JP3405227B2 - Printed circuit board soldering method - Google Patents
Printed circuit board soldering methodInfo
- Publication number
- JP3405227B2 JP3405227B2 JP30095698A JP30095698A JP3405227B2 JP 3405227 B2 JP3405227 B2 JP 3405227B2 JP 30095698 A JP30095698 A JP 30095698A JP 30095698 A JP30095698 A JP 30095698A JP 3405227 B2 JP3405227 B2 JP 3405227B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- hole
- soldering
- closing means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、半田槽の半田噴流
が貫通する大きさの貫通孔を有するプリント基板の半田
付け方法に関するものである。
【０００２】
【従来の技術】例えば、ブラシレスＤＣモータでは、そ
の駆動，制御のためのコントローラを搭載したプリント
基板を備えている。
【０００３】図４及び図５は従来のこの種のブラシレス
ＤＣモータの構造を示したもので、図４は該ブラシレス
ＤＣモータの縦断面図、図５は図４に示すブラシレスＤ
Ｃモータの分解縦断面図である。
【０００４】このブラシレスＤＣモータは、一端にフラ
ンジ１を一体に備えた筒状のボス２を有する。このボス
２の外周には、ステータ（電機子）３が固定されてい
る。ステータ３は、ボス２の外周に固定されたステータ
鉄心（電機子鉄心）４にステータコイル（電機子コイ
ル）５が巻装された構造になっている。ボス２には、軸
受６Ａ，６Ｂを介して回転軸７が回転自在に貫通支持さ
れている。該回転軸７の一端には、ステータ３に対向し
て回転するロータ８が固定されている。ロータ８は、回
転軸７に中心部が固定されていて該回転軸７の回転につ
れて回転するカップ状のロータヨーク９と、このロータ
ヨーク９の内周に固定されていてステータ３の外周に間
隙を介して対向する界磁用永久磁石１０とを備えて構成
されている。ロータヨーク９の開口側には、回転軸７と
直交する向きでプリント基板１１が配置されていてフラ
ンジ１に固定ネジ１２で固定されている。このプリント
基板１１には、界磁用永久磁石１０に対向して図示しな
いがロータ８の回転方向の位置を検出するホール素子等
の位置検出器と、このブラシレスモータを駆動，制御す
るための電子部品（ＩＣ等）からなるコントローラとが
搭載され、これらの電子部品はプリント配線に半田付け
部１３で半田付け接続されている。電機子コイル５の端
末部も、プリント基板１１のプリント配線に半田付け部
１３で半田付け接続されている。プリント基板１１に
は、ボス２を貫通させるためにかなり大きな直径で貫通
孔１４が設けられている。ステータ３は、ネジ１５でフ
ランジ１に固定されている。
【０００５】このようなブラシレスＤＣモータで使用し
ているプリント基板１１では、その板面上に搭載する電
子部品とプリント基板１１のプリント配線パターンとを
接続するために半田付けが行われる。
【０００６】半田付けは、図６（Ａ）に示すように半田
槽１６の半田液面１７から所定の高さＨで噴き上ってい
る半田噴流１８をプリント基板１１の下面に当てること
により行われる。
【０００７】
【発明が解決しようとする課題】しかしながら、このよ
うにプリント基板１１に半田付けを行うに際し、貫通孔
１４が設けられているプリント基板１１の場合には、該
貫通孔１４が半田噴流１８が貫通する大きさであるた
め、次のような問題点がある。
【０００８】（イ）半田噴流１８をプリント基板１１の
下面に当てながら該プリント基板１１を図６（Ａ）
（Ｂ）に示すように矢印方向に移動させつつ半田付けを
行う際に、半田噴流１８がプリント基板１１の貫通孔１
４に対向する個所では、図６（Ｂ）に示すように半田噴
流１８が貫通孔１４を貫通してプリント基板１１の部品
搭載面側（上面側）に飛び出し、該部品搭載面側の電子
部品に半田１３が付いてしまう問題点があった。
【０００９】（ロ）この問題を解決するために、半田噴
流１８の高さＨを低くすると、半田１３がプリント基板
１１のランド部や電子部品の端子につかない半田付け不
良が発生する問題点がある。
【００１０】本発明の目的は、半田噴流が貫通孔を貫通
してプリント基板の部品搭載面側に飛び出すのを防止で
きるプリント基板の半田付け方法を提供することにあ
る。
【００１１】本発明の他の目的は、プリント基板自身を
利用した捨て基板を用いて、半田噴流が貫通孔を貫通し
てプリント基板の部品搭載面側に飛び出すのを防止でき
るプリント基板の半田付け方法を提供することにある。
【００１２】本発明の他の目的は、捨て基板の撤去を容
易に行えるプリント基板の半田付け方法を提供すること
にある。
【００１３】
【課題を解決するための手段】本発明は、半田槽の半田
噴流が貫通する大きさの貫通孔を有するプリント基板の
下面に該半田噴流を当てて該プリント基板の下面に半田
付けする際に、貫通孔を孔塞ぎ手段で仮に塞いだ状態で
プリント基板の下面に半田噴流を当てて該プリ ント基板
の下面に半田付けをし、半田付けの後に孔塞ぎ手段を撤
去するプリント基板の半田付け方法を改良するものであ
る。
【００１４】本発明に係るプリント基板の半田付け方法
においては、孔塞ぎ手段はプリント基板に形成する貫通
孔の輪郭に沿って形成されている輪郭切断線内に該プリ
ント基板自身により捨て基板として形成され、該捨て基
板よりなる孔塞ぎ手段は輪郭切断線を横切って複数個所
に設けられた繋ぎ部によりプリント基板に支持され、複
数個所の繋ぎ部は輪郭切断線の一方の１／２周上の部分
に分散して設けられ、他方の１／２周上の部分には設け
られないようになっていることを特徴とする。
【００１５】このように貫通孔を孔塞ぎ手段で仮に塞い
だ状態で、プリント基板の下面に半田噴流を当てて半田
付けをすると、半田噴流が貫通孔を貫通してプリント基
板の部品搭載面側に飛び出すのを防止できる。このた
め、該プリント基板の部品搭載面側の電子部品に半田が
付いてしまうのを防止することができる。孔塞ぎ手段を
用いても、半田付けの後に撤去するので支障がない。
【００１６】また、孔塞ぎ手段は、プリント基板に形成
する貫通孔の輪郭に沿って形成されている輪郭切断線内
に該プリント基板自身により捨て基板として形成され、
該捨て基板よりなる孔塞ぎ手段が輪郭切断線を横切って
複数個所に設けられた繋ぎ部によりプリント基板に支持
されていると、プリント基板自身を利用して貫通孔を塞
ぐことができ、プリント基板の加工時に一緒に形成でき
て好適である。また、捨て基板は繋ぎ部を折ることによ
り容易に撤去することができる。 特に、捨て基板をプリ
ント基板に連結している複数個所の繋ぎ部は、輪郭切断
線の一方の１／２周上の部分に分散して設けられ、他方
の１／２周上の部分には設けられないようになっている
と、輪郭切断線の他方の１／２周内の捨て基板の部分を
押圧することにより各繋ぎ部を容易に折ることができ、
捨て基板の撤去を容易に行うことができる。
【００１７】
【発明の実施の形態】図１は、本発明に係るプリント基
板の半田付け方法における実施の形態の第１例で用いる
プリント基板を示す平面図である。
【００１８】本例で用いる、半田噴流が貫通する大きさ
の貫通孔１４を有するプリント基板１１は、その貫通孔
１４が孔塞ぎ手段１９で仮に塞がれている。
【００１９】本例の孔塞ぎ手段１９は、プリント基板１
１に形成する貫通孔１４の輪郭に沿って形成されている
輪郭切断線２０内に該プリント基板１１自身により捨て
基板２１として形成されている。この捨て基板２１より
なる孔塞ぎ手段１９は、輪郭切断線２０を横切って複数
個所（本例では、２個所）に設けられた繋ぎ部２２によ
りプリント基板１１に支持されている。これら繋ぎ部２
２は、輪郭切断線２０の一方の１／２周上の部分２０ａ
に分散して設けられ、他方の１／２周上の部分２０ｂに
は設けられないようになっている。
【００２０】本例のプリント基板の半田付け方法におい
ては、このように貫通孔１４を捨て基板２１よりなる孔
塞ぎ手段１９で仮に塞いだ状態で、該プリント基板１１
の下面に図６で説明したように半田噴流１８を当てて該
プリント基板１１の下面に半田付けをする。
【００２１】このようにして半田付けをすると、半田噴
流１８が貫通孔１４を貫通してプリント基板１１の部品
搭載面側に飛び出すのを捨て基板２１により防止でき
る。このため、該プリント基板１１の部品搭載面側の電
子部品に半田が付いてしまうのを防止することができ
る。
【００２２】このように孔塞ぎ手段１９を用いても、半
田付けの後に撤去するので支障がない。特に、この例で
は、孔塞ぎ手段１９である捨て基板２１をプリント基板
１１に連結している複数個所の繋ぎ部２２は、輪郭切断
線２０の一方の１／２周上の部分２０ａに分散して設け
られ、他方の１／２周上の部分２０ｂには設けられない
ようになっているので、この輪郭切断線２０の他方の１
／２周内の捨て基板２１の部分を押圧することにより各
繋ぎ部２２を容易に折ることができ、捨て基板２１の撤
去を容易に行うことができる。
【００２３】また、捨て基板２１よりなる孔塞ぎ手段１
９によれば、プリント基板１１自身を利用して貫通孔１
４を塞ぐことができ、プリント基板１１の加工時に一緒
に形成できて好適である。
【００２４】図２は、本発明に係るプリント基板の半田
付け方法における実施の形態の第２例で用いるプリント
基板を示す平面図である。
【００２５】本例で用いる、半田噴流が貫通する大きさ
の貫通孔１４を有するプリント基板１１も、その貫通孔
１４が孔塞ぎ手段１９で仮に塞がれている。
【００２６】本例の孔塞ぎ手段１９は、貫通孔１４を塞
いでプリント基板１１に貼り付けられたマスキングテー
プの如き耐熱テープ２３により構成されている。
【００２７】本例のプリント基板の半田付け方法におい
ては、このように貫通孔１４を耐熱テープ２３よりなる
孔塞ぎ手段１９で仮に塞いだ状態で、該プリント基板１
１の下面に図６で説明したように半田噴流１８を当てて
該プリント基板１１の下面に半田付けをする。
【００２８】このようにして半田付けをすると、半田噴
流１８が貫通孔１４を貫通してプリント基板１１の部品
搭載面側に飛び出すのを耐熱テープ２３により防止でき
る。このため、該プリント基板１１の部品搭載面側の電
子部品に半田が付いてしまうのを防止することができ
る。
【００２９】このように耐熱テープ２３を用いると、貫
通孔１４を該耐熱テープ２３で容易に塞ぐことができ、
不要になれば該耐熱テープ２３を剥がすことにより容易
に撤去することができる。
【００３０】図３（Ａ）（Ｂ）は、本発明に係るプリン
ト基板の半田付け方法における実施の形態の第３例で用
いるプリント基板を示す平面図及び側面図である。
【００３１】本例で用いる、半田噴流が貫通する大きさ
の貫通孔１４を有するプリント基板１１も、その貫通孔
１４が孔塞ぎ手段１９で仮に塞がれている。
【００３２】本例の孔塞ぎ手段１９は、貫通孔１４を塞
いでプリント基板１１の上に載せられた耐熱樹脂板の如
き耐熱性遮蔽物２４により構成されている。この耐熱性
遮蔽物２４はプリント基板１１上で動き難いようにある
程度の重さを有していることが好ましい。
【００３３】本例のプリント基板の半田付け方法におい
ては、このように貫通孔１４を耐熱性遮蔽物２４よりな
る孔塞ぎ手段１９で仮に塞いだ状態で、該プリント基板
１１の下面に図６で説明したように半田噴流１８を当て
て該プリント基板１１の下面に半田付けをする。
【００３４】このようにして半田付けをすると、半田噴
流１８が貫通孔１４を貫通してプリント基板１１の部品
搭載面側に飛び出すのを耐熱性遮蔽物２４により防止で
きる。このため、該プリント基板１１の部品搭載面側の
電子部品に半田が付いてしまうのを防止することができ
る。
【００３５】このように耐熱性遮蔽物２４を用いると、
貫通孔１４を該耐熱性遮蔽物２４で容易に塞ぐことがで
き、不要になれば該耐熱性遮蔽物２４を持ち上げること
により容易に撤去することができる。
【００３６】上記例では、ブラシレスＤＣモータ用のプ
リント基板の半田付けに本発明を適用した例について示
したが、本発明はこれに限定されるものではなく、半田
噴流が貫通する大きさの貫通孔を有するプリント基板の
半田付けであれば、他の用途のプリント基板の半田付け
にも同様に適用することができる。
【００３７】
【発明の効果】本発明に係るプリント基板の半田付け方
法においては、半田噴流が貫通する大きさの貫通孔を孔
塞ぎ手段で仮に塞いだ状態で、プリント基板の下面に半
田噴流を当てて該プリント基板の下面に半田付けをする
ので、半田噴流が貫通孔を貫通してプリント基板の部品
搭載面側に飛び出すのを防止できる。このため、該プリ
ント基板の部品搭載面側の電子部品に半田が付いてしま
うのを防止することができる。このように孔塞ぎ手段を
用いても、該孔塞ぎ手段は半田付けの後に撤去するので
支障がない。
【００３８】また、孔塞ぎ手段は、プリント基板に形成
する貫通孔の輪郭に沿って形成されている輪郭切断線内
に該プリント基板自身により捨て基板として形成され、
該捨て基板よりなる孔塞ぎ手段が輪郭切断線を横切って
複数個所に設けられた繋ぎ部によりプリント基板に支持
されているので、プリント基板自身を利用して貫通孔を
塞ぐことができ、プリント基板の加工時に一緒に形成で
きて好適である。また、捨て基板は繋ぎ部を折ることに
より容易に撤去することができる。 さらに、繋ぎ部が複
数個所に設けられているので、待機時の捨て基板の姿勢
を安定させることができる。 特に、捨て基板をプリント
基板に連結している複数個所の繋ぎ部は、輪郭切断線の
一方の１／２周上の部分に分散して設けられ、他方の１
／２周上の部分には設けられないようになっているの
で、輪郭切断線の他方の１／２周内の捨て基板の部分を
押圧することにより各繋ぎ部を容易に折ることができ、
捨て基板の撤去を容易に行うことができる。 Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering a printed circuit board having a through hole having a size through which a solder jet of a solder bath penetrates. 2. Description of the Related Art For example, a brushless DC motor has a printed circuit board on which a controller for driving and controlling the motor is mounted. FIGS. 4 and 5 show the structure of a conventional brushless DC motor of this type. FIG. 4 is a longitudinal sectional view of the brushless DC motor, and FIG. 5 is a brushless DC motor shown in FIG.
FIG. 3 is an exploded vertical sectional view of a C motor. This brushless DC motor has a cylindrical boss 2 integrally provided with a flange 1 at one end. A stator (armature) 3 is fixed to the outer periphery of the boss 2. The stator 3 has a structure in which a stator coil (armature coil) 5 is wound around a stator core (armature core) 4 fixed to the outer periphery of the boss 2. A rotary shaft 7 is rotatably supported through the boss 2 through bearings 6A and 6B. At one end of the rotating shaft 7, a rotor 8 rotating to face the stator 3 is fixed. The rotor 8 has a cup-shaped rotor yoke 9 whose center is fixed to the rotating shaft 7 and rotates as the rotating shaft 7 rotates, and a rotor 8 fixed to the inner periphery of the rotor yoke 9 and spaced from the outer periphery of the stator 3 via a gap. And the opposing field permanent magnet 10. On the opening side of the rotor yoke 9, a printed circuit board 11 is arranged in a direction orthogonal to the rotation shaft 7, and is fixed to the flange 1 with fixing screws 12. The printed circuit board 11 includes a position detector such as a Hall element (not shown) for detecting the position of the rotor 8 in the rotation direction, which is opposed to the field permanent magnet 10, and an electronic device for driving and controlling the brushless motor. A controller made up of components (such as an IC) is mounted, and these electronic components are connected to the printed wiring by soldering at a soldering section 13. The terminal portion of the armature coil 5 is also connected to the printed wiring of the printed circuit board 11 by soldering at the soldering portion 13. The printed circuit board 11 is provided with a through hole 14 having a considerably large diameter to allow the boss 2 to pass therethrough. The stator 3 is fixed to the flange 1 with screws 15. In the printed circuit board 11 used in such a brushless DC motor, soldering is performed to connect an electronic component mounted on the board surface to a printed wiring pattern of the printed circuit board 11. [0006] Soldering is performed by applying a solder jet 18 spraying at a predetermined height H from a solder liquid level 17 of a solder tank 16 to the lower surface of the printed circuit board 11 as shown in FIG. Will be However, when soldering to the printed circuit board 11 as described above, in the case of the printed circuit board 11 having the through holes 14, the through holes 14 18 has a size that penetrates, causing the following problems. (A) While the solder jet 18 is applied to the lower surface of the printed circuit board 11, the printed circuit board 11 is
When soldering is performed while moving in the direction of the arrow as shown in FIG.
4, as shown in FIG. 6B, the solder jet 18 penetrates through the through hole 14 and jumps out to the component mounting surface side (upper surface side) of the printed circuit board 11, and the electronic component on the component mounting surface side There was a problem that the solder 13 was attached to the solder. (B) If the height H of the solder jet 18 is reduced in order to solve this problem, there is a problem in that the solder 13 does not adhere to the lands of the printed circuit board 11 or the terminals of the electronic components, resulting in poor soldering. is there. An object of the present invention is to provide a method of soldering a printed circuit board which can prevent a solder jet from flowing through a through hole and jumping out to a component mounting surface side of the printed circuit board. Another object of the present invention is to use a discarded board utilizing the printed circuit board itself to prevent a solder jet from passing through the through hole and jumping out to the component mounting surface side of the printed circuit board. It is to provide a method. Another object of the present invention is to provide a method of soldering a printed circuit board which can easily remove a discarded circuit board . According to the present invention, a solder jet is applied to a lower surface of a printed circuit board having a through hole having a size through which a solder jet of a solder bath penetrates, and soldered to the lower surface of the printed circuit board. When the through hole is temporarily closed by the hole closing means
The print substrate by applying a solder jet flow to the lower surface of the printed circuit board
Solder to the bottom surface of the
This is to improve the method of soldering a printed circuit board to be removed . In the method of soldering a printed circuit board according to the present invention, the hole closing means includes a through hole formed in the printed circuit board.
The pre-cut is located within the contour cutting line formed along the contour of the hole.
Formed as a discarded substrate by the
Hole closing means consisting of a plate
It is supported by the printed circuit board by the connecting portion provided on, double
Several joints are on one half circumference of the contour cutting line
Provided on the other half of the circumference
It is characterized in that it cannot be performed . When soldering is performed by applying a solder jet to the lower surface of the printed circuit board in a state where the through hole is temporarily closed by the hole closing means, the solder jet passes through the through hole and is mounted on the component mounting surface of the printed circuit board. Can be prevented from jumping out. Therefore, it is possible to prevent the electronic components on the component mounting surface side of the printed circuit board from being soldered. Even if the hole closing means is used, since it is removed after soldering, there is no problem. The hole closing means is formed on a printed circuit board.
Contour cutting line formed along the contour of the through hole
Formed as a discarded board by the printed board itself,
The hole closing means consisting of the discarded substrate crosses the contour cutting line.
Supported on printed circuit boards by connecting parts provided at multiple locations
The printed circuit board itself is used to close the through hole.
Can be formed together when processing printed circuit boards.
It is suitable. Also, the discarded substrate can be broken by breaking the joint.
Can be easily removed. In particular, discard the substrate
The connection at multiple locations connected to the printed circuit board
The line is distributed over one half of the line and
Not to be provided on the part that is half the circumference of
And the part of the discarded substrate within the other half circumference of the contour cutting line
By pressing, each joint can be easily folded,
Removal of the discarded substrate can be easily performed. FIG. 1 is a plan view showing a printed circuit board used in a first example of an embodiment of a printed circuit board soldering method according to the present invention. The printed circuit board 11 having a through hole 14 having a size through which a solder jet penetrates, which is used in this embodiment, is temporarily closed by the hole closing means 19. In the present embodiment, the hole closing means 19 is
The printed board 11 itself is formed as a discarded board 21 in a contour cutting line 20 formed along the contour of the through hole 14 formed in the printed circuit board 1. The hole closing means 19 made of the discarded substrate 21 is supported by the printed circuit board 11 by connecting portions 22 provided at a plurality of places (two places in this example) across the contour cutting line 20. These connecting parts 2
2 is a portion 20a on one half circumference of the contour cutting line 20
And is not provided in the portion 20b on the other half circumference. In the method of soldering a printed circuit board according to the present embodiment, the printed circuit board 11 is temporarily occupied by the through-holes 14 by the hole closing means 19 made of the discarded board 21.
The solder jet 18 is applied to the lower surface of the printed circuit board 11 as described with reference to FIG. When the soldering is performed in this manner, it is possible to prevent the solder jet 18 from passing through the through hole 14 and jumping out to the component mounting surface side of the printed board 11 by the discard substrate 21. Therefore, it is possible to prevent the electronic components on the component mounting surface side of the printed circuit board 11 from being soldered. Even if the hole closing means 19 is used as described above, since it is removed after soldering, there is no problem. In particular, in this example, a plurality of connecting portions 22 connecting the discard substrate 21 as the hole closing means 19 to the printed circuit board 11 are distributed to a portion 20 a on one half circumference of the contour cutting line 20. And is not provided in the portion 20b on the other half of the circumference, so that the other
By pressing the portion of the discarded substrate 21 in the / 2 circumference, each connecting portion 22 can be easily folded, and the discarded substrate 21 can be easily removed. Further, a hole closing means 1 made of a discarded substrate 21
9, the printed circuit board 11 itself is used to make the through hole 1.
4 can be closed and can be formed together when the printed circuit board 11 is processed. FIG. 2 is a plan view showing a printed circuit board used in a second example of the embodiment of the method of soldering a printed circuit board according to the present invention. The printed circuit board 11 having a through-hole 14 having a size through which a solder jet penetrates, which is used in this embodiment, is temporarily closed by the hole closing means 19. The hole closing means 19 of this embodiment is made up of a heat-resistant tape 23 such as a masking tape which closes the through hole 14 and is attached to the printed circuit board 11. In the method of soldering a printed circuit board according to the present embodiment, the printed circuit board 1 is temporarily occupied by the through-holes 14 thus temporarily closed by the hole closing means 19 made of a heat-resistant tape 23.
The solder jet 18 is applied to the lower surface of the printed circuit board 11 as described with reference to FIG. When soldering is performed in this manner, the heat-resistant tape 23 can prevent the solder jet 18 from passing through the through-hole 14 and jumping to the component mounting surface side of the printed circuit board 11. Therefore, it is possible to prevent the electronic components on the component mounting surface side of the printed circuit board 11 from being soldered. When the heat-resistant tape 23 is used as described above, the through hole 14 can be easily closed with the heat-resistant tape 23.
If it becomes unnecessary, the heat-resistant tape 23 can be easily removed by peeling it off. FIGS. 3A and 3B are a plan view and a side view showing a printed circuit board used in a third example of the embodiment of the printed circuit board soldering method according to the present invention. The printed circuit board 11 used in this example and having a through hole 14 through which the solder jet flows penetrates is also temporarily closed by the hole closing means 19. The hole closing means 19 of this embodiment is constituted by a heat-resistant shield 24 such as a heat-resistant resin plate placed on the printed circuit board 11 by closing the through-hole 14. It is preferable that the heat-resistant shield 24 has a certain weight so that it does not easily move on the printed board 11. In the method of soldering a printed circuit board according to the present embodiment, the through hole 14 is temporarily closed by the hole closing means 19 made of a heat-resistant shield 24 as shown in FIG. As described above, the solder jet 18 is applied to solder the lower surface of the printed circuit board 11. When soldering is performed in this manner, the heat-resistant shield 24 prevents the solder jet 18 from passing through the through-hole 14 and jumping to the component mounting surface side of the printed circuit board 11. Therefore, it is possible to prevent the electronic components on the component mounting surface side of the printed circuit board 11 from being soldered. When the heat-resistant shield 24 is used as described above,
The through-hole 14 can be easily closed by the heat-resistant shield 24, and when it is no longer necessary, the heat-resistant shield 24 can be easily removed by lifting it. In the above example, an example in which the present invention is applied to soldering of a printed circuit board for a brushless DC motor has been described. However, the present invention is not limited to this, and the present invention is not limited to this. As long as a printed board having holes is soldered, the same can be applied to soldering a printed board for other uses. In the method of soldering a printed circuit board according to the present invention, the solder jet is applied to the lower surface of the printed circuit board in a state where a through hole having a size through which the solder jet flows is temporarily closed by a hole closing means. Since soldering is performed on the lower surface of the printed circuit board, it is possible to prevent the solder jet from passing through the through hole and jumping to the component mounting surface side of the printed circuit board. Therefore, it is possible to prevent the electronic components on the component mounting surface side of the printed circuit board from being soldered. Even if the hole closing means is used as described above, the hole closing means is removed after the soldering, so that there is no problem. The hole closing means is formed on a printed circuit board.
Contour cutting line formed along the contour of the through hole
Formed as a discarded board by the printed board itself,
The hole closing means consisting of the discarded substrate crosses the contour cutting line.
Supported on printed circuit boards by connecting parts provided at multiple locations
The through hole using the printed circuit board itself.
Can be closed and formed together during processing of printed circuit boards
It is suitable. In addition, discarded substrates will break the joint
It can be removed more easily. In addition, there are multiple joints
Since it is provided in several places, the posture of the discarded substrate during standby
Can be stabilized. In particular, print discarded substrates
The joints at multiple locations connected to the board
It is provided dispersedly in a portion on one half circumference, and the other
/ 2 circumference is not provided
Then, the part of the discarded substrate within the other half circumference of the contour cutting line is
By pressing, each joint can be easily folded,
Removal of the discarded substrate can be easily performed.
【図面の簡単な説明】
【図１】本発明に係るプリント基板の半田付け方法にお
ける実施の形態の第１例で用いるプリント基板を示す平
面図である。
【図２】本発明に係るプリント基板の半田付け方法にお
ける実施の形態の第２例で用いるプリント基板を示す平
面図である。
【図３】（Ａ）（Ｂ）は本発明に係るプリント基板の半
田付け方法における実施の形態の第３例で用いるプリン
ト基板を示す平面図及び側面図である。
【図４】従来のブラシレスＤＣモータの縦断面図であ
る。
【図５】図４に示すブラシレスＤＣモータの分解縦断面
図である。
【図６】（Ａ）（Ｂ）はプリント基板に半田付けする状
態の従来例を示す工程図である。
【符号の説明】
１ フランジ
２ ボス
３ ステータ（電機子）
４ ステータ鉄心（電機子鉄心）
５ ステータコイル（電機子コイル）
６Ａ，６Ｂ 軸受
７ 回転軸
８ ロータ
９ ロータヨーク
１０ 界磁用永久磁石
１１ プリント基板
１２ 固定ネジ
１３ 半田付け部
１４ 貫通孔
１５ ネジ
１６ 半田槽
１７ 半田液面
１８ 半田噴流
１９ 孔塞ぎ手段
２０ 輪郭切断線
２０ａ 輪郭切断線の一方の１／２周上の部分
２０ｂ 輪郭切断線の他方の１／２周上の部分
２１ 捨て基板
２２ 繋ぎ部
２３ 耐熱テープ
２４ 耐熱性遮蔽物BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a printed circuit board used in a first example of an embodiment of a printed circuit board soldering method according to the present invention. FIG. 2 is a plan view showing a printed circuit board used in a second example of the embodiment of the printed circuit board soldering method according to the present invention. FIGS. 3A and 3B are a plan view and a side view showing a printed circuit board used in a third example of the embodiment of the printed circuit board soldering method according to the present invention. FIG. 4 is a longitudinal sectional view of a conventional brushless DC motor. 5 is an exploded vertical sectional view of the brushless DC motor shown in FIG. FIGS. 6A and 6B are process diagrams showing a conventional example in a state of being soldered to a printed circuit board. [Description of Signs] 1 Flange 2 Boss 3 Stator (armature) 4 Stator core (armature core) 5 Stator coil (armature coil) 6A, 6B Bearing 7 Rotation shaft 8 Rotor 9 Rotor yoke 10 Permanent magnet for field 11 Print Substrate 12 Fixing screw 13 Soldering part 14 Through hole 15 Screw 16 Solder bath 17 Solder liquid level 18 Solder jet 19 Hole closing means 20 Contour cutting line 20a Part 20b on one half circumference of contour cutting line 20b Contour cutting line Portion 21 on the other half circumference 21 Discard substrate 22 Connecting portion 23 Heat resistant tape 24 Heat resistant shield
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 平５−77974（ＪＰ，Ｕ) 実開 昭58−196875（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/34 B23K 1/08 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A 5-77974 (JP, U) JP-A 58-196875 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 3/34 B23K 1/08
Claims (1)
通孔を有するプリント基板の下面に前記半田噴流を当て
て該プリント基板の下面に半田付けする際に、前記貫通
孔を孔塞ぎ手段で仮に塞いだ状態で前記プリント基板の
下面に前記半田噴流を当てて該プリント基板の下面に半
田付けをし、半田付けの後に前記孔塞ぎ手段を撤去する
プリント基板の半田付け方法において、前記孔塞ぎ手段は前記プリント基板に形成する前記貫通
孔の輪郭に沿って形成されている輪郭切断線内に該プリ
ント基板自身により捨て基板として形成され、該捨て基
板よりなる前記孔塞ぎ手段は前記輪郭切断線を横切って
複数個所に設けられた繋ぎ部により前記プリント基板に
支持され 、複数個所の前記繋ぎ部は前記輪郭切断線の一方の１／２
周上の部分に分散して設けられ、他方の１／２周上の部
分には設けられないようになっている ことを特徴とする
プリント基板の半田付け方法。(57) when soldered to the lower surface of the printed circuit board against the Patent Claims 1, wherein the solder jets to the lower surface of the printed circuit board having a size of the through-hole solder jet penetrates the solder bath The said penetration
In the state where the hole is temporarily closed by the hole closing means,
Apply the solder jet to the lower surface and apply a half to the lower surface of the printed circuit board.
Removing the hole closing means after soldering. <br/> In the method of soldering a printed circuit board, the hole closing means includes the through hole formed in the printed circuit board.
The pre-cut is located within the contour cutting line formed along the contour of the hole.
Formed as a discarded substrate by the
The hole closing means comprising a plate crosses the contour cutting line.
Connected to the printed circuit board by connecting parts provided at multiple locations
Supported, and the connecting portions at a plurality of locations are one-half of one of the contour cutting lines.
Is distributed over the circumference and the other half of the circumference
A method of soldering a printed circuit board, wherein the printed circuit board is not provided separately.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30095698A JP3405227B2 (en) | 1998-10-22 | 1998-10-22 | Printed circuit board soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30095698A JP3405227B2 (en) | 1998-10-22 | 1998-10-22 | Printed circuit board soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000133921A JP2000133921A (en) | 2000-05-12 |
| JP3405227B2 true JP3405227B2 (en) | 2003-05-12 |
Family
ID=17891115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30095698A Expired - Fee Related JP3405227B2 (en) | 1998-10-22 | 1998-10-22 | Printed circuit board soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3405227B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104174958A (en) * | 2014-09-09 | 2014-12-03 | 镇江泛沃汽车零部件有限公司 | Method and system for machining warming motor brush carrier workpieces |
-
1998
- 1998-10-22 JP JP30095698A patent/JP3405227B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104174958A (en) * | 2014-09-09 | 2014-12-03 | 镇江泛沃汽车零部件有限公司 | Method and system for machining warming motor brush carrier workpieces |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000133921A (en) | 2000-05-12 |
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