JP3387151B2 - Intaglio - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an intaglio plate for forming a high-definition pattern on a glass or IC substrate.

[0002]

2. Description of the Related Art Conventionally, high-definition patterns of this kind have been printed by offset printing using a metal intaglio. As shown in FIG. 14, the metal intaglio plate is formed by forming a non-image area having a desired high-definition pattern on the surface of the metal plate material 6 by using a resist 7, and etching the metal exposed surface area which is the image area. Manufactured by treatment.

However, the intaglio made of the metal plate material 6 formed by the above-described etching treatment has an image line (recess) of the metal plate material 6 because the processing reaction isotropically acts as shown in FIG. When an attempt is made to make the depth of the forming groove deep, not only the exposed surface of the metal plate material 6 but also the portion covered with the resist 7 which is a non-image area is wraparound and etched (only the width of d Therefore, when an image line (recess) forming groove is to be formed with the width of the exposed surface portion of the metal plate material 6 being formed, it is inevitable that the recess formation depth is limited by the exposed surface width of the metal plate material 6. is there.

In other words, when the width of the image area is made finer, the depth naturally becomes shallower, and the intaglio printed matter formed in this way can only obtain an image with weak contrast because of lack of ink. . In addition, artwork is required in advance in order to obtain a desired line width and a plate depth for obtaining sufficient contrast.

Therefore, for the purpose of providing a method of manufacturing an intaglio plate which can form a thin image area deeply and uniformly and which has a desired depth even with respect to various line widths within the same printing surface, Manufacture of intaglio without resist after the desired pattern is formed on the surface of the substrate using a resist in the area corresponding to the image area, plating is performed, and then the plating surface is polished to a degree that satisfies printability. Method (JP-A-4-9
952) was developed.

[0006]

However, in the method disclosed in Japanese Patent Laid-Open No. 4-9952, a metal part may be formed on the upper end surface of the resist because the metal part is simply formed between the resist. At that portion, the metal portion extends to the image area.

Even if the metal part does not reach the image part, if the non-image part is made of a metal having no abrasion resistance, the end shape is not only deteriorated. Defects such as scratches also occur on portions other than the ends. further,
There is a problem that it is not easy to select a metal that can be plated well and has abrasion resistance.

[0008]

In view of the above problems in the present invention SUMMARY OF], on claim 1, the substrate, Pa data in non-image pattern
In an intaglio provided with a hardened metal layer, the metal
The layer is made of Ni-PTFE (polytetrafluoroethylene)
Characterized by a metal layer formed by eutectoid plating
It is intended to provide an intaglio .

Further, in claim 2, the base material is a stainless steel.
Nickel strike plating layer and sulfami on the loess material
Characterized in that a nickel oxide plating layer is provided in this order
The intaglio according to claim 1 is provided.

In the third aspect, the metal layer is formed on the substrate.
Resist thickness is equal to or less than desired plating thickness
A resist having the above thickness was formed in a pattern of lines.
After that, it is characterized by being plated as a non-image area pattern
It provides the intaglio according to claim 1 or 2 .

[0011]

[Action] The intaglio plate of the present invention has a pattern pattern in a non-printing pattern.
The coated metal layer is Ni-PTFE (polytetrafluor
Polyethylene) formed by eutectoid plating
Therefore, there is ink repulsion and the doctoring characteristics are good.
In addition, the intaglio can be made with few defects.

Further, in the present invention, stainless steel is used as the base material.
Nickel strike plating layer and sulfamic acid on the material
By providing the nickel plating layers in this order,
The suitability can be improved.

Further intaglio of the invention, a resist pattern is formed on the substrate surface by photolithography at the time of manufacture,
Moreover, since the metal portion is completely contained in the gap, a resist pattern having a uniform and high definition and a desired height can be easily obtained with respect to the printing original plate. Therefore, since this pattern becomes the image area, the intaglio obtained with a plating thickness within the obtained resist pattern film thickness is uniform, high-definition, and has a desired depth, and was used for printing. In this case, ink can sufficiently enter into a fine pattern, and high definition and high contrast can be obtained, and uniform contrast can be given to various line widths within the same printing surface.

For plating, electric plating may be used, but in electroplating, the current density is concentrated on the edge of the metal portion even if the metal portion does not reach the image area.
The surface of the non-image area thus obtained is in a state where the flatness is remarkably lacking, and surface polishing is required for practical use in printing.

When such surface polishing is performed, the edge sharpness of the non-image area metal layer formed by the polishing is impaired. Furthermore, if the non-image area is made of a metal that does not have abrasion resistance, not only the edge shape will deteriorate, but also defects other than the edges will cause defects such as scratches, so plating can be performed well and abrasion resistance There is no easy choice of metal.

In such a case, by using electroless plating instead of electroplating, the surface of the non-image area of the intaglio plate is uniform without polishing the surface, has a high definition, and has a desired depth. In addition, when used for printing, the ink can sufficiently enter into a fine pattern, high definition and high contrast can be obtained, and uniform contrast can be given to various line widths within the same printing surface.

[0017]

EXAMPLES Example 1 Hereinafter, examples of the present invention will be described in detail with reference to the accompanying drawings. In FIG. 1, the intaglio substrate 1 has been surface-treated to the extent that it does not interfere with the subsequent plating process, and stainless steel, amber, iron, aluminum or the like can be used. In this implementation, stainless steel 43
0 material (made by Nichikin Steel Co., Ltd.) was used.

Since the suitability for plating of the stainless steel 430 material is not so sharp, the surface is preliminarily treated with nickel strike plating 2 (FIG. 2) and nickel sulfamate 3 (FIG. 3), and the surface is mirror-polished. Alkali cleaning and acid cleaning are performed, and positive or negative photoresist or electron beam resist of several μm is applied on the surface.
~ Coating to a desired thickness in the range of several tens of μm,
A resist pattern image 4 is formed by bringing a glass mask (not shown) having a light-shielding film of a desired fine pattern into close contact and exposing with near-ultraviolet light, or irradiating the pattern with an electron beam and developing with an organic alkaline developer. To form.

A typical case will be described below. As a photoresist, AZ4620A (manufactured by Hoechst Japan Ltd .:
15 μm is formed using the product name), and the temperature is 100 ° C in the oven.
Pre-bake for 1 hour, contact exposure with a photomask, A
A pattern having a minimum line width resolution of 5 μm can be formed by developing using Z400K (trade name of Hoechst Japan Co., Ltd.) and post-baking at 115 ° C. for 1 hour in an oven.

In this case, the desired resist pattern image 4 can be obtained by adjusting the processing conditions such as exposure, development and baking.
The cross-sectional shape of is obtained (FIG. 4).

When the residual film of the resist pattern is present,
Since it is not good in the subsequent plating process, ashing is performed by oxygen plasma.

Next, by electroplating, the non-image area 5 is obtained by plating the area other than the area shielded by the resist pattern on the substrate surface (FIG. 5). The plating thickness at this time becomes the plate depth of the intaglio plate. In the present implementation, Ni-PTFE (polytetrafluoroethylene) eutectoid plating having ink repellency was used.

In this embodiment, Metaflon FS (produced by Uemura Kogyo Co., Ltd .: product name) is formed to a thickness of 12 μm. In addition, Ni to P or Ni to P to W may be used, and in this case, a metal portion having abrasion resistance can be obtained.

In general, when electroplating is performed, the current density is increased in the vicinity of the cell edge of the resist pattern, and the plating thickness is thicker than other flat portions, resulting in uneven deposition. In order to remove the uneven deposit and to flatten the plated surface, surface polishing is subsequently performed. In this example, surface polishing was performed with a urethane pad using submicron-order alumina abrasive grains (FIG. 6). Finally, the resist was removed to obtain an intaglio plate (FIG. 7).

The obtained intaglio plate had a line width resolution of about 5 μm, similar to the photoresist resolution, and a uniform plate depth of about 10 μm. Further, when printing was performed, a substrate having good doctoring characteristics and few defects was obtained with which a uniform contrast was obtained for a pattern having a line width of 10 μm or more. No deterioration of the pattern was observed even after repeated use.

(Embodiment 2) Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In FIG. 8, the intaglio substrate 1 has been surface-treated to the extent that it does not interfere with the subsequent plating process, and stainless steel, amber, iron, aluminum or the like can be used. In this implementation, stainless steel 43
0 material (made by Nichikin Steel Co., Ltd.) was used.

Since the suitability for plating of the stainless steel 430 material is not so sharp, the surface is preliminarily treated with nickel strike plating 2 (FIG. 9) and nickel sulfamate 3 (FIG. 10), and the surface is mirror-polished. Alkaline cleaning and acid cleaning are performed, and positive or negative photoresist or electron beam resist of several μ
It is coated in a desired thickness in the range of m to several tens of μm, and a glass mask (not shown) having a light-shielding film of a desired fine pattern is brought into close contact with the film and exposed to near ultraviolet rays, or an electron beam is applied onto the pattern. The resist pattern image 4 is formed by irradiating and developing with an organic alkaline developer.

A typical case will be described below. As a photoresist, AZ4620A (manufactured by Hoechst Japan Ltd .:
12 μm is formed using the product name) and the temperature is 100 ° C in an oven.
Pre-bake for 1 hour, contact exposure with a photomask, A
A pattern having a minimum line width resolution of 3 μm can be formed by developing using Z400K (trade name of Hoechst Japan KK) and post-baking at 115 ° C. for 1 hour in an oven.

In this case, the desired resist pattern image 4 can be obtained by adjusting the processing conditions such as exposure, development and baking.
The cross-sectional shape of is obtained (FIG. 11).

When the residual film of the resist pattern is present,
Since it is not good in the subsequent plating process, ashing is performed by oxygen plasma.

Next, the non-image area 5 is obtained by the electroless plating method, which is shielded by the resist pattern on the surface of the substrate and plated on portions other than the portion (FIG. 12). The plating thickness at this time becomes the plate depth of the intaglio plate. In this implementation, Ni ~
P electroless plating was used.

In the present embodiment, Nimden SX (produced by Uemura Kogyo Co., Ltd .: trade name) was formed to a thickness of 10 μm.
In addition, Ni to P to W may be used, and even in this case, a metal portion having abrasion resistance can be obtained.

Finally, the resist was removed to obtain an intaglio plate (FIG. 13).

The obtained intaglio plate had a line width resolution of about 3 μm, similar to the photoresist resolution, and a uniform plate depth of about 10 μm. Further, when printing was performed, a substrate having good doctoring characteristics and few defects was obtained with which a uniform contrast was obtained for a pattern having a line width of 10 μm or more. No deterioration of the pattern was observed even after repeated use.

[0035]

As described above, the intaglio plate of the present invention is
The metal layer patterned in the non-printing pattern is Ni-
Eutectoid plating of PTFE (polytetrafluoroethylene)
Since it is formed by
Use an intaglio plate that has good knurling characteristics and few defects
You can In the present invention, the base material is stainless steel.
Nickel strike plating layer and sulfamine on top of stainless steel
By providing the nickel oxide plating layer in this order,
The plating suitability of the layer can be improved.

Further, the resist pattern is formed by photography.
Uniform and high-definition to form the surface on the substrate surface.
Moreover, a resist pattern of a desired height can be easily obtained.
It Therefore, this pattern is used as the drawing area
Since the part is formed by the metal plating layer, the obtained intaglio plate
Is uniform and high-definition and has the desired depth for printing
When used, the fine pattern contains enough ink and
Fine and high contrast can be obtained and within the same printing surface
To give uniform contrast to various line widths
I can. In addition, when the non-image area is obtained by electroless plating, it has a uniform and high-definition surface without polishing, and has a desired depth. In addition, sufficient ink can be obtained to obtain high definition and high contrast, and uniform contrast can be given to various line widths within the same printing surface.

[0037]

[Brief description of drawings]

FIG. 1 is a sectional view of a substrate according to a manufacturing method of the present invention.

FIG. 2 is a cross-sectional view after nickel strike plating in the manufacturing method of FIG.

FIG. 3 is a cross-sectional view after nickel sulfamate treatment in the manufacturing method of FIG.

4 is a cross-sectional view after forming a resist pattern image in the manufacturing method of FIG.

5 is a cross-sectional view after forming the electroplating layer in the manufacturing method of FIG.

6 is a cross-sectional view after polishing in the manufacturing method of FIG.

7 is a cross-sectional view of the completion of the manufacturing method of FIG.

FIG. 8 is a cross-sectional view of a substrate according to a manufacturing method of the present invention according to another embodiment different from FIG.

9 is a sectional view after nickel strike plating in the manufacturing method of FIG.

10 is a cross-sectional view after nickel sulfamate treatment in the manufacturing method of FIG.

11 is a cross-sectional view after forming a resist pattern image in the manufacturing method of FIG.

12 is a sectional view after the electroless plating layer is formed in the manufacturing method of FIG.

13 is a cross-sectional view after removing the resist pattern in the manufacturing method of FIG.

FIG. 14 is a cross-sectional view after forming a resist pattern image in a conventional manufacturing method.

FIG. 15 is a cross-sectional view showing a problem with the manufacturing method of FIG.

[Explanation of symbols]

1 ... Substrate 2 ... Nickel strike plating 3 ... Nickel sulfamate 4 ... Resist pattern image 5 ... Metal layer (plating layer) that will be the non-image area 6 ... Metal plate material 7 ... Resist

─────────────────────────────────────────────────── ───Continued from the front page (56) References JP-A-6-71838 (JP, A) JP-A-4-9952 (JP, A) JP-A-58-178356 (JP, A) Actually opened 57- 162637 (JP, U) JP-B 47-30754 (JP, B1) (58) Fields surveyed (Int.Cl. ⁷ , DB name) B41C 1/06 G03F 7/00

Claims (3)

(57) [Claims] 1. A patterning on a substrate in a non-printing pattern.
In an intaglio provided with a curved metal layer, the metal layer is N
i-PTFE (polytetrafluoroethylene) eutectoid
Characterized by being a metal layer formed by a kick
intaglio. 2. The base material is nickel on a stainless steel material.
Strike plating layer and nickel sulfamate plating layer
The recess according to claim 1, wherein the recesses are provided in this order.
Edition. 3. The metal layer has a resist thickness on a base material.
Has a thickness equal to or greater than the desired plating thickness
After forming the resist in the image pattern,
The plating according to claim 1, which is plated as a turn.
Or the intaglio described in 2.