JP3386250B2 - Thermal dependency detector - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dependence detecting device, and more specifically, to temperature (humidity), measured values such as temperature, humidity, gas, infrared ray, pressure, vacuum degree, acceleration, flow rate and flow velocity. The present invention relates to an apparatus for measuring a dependent physical quantity of an object to be measured.

[0002]

17 is a block diagram for explaining an example of a conventional detecting device, FIG. 17 (a) is a plan view and FIG.
17B is a sectional view taken along line BB of FIG. 17A, in which
1 is, for example, a Si substrate, 2 is a cavity provided in the Si substrate 1, and as is well known, the upper portion of the cavity 2 is, for example, S
A bridge made of an insulating film 3 such as iO ₂ or Ta ₂ O ₅ is bridged, and a resistor pattern 4 made of, for example, Pt or NiCr is disposed on the bridge. A protective film 5 made of SiO ₁ , Ta ₂ O ₅ or the like is formed on the pattern 4.
Is provided and a current is applied to the resistor pattern 4 through the bonding wire 6, and the heat generating portion or the temperature sensitive (heat) portion A of the resistor pattern 4 is heated.

Taking the case of measuring humidity using the detector as described above as an example, the resistance value of the resistor 4 depends on the ambient temperature and humidity. A resistance value related to ambient temperature is measured by passing such a minute current, and then a resistance value related to ambient temperature and humidity is measured by flowing a current having humidity sensitivity. The ambient humidity is measured by subtracting the measured value for.

The detection device as described above uses a fine processing technique for semiconductors and integrated circuits to separate a space from the substrate 1 (a cavity 2 is provided in the substrate 1 to avoid heat conduction with the substrate 1).
Although the heat-generating or temperature-sensitive part A is formed, the size of the chip is 0.1 in view of normal semiconductor manufacturing technology.
The width is ˜2 mm and the width is 0.5 × 0.5 mm to 10 × 10 mm. When the above-described cavity 2 is provided within this dimension, the distance between the heat-generating portion or temperature-sensing portion A and the cavity wall 2b becomes 5 in particular with respect to the cavity bottom 2a.
Since it approaches 0 to 300 μm, a large space cannot be secured. If this distance is short, the heat generating portion is affected by the temperature state of the substrate 1 having a much larger heat capacity than the heat generating portion A, and the effect of thermal insulation due to the hollow portion is lost. That is, the heat radiation from the substrate 1 and the cavity 2
Since the heat conduction of the inner atmosphere is short, the effect of such heat insulation disappears.

FIG. 18 is a main part configuration diagram for explaining another example of the conventional detection apparatus. In the figure, 1 is a substrate, 2 is a cavity,
3 is an insulating film, 4 is a heat and / or temperature sensitive material, 4a is a lead pattern for the heat or temperature sensitive material 4, 6 is a bonding wire, 7 is a lead wire, 8 is a package base, 9 is a package cap, The detection unit including the substrate 1 to the bonding wire 6 measures ambient temperature, humidity, and other physical quantities in the same manner as in the case of FIG.

In the detection device as described above, the influence of heat received by the temperature-sensitive material 4 on the substrate is that the heat radiation from the peripheral substrate 1 (a ₁ ), the heat radiation from the external package 9 (a ₂ ), the bridge There are heat conduction from the suspension 3 (b ₁ ), heat conduction from the package base 8 (b ₂ ), heat conduction from peripheral convection (b ₃ ), and the like. The response time of the temperature-sensitive material 4 to changes in the ambient temperature is 80 ° C.
If the temperature is 20 ° C., it takes about 20 minutes for the temperature-sensitive material to reach 20 ° C. Since the temperature-sensitive material 4 passes through the cavity 2 of the substrate 1, the packages 8 and 9 and the substrate 1
It may be possible to adapt to the temperature of the surrounding atmosphere more rapidly because it does not come into contact with and has a minute heat capacity, but in reality, it takes a lot of time as described above. The package-based response time is also about 20 min. Therefore, the temperature sensitive material does not have a short response time with or without a cavity.

In the detection device as described above, by arranging the material of the heat-generating or temperature-sensitive part and its arrangement, for example, temperature, humidity, gas, infrared rays, pressure, vacuum degree, acceleration, flow rate, flow velocity, etc. are detected. As the physical phenomenon to be measured, the following principles 1 to 7, namely, 1. As the resistance value change of the electric resistor, 2. It has a sensitive film for desorbing an atmosphere and the electric resistance value of the sensitive film changes. 3. It has a sensitive film that desorbs an atmosphere, and the capacitance of the sensitive film changes. 4. A sensitive film for desorbing an atmosphere is provided, and a change in weight of the sensitive film is used as a change in resonance frequency. 5. Having a sensitive film for desorbing the atmosphere, the reaction heat is generated by the chemical reaction of the sensitive film, and this heat is used as the resistance value change of another resistor. 6. The temperature change is taken as the output voltage change of the thermocouple membrane, Deflection is the output voltage change of the piezoresistive effect,
It is measured by using.

[0008]

When the physical quantity of the object to be measured is measured by using the above-mentioned measurement principles 1 to 7, the measured value is influenced by the temperature. If you don't know it accurately, you will get meaningless measurement results. For example, when the pressure of a gas is detected by piezo resistance, if the temperature of the gas is not known, the accurate pressure cannot be known. It suffices that the temperature of the gas and the temperature of the piezoresistive (the piezoresistive have temperature dependence) have a certain known relationship, but if not, a solution of temperature compensation is used. However, if the piezoresistor is left in gas until temperature equilibrium is reached,
In reality, the temperature variation of the gas and the temperature variation of the piezoresistance cannot follow because of the large heat capacity of the piezoresistance. As a result, temperature compensation becomes incomplete.

The present invention has been made in view of the above circumstances, and in particular, in a detection device having a hollow portion and heat and / or temperature sensitive material on the hollow portion, Alternatively, the purpose of the present invention is to eliminate the influence of the ambient temperature on the temperature-sensitive material as much as possible, thereby improving the heat generation or the response characteristics of the temperature-sensitive material.

[0010]

In order to solve the above-mentioned problems, the present invention comprises (1) a substrate having a cavity and a heat-generating and / or temperature-sensing member provided above the cavity, in the temperature dependence detector for detecting a physical quantity of the object to be measured than the resistance value of the heat generating and / or temperature-sensitive member, before Symbol cavity a through cavity through the front <br/> Symbol substrate and said through cavity Opening on at least one side of the substrate, and ( 2 ) a substrate having a through cavity and at least one end of the through cavity being open, and the through cavity having the opening. A heat generating and / or temperature sensitive member cross-linked to the side, and the substrate is fixed to a package case with the opening as an upper end, and ( 3 ) the through cavity has one end. A substrate with an open
Having a heat generating and / or temperature sensitive member cross-linked on the opening side of the through cavity, the substrate is horizontal, and the side away from the opening is fixed to a package case, ( 4 ) One substrate is provided from the package case side to the bridge, and only the bridge portion has a through cavity, and at least one end of the through cavity is an opening. Further, ( 5 ) through A substrate having a cavity and a bottomed cavity adjacent to the through cavity and independent of the through cavity; and a heat-generating and / or temperature-sensing member bridged above the bottomed cavity, the through cavity side Is fixed to the base plate, further, ( 6 ) the through cavity in ( 5 ) above is a cavity with a bottom, and further,
( 7 ) In the above ( 5 ) or ( 6 ), the heat generation and / or
Alternatively, the cavity having the temperature sensitive member is a through cavity, and further ( 8 ) in ( 5 ) or ( 6 ) or ( 7 ) above,
At least one side portion of the cavity having the heat-generating and / or temperature-sensitive member is open, and ( 9 ) the base member has a U-shaped or U-shaped opening at the tip. A detection chip having a heat-generating and / or temperature-sensing member is cross-linked at the opening of the U-shape or the U-shape, and ( 10 ) the temperature-sensing member on the substrate, In a detection device having a lead pattern for a temperature member and a bonding pad for connecting the lead pattern to an external circuit, a hole penetrating the substrate is provided in the vicinity of the bonding pad, and further, ( 11 ) In a heat-dependent detection device having a substrate having a cavity, a heat-generating and / or temperature-sensitive member bridged to the upper part of the cavity, and a suspension bridging the temperature-sensitive member, the width of the suspension is
The heat generation and / or the heat radiation disposed on the suspension.
Alternatively, the width of the lead pattern for the temperature-sensitive member is made narrower, and further, a substrate having a ( 12 ) cavity and a heat-dependent detection device having a heat generation and / or temperature-sensitive member bridged to the upper part of the cavity. The part of the suspension portion supporting the heat-generating and / or temperature-sensitive member is only a lead pattern for supplying electric power to the heat-generating and / or temperature-sensitive member.

[0011]

In the detection device having the heat-generating and / or temperature-sensitive material in the upper part of the cavity, (1) by increasing the size of the cavity, or by taking measures such as separating the substrate from the heat-generating portion, Improving the response characteristics of the exothermic and / or temperature sensitive material.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a detection device to which the present invention is applied.
In principal part cross-sectional view for illustrating the, in the figure, 1 is a substrate,
2 is a cavity formed in the substrate 1, 3 is an insulating film for forming a bridge provided on the cavity 2, 4 is a heat-generating and / or temperature-sensitive material, and 5 is a protective film (note that , Which have the same reference numbers throughout the drawings), these measure the ambient temperature, for example, in the same manner as in the prior art shown in FIG. The substrate 1 is S
If it is an i substrate, a commercially available wafer has a thickness of about 0.5 to 1 mm in the case of a diameter of 6 inches, and in the conventional detection device, the depth of the cavity 2 is indicated by a dotted line P in the figure. As shown in, the thickness was about half the thickness of the substrate 1. On the other hand, in the present invention, the etching for forming the cavity 2 is further advanced so that the thickness of the substrate 1 is barely reached (for example, until the thickness of the cavity bottom of the substrate 1 becomes 0.1 mm). 2 is dug down, and as shown by the solid line in the figure, the substrate 1
The inner cavity 2 is enlarged.

FIG. 2 shows another detection device to which the present invention is applied.
Etching in fragmentary cross-sectional configuration diagram for explaining the examples, examples of this are thicker in thickness as the substrate 1 (e.g., 1 to 5 mm) prepared was (prefabricated), until the last minute of the substrate 1 thickness (0.9 to 4.9 mm), the cavity 11 is enlarged.

[0014] FIG. 3 (a), (b), it present invention, respectively
FIG. 3 is a cross-sectional view of an essential part showing another example of an applied detecting device , both of which show a through hole (cavity) 2 formed in a substrate 1.
In FIG. 3A, the through-cavity 2 is formed by unilaterally etching from the top, and in FIG. 3B, the through-cavity 2 is formed by advancing the etching from the back surface.

FIG. 4 is a sectional view of an essential part for explaining another example to which the present invention is applied . In the figure, 10 is a pedestal, 11 is a notch hole provided in the pedestal 10, and 12 is solder. In this embodiment, another pedestal 10 having another cutout hole 11 having excellent air permeability is attached to the lower portion of the substrate 1 having the through cavity 2 formed as shown in FIG. It has the same effect as 2. The cutout hole 11 may be formed by melting or selective etching after die-bonding to the package. This has the advantage that the substrate can be made thin and etching can be performed in a short time.

FIG. 5 is a diagram for explaining one embodiment (claim 1 ) of the present invention, in which 5 (a) is a plan view and FIG.
5B is a sectional view taken along the line BB of FIG. 5A. In this embodiment, a through-hole cavity 2 is provided in the substrate 1 and at least one of the through-hole cavities is indicated by A in FIG. 5A. As shown
Opened, in this case Si (110) as the substrate 1
Should be used.

FIG. 6 shows another embodiment (claim 2 ) of the present invention.
6A and 6B are configuration diagrams for explaining FIG. 6A and FIG.
FIG. 6B shows a sectional view taken along the line 6B-B. Thus, in this embodiment, the through-hole cavity 2 is provided in the substrate, one of the through-hole cavities is formed with the opening A, and the opening A is set to the upper side, and the substrate 1 is used in the vertical direction. In the figure, 12 is a die bond paste for attaching the substrate 1 to the package base 8, and 13 is a bonding pad.
By doing so, the heat generating or temperature sensitive member 4 can be arranged at a distance from the support pedestal portion of the substrate 1 (where the bonding pad 13 is arranged), that is, at a distance. The heat generating and temperature sensitive member 4 can be arranged at a position far from the package base 8.

FIG. 7 shows another embodiment of the present invention (claim 3 ).
FIG. 7 (a) is a plan view, FIG.
7B is a sectional view taken along line BB of FIG. 7A, and FIG. 7C is a sectional view taken along line CC of FIG. 7A, in which 14 is a base plate and 4a is a lead film pattern. Is. Thus, in this embodiment, the base plate 14 is used, and the substrate 1 is horizontally mounted on the base plate 14. The substrate 1 is provided with the through cavity 2 which is open on one side A. The substrate 1 is located near the bonding pad 13 on the side opposite to the opening A.
It is attached to the package base 8 by 4. In this way, the heat generating or temperature sensitive member 4 can be kept away from the bonding pad 13 and, on the other hand, one side (A side)
Since it is opened, it has good breathability.

FIG. 8 is a schematic diagram showing an example of a conventional detection device. In the figure, 4 is a temperature sensor (thermistor bead), 7 is a stem, and 8 is a package case. The sensor 4 is arranged at a position separated by about 1 to 3 mm from the package case 8 by the stem 7.
On the other hand, in the embodiment shown in FIG.
Can play the role of the stem 7 in FIG. 8, so that the influence of heat of the base plate 14 can be reduced. Further, since the stem is integrated with the substrate 1, there is an advantage that two parts, that is, the temperature sensitive member (thermistor bead) and the stem can be manufactured at one time.

FIG. 9 shows another embodiment of the present invention (claim 4 ).
9A is a plan view and FIG.
9B is a sectional view taken along line BB of FIG. 9A. Therefore,
In this embodiment, the two boards (beams) 1 shown in FIG.
In this case, the cross-sectional area of the beam can be reduced and the heat conduction on the side of the base plate can be further reduced.

FIG. 10 shows another embodiment of the present invention (claims).
5 (a) is a plan view, FIG. 10 (b) is a sectional view taken along line BB of FIG. 10 (a), and FIG.
Reference numeral 2'denotes a through cavity, 2 is a bottomed cavity, and a heat generating and temperature sensitive member 4 is bridged to the top of the bottomed cavity 2. Thus, according to this embodiment, since the through-hole 2'is provided in the substrate 1 extending from the base plate 14 to the heat-generating or temperature-sensitive member 4, the heat conduction from the base plate 14 can be reduced. Further, the heat-generating or heat-sensitive member 4 is surrounded, that is, bridged on the bottomed cavity 2 independent of the through cavity 2 ′, and this structure facilitates dicing of the wafer (substrate). Becomes That is, the substrate 1 has a quadrangular shape and can be diced along the dicing line. Further, since the heat generating and temperature sensitive member 4 is disposed in the bottomed cavity 2, the mechanical shock and foreign matter during dicing can be prevented. Strong against collisions.

FIG. 11 shows another embodiment of the present invention (claims).
6A ), FIG. 11A is a plan view, FIG. 11B is a sectional view taken along the line BB of FIG. 11A, and this embodiment is the same as the embodiment shown in FIG. The through-hole cavity 2'in the example is a bottomed cavity 2 ". In FIGS. 10 and 11, the cavity 2 under the heat- and temperature-sensitive member 4 has a bottom. It is also possible to make the cavity 2 a through cavity, and further, the end portion 1a of the substrate 1 is eliminated and this portion is opened, and the opening A is also formed as in the embodiment shown in FIGS. The good things are easy to understand.

FIG. 12 is a diagram showing a flow of a mounting process using the detection device shown in FIGS. 7, 9, 10 and 11 as an example, and FIG. 13 is an assembly procedure according to the flow shown in FIG. 12 is a schematic configuration diagram showing steps S1 to S in FIG.
5 and the respective steps (a) to (e) of FIG. 13 correspond to each other. First, S1: a frame in which the base plate 14 and the lead plate 7 and the like are incorporated is formed (a), and then, S2: the chip 20 in which the heat generating or temperature sensitive member is incorporated on the substrate as described above is formed on the base plate 14. Die bonding is performed (b), and then S3: the bonding pad on the chip 20 and the lead plate 7 are connected by the bonding wire 6 (c). Next, S4: The mesh 15 for protecting from dust etc. is incorporated (d), and finally, S5: The mesh 15 is attached to the package 9 having the ventilation holes 9a to complete the mounting (e).

FIG. 14 shows another embodiment of the present invention (claims).
9 ) is a plan view showing a base suitable for mounting the detection device (chip) 20 having the structure as shown in FIGS. 1 to 5 in this embodiment. 14a has a U-shaped opening as shown by 16a in FIG. 14A, or has a square-shaped opening as shown by 16d in FIG. 14B. The detecting device 20 is bridged or attached to the tip of the U-shaped or U-shaped opening. In other words, in this embodiment, the electrode lead-out pattern from the bonding pad 13 to the heat generation or temperature sensitive member 4 in the embodiment shown in FIG. 7, FIG. 10, FIG. The heat from 16 does not affect the heat generation or the temperature sensitive member 4.

When the detection chip shown in FIG. 14 is used as a flow rate sensor, it can be installed in a flow in either the Z direction (upper or lower) or the Y or X direction perpendicular to the drawing. . In this case, in the X direction, the base 1
It is necessary to limit the substrate 1 side to the upstream side so as not to be affected by heat such as 6. In order to reduce the heat effect of the bonding wire 6, it is better to keep the U-shaped or B-shaped side legs 16b, 16c away from the heat generating or temperature sensitive member 4 as much as possible. It is better to adhere to the corner of No. 1. Similarly, since the lead beam 7 is also separated from the heat generating or temperature sensitive member 4, the substrate 1
Place it closer to the corner side of. Further, the material of the base 16 shown in FIG. 14 is the same as that of the package 9 shown in the assembly view of FIG.
When is a ceramic material, a material such as Kovar alloy is generally used in order to match the coefficient of thermal expansion and to weld it together with the frit glass. However, the effect can be further improved by considering the use of a material having a small thermal conductivity, rather than just adjusting the thermal expansion coefficient. Further, as the material of the base 16, a material having a low thermal conductivity such as a stainless steel material or a material obtained by coating a thin glass plate with a thin film of a metal material having electrical conductivity is selected. Further, in FIG. 14, since the substrate 1 can be made smaller than that in FIG. 7, the base 1 is less expensive than the substrate 1.
6, because the bonding beam 7 can partially act,
The cost can be reduced.

[0026] Figure 15 is another embodiment of the present invention (claim 1
0 ) is a plan configuration diagram, and FIG. 15A shows a conventional example, and FIGS. 15B and 15C show an example when the present invention is applied. In FIG. 15, reference numeral 21 is a ceramic insulating substrate, 22 is a comb-shaped electrode, 23 is a bonding pad portion, 24 is a moisture sensitive layer, and 25 is a glass coat. The layer 24 is designed so as to prevent the layer 24 from coming into contact with each other. In this embodiment, the humidity sensor shown in FIG.
As shown in FIG.
6 or, as shown in FIG. 15 (c), the notch 26
a is provided. However, the strength is higher when the hole 26 is formed than when the notch 26a is formed.

That is, the humidity sensor shown in FIG. 15 (a) uses a ceramic substrate 21, and a detection layer and an electrode layer are printed on the ceramic substrate 21 in a thin film. 15 (b), FIG.
By providing the through hole 26 or the notch 26a as shown in (c), the amount of heat capacity of the pad portion given to the moisture sensitive layer can be reduced. As a result, the detection performance is made uniform in the plane of the substrate and the sensitivity is increased. The influence of the lead wire laid on the pad portion is also reduced. Since the package case (especially the base) has a large heat capacity, under environmental conditions where dew condensation is likely to occur, dew condensation starts before the substrate. At this time, if the through hole 26 or the notch 26a is provided, the water droplets of dew condensation are less likely to be transmitted and the drip-proof effect is great. After being submerged in water, it can be quickly returned to reuse. The presence of the through hole 26 or the notch 26a not only provides good ventilation, but also can reduce the surface tension of the water droplet, reduce the size of the water droplet, and reduce the upper amount. The through hole 26 or the notch 26a can be easily formed by molding a ceramic blank type, and a method such as etching, ion milling, electric discharge machining or the like can be used as a post processing.

[0028] FIG. 16 shows another embodiment of the present invention (claim 1
1, 12) a diagram for explaining the FIG. 16 (a) a plan view (a conventional example), FIG. 16 (b), (b ') Fig 16 (a)
FIG. 3B is a sectional view taken along line BB of FIG.
(B ') is a sectional view in the case of the present invention. 16 (c) and 16 (c ') are cross-sectional views taken along the line CC of FIG. 16 (a), in which (c) is a cross-sectional view of a conventional technique and (c') is a cross-sectional view of the present invention. According to the prior art, as shown in FIG. 16 (b) in a cross-sectional view, the suspension portion 3a bridging the heat-generating or temperature-sensitive member 4 has a wide width, but as shown in FIG. According to this suspension section 3
The width of a is configured to be narrow. Further, in the suspension portion 3a, as shown by A in FIG. 16 (c '), a part of the suspension is removed by etching and is supported only by the lead pattern.

According to the embodiment shown in FIG. 16, the width of the suspension for supporting the lead pattern for the heat generating and temperature sensitive members is made narrower than the width of the lead pattern, or a part of the suspension is eliminated and only the lead pattern is formed. By doing so, the heat generation or temperature sensitive member can be substantially separated from the substrate, and the heat conduction from the substrate to the heat generation or temperature sensitive member can be reduced.

[0030]

As is apparent from the above description, according to the present invention, the heat-generating or temperature-sensitive member is separated from the substrate as much as possible. And, the physical quantity to be measured can be accurately detected.

[Brief description of drawings]

FIG. 1 is a cross-sectional configuration diagram of main parts for explaining an example of a detection device to which the present invention is applied .

FIG. 2 is a cross-sectional configuration diagram of main parts for explaining another example of the detection device to which the present invention is applied .

FIG. 3 is a cross-sectional configuration diagram of main parts for explaining another example of the detection device to which the present invention is applied .

FIG. 4 is a cross-sectional configuration diagram of main parts for explaining another example of the detection device to which the present invention is applied .

[5] One embodiment of the sensor according to the present invention (claim
1A and 1B are a plan view and a cross-sectional view for explaining 1 ).

FIG. 6 shows another embodiment of the detection device according to the present invention (claims)
2 ) A front view and a cross-sectional view for explaining 2 ).

FIG. 7 shows another embodiment of the detection device according to the present invention (claims)
3 ) A front view and a sectional view for explaining FIG.

FIG. 8 is a schematic configuration diagram showing an example of a conventional detection device.

FIG. 9 is a plan view and a sectional view for explaining another embodiment (claim 4 ) of the present invention.

FIG. 10 is a plan view and a cross-sectional view for explaining another embodiment (claim 5 ) of the present invention.

FIG. 11 is a plan view and a sectional view for explaining another embodiment (claim 6 ) of the present invention.

FIG. 12 is a flowchart for explaining an example of a mounting process of the detection device according to the present invention.

13 is a diagram showing an assembling procedure corresponding to the flow of FIG.

FIG. 14 is a plan configuration diagram for explaining another embodiment (claim 9 ) of the present invention.

FIG. 15 is a plan configuration diagram for explaining another embodiment (claim 10 ) of the present invention.

FIG. 16 is another embodiment of the present invention (claims 11 and 12 ).
FIG. 3 is a plan view and a cross-sectional view of a main part for explaining the above.

FIG. 17 is a plan view and a cross-sectional view for explaining an example of a conventional detection device.

FIG. 18 is a main part configuration diagram for explaining another example of the conventional detection device.

[Explanation of symbols]

1 ... Substrate, 2, 2 ', 2 "... Cavity, 3 ... Insulating film, 3a ...
Suspension, 4 ... Heat or temperature sensitive member, 4a ... Lead pattern, 5 ... Protective film, 6 ... Bonding wire, 7 ... Lead wire, 8 ... Package case, 9 ... Package cap, 10 ... Pedestal, 11 ... Notch hole , 12 ... Die bond paste, 13 ... Bonding pad, 14 ... Base plate, 15 ... Mesh, 16 ... Base, 20 ... Chip.

Continuation of front page (51) Int.Cl. ⁷ Identification code FI // H01L 31/02 H01L 31/02 B (56) Reference JP-A-5-264564 (JP, A) JP-A-6-137935 (JP , A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G01K 7 / 16,7 / 18,7 / 24 G01F 1/68

Claims (12)

(57) [Claims] 1. A substrate having a cavity and a heat-generating and / or temperature-sensitive member provided on the cavity, and a physical quantity of an object to be measured is detected from a resistance value of the heat-generating and / or temperature-sensitive member. In the temperature-dependent detection device, the cavity is the substrate
A through cavity that penetrates through the
Both are open on one side
Thermal dependence detector. 2. A substrate having a through-hole and at least one end of the through-hole being open, and a heat-generating and / or temperature-sensing member bridged to the open side of the through-hole. A heat dependence detecting device, wherein the substrate is fixed to a package case with the opening as an upper end. 3. A substrate having a through-cavity and having one end of the through-cavity opened, and a heat-generating and / or temperature-sensitive member bridged to the opening side of the through-cavity, the substrate comprising: A thermal dependence detection device, which is horizontal and is fixed to a package case on the side away from the opening. 4. The substrate from the side of the package case to the bridge is made one, and only the bridge is a through cavity, and at least one end of the through cavity is an opening. The heat-dependent detection device according to item 3 . 5. A substrate having a through cavity and a bottomed cavity adjacent to the through cavity and independent of the through cavity, and a heat-generating and / or temperature-sensing member bridged above the bottomed cavity. The heat-dependent detection device is characterized in that the through cavity side is fixed to the base plate. 6. A heat-dependent detection device, wherein the through cavity in claim 5 is a cavity with a bottom. 7. The according to claim 5 or 6, the thermal dependency detecting apparatus characterized by cavities with the heating and / or temperature-sensitive member is a through cavity. 8. The method of claim 5 or 6 7, the heating and / or heat-dependent detection apparatus characterized by reduced one side of the cavity is opened with a temperature-sensitive member. 9. A base member having a U-shaped or a U-shaped opening at its tip, and a heat-generating and / or temperature-sensing member is provided at a portion of the U-shaped or B-shaped opening. A heat-dependent detection device, wherein the detection chip is cross-linked. 10. A detection device having a temperature-sensitive member, a lead pattern for the temperature-sensitive member, and a bonding pad for connecting the lead pattern to an external circuit on a substrate, wherein the bonding device is provided in the vicinity of the bonding pad. A heat-dependent detection device having a hole penetrating a substrate. 11. A thermal dependence detection device comprising a substrate having a cavity, a heat-generating and / or temperature-sensitive member bridged to the upper part of the cavity, and a suspension bridging the temperature-sensitive member, wherein the width of the suspension is Is narrower than the width of the lead pattern for the heat-generating and / or temperature-sensitive member disposed on the suspension. 12. A heat-dependent detection device having a substrate having a cavity and a heat-generating and / or temperature-sensing member bridged above the cavity, wherein a suspension part for supporting the heat-generating and / or temperature-sensitive member is provided. The heat dependency detecting device is characterized in that the part is only a lead pattern for supplying electric power to the heat generating and / or temperature sensitive member.