JP3383169B2 - Peripheral exposure equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a peripheral exposure apparatus for exposing a peripheral portion (peripheral portion) of a photosensitive film coated on the surface of a substrate such as a semiconductor wafer.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a resist solution is spin-coated on a substrate such as a semiconductor wafer, developed into a predetermined pattern to form a resist mask, and then a thin film pattern is formed using the resist mask. Is being done.

The substrate on which the resist solution is spin-coated is gripped at the peripheral edge thereof and conveyed between various substrate devices. The resist solution is applied to the peripheral portion of the substrate by spin coating. Therefore, when the peripheral edge of the substrate is gripped, the resist on the peripheral edge is peeled off and scattered, which contaminates the resist film surface in the central part of the substrate or the surface of another substrate, thereby lowering the yield of substrate processing. There is a case to let you.

For this reason, in the case of a positive resist, the peripheral edge of the substrate is exposed in advance by using a peripheral exposure device, and unnecessary resist on the peripheral edge of the substrate is removed at the same time when the resist pattern is developed. Processing is being performed.

In the conventional peripheral exposure apparatus, a method of annularly exposing a region having a constant width from the outer edge of the substrate is used. Such an exposure method is disclosed in, for example, Japanese Patent Laid-Open No. 2-288221.
It is disclosed in Japanese Patent Publication No. 6-127756. In the former peripheral exposure apparatus, the position of the orientation flat (hereinafter referred to as orientation flat) or notch of the substrate is mechanically detected using a cam that is in contact with the outer peripheral edge of the substrate, and this is used as a reference for the peripheral edge of the substrate. A peripheral exposure area having a constant width is formed in an annular shape.

In the latter peripheral exposure apparatus, the position of the orientation flat or notch of the substrate is optically detected by using the line sensor, and the peripheral exposure area having a constant width is formed in an annular shape with reference to this.

However, in recent years, in order to reliably prevent contamination by particles generated from the resist, there is an increasing demand for more complete removal of unnecessary resist on the peripheral portion of the substrate.

Since a plurality of rectangular elements are formed on the substrate, the outer shapes of the plurality of aligned elements (element regions) are formed in a step shape. On the other hand, since the substrate has a substantially circular shape, when a peripheral exposure region having a constant width is formed from the outer peripheral edge of the substrate, a region where unnecessary resist remains is formed between the substrate and the outer peripheral portion of the stepwise element region.

Therefore, recently, there has been proposed a peripheral exposure apparatus capable of performing peripheral exposure along the outer shape of a stepwise element region. Such a peripheral exposure apparatus is disclosed in, for example, Japanese Patent Laid-Open No. 3-242922. Figure 9
FIG. 7 is an explanatory diagram of an exposure operation of a peripheral exposure apparatus capable of performing stepwise peripheral exposure. In FIG. 9, a plurality of elements 2 are arranged on a substrate 1, and cutting lines (scribe lines) 3 for cutting each element 2 are formed between the elements.

In this peripheral exposure apparatus, the dimension data of the stepwise peripheral exposure region 5 to be formed on the peripheral portion of the substrate 1 is stored in advance. In the peripheral exposure processing, first, the photo sensor 45 is used to detect the orientation flat portion 1a of the substrate 1, a reference position for the peripheral exposure is set based on the position of the orientation flat portion 1a, and the peripheral exposure stored in advance from the reference position. Peripheral exposure of the resist on the substrate 1 is performed according to the dimension data of the region 5. The dotted line 4a in FIG. 9 is the outline 7 of the element region.
The boundary line with the regular peripheral exposure area 5 which is to be formed at a position separated by a certain distance from is shown.

[0011]

However, each element 2 is formed on the basis of the alignment mark (not shown) formed on the substrate 1, and is formed on the basis of the outer peripheral edge of the substrate 1 or the orientation flat portion 1a. It does not exist. Therefore, when the above-mentioned peripheral exposure is performed with reference to the outer peripheral edge position of the substrate 1, for example, the position of the orientation flat portion 1a, the relative positional relationship of the element 2 with respect to the outer peripheral edge of the substrate 1 varies from substrate to substrate. As shown by the solid line 4b in FIG.
There is a case in which the edge position of is displaced from the regular position (dotted line 4a). In this case, there has been a problem that a peripheral exposure defect occurs due to the exposure of even the required resist portion on the element 2 or the remaining portion that should be removed by the peripheral exposure. Further, the work of pre-storing the dimensional data of the peripheral exposure area 5 is complicated and the operator's burden is heavy.

An object of the present invention is to provide a peripheral exposure apparatus capable of performing peripheral exposure with high accuracy in a stepwise manner along the outer shape of an element region on a substrate.

[0013]

In the peripheral exposure apparatus according to the first aspect of the present invention, the peripheral exposure area outside the element area of the substrate is defined as the element area of the photosensitive film coated on the substrate. A peripheral exposure apparatus that performs stepwise exposure along an outer shape, including substrate holding means for holding a substrate in a horizontal posture, edge position detecting means for detecting an edge position of the substrate, and at least 1 included in the element region. Image input means for inputting the shape of one element as image data, and the size and position of one element are detected from the image data input from the image input means,
The outer peripheral position of the element region is calculated based on the element size and the edge position of the substrate detected by the edge position detecting means, and the position of the peripheral exposure region along the outer shape of the element region is calculated based on the outer position of the element region. Exposure area calculation means, a light irradiation means for irradiating the photosensitive film with light, and light for exposing the peripheral exposure area of the photosensitive film based on the position of the peripheral exposure area calculated by the exposure area calculation means. And a control means for controlling the irradiation means.

In the peripheral exposure apparatus according to the second invention, in the configuration of the peripheral exposure apparatus according to the first invention, the exposure area calculation means detects the dimension of the element based on the position of a scribe line surrounding the element. It includes a scribe line calculation unit that does this.

A peripheral exposure apparatus according to a third aspect of the present invention is the configuration of the peripheral exposure apparatus according to the first or second aspect, wherein the substrate holding means has a substrate rotating section for rotating the substrate, and the control means is The light irradiation means is controlled so that the peripheral exposure region is divided and exposed at each position where the substrate is rotated by a predetermined angle.

A peripheral exposure apparatus according to a fourth aspect of the present invention is the peripheral exposure apparatus according to the first or second aspect of the present invention, wherein the light irradiation section for irradiating light by the light irradiation unit and the light irradiation section are provided on the entire surface of the substrate. And a moving unit for moving the same.

In the peripheral exposure apparatus according to the first to fourth aspects of the invention, the element area of the substrate is determined by the shape of one element input from the image input means and the edge position of the substrate detected by the edge position detection means. Then, the position of the peripheral exposure area is calculated. Therefore, it is possible to perform the peripheral exposure without the operator inputting the position coordinates of the peripheral exposure area having a stepwise complicated shape along the outer shape of the element area, and the operability of the peripheral exposure apparatus is improved.

Further, even if the image input means has an image input range smaller than the substrate outer diameter, the peripheral exposure area can be calculated. Moreover, the position of the peripheral exposure region can be calculated with high accuracy by directly inputting the image of the substrate held by the substrate holding means.

In particular, in the peripheral exposure apparatus according to the second aspect of the invention, the dimensions of the element are calculated from the image data of the scribe lines surrounding the periphery of the element, and the outer shape of the element area and the position of the peripheral exposure area are calculated based on this. By calculating, the detection accuracy of the position of the peripheral exposure area can be improved.

Particularly, in the peripheral exposure apparatus according to the third aspect of the present invention, the peripheral exposure processing is performed for each predetermined area obtained by dividing the substrate while rotating the substrate by a predetermined angle, so that the range of movement of the light irradiation means is increased. The peripheral exposure process can be performed on a substrate having a large outer diameter.

In particular, in the peripheral exposure apparatus according to the fourth aspect of the invention, since the light irradiation means is constructed so as to be movable over the entire surface of the substrate, the peripheral exposure processing can be performed while the substrate is stationary, The configuration and control operation of the exposure apparatus can be simplified.

[0022]

1 is a block diagram of a peripheral exposure apparatus according to an embodiment of the present invention. The peripheral exposure apparatus includes a substrate rotating unit 10 that horizontally holds and rotates the substrate 1, a light irradiating unit 20 that irradiates a peripheral portion of the substrate 1 with a light beam, and exposes the light.
A moving unit 30 for moving the irradiation position of 0, a CCD line sensor 40 for detecting the edge position of the substrate 1, and an image input unit 50 for inputting an image of the element region of the substrate 1 are provided.

The substrate rotating unit 10 includes a spin chuck 11 for sucking and holding the back surface of the substrate 1, and a spin chuck 11 for holding the back surface of the substrate 1.
And a motor 12 for rotating the shaft around an axis extending in the vertical direction. The substrate 1 is sucked and held by the spin chuck 11 in a horizontal posture, and is rotated about the axis of the rotation shaft of the motor 12.

The light irradiating section 20 is attached to the exposure light source 28 for generating ultraviolet rays as an exposure light beam, the optical fiber 23 for transmitting the ultraviolet rays from the exposure light source 28, the tip of the optical fiber 23, and the substrate 1. An irradiation end 21 for irradiating the surface with ultraviolet rays is provided. The exposure light source 28 is a mercury xenon lamp 25, an elliptical mirror 26, an ultraviolet transmission filter 24.
And a shutter 27. The ultraviolet rays transmitted through the ultraviolet ray transmitting filter 24 are guided to the irradiation end 21 through the optical fiber 23. The irradiation end 21 is provided with a slit, an optical lens system (not shown), etc. for narrowing the ultraviolet light into a predetermined spot shape (for example, a rectangle) and irradiating the substrate 1.

The moving section 30 includes a radial displacement section Mx and a tangential displacement section My for displacing the support arm 22 supporting the irradiation end 21 in the X direction (X axis) and the Y direction (Y axis), respectively. Composed. Radial displacement part Mx
Is composed of an X table 30 capable of reciprocating in the X direction, a stepping motor 32 for moving the X table 30, and a ball screw. Further, the tangential displacement portion My is provided with a Y table 33 that is movable in the Y direction.
Stepping motor 3 for moving the table 33
4 and a ball screw.

The CCD line sensor 40 includes a light source 41 disposed above the substrate 1 and a light source 4 disposed below the substrate 1.
1 and a light receiving section 42 arranged so as to face each other. A part of the light source 41 and the light receiving portion 42 is installed at a position closer to the center side than the outer peripheral edge portion of the substrate 1. And
The substrate 1 is rotated in a state in which the light source 41 irradiates the light receiving unit 42, and the light receiving unit 42 detects the position where the substrate 1 blocks the light beam from the light source 41, thereby detecting the edge position of the substrate 1.

The image input section 50 is composed of a CCD camera 51 for inputting the shape of an element region formed on the surface of the substrate 1 as an image, a camera lens 52, and a camera illuminator 53 for illuminating the surface of the substrate 1. ing. The CCD camera 51 to which the camera lens 52 is attached has an input range in which an image of at least one element can be captured, and has a resolution that allows the size and position of each element to be calculated with high accuracy. . The CCD camera 51 is arranged above the substrate 1, and particularly when arranged above the center of the substrate 1, it is effective in preventing interference with the irradiation end 21 of the light irradiation unit 20. In addition, the camera illuminator 12
Is used when the illuminance on the surface of the substrate 1 is insufficient.

FIG. 2 is a functional block diagram of the peripheral exposure apparatus. Here, the substrate edge position calculating means A, the exposure amount setting means C, the control section D, and the exposure position calculating means F are composed of a personal computer, the exposure width setting means B is composed of a display and a keyboard device, and further scribe. The line position calculation unit E is composed of an image processing board. In the above configuration, the scribe line position calculation unit E and the exposure position calculation unit F form the exposure area calculation unit of the present invention, and the light irradiation unit 20 and the moving unit 30 form the light irradiation unit of the present invention. The substrate rotating unit 10 constitutes the substrate holding unit of the present invention, the image input unit 50 constitutes the image input unit of the present invention, and the control unit D constitutes the control unit.

The operation of each section of the above-mentioned peripheral exposure apparatus is controlled by the control section D. FIG. 3 is a flow chart showing the operation of the peripheral exposure apparatus according to the embodiment of the present invention. Less than,
The peripheral exposure operation of the peripheral exposure apparatus will be described with reference to FIG.

Prior to the description of the peripheral exposure operation, the substrate center Ow of the substrate 1 and the rotation center Or of the spin chuck 11 are rotated.
And the field center O of the image input area V of the CCD camera 51
The positional relationship of v and the coordinate system in the peripheral exposure apparatus will be described with reference to FIG.

The rotation center Or of the spin chuck 11 is X.
It is located on the axis of the axis, and the detection position of the CCD line sensor 40 is also set on the axis of the X axis. Further, the moving origin of the moving unit 30 is set to point O in the figure.

The substrate 1 is spin chuck 1 so that the substrate center Ow coincides with the rotation center Or of the spin chuck 11.
Although it is preferable to mount it on No. 1, there are cases where it is actually mounted with a shift. Also, it is difficult to install the CCD camera 51 so that the center Ov of the field of view of the CCD camera 51 coincides with the rotation center Or of the spin chuck 11,
It may be installed at a different position. In this case, the substrate center O
For example, the displacement shown in the figure occurs between w, the visual field center Ov, and the rotation center Or. Therefore, in each step of the operation of the peripheral exposure apparatus described below, work is performed in consideration of the displacement amounts of these positions.

First, the CCD camera 51 in the peripheral exposure device
At the time of assembling, the offset amount between the visual field center Ov of the CCD camera 51 and the rotation center Or of the spin chuck 11 is detected. For example, a dummy substrate having a "+" mark drawn in the center thereof is suction-held on the spin chuck 11 and rotated every 1 / n round (n is an integer of 2 or more), and "+" every 1 / n round. An image including a mark is captured from the CCD camera 51.
Then, the position of the "+" mark of the image for each 1 / n round is calculated,
The average of them becomes the rotation center Or. Therefore, the calculated displacement amount (ΔX ₂ , Δ) between the rotation center Or and the visual field center Ov.
Y ₂ ) is detected as the offset amount.

In FIG. 3, when the peripheral exposure process is started, the substrate 1 which is the target of the peripheral exposure process is first placed on the spin chuck 11 by the transfer device and suction-held (step S1).

Next, the motor 12 is started, and the CCD line sensor 40 detects the edge position of the substrate 1 while rotating the substrate 1. In the CCD line sensor 40, the substrate 1
The OFF signal is output from the pixel of the light receiving section 42 below the pixel, and the ON signal is output from the pixel outside the substrate 1. Then, based on the position of the pixel that outputs the ON signal, the radius from the rotation center Or of the spin chuck 11 to the outer peripheral edge of the substrate 1 is set at a plurality of positions along the outer peripheral edge of the substrate 1 at every rotation angle of several degrees. Desired. At this time, the rotation angle of each outer peripheral edge position whose radius is obtained is also detected at the same time.

The substrate center Ow of the substrate 1 is the spin chuck 1.
The number of pixels that output the ON signal does not change when the rotation center Or is 1, but the number of pixels that output the ON signal changes when the rotation center Or is 1. Therefore, the substrate center Ow of the substrate 1 is determined based on the change amount of the pixel.
And the offset amount between the rotation center Or of the spin chuck 11 is calculated. In the example shown in FIG. 4, the offset amounts of both are (ΔX ₁ , ΔY ₁ ) (step S2).

Further, the point where the radius from the rotation center Or of the spin chuck 11 to the outer peripheral edge detected by the CCD line sensor 40 is the shortest is determined to be the center position of the orientation flat portion 1a, and the center position of this orientation flat portion 1a is determined. The substrate 1 is stopped at either a position corresponding to the detection position of the CCD line sensor 40 or a position rotated by 90 °, 180 ° or 270 ° from that position. As shown in FIG.
The detection position of the CD line sensor 40 is set on the X axis passing through the rotation center Or of the spin chuck 11. Therefore, when the substrate 1 is stopped at the above position, the straight portion of the orientation flat 1a of the substrate 1 becomes substantially parallel to the X-axis direction or the Y-axis direction. In the following description, as shown in FIG.
It is assumed that the orientation flat portion 1a is stopped parallel to the Y axis at a position opposite to the CCD line sensor 40 (step S).
3).

Further, an image of the element region on the surface of the substrate 1 is input from the image input section 50 (step S4). Figure 5
It is a schematic diagram of the input image of an element region. In FIG. 5A, the input range V of the CCD camera 51 has a size including at least one element 2. Element 2 has two sets of parallel scribe lines SLX0, SLX1, S
It is surrounded by LY0 and SLY1. The scribe line position calculation unit E identifies each scribe line SLX0-1, SLY0-1 from the input image data, and obtains the position coordinates of the intersections of the scribe lines. Then, for example, based on the coordinate values of the intersections A1 and A2, the scribe line SL
It is determined whether Y0 is parallel to the Y axis. Figure 5 (a)
As shown in FIG. 5B, the substrate 1 is rotated to tilt the scribe line SLY as shown in FIG.
The rotation stop position of the substrate 1 is finely adjusted so that 0 and SLY1 are parallel to the Y axis (step S5).

FIG. 6 shows the operation of the scribe line position calculation unit.
It is an explanatory view showing a work. 5 (b) and 6
Then, the scribe line position calculation unit E determines the field center Ov
Field of view from the offset amount of the substrate center Ow or the input image
From the center Ov to the scribe lines SLX0 and SLY0
Distance (△ X₁, △ Y₁) And a pair of scribe lines
Distance Sc between SLX0 and SLX1 and a pair of scrubbers
The distance Xc between the lane lines SLY0 and SLY1 is obtained.
In the element area, elements 2 having the same shape are repeatedly arranged.
It Therefore, the distance Yc between the scribe lines is set in the Y-axis direction.
Each scribe line parallel to the X axis by multiplying by an integer
The coordinate values of the SLX-3 to SLX3 in the Y-axis direction are the field of view center O
Obtained based on v, the scribe line interval Xc
Each scalar parallel to the Y-axis is multiplied by an integral multiple in the X-axis direction.
If the coordinate values of the Y-lines SLY-3 to SLY3 in the X-axis direction are
It is obtained with the center of view Ov as a reference. Also, spin ch
Offset amount between the center of rotation Ov and the center of field of view Ov
(△ X₂, △ Y₂) Is also calculated in advance. According to
The offset value (ΔX
₂, △ Y₂) Is added to the spin chuck 11
Each scribe line SLX-based on the rotation center Or
The coordinate values of 3 to 3 and SLY-3 to 3 are obtained.

The external dimensions of the substrate 1 are also obtained in advance by the CCD line sensor 40. Therefore, the outermost scribe lines SLX3, SL included in the substrate 1
X-3, SLY3, and SLY-3 are assumed, and a rectangular element region R is assumed (step S6).

The assumed element region R includes an element that partially protrudes from the substrate 1 or an element that is extremely close to the outer peripheral edge of the substrate 1. Therefore, it is necessary to determine the effective element region on the substrate 1. FIG. 7 is a schematic diagram for explaining a method of determining an effective element region on the substrate.
As a method for determining the effective element region Re, there is a method in which the schematic diagram of the substrate 1 shown in FIG. 6 is displayed on the monitor, and the operator directly points to the inappropriate element 2a shown by hatching in FIG. . Alternatively, based on the coordinate value of the scribe line surrounding each element, an element in which a part of the element exists outside the substrate 1 or an element which is close to the outer peripheral edge of the substrate 1 within a certain distance is inappropriate. A method of excluding it as an element can also be used.

As shown in FIG. 7, when a reference point (indicated by a black circle in the figure) that defines the outer shape of the effective element region Re is obtained,
The exposure position calculation means F adds the offset width for exposing a region separated from the outer shape of the element region Re by a constant width to the coordinate value of the reference point, and the exposure reference points P _{0 to} P ₅ as shown in FIG.
Position data is calculated. The offset amount between the outer shape of the element region Re and the peripheral exposure region is set to, for example, 200 μm or less (step S7).

FIG. 8 is a schematic diagram showing the operation of the peripheral exposure processing. The peripheral exposure process is performed for each of the four divided regions of the substrate 1 according to the exposure reference points P _{0 to} P ₅ of the peripheral exposure region. Irradiation end 21 of the light irradiation unit 20 (see FIG. 1)
The spot light SB emitted from is narrowed down into a rectangle. Then, the moving unit 30 first moves the irradiation end 21 to a position where the reference point S ₀ of the spot light SB matches the exposure reference point P ₀ , and starts irradiation of the spot light SB. Further, at the irradiation end, based on the exposure amount data set by the exposure amount setting means C, the exposure end points are sequentially moved between the exposure reference points P _{1 to} P _{5 in} accordance with the arrow direction in the figure, and the substrate 1 Exposure processing is performed on the peripheral region of 1/4 (step S8).

After that, it is judged whether or not the exposure processing for all the peripheral areas of the substrate has been completed (step S9). If not completed, the substrate 1 is rotated 90 degrees and the processing from step S5 to step S8 is repeated. To do.

When the exposure processing for all the peripheral areas is completed, the peripheral exposure processing is completed. Accordingly, it is possible to form a stepwise peripheral exposure region that is separated by a predetermined distance along the outer shape of the element region Re.

As described above, the peripheral exposure apparatus according to the present embodiment has the CCD line sensor 40 for detecting the edge position of the substrate.
And a CCD camera 51 for inputting the shape of one element on the substrate as image information, the outer dimension of the element region Re is calculated by detecting the shape of one element, and the periphery is calculated based on this outer dimension. The peripheral exposure processing can be performed by calculating the coordinate values of the exposure area. Therefore, it is not necessary to input the position information of the element region Re one by one as in the conventional case, and it is possible to obtain a peripheral exposure apparatus having good operability and high processing efficiency.

In the initial stage of the substrate processing, if the image on the surface of the substrate 1 is unclear, it becomes difficult to capture the image data of the element region. In this case, the exposure width setting means B sets the exposure width on the basis of the edge position of the substrate obtained by the CCD line sensor 40, and the peripheral exposure processing of exposing the outer peripheral edge of the substrate in an annular shape with the exposure width is performed. You may use together.

Further, in the above embodiment, the CCD camera 51 is arranged so as to capture the image of the element 2 in the central portion of the substrate 1, but the element 2 for capturing the image is not limited to the central portion. Instead, the CCD camera 51 may be arranged so as to capture an image of any element 2 in the element region Re. In this case, the position of the element 2 is the center of rotation Or of the spin chuck 11 and the center of view Ov of the CCD camera 51.
It can be calculated from the offset amount between and.

Further, in the above embodiment, the CCD line sensor 40 is used to detect the edge position of the substrate 1, but the edge position of the substrate 1 is detected using other means. You may.

Further, in the above embodiment, the peripheral exposure is performed for each quarter area of the substrate 1, but the moving unit 3 is used.
When the displacement amount of 0 in the X and Y directions is large and the irradiation end 21 is configured to be movable over the entire surface of the substrate 1,
Peripheral exposure of the substrate 1 can be performed without rotating the substrate 1. In this case, the exposure position calculation means F is configured to simultaneously calculate the exposure reference points in all the peripheral exposure areas of the substrate 1.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an edge exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a functional block diagram of an edge exposure apparatus according to an embodiment of the present invention.

FIG. 3 is a flowchart showing an operation of the peripheral exposure apparatus shown in FIG.

FIG. 4 is an explanatory diagram showing a relationship of offsets of a substrate center, a rotation center, and a visual field center of the peripheral exposure apparatus.

5 is a schematic diagram of an input image of a CCD camera of the peripheral exposure apparatus of FIG.

FIG. 6 is an explanatory diagram showing an operation in a scribe line position calculation unit.

FIG. 7 is an explanatory diagram showing an operation of determining an effective element region on a substrate.

FIG. 8 is an explanatory diagram showing an exposure operation in the peripheral exposure apparatus of FIG.

FIG. 9 is an explanatory diagram showing an exposure operation in a conventional peripheral exposure apparatus.

[Explanation of symbols]

1 substrate 2 element 10 substrate rotating part 11 spin chuck 20 light irradiation part 21 irradiation end 30 moving part 40 CCD line sensor 50 image input part 51 CCD camera SLX-3 to SLX3, SLY-3 to SLY3 scribe line Or rotation of spin chuck Center Ov View center Ow Substrate center

─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-3-242922 (JP, A) JP-A-5-3153 (JP, A) JP-A-6-224117 (JP, A) JP-A-7- 142332 (JP, A) JP 3-195011 (JP, A) JP 6-109446 (JP, A) JP 3-84921 (JP, A) JP 9-162120 (JP, A) (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/027 G03F 7/20 521

Claims (4)

(57) [Claims] 1. A peripheral exposure apparatus which exposes a peripheral exposure region outside a device region of the substrate in a stepwise manner along the outer shape of the device region, of the photosensitive film coated on the substrate, the substrate comprising: A substrate holding means for holding the substrate in a horizontal posture, an edge position detecting means for detecting an edge position of the substrate, an image input means for inputting the shape of at least one element included in the element region as image data, The size and position of the one element are detected from the image data input from the image input means, and the element is based on the size of the element and the edge position of the substrate detected by the edge position detection means. Exposure area calculation means for calculating the outer shape position of the area and calculating the position of the peripheral exposure area along the outer shape of the element area based on the outer shape position of the element area; and irradiating the photosensitive film with light. An irradiation means; and a control means for controlling the light irradiation means so that the peripheral exposure area of the photosensitive film is exposed based on the position of the peripheral exposure area calculated by the exposure area calculation means. A characteristic edge exposure system. 2. The peripheral exposure according to claim 1, wherein the exposure area calculation means includes a scribe line calculation unit that detects a dimension of the element based on a position of a scribe line surrounding the element. apparatus. 3. The substrate holding unit has a substrate rotating unit for rotating the substrate, and the control unit exposes a peripheral exposure region by dividing the substrate at each position rotated by a predetermined angle. 3. The peripheral exposure apparatus according to claim 1, wherein the light irradiating means is controlled as described above. 4. The light irradiating means comprises a light irradiating section for irradiating light, and a moving section for moving the light irradiating section over the entire surface of the substrate.
The peripheral exposure apparatus described.