JP3383743B2 - Wiring board connection structure - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is intended to connect flexible wiring boards (circuit boards) to each other or a flexible wiring board and a hard wiring board (circuit board) by pressure to connect wiring patterns formed on the flexible wiring boards to each other. Wiring board connection structure.

[0002]

2. Description of the Related Art Conventionally, when a plurality of flexible wiring boards are electrically connected to each other, or when a flexible wiring board and a hard wiring board are electrically connected to each other, for example, it is described in Japanese Patent Publication No. 7-46749. There are things that have been done. This configuration is for connecting the flexible wiring board and the hard wiring board, and will be described below with reference to the drawings. FIG. 7 is a perspective view showing a conventional wiring board connection structure.

In FIG. 7, a pedestal 10 is made of an insulating material, and a semicylindrical groove portion 10a is provided on one surface of a rectangular parallelepiped, and an elastic member 20 such as rubber having a cylindrical shape is partially formed in the groove portion 10a. The flexible wiring board 30 having the wiring pattern 30a provided thereon and the hard wiring board 40 having the wiring pattern 40a so that the wiring patterns 30a and 40a face each other. , And the wiring boards 30 and 40 are tightened with a small screw 60 through a pressing plate 50 made of a rectangular rigid insulating material, and are pressed against each other by utilizing the elasticity of the elastic member 20. A method of electrically connecting the wiring patterns 30a and 40a has been adopted without using.

[0004]

However, in the above-mentioned structure, the wiring pattern 3 formed on each of the flexible wiring board 30 and the hard wiring board 40.
The pattern interval of 0a and 40a is, for example, 1.5 to 3 mm
When the distance is relatively wide, the wiring boards 30 and 40 are
Even if the positions of the wiring patterns are slightly displaced from each other, the displacement does not affect the electrical continuity of the wiring patterns 30a and 40a. However, the wiring pattern spacing is, for example, 0.7 m
Machine screws 60 when the density is high and the intervals are narrow, such as m.
When tightened by, problems such as clearance of holes for screwing the machine screws 60 and deviation of arrangement size of holes for positioning the wiring boards 30 and 40 become apparent, and mutual wiring patterns 30a are formed. Then, there is a problem that the connection with 40a cannot be established, and the wiring patterns 30a and 40a which should not be originally connected are connected with each other.

In order to solve this problem, the machine screw 6 is used.
Instead of 0, two positioning projections are provided on the pedestal 10 or the pressing plate 50, and these projections are provided on the wiring boards 30 and 40.
It is conceivable that both wiring boards 30 and 40 are positioned by being inserted into the guide holes provided in the board, and the members from the pedestal 10 to the pressing plate 50 are sandwiched by a clip member or the like to connect the wiring patterns. There is. In this configuration, compared to the configuration shown in FIG. 7, even if the spacing between the wiring patterns is narrow, it is possible to position and connect the wiring patterns, but the spacing between the wiring patterns is 0.3 mm and the pitch is If the width is further reduced to 0.6 mm, the same problem occurs and it becomes difficult to connect the wiring patterns to each other as desired.

This point will be described with reference to FIGS. 8 and 9. FIG. 8 is an enlarged plan view showing a connection portion of the wiring board, and FIG. 9 is a plan view showing a state where the wiring board is inclined with respect to the guide post, and the X axis and the Y axis are shown for the sake of explanation. It is an axis. In the figure, a plurality of wiring patterns 70a are formed on the wiring board 70 along the Y-axis direction, and two guide holes 7 are provided on both sides of the wiring pattern 70a.
0b and 70b are provided. Then, two guide posts (positioning projections) 80, 80 provided on a pedestal or the like (not shown) are respectively inserted into these guide holes,
The wiring board 70 is positioned with respect to the guide posts 80. Similarly, another wiring board (not shown) having a wiring pattern and guide holes formed therein is positioned on the guide posts 80, 80 and is placed on the wiring board 70 in an overlapping manner, and both wiring boards are provided by a clip member (not shown). The wiring patterns are connected to each other.

Here, since the guide posts 80, 80 are inserted into the guide holes 70b, 70b, a clearance is required between the guide posts 80, 80b.
Take a clearance of about 1 mm. Then, due to this clearance, as shown in FIG. 8B, there is a possibility that the wiring board (wiring pattern) is not parallel to the Y axis and is inclined and attached to the pedestal or the like. This inclination is not a serious problem when the distance between the wiring patterns is large and the width W of the connection portion of the wiring board can be widened. However, since the width W becomes narrower as the wiring pattern becomes narrower in pitch, the distance between the guide holes 70b and 70b must be narrowed, and the angle due to the inclination cannot be ignored. In particular, both wiring boards are inclined in different directions. In this case, there is a problem in that there is a high possibility that wiring patterns that should not be originally connected will be connected to each other.

Further, the reason why the wiring pattern has a narrow pitch is that the width W cannot be increased with the downsizing of the product, but since the guide holes 70b and 70b are provided on both sides of the wiring pattern 70a. There is also a problem that the width W cannot be narrowed. The present invention solves at least one of the above-mentioned problems, and an object thereof is to provide a connection structure of a wiring board which can cope with a further narrowing of the pitch of the wiring pattern.

[0009]

First and second wiring boards each having a plurality of connection wiring patterns and at least two guide holes provided apart from each other along the formation direction of the wiring patterns. And a base member having at least two guide posts projecting through the guide hole, and the wiring patterns of the two wiring boards facing each other, together with the base member, the first and second wiring boards. And a pressing member for sandwiching the guide post,
Is to insert the guide hole into and connect the connection portions of the wiring patterns formed on the first and second wiring boards.

Further, the guide holes are provided in the first and second wiring boards so that the respective connection portions of the wiring pattern are located between the at least two guide holes.

Further, the first and second wiring boards are provided with guide marks made of the same material as the wiring pattern, and the guide holes are formed in the guide marks.

Further, the guide mark is larger than the guide hole.

The guide mark is formed together with the wiring pattern, and the guide holes formed in each of the first and second wiring boards are formed by a punching machine having a function of recognizing an image. That is, the guide mark is formed by image recognition.

Further, of the first and second wiring boards, a wiring board arranged on the side of the base member is provided with a temporary fixing hole, and the temporary fixing is inserted through the temporary fixing hole and heat-welded. A post is provided on the base member.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An exploded perspective view of an embodiment of the present invention for explaining a wiring board connection structure in one embodiment of the present invention, and a wiring board connection structure shown in FIG. 2 of FIG. Will be described based on a cross-sectional view in the connected state and a plan view showing a first wiring board connected by the wiring board connection structure shown in FIG.

In FIG. 1, the base member 1 has a wide portion 1
g and the narrow portion 1h, and the vertical dimension (dimension in the Y-axis direction) and the horizontal dimension (width dimension of the wide portion 1g) on the drawing are, for example, 1
It is made of synthetic resin material such as ABS resin having a size of about 5 mm and 15.15 mm. Then, on the center line of the base member 1 in the vertical direction (Y-axis direction), the tip is, for example, a hemispherical shape, a height of about 1.55 mm, and a cylindrical shape having a diameter of 1φ.
Book guide posts 1a and 1a are respectively provided on the wide portion 1g and the narrow portion 1h so as to project, and on both sides of the guide post 1a provided on the narrow portion 1h, the same height is provided. Two cylindrical caulking posts 1b, 1b having a diameter of about 1 mm and a diameter of 1φ are formed so as to protrude in a direction perpendicular to the surface of the base member 1, respectively.

The base member 1 has a narrow portion 1h.
A pair of vertically protruding side walls 1c and 1c at each end in the width direction (X-axis direction), and a bottom face 1d 'between the side walls 1c and 1c. A recess 1d is formed. In the concave portion 1d, a rectangular elastic member 5 made of an elastic material such as silicon rubber or urethane rubber, and an adhesive material 6 such as a double-sided adhesive tape material are used.
Is fixedly attached to the bottom surface 1d 'thereof, and a part of the elastic member 5 is arranged so as to project from the upper surface of the narrow portion 1h (see FIG. 2).

Further, substantially wedge-shaped engaging members 1e, 1e are formed on the outer wall surfaces of the side walls 1c, 1c so as to project outward, and further, on the open end side of the outer wall surfaces. , Circular recesses 1f, 1f are formed, respectively.

The pressing member 2 is made of a metal material such as stainless steel or a molding material such as ABS resin, and has a substantially rectangular shape with vertical and horizontal dimensions of 14.15 mm and 13.2 mm. And, in the flat plate portion 2f of the pressing member 2,
On the center line in the longitudinal direction (Y-axis direction in the drawing) of the guide posts 1a, 1a, which are escapes of the guide posts 1a, 1a, and semi-elliptical notches 2a, 2a 'and short sides thereof, respectively. On both sides in the direction (X-axis direction in the drawing), the flat plate portion 2f
Is provided with a pair of side plates 2b, 2b bent at a right angle and a pair of semi-elliptical notches 2e, 2e adjacent to the side plates 2b, 2b. Also, the pair of side plates 2
2b and 2b, the concave portion 1 of the base member 1
The circular protrusions 2c and 2c that engage with f and 1f are respectively formed, and the engaging members 1e and 1e of the base member 1 that extend to the flat plate portion 2f extend in the middle of the side plates 2b and 2b. Rectangular notches 2d and 2d for cutting are provided.

As shown in FIG. 3, the first wiring board 3 is
For example, it is made of a film-like flexible insulating material made of PET (polyethylene terephthalate), and has a wide portion 3h and a narrow portion 3i. The first wiring board 3
The wide portion 3h and a part of the narrow portion 3i constitute a first circuit wiring portion 3a, and a conductive material such as a silver paste is printed on the upper surface of the first circuit wiring portion 3a. 17 wiring patterns 3b having a width of 0.25 mm, for example, are formed at predetermined intervals. Further, the narrow portion 3i constitutes a connecting portion (connecting portion) 3d having a width of 9 mm, and the connecting portion 3d has 17 wiring patterns 3b having a pattern width of 0.25 mm. , Are derived with high density, and are arranged at intervals of 0.25 mm (that is, at a pitch of 0.5 mm). The wiring patterns 3b, ... Are connected to unillustrated switches (contacts) and circuit components provided on the first wiring board 3. Further, a resist layer (not shown) is formed by printing on the wiring patterns 3b, ...

When the wiring patterns 3b, ... Are formed by printing on the narrow portion 3i and the wide portion 3h, two circular first guide marks are simultaneously formed by silver paste which is the same material. 3f and the second guide mark 3g are printed. The first guide mark 3f is provided at the center in the width direction of the narrow portion 3i and at a position slightly apart from the ends of the wiring patterns 3b, ..., And the second guide mark 3g is Wiring pattern 3b,
Is provided at the center in the width direction of the wide portion 3h in which is formed. The wiring pattern 3b, ...
Are routed so as to avoid the second guide mark 3g.

Furthermore, the first and second guide marks 3f
, 3g are substantially parallel to the wiring patterns 3b, ... Derived to the connecting portion 3d. That is,
The first and second guide marks 3f and 3g are provided apart from each other along the formation direction (lead-out direction) of the wiring patterns 3b, ..., And the connecting portion 3d is located between these guide marks 3f and 3g. is doing. In addition, the guide mark 3
The guide marks 3f and 3g are provided inside the circles f and 3g.
The guide holes 3c and 3c 'which are concentric and have an inner diameter smaller than that are formed. Further, the pair of temporary fixing holes 3e and 3e are symmetrically arranged with the first guide mark 3f interposed therebetween,
It is provided in the width direction of i and has a pair of temporary fixing holes 3e, 3e.
The line connecting the centers of e and the line connecting the centers of the guide holes 3c and 3c 'are orthogonal to each other.

The second wiring board 4 shown in FIG. 1 is made of epoxy resin containing glass, is hard, or is made of polyimide or P.
It is made of a film-like flexible insulating material such as ET and has a wide portion 4h and a narrow portion 4i, like the first wiring board 3. A part of the wide portion 4h and the narrow portion 4i of the second wiring board 4 constitutes a second circuit wiring portion 4a, and the lower surface of the second circuit wiring portion 4a is
For example, 17 wiring patterns 4b having a width of 0.25 mm, which are formed by etching a copper foil which is a conductive material, are formed at predetermined intervals.

The narrow portion 4i, like the first wiring board 3, has a connecting portion (connecting portion) 4 having a width of 9 mm.
d, and in the connecting portion 4d, the 17 wiring patterns 4b having a pattern width of 0.25 mm correspond to the wiring patterns 3b of the first wiring board 3 ... , Are formed in parallel with high density (at a pitch of 0.5 mm) with a spacing of 0.25 mm. The wiring pattern 4b except the connecting portion 4d is covered with a resist layer (not shown) to prevent undesired connection with the wiring pattern 3b.

At the center of the narrow portion 4i in the width direction and slightly away from the end portions of the wiring patterns 4b, ..., A circular first guide mark 4f is formed on the wiring pattern 4b. It is formed by etching copper foil which is the same material at the same time as it is formed. In addition, the circular second guide mark 4g is used for the wiring pattern 4
It is provided at the same time as the wiring pattern 4b at the center in the width direction of the wide portion 4h where b is formed by the same means.

Then, the first and second guide marks 4
The guide marks 4f and 4g are provided inside the circles f and 4g.
The guide holes 4c and 4c 'which are concentric and have an inner diameter smaller than that are formed. In addition, the temporary fixing hole 3 of the first wiring board 3
Similarly to e and 3e, a pair of temporary fixing holes 4e and 4e are provided at symmetrical positions with the first guide mark 4f sandwiched therebetween. It is set to be larger than the temporary fixing holes 3e, 3e of the wiring board 3.

In the wiring board connecting structure having the above-described structure, the connecting portions 3 of the first and second wiring boards 3 and 4 are connected.
The guide holes 3c and 3 of the first and second wiring boards 3 and 4 are provided so that the d and 4d can be brought into contact with each other and arranged without displacement.
When forming c ′, 4c, and 4c ′, the processing accuracy that determines the hole position is important.

Therefore, a method of forming the guide hole and the like will be described in detail with reference to FIGS. 4 to 6 are first to third explanatory diagrams for explaining the manufacturing process of the first wiring board 3. First, as shown in FIG. 4, a conductive material such as silver paste having a width of 300 mm and a long roll-shaped insulating film A is screen-printed with a wiring pattern 3b and a circular guide mark 3f. 3g and multiple sets at the same time,
Dry the conductive material.

After that, the guide marks 3f and 3g are respectively provided with optical mechanisms such as a television camera and the center of the guide marks 3f and 3g by a punching machine (not shown) having a function of allowing image recognition by the optical mechanism. The position is recognized, and the hole is punched based on the recognized position. Then, the first guide hole 3c and the second guide hole 3c 'are formed by processing this hole (see FIG. 5). A punching machine having an image recognition function has precise positioning accuracy. The positioning accuracy for processing this hole is generally about ± 50 μm. Therefore, the positioning accuracy of the two first and second guide holes 3c and 3c 'is processed with high accuracy with respect to the positions of the guide marks 3f and 3g.

Further, the first and second guide holes 3c, 3
Since the diameter of c'is formed smaller than the diameter of the guide marks 3f, 3g, the guide marks 3f, 3g printed and formed on the first wiring board 3 are
It is also displayed after processing the hole 3c '. Therefore,
Normally, the punching machine does not measure the mutual positional deviation amount between the guide marks 3f and 3g and the guide holes 3c and 3c ′ because of the extremely high accuracy as described above, but for some reason, Even if it becomes necessary to measure the amount of positional deviation, the guide holes 3c and 3c ′ are measured by measuring the mutual positional deviation between the displayed guide marks 3f and 3g and the guide holes 3c and 3c ′.
The positioning accuracy of can be confirmed. Further, when the amount of positional deviation is large, for example, 0.1 mm, the presence of positional deviation can be grasped even by visual observation.

Next, as shown in FIG. 6, in order to determine the outer shape of the first wiring board 3, a punching process is performed into a predetermined shape to form a narrow portion 3i and a wide portion 3h, and at the same time. A plurality of the first wiring boards 3 are individually formed simultaneously by punching out a pair of temporary fixing holes 3e, 3e penetrating therethrough. In the example described with reference to FIGS. 4 to 6, the guide marks 3f and 3g are made larger than the guide holes 3c and 3c ′,
Although the guide marks 3f and 3g are left after the holes are processed, the present invention is not limited to this, and the guide marks 3f and 3g have a smaller diameter than the guide holes 3c and 3c ′, and the guide marks 3f and It does not need to leave 3 g.

Further, the guide marks 3f and 3g are formed into two concentric circles of a small diameter and a large diameter, the center position of the circle on the small diameter side is obtained by image recognition, and only the large diameter concentric circles are left to form the guide holes 3c and 3c '. It may be punched out. The method for forming the second wiring board 4 is almost the same as the method for forming the first wiring board 3 except that the wiring pattern 4b and the guide marks 4f and 4g are simultaneously formed by etching the copper foil. Since it is the same, detailed description is omitted.

Further, the guide post 1a of the base member 1,
The diameter of 1a and the diameters of the first and second guide holes 3c and 3c ′ of the first wiring board 3 are almost the same,
The guide posts 1a, 1a can be inserted into the guide holes 3c, 3c 'with little play. Also, similarly,
The first and second guide holes 4c, 4 of the second wiring board 4
The diameter of c'is also provided to be substantially the same as that of the guide posts 1a, 1a and can be inserted into the guide posts 1a, 1a with little play.
In order to prevent the problem that c, 3c ′, 4c, and 4c ′ cannot be inserted, a clearance is provided between the two so that the clearance is required for processing accuracy. On the other hand, caulking post 1
The clearance between b and 1b and the temporary fixing holes 3e and 3e is set to be larger than the clearance between the guide posts 1a and 1a and the guide holes 3c and 3c 'and the guide holes 4c and 4c'. This is for positioning the guide holes 3c, 3
c ', 4c, 4c', and this position is caulking post 1
This is for avoiding the influence of b, 1b and the temporary fixing holes 3e, 3e.

Next, the assembly (connection procedure) of the wiring board connection structure according to the embodiment of the present invention will be described. First, in FIG. 1, the elastic member 5 is fixed to the recess 1d of the base member 1 with an adhesive 6 such as a double-sided adhesive tape. At this time, the elastic member 5 is thick, and one surface of the elastic member 5 projects outward from the recess 1d. Next, the insulating surface (back surface) of the first wiring board 3 is placed so as to come into contact with the elastic member 5 fixed to the recess 1d. At this time, the first wiring board 3 is attached to the guide posts 1a, 1a of the base member 1.
The first and second guide holes 3c and 3c 'are inserted, and at the same time, the temporary fixing holes 3e and 3e are inserted into the pair of caulking posts 1b and 1b. In other words, four posts 1
a, 1a, 1b, 1b have four holes 3c, 3c ', 3e,
3e are respectively inserted.

Next, the tips of the caulking posts 1b, 1b made of synthetic resin of the base member 1 are deformed by heat welding (caulking) so that the first wiring board 3 does not fall off from the base member 1 (see FIG. 2). At this time, the end portion of the narrow portion 3i of the first wiring board 3 is temporarily fixed to the base member 1. The above-described heat welding (caulking) of the caulking posts 1b and 1b is performed by the second wiring board 4 which will be described later.
Place also on the base member 1 and press the caulking posts 1b, 1b
May be inserted into the temporary fixing holes 4e, 4e of the second wiring board 4, and the first and second wiring boards 3 and 4 may be temporarily fixed at the same time.

When temporarily fixing only the first wiring board 3,
The first wiring board 3 and the second wiring board 4 are placed on the base member 1 in different steps, that is, in the first manufacturing factory, and the first wiring board 3 is placed on the base member 1 to manufacture a semi-finished product. Then, with a process time difference, at the second manufacturing plant, the second wiring board 4
In the case where the first wiring board 3 is placed on the first wiring board 3 on the base member 1 so as to be electrically connected, as described above, first, only the first wiring board 3 is placed and then the caulking post 1b, 1b
Will be heat-welded. By this heat caulking, the base member 1 and the first wiring board 3 can be transported without being separated, and the second wiring board 4 can be transferred.
When assembled in, the first wiring board 3 can be prevented from falling off the base member 1, and the assembling workability is improved.

Next, the connecting portion 3d of the first wiring board 3
Then, the second wiring board 4 is placed on the base member 1 so that the connecting portion 4d of the second wiring board 4 comes into contact with the wiring patterns 3b and 4b. At this time, the guide posts 1a and 1a of the base member 1 are inserted into the first and second guide holes 4c and 4c 'of the second wiring board 4 as in the case of the first wiring board 3. In addition, the caulking post 1b,
Since 1b is heat-welded, as shown in FIG. 2, these caulking posts 1b and 1b are temporarily fixed to holes 4e and 4e.
However, if the caulking posts 1b and 1b after heat welding have a high height and may reach the second wiring board 4, these caulking posts 1b and 1b may not be inserted.
The hole diameters of the temporary fixing holes 4e and 4e are set to be relatively large so that they can be inserted into the temporary fixing holes 4e and 4e.

Next, a pair of circular convex portions 2 of the pressing member 2
c, 2c are a pair of circular recesses 1f, 1 of the base member 1.
The pressing member 2 is fitted to the f so as to be pushed in while being expanded against the elasticity of the pressing member 2, and the pressing member 2 is rotatably attached with the engaging portion of the pair of convex and concave portions 2c and 1f as a fulcrum. Then, the pressing member 2 is pressed against the base member 1 side with the convex portions 2c and 2c as fulcrums, and the cutout portions 2d and 2d of the pressing member 2 are engaged with the engaging member 1 of the base member 1.
The assembly is completed by engaging with e and 1e. The step of attaching the pressing member 2 to the base member 1 may be performed first.

As described above, in the assembled wiring board connection structure, the first wiring board 3 and the second wiring board 4 are used.
The wiring patterns 3b and 4b in the connecting portions 3d and 4d of and are pressed and brought into contact with each other by the elastic member 5, so that the corresponding wiring patterns 3b and 4b are electrically connected to each other.

In the embodiment of the present invention described in detail above, the guide posts 1a, 1a, the guide holes 3c, 3c ', and the guide holes 4c, 4c' are generated due to variations in processing accuracy and clearances in design. Due to the slight backlash, the first and second wiring boards 3 and 4 may be attached to the guide posts 1a and 1a while being inclined. Here, the guide holes 3c, 3c 'and 4c, 4c' are provided along the pattern forming direction (extending direction) of the wiring patterns 3b and 4b formed on the first and second wiring boards 3 and 4, respectively. Therefore, the guide holes 3c (4c) and the guide holes 3c ′ are provided regardless of the narrowing of the wiring pattern pitch.
Since the distance from (4c ′) can be set large, the inclination angle due to the play can be suppressed to be small, and the positional deviation of the wiring patterns 3b and 4b in the connecting portions 3d and 4d from the reference position can be reduced. A desired connection can be achieved even if the pitch of the wiring patterns 3b and 4b is narrow, for example, 0.5 mm.

Further, both the first wiring board 3 and the second wiring board 4 have guide holes 3c (4c) and guide holes 3c '(4
c ') and the substantially central portion thereof is connected to the connecting portion 3d.
Since it is set to (4d), even if the wiring boards 3 and 4 are inclined with respect to the guide posts 1a and 1a, the positional deviation due to the inclination is offset to some extent, and therefore the wiring patterns 3b and 4b which should not be originally connected should be provided. The problem of electrical continuity between and is less likely to occur. Further, the wiring pattern 3b (4b) located farther from the line connecting the guide holes 3c (4c) and the guide holes 3c '(4c') has a larger positional deviation due to the inclination, but the guide holes 3c, 3c '( 4c, 4
c ') is the width direction of the wiring board 3 (4) (X-axis direction in FIG. 1)
Since it is located at the center of the guide holes 3c, 3c '(4c, 4
Even in the wiring pattern 3b (4b) farthest from c '), the amount of positional deviation can be suppressed.

The guide holes 3c and 4c and the temporary fixing hole 3 are also provided.
e and 4e at positions where the wiring patterns 3b and 4b do not exist,
That is, since it is provided in the extension of the first and second circuit wiring portions 3a, 4a, these holes 3c, 4c, 3e, 4e.
To connect parts 3d and 4d of the first and second wiring boards
The width dimension at does not increase. In the above-described embodiment of the present invention, the elastic member 5 is arranged on the base member 1 and the back surface of the first wiring board 3 (the surface on which the wiring pattern is not formed) is pressed. The present invention is not limited to this, and the elastic member 5 may be attached to the pressing member 2 so that pressing force is applied from the back surface of the second wiring board, and the elastic members are respectively provided to the base member 1 and the pressing member 2. It may be provided. That is, by providing the elastic member on at least one of the base member 1 and the pressing member 2, contact between the wiring patterns 3b and 4b can be stably achieved, and when one of the wiring boards is a hard board. The elastic member is preferably located on the back surface of the other flexible wiring board. Further, as the elastic member 5, instead of the rubber material described above, an elastic metal plate having a spring property such as phosphor bronze may be used. Further, a semi-cylindrical protrusion is integrally formed at the position where the concave portion 1d of the base member 1 is formed and brought into contact with the first wiring board 3, and the slight elastic force of the flexible wiring board 3 itself is used. You can also

Further, in the present embodiment, in both the first and second wiring boards 3 and 4, the line connecting the guide hole 3c (4c) and the guide hole 3c '(4c') and the connecting portion 3d.
Although the wiring pattern 3b (4b) in (4d) is made substantially parallel, the present invention is not limited to this, and there may be an angle of several tens of degrees between them. In other words, the line connecting the guide holes is generally the wiring pattern 3b.
It suffices to follow the pattern forming direction (deriving direction) of (4b).

[0044]

According to the present invention, at least two guide posts projecting from the base member are inserted into at least two guide holes that are spaced apart from each other along the wiring pattern forming direction of the first and second wiring boards. Therefore, regardless of the narrowing of the pitch of the wiring pattern, the distance between at least two guide holes can be widened, and even if the first and second wiring boards are attached to the base member at an inclination, It is possible to suppress the positional deviation due to the inclination, so that even if the pitch of the wiring pattern is narrowed, undesired connection hardly occurs. Moreover, since it is not necessary to provide guide holes on both sides of the wiring pattern, the width of the wiring board can be reduced. Further, even if there is a slight positional deviation in the guide hole, the amount of positional deviation is not accumulated in the width direction of the wiring pattern (wiring board), so the influence of the position deviation in the width direction of the wiring pattern can be reduced. I can.

Further, since the connection portion of the wiring pattern is positioned between at least two guide holes, even if the first and second wiring boards are attached with an inclination with respect to the base member, the connection due to the inclination. It is possible to suppress the amount of positional deviation in the portion, and it is possible to improve the positioning accuracy of the connecting portion by the at least two guide holes and the at least two guide posts.

Guide marks made of the same material as the wiring pattern are provided on the first and second wiring boards. Therefore, the guide mark can be provided at the same time when the wiring pattern is formed, and the positions of the wiring pattern and the guide mark can be formed extremely accurately. Since the guide hole is formed based on the guide mark, the guide hole can be processed with good positional accuracy,
Even when the wiring patterns have a narrow pitch (0.6 mm pitch) such that the wiring patterns have an interval of 0.3 mm and the width of the wiring patterns is 0.3 mm, the wiring patterns can be contacted and conducted even more. It is possible to provide a wiring board connection structure in which no positional deviation occurs.

Further, since the guide mark is provided larger than the guide hole, when the guide hole is provided in the guide mark, the guide mark mark is displayed on the wiring board. By measuring the mutual positions of the guide mark and the guide hole as necessary, the positional deviation of the guide hole can be confirmed. In addition, if the positional deviation between the guide mark and the guide hole becomes large for some reason, the positional deviation can be known even by silent observation.

Further, the guide hole formed in the wiring board is
Since the punching machine having a function of recognizing an image recognizes and forms the guide mark formed at the same time as the wiring pattern, it is possible to process the guide hole with extremely high positioning accuracy. Therefore, compared to the conventional case, the wiring boards having a wiring pattern having a significantly narrow pitch can be pressed and brought into conduction without using solder.

Further, the wiring board on the side of the base member is provided with a temporary fixing hole, and the temporary fixing post made of synthetic resin provided on the base member is inserted into the temporary fixing hole and heat-welded. This allows the wiring board on the base member side to be temporarily fixed to the base member, preventing the wiring board on the base member side from falling off the base member when the wiring board on the pressing member side is installed in a different factory (separate process). Therefore, the assembling workability can be improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a wiring board connection structure according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a wiring board connection structure according to an embodiment of the present invention.

FIG. 3 is a plan view showing a first wiring board according to an embodiment of the present invention.

FIG. 4 is a first explanatory diagram for explaining a manufacturing process of the first wiring board according to the embodiment of the present invention.

5 is a second explanatory diagram for explaining the next manufacturing step of the first wiring board shown in FIG. 4. FIG.

FIG. 6 is a third explanatory diagram for explaining the next manufacturing step of the first wiring board shown in FIG. 5.

FIG. 7 is a perspective view showing a conventional wiring board connection structure.

FIG. 8 is an enlarged plan view showing a connection portion of a conventional wiring board.

FIG. 9 is a plan view showing an enlarged connection portion of a conventional wiring board in a state of being inclined with respect to a guide post.

[Explanation of symbols]

1 Base member 1a Guide post 1b Caulking post (temporary fastening post) 2 Holding member 3 First wiring board 3a First circuit wiring section 3b, 4b wiring pattern (wiring pattern for connection) 3c, 3c ', 4c, 4c' guide holes 3d, 4d Connect part (connecting part) 3e, 4e Temporary fixing hole 3f, 4f First guide mark 3g, 4g Second guide mark 3h, 4h Wide part 3i, 4i Narrow part 4 Second wiring board 4a Second circuit wiring section

Claims (6)

(57) [Claims] 1. A first wiring board and a second wiring board each having a plurality of wiring patterns for connection and at least two guide holes provided apart from each other along a direction in which the wiring patterns are formed, and the guide. A pressing member that sandwiches the first and second wiring boards together with the base member in a state where the base member having at least two guide posts through which the holes pass through and the wiring patterns of the two wiring boards face each other. And the guide hole in the guide post.
And connecting the connecting portions of the wiring patterns formed on the first and second wiring boards to each other. 2. The respective connection portions of the wiring pattern are located between the at least two guide holes,
The wiring board connection structure according to claim 1, wherein the guide hole is provided in the first and second wiring boards. 3. The first and second wiring boards are provided with guide marks made of the same material as the wiring pattern,
The wiring board connecting structure according to claim 1 or 2, wherein the guide hole is formed in the guide mark. 4. The wiring board connecting structure according to claim 3, wherein the guide mark is larger than the guide hole. 5. The guide mark is formed together with the wiring pattern, and the guide holes formed in each of the first and second wiring boards are formed by a punching machine having a function of image recognition. The wiring board connection structure according to claim 3 or 4, wherein the guide mark is formed by image recognition. 6. The wiring board, which is arranged on the side of the base member, of the first and second wiring boards is provided with a temporary fixing hole, and the temporary fixing is inserted through the temporary fixing hole and heat-welded. The wiring board connecting structure according to claim 1, wherein the base member is provided with a post.