides, and only one to three sides are effective. << Pressing Structure of Liquid Crystal Display Panel PNL >> FIG. 45 shows a liquid crystal display panel P in a conventional liquid crystal display module MDL.
It is a principal part sectional view which shows the pressing structure of NL. Figure 44 shows
FIG. 6 is a cross-sectional view of a main part showing a pressing structure of a liquid crystal display panel PNL in a liquid crystal display module MDL according to an embodiment of the present invention.

In the conventional liquid crystal display module MDL, as shown in FIG. 45, in order to fix the liquid crystal display panel PNL in the module MDL, the liquid crystal display panel PNL is used.
Both of the two transparent glass substrates constituting the above were pressed through the rubber cushion GC. That is, as described in detail in << Shield case SHD >>, the elasticity of the rubber cushion GC is used to push the shield case SHD toward the inside of the device, thereby
It is fixed by each fixing member of HD and the lower case MCA (that is, the fixing hook HK is caught by the fixing protrusion HP, and the fixing claw NL is bent inward and inserted into the fixing recess NR). . Therefore, conventionally, 2
Since the one transparent glass substrate is strongly pressed via the rubber cushion GC, the liquid crystal gap between the two transparent glass substrates of the liquid crystal display panel PNL is partially changed, resulting in display unevenness. Therefore, the liquid crystal display panel PNL cannot be pressed so strongly that the mechanical strength cannot be sufficiently secured. On the other hand, in the present invention, as shown in FIG. 44, the dimensions of the two transparent glass substrates forming the liquid crystal display panel PNL are changed, that is, the side on which the terminals are not arranged (on the side of the interface circuit board PCB3). Regarding the side), one transparent glass substrate is provided over the three sides of the liquid crystal display panel PNL by projecting the transparent glass substrate from the other transparent glass substrate, and only one transparent glass substrate is attached to the one glass plate portion. Since it is pressed through the rubber cushion GC placed, even if it is strongly pressed, the gap between the two transparent glass substrates does not change and display unevenness does not occur. Therefore, the pressing force of the liquid crystal display panel PNL can be increased, so that the mechanical strength can be improved and the reliability can be improved. A double-sided adhesive tape BAT is interposed between the upper surface of the single glass plate portion of the liquid crystal display panel PNL and the lower surface (inner surface) of the metal shield case SHD, and both are fixed. Note that FIG. 44 is a diagram schematically showing a holding structure of the liquid crystal display panel PNL, and in practice, a light guide plate GLB is arranged between the rubber cushion GC and the lower case MCA.

The embodiment shown in FIG. 44 is not limited to overhanging the above-mentioned prism sheet PRS, so the prism sheet PRS is not limited to this.
Does not overhang the light guide plate GLB.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention. .

[0138]

As described above, according to the present invention,
Since the light guide plate and the liquid crystal display panel can be firmly held in the device without increasing the external dimensions,
The mechanical strength can be improved, the device can be made smaller and lighter, and the manufacturing cost can be reduced. Further, since the cable of the fluorescent tube of the backlight can be stored without protruding from the device, the device can be downsized and lightened, and the manufacturing cost can be reduced. In addition, the retention of the fluorescent tube can be improved. Moreover, since the light guide plate of the backlight can be held in a small space, the device can be downsized and lightened, and the manufacturing cost can be reduced. Further, since the large opening is provided at the center of the bottom surface of the mold case, it is possible to prevent the bottom surface of the mold case from bulging, and it is possible to reduce the thickness and weight of the liquid crystal display device. Further, since the cable of the backlight and the inverter can be housed without protruding to the outside of the device, the liquid crystal display device can be made smaller and lighter, and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a liquid crystal display module of an active matrix type color liquid crystal display device to which the present invention is applied.

FIG. 2 is a main-portion plan view showing one pixel of a liquid crystal display portion and its periphery.

FIG. 3 is a cross-sectional view showing one pixel and its periphery taken along the section line 3-3 in FIG.

FIG. 4 is a cross-sectional view of the additional capacitance Cadd taken along the line 4-4 in FIG.

5 is a plan view of a main part of a liquid crystal display unit in which a plurality of pixels shown in FIG. 2 are arranged.

FIG. 6 is a plan view showing only a layer g2 and AS of the pixel shown in FIG.

7 is a plan view illustrating only layers d1, d2, and d3 of the pixel shown in FIG.

8 is a plan view showing only a pixel electrode layer ITO1, a light shielding film BM and a color filter layer FIL of the pixel shown in FIG.

9 is a plan view of a principal part illustrating only a pixel electrode layer, a light shielding film, and a color filter layer of the pixel array shown in FIG.

FIG. 10 is a plan view and a cross-sectional view showing the vicinity of a connecting portion between a gate terminal GTM and a gate wiring GL.

FIG. 11 is a plan view and a cross-sectional view showing the vicinity of a connection portion between a drain terminal DTM and a video signal line DL.

FIG. 12 is an equivalent circuit diagram showing a liquid crystal display section of an active matrix type color liquid crystal display device.

FIG. 13 is an equivalent circuit diagram of the pixel shown in FIG.

FIG. 14 is a flow chart of a cross-sectional view of a pixel portion and a gate terminal portion showing a manufacturing process of steps A to C on the substrate SUB1 side.

FIG. 15 is a flow chart of a cross-sectional view of a pixel portion and a gate terminal portion showing manufacturing steps of steps D to F on the substrate SUB1 side.

FIG. 16 is a flow chart of a cross-sectional view of a pixel portion and a gate terminal portion showing manufacturing steps of steps GI on the side of the substrate SUB1.

FIG. 17 is a plan view for explaining the configuration of the matrix peripheral portion of the display panel.

FIG. 18 is a panel plan view for slightly exaggerating the peripheral portion of FIG. 17 to explain it more specifically.

FIG. 19 is an enlarged plan view of a corner portion of a display panel including electrical connection portions of upper and lower substrates.

FIG. 20 is a cross-sectional view showing the vicinity of a panel angle and the vicinity of a video signal terminal portion on both sides with the pixel portion of the matrix at the center.

FIG. 21 is a cross-sectional view showing a scan signal terminal on the left side and a panel edge portion without an external connection terminal on the right side.

FIG. 22 is a diagram showing a cross-sectional structure of a tape carrier package TCP in which an integrated circuit chip CHI forming a drive circuit is mounted on a flexible wiring board.

FIG. 23 is a main-portion cross-sectional view showing a state where the tape carrier package TCP is connected to the video signal circuit terminal DTM of the display panel PNL.

FIG. 24 shows a liquid crystal display panel P in a shield case SHD.
A bottom view in which NL and circuit boards PCB1 to PCB3 are incorporated, A
It is a sectional view in a section line A-A, a sectional view in a section line AA, a sectional view in a section line BB, a sectional view in a section line CC, and a sectional view in a section line DD.

FIG. 25 is a top view, a front side view of the shield case SHD,
It is a rear side view, a right side view, and a left side view.

FIG. 26 is a bottom view of the liquid crystal display panel PNL and the circuit boards PCB1 to PCB3 on which the tape carrier package TCP is mounted, a cross-sectional view taken along the line AA, a cross-sectional view taken along the line BB, and a line cut along CC. It is sectional drawing, sectional drawing in the DD cutting line.

FIG. 27 is a detailed bottom view of the circuit boards PCB1 to PCB3 on which the tape carrier package TCP is not mounted.

FIG. 28 is a top view of insulating sheets INS1 to INS3, a sectional view taken along the line AA, a sectional view taken along the line BB, and C.
It is sectional drawing in the -C cutting line.

FIG. 29 (A) is an interface circuit board PCB3
Is a top view, and (B) is a bottom view.

FIG. 30 is a lateral side view and a front side view of the hybrid integrated circuit HI mounted on the interface circuit board PCB3.

FIG. 31 is a bottom view of the gate-side circuit board PCB1.

FIG. 32 is a bottom view of the gate-side circuit board PCB2.

FIG. 33 is a plan (bottom) view of the tape carrier package TCP.

34A and 34B are a plan view (bottom surface) and a side view of a plurality of mounted TCPs.

35 (A), (B), and (C) are plan views of joiners JN1 to JN3, respectively.

FIG. 36 is a plan view of the mounted joiners JN1 and JN2,
It is a side view.

FIG. 37 is a top view, a front side view, a rear side view, a right side view, and a left side view of a lower case MCA.

FIG. 38 is a bottom view of the lower case MCA.

FIG. 39 (A) is a top view of the light guide plate GLB, the fluorescent tube LP, the rubber bush GB, etc. housed in the lower case MCA;
(B) is a sectional view taken along the line BB, and (C) is CC.
It is sectional drawing in a cutting line.

FIG. 40A is a top view of a main part of the backlight BL (fluorescent tube LP, lamp cable LPC, rubber bush GB), and FIG. 40B is a sectional view taken along the line AA.

FIG. 41 is a cross-sectional view of essential parts of a backlight BL (light guide plate GLB, fluorescent tube LP, etc.) housed in a lower case MCA.

FIG. 42 is a cross-sectional view of essential parts of a liquid crystal display module MD, showing a pressing structure of a light guide plate GLB and a liquid crystal display panel PNL.

FIG. 43 is a bottom view of the liquid crystal display panel PNL, the circuit boards PCB1 to PCB3 mounted with the tape carrier package TCP, and the rubber cushion GC.

FIG. 44: Shield case SHD, liquid crystal display panel PN
FIG. 7 is a cross-sectional view of a main part showing a mounting state of L, a rubber cushion GC, and a lower case MCA.

FIG. 45: Shield case SHD, liquid crystal display panel PN
It is a principal part sectional view which shows the conventional mounting state of L, the rubber cushion GC, and the lower case MCA.

FIG. 46: Mounting hole S of conventional liquid crystal display module MDL
It is a figure which shows H.

FIG. 47 is a perspective view of a notebook personal computer or a word processor in which the liquid crystal display module MDL is mounted.

[Explanation of symbols]

GLB ... Light guide plate, PNL ... Liquid crystal display panel, SUB2 ...
Upper transparent glass substrate, SPS ... Diffusion sheet, PRS ... Prism sheet, SHD ... Metal shield case, MCA
… Lower case, GC… Rubber cushion, LP… Fluorescent tube,
LPC1, LPC2 ... Lamp cable, GB1, GB2
... rubber bush, GBH ... hole, GBD ... groove, BL ... backlight, GLB ... light guide plate, PJ ... projection, MCA ... lower case, GC ... rubber cushion, MO ... opening, IV ... inverter, MI ... inverter housing .

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshio Toriyama, 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd. (56) References JP-A-4-7519 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G02F 1/1333 G02F 1/13357

Claims (9)

(57) [Claims] [1 claim: a liquid crystal display panel, a light guide plate disposed on the lower side of the liquid crystal display panel, a fluorescent tube disposed opposite to at least one side surface of the light guide plate, an upper side of the liquid crystal display panel A metal frame having an opening for holding the periphery of the liquid crystal display panel and exposing the liquid crystal display panel; a resin case that holds the light guide plate and the fluorescent tube and is fixed to the metal frame and molded; A first cable connected to one end of the fluorescent tube and a second cable connected to the other end of the fluorescent tube, the first cable from the one end of the fluorescent tube held in the resin case A liquid crystal display device, characterized in that the liquid crystal display device is housed in a groove formed in the resin case toward the other end. 2. The liquid crystal display device according to claim 1, wherein the groove is formed along the fluorescent tube held by the resin case. 3. The liquid crystal display device according to claim 1, wherein the groove is formed in a side wall of the resin case facing the fluorescent tube held in the resin case. 4. A liquid crystal display device according to claim 3, characterized in that the lamp reflecting sheet is provided between the side wall and the fluorescent tube of the resin case. Claims the other end of claim 5 wherein said fluorescent tube of the resin case, characterized in that the other groove for accommodating said second cable and the first cable is formed 1
The liquid crystal display device according to item 1. 6. The liquid crystal display device according to claim 1, characterized in that the said first cable and the second cable is drawn out to the outside of the resin case from a predetermined position of the resin case . 7. A liquid crystal display panel, a light guide plate arranged below the liquid crystal display panel, a fluorescent tube arranged so as to face a side surface of the light guide plate, and a first tube holding one end of the fluorescent tube. No. 1 holding member and a second holding member holding the other end of the fluorescent tube, a frame-shaped upper case holding the upper peripheral edge of the liquid crystal display panel, holding the light guide plate and the fluorescent tube, and A lower case fixed to the upper case and a cable connected to one end of the fluorescent tube are provided, and the cable is held by the first holding member and the second holding member along the fluorescent tube. A first groove that extends and that houses the first holding member, a second groove that houses the second holding member, and the first groove and the second groove that extend in the lower case. A third groove for accommodating the cable is formed between the groove and the groove. The liquid crystal display device characterized by being. Claim wherein said first and second holding members is characterized by a rubber bush holes or grooves are formed for holding said cable with a hole for holding the fluorescent tube 7 The liquid crystal display device according to item 1. 9. The liquid crystal display device according to claim 7, wherein the lower case is integrally formed by molding.