JPH10106695A - Wiring board connection structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board connection structure capable of ensuring stable connection, without causing the shift of wiring patterns when high-density and narrow-space flexible wiring boards connect each other for conduction. SOLUTION: A wiring board connection structure comprises plural wiring patterns 3b, 4b, the first and second wiring boards 3, 4, on which respective two guide holes 3c, 3c' and 4c, 4c' separating each other along the wiring patterns 3b, 4b are provided, a base member 1 on which two guide posts 1a are protruded and a hold-down member 2 mounted on the base member 1 via the first wiring board 3 and the second wiring board 4 to fit the guide holes 3c, 4c into the guide posts 1a for placing the first wiring board 3 and the second wiring board 4 on the base member 1, so that the wiring patterns on the first and second wiring boards 3, 4 are connected together.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to press-connecting flexible wiring boards (circuit boards) or a flexible wiring board and a hard wiring board (circuit board) to connect wiring patterns formed on each other. And a wiring board connection structure.

[0002]

2. Description of the Related Art Conventionally, when a plurality of flexible wiring boards are electrically connected to each other, or when a flexible wiring board and a hard wiring board are electrically connected, for example, Japanese Patent Publication No. 7-46749 discloses the technique. There are things that are. This configuration is for connecting the flexible wiring board and the hard wiring board, and will be described below with reference to the drawings. FIG. 7 is a perspective view showing a conventional wiring board connection structure.

In FIG. 7, a pedestal 10 is made of an insulating material. A semi-cylindrical groove 10a is provided on one surface of a rectangular parallelepiped, and a cylindrical elastic member 20 such as rubber is partially provided in the groove 10a. Are inserted and adhered so as to protrude outside, and the flexible wiring board 30 provided with the wiring pattern 30a thereon and the hard wiring board 40 provided with the wiring pattern 40a are arranged so that the two wiring patterns 30a and 40a face each other. And the wiring boards 30 and 40 are tightened with small screws 60 via a holding plate 50 made of a highly rigid rectangular insulating material. The method of making the wiring patterns 30a and 40a conductive without using the method has been adopted.

[0004]

However, in the above configuration, the wiring pattern 3 formed on each of the flexible wiring board 30 and the hard wiring board 40 is not required.
The pattern interval of 0a, 40a is, for example, 1.5 to 3 mm
When the interval is relatively wide, the wiring boards 30, 40
Even if the mutual arrangement was slightly shifted, this shift did not affect the electrical continuity of the wiring patterns 30a and 40a. However, the interval between the wiring patterns is 0.7 m, for example.
m, small screws 60
When tightening, the problems such as the clearance of the holes for screwing the small screws 60 and the disposition of the holes for positioning the wiring boards 30 and 40 become apparent, and the mutual wiring patterns 30a And 40a cannot be connected, and the wiring patterns 30a and 40a that should not be connected are connected.

To solve this problem, the small screw 6
0, two positioning projections are provided on the pedestal 10 or the holding plate 50, and these projections are provided on the wiring boards 30, 40.
A configuration is conceivable in which the wiring patterns 30 and 40 are positioned by inserting the wiring patterns into the guide holes provided in the base plate, and the wiring pattern is connected by sandwiching the member from the pedestal 10 to the holding plate 50 with a clip member or the like. I have. In this configuration, positioning and connection between the wiring patterns can be performed even when the spacing between the wiring patterns is narrower than the configuration shown in FIG. 7, but the spacing between the wiring patterns is, for example, 0.3 mm and the pitch is smaller. When the width is further reduced to 0.6 mm, the same problem occurs, and it becomes difficult to make a desired connection between the wiring patterns.

This point will be described with reference to FIGS. FIG. 8 is an enlarged plan view showing a connection portion of the wiring board, and FIG. 9 is a plan view showing a state in which the wiring board is inclined with respect to the guide post. The X axis and the Y axis are illustrated for explanation. It is an axis. In the figure, a plurality of wiring patterns 70a are formed in a wiring board 70 along the Y-axis direction, and two guide holes 7 are provided on both sides of the wiring pattern 70a.
0b and 70b are provided. Then, two guide posts (positioning projections) 80, 80 provided on a pedestal (not shown) are inserted through these guide holes, respectively.
The wiring board 70 is positioned with respect to the guide posts 80,80. Similarly, another wiring board (not shown) in which a wiring pattern and a guide hole are formed is positioned on the guide posts 80, 80, is placed on the wiring board 70, and is placed on the wiring board 70 by clip members (not shown). Are connected to each other.

Here, since the guide posts 80, 80 are inserted into the guide holes 70b, a clearance is required between the guide posts 80, 80, and for example, a value of 0.
Leave a clearance of about 1 mm. Then, due to the clearance, as shown in FIG. 8B, there is a possibility that the wiring board (wiring pattern) is not parallel to the Y axis and is inclined and attached to the pedestal or the like. This inclination is not so problematic if the distance between the wiring patterns is large and the width W of the connection portion of the wiring board can be widened. However, since the width W becomes narrower as the wiring pattern becomes narrower, the interval between the guide holes 70b and 70b must be narrowed, and the angle due to the inclination cannot be ignored. In particular, both wiring boards are inclined in different directions. In such a case, there is a problem that the possibility that wiring patterns that should not be connected to each other are connected increases.

The reason why the wiring patterns are narrowed in pitch is that the width W cannot be increased with the miniaturization of the product. However, since the guide holes 70b, 70b are provided on both sides of the wiring pattern 70a. Also, there is a problem that the width W cannot be reduced. An object of the present invention is to solve at least one of the above-mentioned problems, and an object of the present invention is to provide a connection structure of a wiring board that can cope with a further narrow pitch of a wiring pattern.

[0009]

SUMMARY OF THE INVENTION First and second wiring boards each having a plurality of connection wiring patterns and at least two guide holes provided apart from each other in a direction in which the wiring patterns are formed. And a base member on which at least two guide posts for projecting the guide holes are inserted, and the first and second wiring boards together with the base member in a state where the wiring patterns of the two wiring boards face each other. And a connecting member for holding the wiring pattern formed on the first and second wiring boards.

Further, the guide holes are provided in the first and second wiring boards such that respective connection portions of the wiring pattern are located between the at least two guide holes.

Further, the first and second wiring boards are provided with guide marks made of the same material as the wiring pattern, and the guide holes are formed in the guide marks.

Further, the guide mark is provided to be larger than the guide hole.

The guide mark is formed together with the wiring pattern, and guide holes formed in each of the first and second wiring boards are formed by a punching machine having a function of recognizing an image. The guide mark is formed by image recognition.

Further, a temporary fixing hole is provided in the wiring board of the first and second wiring boards which is arranged on the base member side, and the temporary fixing hole is inserted through the temporary fixing hole and thermally welded. A post is provided on the base member.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an exploded perspective view for explaining a wiring board connection structure according to one embodiment of the present invention, and FIG. 2 is a wiring board connection structure shown in FIG. 3 and a plan view showing a first wiring board connected by the wiring board connection structure shown in FIG. 1 in FIG.

In FIG. 1, a base member 1 has a wide portion 1
g and the narrow portion 1h, and the vertical dimension (the Y-axis direction dimension) and the horizontal dimension (the width dimension of the wide section 1g) in the drawing are, for example, 1
It is made of a synthetic resin material such as an ABS resin having a size of about 5 mm and 15.15 mm. The tip of the base member 1 is, for example, a hemispherical cylinder having a height of about 1.55 mm and a diameter of 1φ, which is on the center line of the base member 1 in the vertical direction (Y-axis direction).
The guide posts 1a, 1a are provided to project from the wide portion 1g and the narrow portion 1h, respectively, and the height of the same shape is provided on both sides of the guide post 1a provided in the narrow portion 1h. Two cylindrical caulking posts 1b, 1b having a diameter of about 1 mm and a diameter of 1φ are formed so as to protrude in a direction perpendicular to the surface of the base member 1, respectively.

The base member 1 has a narrow portion 1h.
Each of the end portions in the width direction (X-axis direction) has a pair of vertically protruding side walls 1c, 1c and a rectangular shape long in the X-axis direction having a bottom surface 1d 'at a portion sandwiched between the side walls 1c, 1c. A recess 1d is formed. In the concave portion 1d, a rectangular elastic member 5 made of an elastic material such as silicon rubber or urethane rubber is attached with an adhesive 6 such as a double-sided adhesive tape.
The elastic member 5 is fixedly attached to the bottom surface 1d ', and a part of the elastic member 5 is disposed so as to protrude from the upper surface of the narrow portion 1h (see FIG. 2).

On the outer wall surfaces of the side walls 1c, 1c, engaging members 1e, 1e each having a substantially wedge shape are formed so as to protrude outward. , Circular recesses 1f, 1f are formed respectively.

The holding member 2 is made of a metal material such as stainless steel or a molding material such as ABS resin, and has a substantially rectangular shape having vertical and horizontal dimensions of 14.15 mm and 13.2 mm. And, in the flat plate portion 2f of the pressing member 2,
Semi-elliptical cutouts 2a, 2a 'which are located on the center line in the longitudinal direction (Y-axis direction in the drawing) and which allow the guide posts 1a, 1a to escape therefrom, 2f on both sides in the direction (X-axis direction in the drawing)
A pair of side plates 2b, 2b bent at a right angle from, and a pair of semi-elliptical notches 2e, 2e adjacent to the side plates 2b, 2b are provided. Also, a pair of side plates 2
b, a concave portion 1 of the base member 1
f, 1f are respectively formed with circular convex portions 2c, 2c, and the intermediate portions of the side plates 2b, 2b are engaged with the engaging members 1e, 1e of the base member 1 extending to the flat plate portion 2f. Rectangular notches 2d and 2d for providing the same.

As shown in FIG. 3, the first wiring board 3
For example, it is made of a flexible insulating material in the form of a film made of PET (polyethylene terephthalate) and has a wide portion 3h and a narrow portion 3i. The first wiring board 3
The wide portion 3h and a part of the narrow portion 3i constitute a first circuit wiring portion 3a, and a conductive material such as silver paste is printed on the upper surface of the first circuit wiring portion 3a. Thus, for example, 17 wiring patterns 3b having a width of 0.25 mm are formed at predetermined intervals. The narrow portion 3i forms a connecting portion (connecting portion) 3d having a width of 9 mm, and the connecting portion 3d includes the 17 wiring patterns 3b having a pattern width of 0.25 mm. , And are arranged with a spacing of 0.25 mm (that is, at a pitch of 0.5 mm). The wiring patterns 3b are connected to switches (contacts) and circuit components (not shown) provided on the first wiring board 3. A resist layer (not shown) is printed and formed on the wiring patterns 3b, except for the connecting portions 3d, as necessary.

When the wiring patterns 3b,... Are printed and formed on the narrow portions 3i and the wide portions 3h, two circular first guide marks are formed at the same time using silver paste, which is the same material. 3f and a second guide mark 3g are printed. The first guide mark 3f is provided at the center of the narrow portion 3i in the width direction and slightly away from the end of the wiring pattern 3b,. Wiring pattern 3b,
Is provided at the center of the wide portion 3h in the width direction. The wiring pattern 3b,.
Are routed so as to avoid the second guide mark 3g.

Still further, the first and second guide marks 3f
And 3g are substantially parallel to the wiring patterns 3b,... Led to the connecting portion 3d. That is,
The first and second guide marks 3f, 3g are provided apart from each other along the forming direction (leading direction) of the wiring patterns 3b,..., And the connecting portion 3d is located between the guide marks 3f, 3g. doing. The guide mark 3
f, 3g, the guide marks 3f, 3g
The guide holes 3c and 3c ', which are concentric with each other and have smaller inner diameters, are formed respectively. Further, symmetrically with the first guide mark 3f interposed therebetween, the pair of temporary fixing holes 3e, 3e
i, a pair of temporary fixing holes 3e, 3e
The line connecting the center of e and the line connecting the centers of the guide holes 3c and 3c 'are orthogonal to each other.

The second wiring board 4 shown in FIG. 1 is made of hard or polyimide or P
It is made of a film-like flexible insulating material made of ET or the like, and has a wide portion 4h and a narrow portion 4i, like the first wiring board 3. The wide part 4h and the part of the narrow part 4i of the second wiring board 4 constitute a second circuit wiring part 4a, and the lower surface of the second circuit wiring part 4a has
Seventeen wiring patterns 4b each having a width of 0.25 mm, for example, formed by etching a copper foil as a conductive material are formed at predetermined intervals.

The narrow portion 4i is, like the first wiring board 3, a connecting portion (connecting portion) 4 having a width of 9 mm.
d in the connecting portion 4d, for example, the 17 wiring patterns 4b having a pattern width of 0.25 mm so as to correspond to the wiring patterns 3b of the first wiring board 3,. Are formed at a high density (0.5 mm pitch) in parallel at intervals of 0.25 mm. Note that the wiring pattern 4b excluding the connecting portion 4d is covered with a resist layer (not shown), thereby preventing undesired connection with the wiring pattern 3b.

At the center of the narrow portion 4i in the width direction and at a position slightly away from the ends of the wiring patterns 4b,. It is formed by etching a copper foil of the same material at the same time as forming. In addition, the circular second guide mark 4g is
At the center in the width direction of the wide portion 4h where b is formed, it is provided simultaneously with the wiring pattern 4b by the same means.

The first and second guide marks 4
f, 4g, the guide marks 4f, 4g
The guide holes 4c and 4c 'are formed concentrically with each other and have a smaller inner diameter. Further, the temporary fixing holes 3 of the first wiring board 3 are provided.
Similar to e and 3e, a pair of temporary fixing holes 4e and 4e are provided at positions symmetrical with respect to the first guide mark 4f, and the inner diameter of these temporary fixing holes 4e and 4e is the first. It is set larger than the temporary fixing holes 3e and 3e of the wiring board 3.

In the wiring board connection structure having the above-described structure, the connection portions 3 of the first and second wiring boards 3 and 4 are provided.
In order for the first and second wiring boards 3 and 4 to be in contact with each other without any displacement, the guide holes 3 c and 3
In forming c ′, 4c, and 4c ′, processing accuracy for determining the hole position is important.

Therefore, a method of forming the guide holes will be described in detail with reference to FIGS. 4 to 6 are first to third explanatory views for explaining the manufacturing process of the first wiring board 3. First, as shown in FIG. 4, for example, a conductive material such as silver paste is screen-printed on one surface of a long roll-shaped insulating film A having a width of 300 mm and a wiring pattern 3b and a circular guide mark 3f by screen printing. , 3g at the same time,
Dry the conductive material.

Thereafter, the guide marks 3f, 3g are centered by a punching machine (not shown) having an optical mechanism such as a television camera and having a function of recognizing an image by the optical mechanism. The position is recognized, and a hole is punched based on the recognized position. Then, the first guide hole 3c and the second guide hole 3c 'are formed by processing the holes (see FIG. 5). A punching machine having an image recognition function has precise positioning accuracy. The positioning accuracy of this hole processing is generally about ± 50 μm. Therefore, the positioning accuracy of the two first and second guide holes 3c and 3c 'is extremely high with respect to the positions of the guide marks 3f and 3g.

The first and second guide holes 3c, 3c
Since the diameter of c ′ is formed smaller than the diameter of the guide marks 3f and 3g, the guide marks 3f and 3g printed on the first wiring board 3 are formed by the guide holes 3c and 3c.
It is also displayed after processing the hole 3c '. Therefore,
Usually, since the punching machine has extremely high precision as described above, the punching machine does not measure the mutual displacement between the guide marks 3f, 3g and the guide holes 3c, 3c ', but for some reason. Even if it is necessary to measure the amount of displacement, the guide holes 3c, 3c 'are measured by measuring the mutual displacement of the center between the displayed guide marks 3f, 3g and the guide holes 3c, 3c'.
Can be checked for positioning accuracy. In addition, when the displacement amount is large, for example, 0.1 mm, the presence of the displacement can be grasped even by silent observation.

Next, as shown in FIG. 6, in order to determine the outer shape of the first wiring board 3, a punching process is performed into a predetermined shape to form a narrow portion 3i and a wide portion 3h. A plurality of first wiring boards 3 are simultaneously formed individually by punching a pair of temporary fixing holes 3e, 3e penetrating therethrough. In the example described with reference to FIGS. 4 to 6, the guide marks 3f and 3g are made larger than the guide holes 3c and 3c ',
The guide marks 3f and 3g are left after the holes are formed. However, the present invention is not limited to this. The guide marks 3f and 3g are made smaller in diameter than the guide holes 3c and 3c '. What does not leave 3 g may be used.

Further, the guide marks 3f and 3g are formed into two concentric circles of a small diameter and a large diameter, and the center position of the circle on the small diameter side is obtained by image recognition, and the guide holes 3c and 3c 'are left while leaving only the large diameter concentric circles. You may make it punch out. The method of forming the second wiring board 4 is also substantially the same as the method of forming the first wiring board 3 except that the wiring pattern 4b and the guide marks 4f and 4g are formed by simultaneously etching the copper foil. The details are omitted because they are the same.

Further, the guide posts 1a of the base member 1,
The diameter of 1a and the diameter of the first and second guide holes 3c, 3c 'of the first wiring board 3 are almost the same,
The guide posts 1a, 1a can be inserted into the guide holes 3c, 3c 'with almost no play. Similarly,
The first and second guide holes 4c and 4c of the second wiring board 4
The diameter of c ′ is substantially the same as the diameter of the guide posts 1a and 1a, and can be inserted through the guide posts 1a and 1a with little play.
In order to prevent a problem that c, 3c ', 4c, and 4c' cannot be inserted, a clearance required between them is provided to the extent required for processing accuracy. On the other hand, caulking post 1
The clearance between b, 1b and the temporary fixing holes 3e, 3e is set larger than the clearance between the guide posts 1a, 1a and the guide holes 3c, 3c 'and the guide holes 4c, 4c'. This is because the guide holes 3c, 3
c ', 4c, 4c', and this position is
This is to prevent the influence of b and 1b and the temporary fixing holes 3e and 3e.

Next, the assembly (connection procedure) of the wiring board connection structure in one embodiment of the present invention will be described. First, in FIG. 1, an elastic member 5 is fixed to a concave portion 1d of a base member 1 with an adhesive 6 such as a double-sided adhesive tape. At this time, the thickness of the elastic member 5 is large, and one surface of the elastic member 5 protrudes outward from the concave portion 1d. Next, the insulating surface (back surface) of the first wiring board 3 is placed so as to be in contact with the elastic member 5 fixed to the concave portion 1d. At this time, the first wiring board 3 is attached to the guide posts 1a and 1a of the base member 1.
The first and second guide holes 3c, 3c 'are inserted, and simultaneously, the temporary fixing holes 3e, 3e are inserted into the pair of caulking posts 1b, 1b. That is, four posts 1
a, 1a, 1b, 1b have four holes 3c, 3c ', 3e,
3e are respectively inserted.

Next, the tips of the caulking posts 1b and 1b made of synthetic resin of the base member 1 are deformed by heat welding (caulking) so that the first wiring board 3 does not fall off the base member 1 (FIG. 2). At this time, the end of the narrow portion 3i of the first wiring board 3 is temporarily fixed to the base member 1. The above-mentioned heat welding (caulking) of the tips of the caulking posts 1b and 1b is performed by a second wiring board 4 described later.
Are also placed on the base member 1, and the caulking posts 1b, 1b
May be temporarily fixed to the first and second wiring boards 3 and 4 at the same time after they are inserted into the temporary fixing holes 4e and 4e of the second wiring board 4.

When temporarily fixing only the first wiring board 3,
The first wiring board 3 and the second wiring board 4 are placed on the base member 1 in different steps, for example, in a first manufacturing plant, and a semi-finished product is manufactured first. Then, after a process time difference, the second wiring board 4
Is placed on the first wiring board 3 on the base member 1 and electrical conduction is performed, as described above, first, only the first wiring board 3 is placed, and then the caulking post 1b, 1b
Will be thermally welded. By this heat caulking, the base member 1 and the first wiring board 3 can be transported without being separated, and the second wiring board 4 can be moved to the base member 1.
When the first wiring board 3 is assembled, the first wiring board 3 can be prevented from falling off from the base member 1, and the assembling workability is improved.

Next, the connection portion 3d of the first wiring board 3
Then, the second wiring board 4 is placed on the base member 1 such that the connecting portion 4d of the second wiring board 4 comes into contact with the wiring patterns 3b and 4b. At this time, the guide posts 1a, 1a of the base member 1 are inserted into the first and second guide holes 4c, 4c 'of the second wiring board 4, as in the case of the first wiring board 3. In addition, caulking post 1b,
As shown in FIG. 2, these caulking posts 1b and 1b are temporarily fixed holes 4e and 4e.
However, if the caulked posts 1b and 1b after the heat welding are high and may reach the second wiring board 4, these caulking posts 1b and 1b
The hole diameter of the temporary fixing holes 4e, 4e is set to be large so that can be inserted into the temporary fixing holes 4e, 4e.

Next, a pair of circular convex portions 2 of the pressing member 2
c, 2c, a pair of circular recesses 1f, 1
f, the pressing member 2 is fitted so as to be pushed in while being spread against the elasticity of the pressing member 2, and the pressing member 2 is rotatably mounted around the engaging portion of the pair of convex and concave portions 2c, 1f as a fulcrum. The pressing member 2 is pressed against the base member 1 with the protrusions 2c and 2c as fulcrums, and the notches 2d and 2d of the pressing member 2 are connected to the engaging members 1 of the base member 1.
The assembly is completed by engaging with e and 1e. The step of attaching the holding member 2 to the base member 1 may be performed first.

As described above, in the assembled wiring board connection structure, the first wiring board 3 and the second wiring board 4
The wiring patterns 3b and 4b in the connection portions 3d and 4d are pressed by the elastic member 5 and come into contact with each other, so that the corresponding wiring patterns 3b and 4b are electrically connected to each other.

In the embodiment of the present invention described in detail above, the guide posts 1a, 1a, the guide holes 3c, 3c ', and the guide holes 4c, 4c', which are generated due to variations in processing accuracy and design clearances. The first and second wiring boards 3 and 4 may be attached to the guide posts 1a and 1a at an angle due to slight backlash. Here, the guide holes 3c, 3c 'and 4c, 4c' are provided along the pattern forming direction (extending direction) of the wiring patterns 3b and 4b formed on the first and second wiring boards 3, 4, respectively. Therefore, regardless of the narrow pitch of the wiring pattern, the guide hole 3c (4c) and the guide hole 3c '
(4c '), the inclination angle due to the play can be reduced, and the positional deviation of the wiring patterns 3b, 4b from the reference positions in the connection portions 3d, 4d becomes smaller. Even if the pitch between the wiring patterns 3b and 4b is reduced to, for example, 0.5 mm, desired connection can be achieved.

Further, both the first wiring board 3 and the second wiring board 4 have guide holes 3c (4c) and 3c '(4c).
c ′), and a substantially central portion thereof is a connect portion 3d.
(4d), even if the wiring boards 3 and 4 are tilted with respect to the guide posts 1a and 1a, the positional shift due to the tilt is offset somewhat, so that the wiring patterns 3b and 4b which should not be connected originally. Is less likely to occur. Further, as the wiring pattern 3b (4b) located farther from the line connecting the guide holes 3c (4c) and the guide holes 3c '(4c') has a greater positional deviation due to the inclination, the guide holes 3c, 3c '( 4c, 4
c ′) is the width direction of the wiring board 3 (4) (the X-axis direction in FIG. 1).
, The guide holes 3c, 3c '(4c, 4
Even in the wiring pattern 3b (4b) farthest from c ′), the positional deviation amount can be suppressed.

The guide holes 3c, 4c and the temporary fixing holes 3
e, 4e are positions where the wiring patterns 3b, 4b do not exist,
That is, since the holes 3c, 4c, 3e, and 4e are provided at the extensions of the first and second circuit wiring portions 3a and 4a.
Connecting portions 3d, 4d of the first and second wiring boards
Does not increase the width dimension. In the above-described embodiment of the present invention, the elastic member 5 is disposed on the base member 1 so as to press the back surface (the surface on which the wiring pattern is not formed) of the first wiring board 3. However, the present invention is not limited to this. The elastic member 5 may be attached to the pressing member 2 so that a pressing force is applied from the back surface of the second wiring board, and the elastic members are respectively applied to both the base member 1 and the pressing member 2. It may be provided. That is, by providing the elastic member on at least one of the base member 1 and the pressing member 2, the contact between the wiring patterns 3b and 4b can be stably achieved, and when one of the wiring substrates is a hard substrate. Preferably, the elastic member is located on the back surface of the other flexible wiring board. Further, instead of the above-described rubber material, an elastic metal plate having a spring property such as phosphor bronze may be used as the elastic member 5. Further, a semi-cylindrical projection is integrally formed at the position where the concave portion 1d of the base member 1 is formed and is brought into contact with the first wiring board 3, and utilizes the slight elastic force of the flexible wiring board 3 itself. You can also.

In this embodiment, both the first and second wiring boards 3 and 4 are connected to a line connecting the guide hole 3c (4c) and the guide hole 3c '(4c') with the connecting portion 3d.
Although the wiring pattern 3b (4b) in (4d) is made substantially parallel, the present invention is not limited to this, and there may be an angle of several tens of degrees between the two. In other words, the line connecting the guide holes is substantially the wiring pattern 3b.
What is necessary is just to follow the pattern forming direction (leading direction) of (4b).

[0044]

According to the present invention, at least two guide posts projecting from the base member are inserted into at least two guide holes provided apart from each other in the direction in which the wiring patterns of the first and second wiring boards are formed. Since the distance between the at least two guide holes can be widened regardless of the narrow pitch of the wiring pattern, even if the first and second wiring boards are inclined and attached to the base member, Unevenness due to the inclination can be suppressed, and therefore, even if the pitch of the wiring pattern becomes narrow, undesired connection hardly occurs. Further, since it is not necessary to provide guide holes on both sides of the wiring pattern, the width of the wiring substrate can be reduced. Furthermore, even if there is a slight positional deviation in the guide hole, the positional deviation amount is not accumulated in the width direction of the wiring pattern (wiring board), so that the influence of the positional deviation in the width direction of the wiring pattern can be reduced. I can do it.

Further, since the connection portion of the wiring pattern is located between the at least two guide holes, even if the first and second wiring boards are attached to the base member while being inclined with respect to the base member, the connection due to the inclination is provided. It is possible to suppress the amount of positional deviation in the portion, and it is possible to increase the positioning accuracy of the connecting portion by at least two guide holes and at least two guide posts.

Further, guide marks made of the same material as the wiring pattern are provided on the first and second wiring boards. Therefore, the guide mark can be provided at the same time when the wiring pattern is formed, and the positions of the wiring pattern and the guide mark can be formed with extremely high precision. And since the guide hole is formed based on the guide mark, the guide hole can also be processed with good positional accuracy,
Even when wiring patterns having a narrow pitch (0.6 mm pitch) in which the wiring patterns are arranged at intervals of, for example, 0.3 mm and the width of the wiring patterns is 0.3 mm, the wiring patterns are further contacted and conducted. Can be provided.

Further, since the guide mark is provided larger than the guide hole, when the guide hole is provided in the guide mark, the mark of the guide mark is displayed on the wiring board. By measuring the mutual position of the guide mark and the guide hole as needed, the positional deviation of the guide hole can be confirmed. Further, if the positional deviation between the guide mark and the guide hole becomes large for some reason, the positional deviation can be known even by silent observation.

Further, the guide hole formed in the wiring board is
Since the guide mark formed simultaneously with the wiring pattern is formed by image recognition using a punching machine having a function of recognizing an image, it is possible to process a guide hole with extremely high positioning accuracy. For this reason, compared with the conventional case, the wiring boards having a significantly narrower pitch of the wiring patterns can be brought into pressure contact and conduction without using solder.

Further, a temporary fixing hole is provided in the wiring board on the base member side, and a synthetic resin temporary fixing post provided in the base member is inserted into the temporary fixing hole and heat-welded. As a result, the wiring board on the base member side can be temporarily fixed to the base member, thereby preventing the wiring board on the base member side from dropping off from the base member when the wiring board on the holding member side is incorporated in another factory (another process). It is possible to improve the assembly workability.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a wiring board connection structure according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a wiring board connection structure according to one embodiment of the present invention.

FIG. 3 is a plan view showing a first wiring board of one embodiment of the present invention.

FIG. 4 is a first explanatory diagram for explaining a manufacturing process of a first wiring board in one embodiment of the present invention.

FIG. 5 is a second explanatory diagram for explaining the next manufacturing step of the first wiring board shown in FIG. 4;

FIG. 6 is a third explanatory view for explaining the next manufacturing step of the first wiring board shown in FIG. 5;

FIG. 7 is a perspective view showing a conventional wiring board connection structure.

FIG. 8 is an enlarged plan view showing a connection portion of a conventional wiring board.

FIG. 9 is an enlarged plan view showing a connection portion in a state where a conventional wiring board is inclined with respect to a guide post.

[Explanation of symbols]

 Reference Signs List 1 base member 1a guide post 1b crimping post (temporary fixing post) 2 holding member 3 first wiring board 3a first circuit wiring portion 3b, 4b wiring pattern (connection wiring pattern) 3c, 3c ', 4c, 4c' Guide holes 3d, 4d Connect portions (connecting portions) 3e, 4e Temporary fixing holes 3f, 4f First guide marks 3g, 4g Second guide marks 3h, 4h Wide portions 3i, 4i Narrow portions 4 Second wiring board 4a Second circuit wiring section

Claims (6)

[Claims] A first wiring board having a plurality of connection wiring patterns and at least two guide holes provided apart from each other in a direction in which the wiring patterns are formed; A base member having at least two guide posts projecting therethrough, and a holding member that sandwiches the first and second wiring boards together with the base member in a state where the wiring patterns of the two wiring boards face each other. And connecting the connection portions of the wiring patterns formed on the first and second wiring boards to each other. 2. The method according to claim 1, wherein each connection portion of the wiring pattern is located between the at least two guide holes.
2. The wiring board connection structure according to claim 1, wherein said guide holes are provided in said first and second wiring boards. 3. The first and second wiring boards are provided with guide marks made of the same material as the wiring pattern,
3. The wiring board connection structure according to claim 1, wherein said guide hole is formed in said guide mark. 4. The wiring board connection structure according to claim 3, wherein said guide mark is provided larger than said guide hole. 5. The guide mark is formed together with the wiring pattern, and a guide hole formed in each of the first and second wiring boards is formed by a punching machine having a function of recognizing an image. The wiring board connection structure according to claim 3, wherein the guide mark is formed by image recognition. 6. A temporary fixing hole is provided in a wiring board arranged on the base member side of the first and second wiring boards, and the temporary fixing hole is inserted into the temporary fixing hole and thermally welded. The wiring board connection structure according to claim 1, wherein a post is provided on the base member.