JP3366192B2 - Wiring board and power conversion device using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for reducing the inductance of wiring by utilizing an induced current in a power converter and a power semiconductor device using the wiring board for suppressing spike voltage and reducing power loss. Regarding the converter.

[0002]

2. Description of the Related Art A power conversion device for converting direct current power into alternating current power, converting alternating current power into direct current power, or converting direct current power into direct current power using a power semiconductor device having a withstand voltage of several tens of volts or more. In recent years, in devices, the increase in the current of the element and the increase in the switching speed have been remarkable.

Accordingly, the switching element is turned on,
The current change (di / dt) that occurs when the power is off is several kA / μ
It also becomes s.

Since the wiring through which such a current flows has an inductance L, it is Ldi / d during switching.
A spike voltage represented by t is generated, this spike voltage is applied as a stress voltage of the power semiconductor element, and the switching loss of the power semiconductor element is increased.

Electromagnetic energy represented by 1/2 Li2 is accumulated in the wiring. This accumulated electromagnetic energy causes snubber loss because it is absorbed by a capacitor or the like provided in the snubber circuit and released by a resistor or the like.

For this reason, it is desired that the inductance of the wiring is small, but since the inductance is determined by the size of the wiring, it has been a conventional countermeasure to shorten the wiring length.

Recently, a method of reducing the combined inductance of each wiring by using the mutual inductance between the two wirings has been studied.
There is JP-A No. 6-225545 (hereinafter referred to as the first conventional technology).

On the other hand, in addition to the above-mentioned known examples, shielded cables, coaxial cables, microstrip lines, etc. are known as wiring in consideration of impedance characteristics of wiring.

In the shielded cable, a shield conductor is installed on the wiring conductor via an insulator so as to cover the wiring conductor, and the shield conductor is connected to a ground point having an extremely low impedance. As a result, the electric field created by the wiring conductor is blocked by the grounded shield conductor so as not to leak outside, and an electrostatic shield effect is obtained in which an external noise electric field is not transmitted to the wiring conductor.

The coaxial cable is a line for transmitting a signal by confining electromagnetic waves in a closed space surrounded by a shield conductor. Therefore, the shield conductor is installed so as to cover the wiring conductor centering around the wiring conductor via an insulator having a small high-frequency loss. With this configuration, the characteristic impedance is kept constant and the matching condition of the connection circuit can be maintained.

In particular, a characteristic impedance may be made constant by maintaining a matching condition of the connection circuit by causing a current having the same magnitude in the opposite direction as the current flowing through the wiring conductor to flow through the shield conductor. With such a configuration, the magnetic field generated by the wiring conductor does not leak to the outside of the shield conductor, the characteristic impedance can be kept constant, and the matching condition of the connection circuit can be maintained.

The microstrip line is a kind of parallel plate type homo-wave tube used as a microwave transmission line, in which strip conductors are provided in parallel on a conductor plate through an insulator and an electric field is applied between the conductors. A transmission line that propagates electromagnetic waves. Therefore, the conductor plate needs to be fixed at a potential that does not fluctuate due to the external environment, and is normally connected to the ground potential (earth). As an example, Japanese Patent Laid-Open No. 5-283
There is a publication No. 487 (hereinafter referred to as a second conventional technique).

[0013]

According to the above-mentioned first prior art, in order to reduce the combined inductance of the wirings by using the mutual inductance, the flowing directions of the two wirings adjacent in parallel are different from each other. It is an electric current. When the amplitude and the phase change with time are the same as in the input current and the output current, the input current and the output current may be supplied as the round trip current to the two wirings, respectively. However, there is a problem that the current can be used only when the current whose amplitude and phase change with time is the same can be used, and the mutual inductance cannot be used when there is no adjacent wiring.

Further, in the above-mentioned shielded cable, coaxial cable, and microstrip line as well, similar to the first conventional technique, other conductors are crawled to the wiring conductor through an insulator, and the crawled conductor intentionally changes the wiring current. The effect of reducing the inductance was not obtained unless currents with different directions were applied. Therefore, there is a limit in reducing the inductance of the wiring of the power converter even if the above-mentioned conventional technique is used. If the inductance of the wiring cannot be reduced sufficiently, the above-mentioned problems such as spike voltage and snubber loss remain, and the voltage generated by the resonance generated between the wiring inductance and the parasitic capacitance of the element causes noise malfunction. There was a problem.

An object of the present invention is to reduce the inductance of a wiring forming a circuit without causing a current in a direction different from that of the wiring current to flow, and to reduce the above spike voltage, switching loss and snubber loss. Alternatively, it is to provide a wiring board that reduces noise and a power conversion device using the same.

[0016]

In order to solve the above-mentioned problems, the present invention provides a wiring board for reducing the inductance of wiring by providing another conductor for generating an induced current with respect to a wiring conductor which constitutes a circuit. To form.

The above-mentioned other conductors are arranged close to and parallel to the wiring conductor. In addition, the loop conductor formed by the current flowing in the circuit and the loop conductor are arranged close to and parallel to each other so as to overlap the loop. As a result, an induced current is generated in the conductors arranged close to each other and in parallel with each other, and the induced inductance reduces the combined inductance of the wiring conductors.

According to the above configuration, when a time-varying current flows through the wiring conductors used in the circuit that constitutes the power conversion device or the like, the current causes a magnetic field in these wiring conductors. This magnetic field interlinks with other conductors arranged close to or parallel to the wiring conductors, other wiring conductors, or annular conductors connected in an annular shape, and induces induced electromotive force in these other conductors. The induced electromotive force causes an induced current to flow through the other conductor in a direction opposite to that of the current flowing through the wiring conductor. This induced current creates a magnetic field in the opposite direction in these other conductors, and has the function of weakening the magnetic field created by the wiring conductors described above.

Generally, the magnetic field generated by the induced current is
It is called the repulsive magnetic field. This induced current and the current flowing through the wiring conductor bring about the same effect as the round-trip current of the two wirings in the above-mentioned conventional technique, and the effect of reducing the combined inductance of the wiring conductor due to the mutual inductance due to the induced current.

This is effective only for a wiring conductor through which a time-varying current flows. For example, when the wiring substrate of the present invention is used in a snubber circuit of a power converter, when a power semiconductor element is switched. A pulsed current flows through the snubber circuit wiring only. The induced current is generated by this change in current, and the inductance of the snubber circuit wiring can be reduced.

This effect suppresses the spike voltage generated during switching.

Further, if the wiring board of the present invention is used for the wiring from the power supply of the power converter to the power semiconductor element, the current on this wiring is rectangular by the general PWM (pulse width modulation) control. Since the current of (1) repeatedly flows, the above-mentioned induced current is generated due to the change in current at the time of rising and falling of the current, and the effect of reducing the inductance of the wiring conductor can be obtained. This effect reduces the electromagnetic energy of the wiring to reduce the loss of the power conversion device, reduces the electromagnetic radiation noise from the device, and reduces the heat generation, vibration, noise and radio noise of the metal case and parts surrounding the device. Let

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a side view of a main circuit portion of a power converter according to the present invention, and FIG. 2 is a top view thereof.

In FIGS. 1 and 2, an insulated gate bipolar transistor (hereinafter referred to as an IGBT) which is a power semiconductor element is used.
The connection between the module 4 and the power supply 3 is shown.

The input and output terminals 12 of the IGBT module 4 and the positive and negative terminals 13 of the power source 3 are connected using the wiring conductor 1. Here, the induction conductor 2 is arranged above the wiring conductor 1 in order to flow an induction current in parallel.

In this embodiment, further, an annular induction conductor 2 constituted by connecting each end of the induction conductor 2 with a conductor 40 is arranged so as to overlap the current loop flowing in this circuit.

The annular induction conductor 2 does not have to be formed by connecting a plurality of such conductors.

The IGBT inside the module 4 is turned on and off in response to a command from a control circuit (not shown). Although there are various control methods, whichever method is used, the current flowing from the power supply 3 to the module 4 is turned on or off depending on whether the IGBT is turned on or off, and becomes an intermittent pulsed current.

An induced current flows through the annular conductor composed of the induction conductor 2 and the conductor 40 in accordance with the temporal change of the current,
The inductance of the wiring conductor 1 can be reduced by this induced current.

Although both ends of the wiring conductor 1 are electrically connected to the terminals 12 and 13 of the module 4, the induction conductor 2 on the upper side thereof has the insulating collar 6 and the insulating collar 7.
Are fastened with bolts 8 and 10, and the induction conductor 2 is electrically separated from the terminals 12 and 13.

Although not shown, since the induction conductor 2 has a floating potential, one end of a resistance of, for example, about 1 kΩ is connected to the induction conductor 2 and the other end of the resistance is connected to a reference potential. Therefore, it is possible to prevent the electric charge from being accumulated in the induction conductor 2.

An important point in the above structure is the space 46 between the wiring conductor 1 and the induction conductor 2, and it is desirable to make this space as narrow as possible. This is equivalent to making the current flowing through the wiring conductor 1 and the induced current as close as possible. However, in the present embodiment, since the wiring conductor 1 and the induction conductor 2 are electrically insulated as described above, it is necessary to maintain the insulating property of both conductors, and the distance between both conductors cannot be set to the insulation distance or less. This is important for maximizing the effect of the induction current of the induction conductor 2.

Therefore, the relationship between the spacing 46 and the wiring inductance was verified by experiments, and an example thereof is shown for reference.

FIG. 31 shows the shape of the wiring board used in the experiment. The structure is such that a mica insulator 14 is bonded onto a copper wiring conductor 1 cut out in a loop shape, and a copper annular induction conductor 2 having the same shape as the wiring conductor 1 but having a different thickness.
Is bonded on the insulator 14. In particular, the structure is such that the space 46 between the wiring conductor 1 and the annular induction conductor 2 can be changed.

In the experiment, the presence or absence of the annular conductor and the above-mentioned interval 46
Was changed and the inductance of the wiring conductor 1 was measured with respect to the space 46.

The results are shown in FIG. As can be seen from FIG. 32, if the interval 46 is made extremely small, the wiring inductance can be reduced to about 1/10 as compared with the case without the annular conductor.

Further, as can be seen from FIG. 33, the effect of reducing the inductance of the wiring decreases as the spacing 46 increases. It is considered that this is because as the spacing 46 increases, the leakage magnetic field not interlinking with the annular induction conductor 2 increases and the distance between the wiring current and the induction current increases. Therefore,
It is considered effective that the distance 46 is at least 1 mm or less.

The second important point is the induction conductor 2 and the conductor 4.
It is the resistance value of the annular induction conductor 2 created by 0, and it is desirable to make this resistance value as small as possible. That is, the magnitude of the induced current flowing in the annular induction conductor 2 is determined by the induced electromotive force generated by the change in the interlinkage magnetic flux and the resistance value of the annular induction conductor 2. Therefore, at least the resistance value of the ring-shaped induction conductor 2 is made smaller than that of the wiring conductor 1, and
It is important to increase the induced current flowing in the.

The third important point is the sectional shapes of the wiring conductor 1 and the annular induction conductor 2. Here, when a current including a high frequency component flows in the wiring conductor 1, a skin effect occurs in the current flowing in the wiring conductor 1. The induced current induced by the magnetic field generated by the current flowing through the wiring conductor 1 also contains a high frequency component, and the skin effect also occurs in the induced current flowing through the annular induction conductor 2. Therefore, it is desirable that the wiring conductor 1 and the ring-shaped induction conductor 2 also have a shape that increases their surface area, for example, a foil shape. Although not shown in the cross-sectional shape of the wiring board, an induction conductor 2 that covers the wiring conductor 1 is added to the wiring conductor 1, and the wiring board is formed by connecting the induction conductors 2 in a ring shape with the conductor 40 as shown in FIG. The same effect as the wiring board can be obtained.

Next, the principle of the reduction of the inductance of the wiring conductor 1 in this embodiment below the self-inductance determined by the structure will be described.

FIG. 3 is a view for explaining the principle of reducing the inductance of the wiring conductor 1 according to the present invention. As shown in this figure, when a time-varying current flows in the loop formed by the wiring conductor 1 in the counterclockwise direction as indicated by the arrow 34, the magnetic field 32 indicated by the arrow is generated in the loop of the wiring conductor 1. The generated magnetic flux links the induction conductors 2 connected in a ring. This flux linkage changes according to the instantaneous value of the current. As a result, according to the Faraday-Neumann's law known electromagnetically, an induced electromotive force is generated in the induction conductor 2 according to the temporal change of the interlinkage magnetic flux, and this induced electromotive force and the resistance of the induction conductor 2 cause the induced electromotive force. An electric current flows through the induction conductor 2 as an induction current 42. The direction of this induced current 42 is generated so as to create a repulsive magnetic field 41 for canceling the interlinkage magnetic flux,
It flows clockwise as shown in the figure. That is, the current flows in the opposite direction to the current flowing through the wiring conductor 1. This is equivalent to the principle that the combined inductance of each wiring is reduced by the mutual inductance created by the opposite currents as described in the above-mentioned known example, and in the present invention, the mutual inductance is utilized by utilizing the induced current of the induction conductor 2. The feature is that the effect of is produced equivalently.

The magnetic field 32 produced by the loop current 34 flowing in the wiring conductor 1 is the induced current 4 flowing in the induction conductor 2.
It is weakened by the repulsive magnetic field 41 created by 2. Therefore, the amount of electromagnetic radiation emitted from the wiring conductor 1 to the external space is reduced. In the power conversion device, the use of the wiring board of the present invention for each wiring path leads to reduction of electromagnetic radiation noise emitted from the device. In this way, the electromagnetic radiation noise reduction effect weakens the interlinkage magnetic flux to the metal case and parts of the device, which can contribute to the reduction of noise and radio noise caused by heat generation and vibration due to the induced current.

In this embodiment, an IGBT is used as a power semiconductor.
Although the power conversion device using T has been described, the present invention can be naturally applied to a power converter using another power semiconductor.

FIG. 4 is a side view showing a second embodiment of the main circuit section of the power converter according to the present invention. Figure 4
The point different from FIG. 1 described above is that the thickness of the wiring conductor 1 is reduced. This is because a skin effect occurs when a time-varying current flows through the wiring conductor 1, and the current flows only on the conductor surface as the frequency increases. Therefore, when a high-frequency current is passed, even if the thickness of the wiring conductor 1 is increased, the current does not flow inside the conductor, which is meaningless. As a result of thinning the wiring conductor 1, the material cost can be reduced and the weight of the device can be reduced.

The second difference from FIG. 1 is that an insulator 14 is laminated between the wiring conductor 1 and the induction conductor 2.
The induction conductor 2 is in parallel with the wiring conductor 1 with this insulator interposed. With such a configuration, the inductance of the wiring conductor 1 can be reduced as in the first embodiment, and the wiring conductor 1 can be made thinner and lighter than the first embodiment, resulting in cost reduction. It can contribute to the reduction of the device weight.

FIG. 5 is a side view showing a third embodiment of the main circuit portion of the power conversion device according to the present invention. Figure 5
1 is different from FIGS. 1 and 4 in that the thickness of the induction conductor 2 in addition to the wiring conductor 1 is reduced. That is, since the induction current flowing in the induction conductor 2 flows only on the conductor surface, the effect of the present invention is not affected even if the thickness is reduced.
Further, as a result of thinning the thickness of the wiring conductor 1 and the induction conductor 2 in this embodiment, the entire wiring board can be formed in a foil shape as shown in FIG. 5, and by using such a foil-shaped wiring board. The wiring can be routed in a curved manner according to the unevenness of the outer shape of the module 4, the power source 3, and the like. With such a configuration, the wiring inductance can be reduced as in the first embodiment, and the wiring conductor 1 and the induction conductor 2 have a foil shape as compared with the first embodiment, so that the wiring board can be easily manufactured. Since it can be bent and bent to be used for connection between terminals, the shortest distance wiring becomes possible and the wiring inductance can be further reduced.

FIG. 6 is a block diagram showing a fourth embodiment of the main circuit portion of the power conversion device according to the present invention. The difference from the above-mentioned embodiment is that a plurality of annular induction conductors 2 are arranged along the loop current path flowing in the circuit. At this time, as the installation location of each annular induction conductor 2, an annular induction conductor 2 is prepared and installed for each insulated wiring conductor 1 having a different potential between the respective wiring conductors 1. Further, it is important that the annular induction conductors 2 are arranged close to each other while being insulated from each other while being insulated from each other.

The second difference from the above embodiment is that the wiring conductor 1 and the ring-shaped induction conductor 2 are electrically connected at one point. The wiring 43 shown in FIG. 6 is a wiring for connecting the wiring conductor 1 and the annular induction conductor 2. In this way, by connecting at one point, the wiring current does not flow into the annular induction conductor 2 and the inductance reduction effect due to the induction current is not hindered, and the wiring conductor 1 and the annular induction conductor 2 have the same potential, No need to insulate. Therefore, the wiring conductor 1 and the ring-shaped induction conductor 2 can be installed extremely close to each other.

The third difference from the above embodiment is that the high resistance element 14 is laminated between the wiring conductor 1 and the annular induction conductor 2. As described above, since the wiring conductor 1 and the ring-shaped induction conductor 2 are at the same potential, the high resistance body only needs to have a resistance value such that the wiring current 34 does not flow into the ring-shaped induction conductor 2, and is approximately 1 kΩ. It only has to be about.

With the above configuration, the wiring conductor 1 and the annular induction conductor 2 can be installed very close to each other, and the wiring inductance reducing effect and the electromagnetic radiation amount reducing effect can be enhanced.

FIGS. 7 and 8 are a side view and a top view showing a fifth embodiment of the main circuit portion of the power converter according to the present invention.

The embodiment shown in FIGS. 7 and 8 differs from the above-mentioned embodiments in that, as is apparent from FIG. 8, a common induction conductor 2 is arranged for a plurality of wiring conductors 1. Is. With such a configuration, an eddy current, which is a kind of an induced current, flows in the induction conductor 2 according to a temporal change of the current flowing in the wiring conductor 1, and the eddy current can reduce the inductance of the wiring conductor 1. Compared with the first embodiment, the number of the induction conductors 2 can be reduced with respect to the number of the wiring conductors 1, and the device manufacturing and assembling process can be reduced. Although not shown, since the induction conductor 2 has a floating potential, one end of high resistance is connected to the induction conductor 2 and the other end is connected to a reference potential so that electric charge is accumulated in the induction conductor 2. Can be prevented.

Next, the principle of this embodiment to reduce the inductance of the wiring conductor 1 below the self-inductance determined by the structure will be described as in the above embodiments.

FIG. 9 shows a wiring board 1 according to the present invention.
3 is a diagram for explaining the principle of reducing the inductance of FIG. As shown in this figure, when a time-varying current flows in the wiring conductor 1 in the direction indicated by the arrow 34, a magnetic field 32 is generated in the clockwise direction with respect to the arrow, and this magnetic flux chains the induction conductor 2. Cross. The interlinkage magnetic flux changes according to the instantaneous value of the current. As a result, as is known electromagnetically, an induced electromotive force is generated in the induction conductor 2 according to the temporal change of the interlinkage magnetic flux, and an induced current generated by the induced electromotive force and the resistance of the induction conductor 2 is generated. Flows into the induction conductor 2 as an eddy current 33.
The direction of the eddy current 33 is generated so as to create a repulsive magnetic field that cancels the interlinkage magnetic flux. Then, the combined current of each eddy current 33 flows immediately below the wiring conductor 1 and becomes the eddy current 33. The direction of this eddy current 33 is opposite to the current flowing through the wiring conductor 1. This is equivalent to the principle that the combined inductance of each wiring is reduced by the mutual inductance created by the opposite currents as described in the above-mentioned known example. The feature is that the effect of is produced equivalently.

10 and 11 are a side view and a top view showing a sixth embodiment of the main circuit portion of the power conversion device according to the present invention.

In FIGS. 10 and 11, an insulated gate bipolar transistor (hereinafter, I
The connection between the module 4 and the power supply 3 is shown, and the input and output terminals 12 of the IGBT module 4 are shown.
The positive electrode terminal 13 and the negative electrode terminal 13 of the power source 3 are connected using the wiring conductor 1. Here, the second induction conductor 2 is arranged above the wiring conductor 1 in parallel therewith. The IGBT inside the module 4 is turned on / off in response to a command from a control circuit (not shown). There are various control methods, whichever method is used, the current flowing from the power source 3 to the module 4 is passed or interrupted depending on whether the IGBT is turned on or off.
It becomes an intermittent pulsed current. The purpose of the present invention is to reduce the inductance of the wiring conductor 1 by the eddy current, which is a kind of the induced current, flowing through the induction conductor 2 according to the temporal change of the current.

One ends of the wiring conductor 1 and the induction conductor 2 are fixed to the terminal 13 of the power source by using the conductive collar 11 and the bolt 10, and the both conductors are electrically connected to the terminal 13. On the other hand, the other end of the wiring conductor 1 is the terminal 1 of the module 4.
2 is electrically connected to the induction conductor 2 above it.
Is fastened with bolts 8 using insulating collars 6 and 7, and the induction conductor 2 and the terminal 12 are electrically separated. Thus, one end of the induction conductor 2 is electrically connected, but the other end is electrically separated, which is important for passing an eddy current through this conductor. That is, the induction conductor 2 is connected to the terminal 12,
If it is connected to the inductor 13, the current flowing between the power source and the module flows through the induction conductor 2 like the wiring conductor 1, and the directions of the currents flowing through both conductors are the same. No decrease occurs. Although not shown, in addition to the wiring board structure utilizing the eddy current, a structure in which the wiring conductor 1 and the induction conductor 2 are thinned and a high resistance body 14 is laminated between the wiring conductor 1 and the induction conductor 2. There is a wiring board that has a structure. The high resistance element 14 does not need to insulate the wiring conductor 1 and the induction conductor 2 from each other because they have the same potential, and the resistance value is such that the current flowing through the wiring conductor 1 is not shunted to the induction conductor 2. I just need
It may be about 1 kΩ. With such a configuration, the interlinking magnetic flux interlinking with the induction conductor 2 changes according to the instantaneous value of the current, according to the temporal change of the current flowing through the wiring conductor 1. As a result, an induced electromotive force is generated in the induction conductor 2 according to the temporal change of the interlinkage magnetic flux.
An electric current generated by the resistance of the electric current flows into the induction conductor 2 as an eddy current. The combined current of the eddy currents reduces the inductance of the wiring conductor 1.

An important point in the above structure is the distance between the wiring conductor 1 and the induction conductor 2, and it is desirable to make this distance as narrow as possible. In this embodiment, since the wiring conductor 1 and the induction conductor 2 are electrically connected to the terminal 13 as described above, the potential of the induction conductor 2 is equal to that of the wiring conductor 1. When the potential of the induction conductor 2 is different from that of the wiring conductor 1, it is necessary to maintain the insulating properties of both conductors, and the distance between both conductors cannot be shortened to the insulation distance or less. However, in this embodiment, since both conductors have the same potential at the terminal 13, it is possible to make them closer than the insulation distance. This is important for maximizing the effect of the eddy current of the induction conductor 2.

The second important point is the width of the wiring conductor 1 and the induction conductor 2, and as shown in FIG. 11, the width of the induction conductor 2 is smaller than the width of the wiring conductor 1 as long as the space for mounting the wiring and the breakdown voltage allow. Increasing the size leads to an increase in the combined current of the eddy currents, widens the loop area formed by the combined currents, and increases the effect of mutual inductance due to the combined currents flowing immediately below the wiring current.

The third important point is the material of the induction conductor 2,
Copper or aluminum, which has excellent conductivity, is desirable. With such a good conductor, the eddy current that flows when the same magnetic flux is linked increases. On the other hand, copper is used for the wiring conductor 1 as in the case of a normal bus bar.

Next, the principle that the inductance of the wiring conductor 1 is reduced below the self-inductance determined by the structure in this embodiment will be described.

FIG. 12 is a view for explaining the principle of reducing the inductance of the wiring conductor 1 in the wiring board according to the present invention. As shown in this figure, when a time-varying current flows in the wiring conductor 1 in the direction indicated by the arrow 34, a magnetic field 32 is generated in the counterclockwise direction with respect to the arrow, and this magnetic flux causes the induction conductor 2 to flow. Interlink. The interlinkage magnetic flux changes according to the instantaneous value of the current. As a result, as is known electromagnetically, an induced electromotive force is generated in the induction conductor 2 according to the temporal change of the interlinkage magnetic flux, and a current generated by the induced electromotive force and the resistance of the induction conductor 2 is generated. The eddy current 33 flows through the induction conductor 2. The direction of the eddy current 33 is generated so as to create a repulsive magnetic field for canceling the interlinkage magnetic flux, and on the left side of the wiring conductor 1 in the figure, as shown by 33-1 in the counterclockwise direction, On the right side, it occurs clockwise as indicated by 33-2. When the eddy currents flowing in the induction conductor 2 are combined, the current flowing in the wiring conductor 1 is in the opposite direction immediately below the wiring conductor 1 as shown in FIG. This is equivalent to the principle that the combined inductance of each wiring is reduced by the mutual inductance created by the opposite currents as described in the above-mentioned known example. In the present invention, the mutual inductance is utilized by using the eddy current of the induction conductor 2. The feature is that the effect of is produced equivalently.

By the way, the relationship of FIG. 13 can be expressed as an electrical equivalent circuit as shown in FIG. In this figure, 35 corresponds to the wiring conductor 1 and 36 corresponds to the induction conductor 2. The relationship between the interlinkage magnetic flux that magnetically couples both conductors and the repulsive magnetic field is expressed equivalently by a transformer. Here, the resistance 38 that short-circuits both ends of 36 corresponding to the induction conductor 2 is the resistance of the induction conductor 2. Since the eddy current flows only near the surface of the resistor 38, it differs from the normal resistance value determined by the volume of the induction conductor 2. Here, if the value of the combined resistance 38 is increased to such an extent that the eddy current flowing in the electrical equivalent circuit 36 of the induction conductor 2 is not disturbed, the electrical equivalent of the wiring conductor 1 is obtained through the magnetic coupling represented by the transformer in the figure. The electromagnetic energy of the circuit 35 is thermally consumed by the combined resistance 38.
This means that the current caused by the electromagnetic energy of the wiring,
Alternatively, it is important for suppressing voltage oscillation. It is possible to increase the value of the combined resistance 38 in FIG. 14 by forming a hole 39 in the induction conductor 2 while avoiding directly under the wiring conductor 1 so as not to hinder the generation of eddy currents, as shown in FIG. Since the eddy current flows while avoiding this hole, its current path increases and the combined resistance 38 shown in FIG. 14 increases. Figure 1
With the structure as shown in FIG. 5, the electromagnetic energy accumulated in the inductance of the wiring conductor 1 is converted into heat by the induction conductor 2 and the vibration is suppressed, so that the noise of the circuit can be reduced.

16 and 17 are configuration diagrams showing an embodiment relating to the snubber circuit of the power conversion device according to the present invention. FIG. 16 is an external view of the snubber circuit portion, and FIG. 17 is FIG.
6 is a drawing in which the components and wirings included in 6 are drawn in a circuit diagram.

In FIGS. 16 and 17, the switching element is an IGBT, and this module is 19.
Hereinafter, the connection relationship of each component will be described with reference to the external view of FIG. 16, but the connection relationship is easy to understand with reference to the circuit diagram of FIG. The configuration of the snubber circuit shown in FIG. 16 is publicly known, and this embodiment is characterized by using this publicly known circuit as an example and using a wiring board using the above-mentioned induced current for the wiring of the snubber circuit. The snubber circuit itself may have any configuration.

First, in FIG. 16, the positive and negative terminals of the power supply 3 and the IGBT module 19 are connected. In this embodiment, the hatched wiring in FIG. 16 is the wiring board according to the present invention, and the wiring for connecting the power source and the module is normal wiring. The wiring board of the present invention may be used as shown in the examples. Two IGBTs are connected inside the module 19 in a serial bridge configuration. This bridge corresponds to one phase of a three-phase inverter used for driving a motor.

Next, the snubber circuit will be described. As shown in FIG. 17, a snubber circuit is provided for each of the upper and lower IGBTs of the bridge, and a series connection body composed of a capacitor 16 and a diode 17 that absorbs energy is connected to the input and output terminals of the upper and lower IGBTs. The terminals are connected in parallel. Further, the resistor 18 is connected from the connecting portion of the capacitor 16 and the diode 17 to the positive side or negative side terminal of the bridge. Here, each wiring of the series connection body including the capacitor 16 and the diode 17 and the wiring connecting the series connection body in parallel to the input / output terminal of the IGBT are the same as those described in the first to third embodiments. A wiring board having such a structure is used. Since the inductance of the wiring does not affect the connection of the resistor 18, the wiring may be a normal conductor.

In the above configuration, either the upper or lower IG
A case where the BT is turned off will be described. Here, the case where the IGBT above the bridge is turned off is taken as an example.
First, assuming that the IGBT is in the ON state, at this time, since the capacitor 16 is connected to the positive and negative terminals of the power source 3 via the resistor 18, its voltage is equal to the voltage of the power source 3. The IGBT above the bridge supplies current to a load (not shown). Next, this IGBT
When an attempt is made to turn off in accordance with a control command (not shown), the current flowing in the IGBT is commutated to the snubber circuit provided in parallel with the element. At this time, the current flowing into the snubber circuit reaches the capacitor 16 through the inductance L1 of the wiring board, then flows into the diode 17 through the inductance L2 of the second wiring board, and finally from the diode to the third wiring board. Flows through the inductance L3 of the above into a load (not shown). That is, the current commutated to the snubber circuit passes through the three wiring boards.

In the conventional snubber circuit, the inductance of the wiring did not become smaller than the value determined by the shape of the wiring. Therefore, the total value of the wiring inductance of the snubber circuit had a value of at least several hundreds nH. Since the time change of the current flowing into the snubber circuit is equal to the current cutoff speed of the IGBT, the IGBT having a high switching speed reaches several kA / μs. As a result, at the moment when the current flows into the snubber circuit, a spike voltage represented by Ldi / dt is generated across the wiring inductance,
The value was several hundred V to a value close to 1 kV. The capacitor 16 is connected to the spike voltage between the input and output terminals of the IGBT.
A voltage obtained by adding the charging voltage of 1 was applied, resulting in a very high overvoltage, and stress was applied to the element. In particular, IG
Since the BT is in the middle of shutting off the current, the IGB
Since T can apply an overvoltage at the same time while flowing a current, the instantaneous energy generated by the product of the two causes IGB
There was a possibility that T would be destroyed.

In the embodiment of FIG. 16, since the wiring board utilizing the induced current described in the first to fourth embodiments is used for the wiring of the snubber circuit as described above, the snubber circuit is not supplied with the current. It responds to the time change when commutating without delay,
The inductance of the wiring can be reduced and the spike voltage can be suppressed. In particular, if the time change of the current is the above value, the equivalent frequency is several MHz, and since the induced current is generated by the time change of the interlinking magnetic flux corresponding to this high frequency, the repulsive magnetic field is large and the wiring board The combined inductance of the wiring conductor 1 is about 1 / of the original self-inductance.
It is reduced to 2. That is, the generated spike voltage is also halved, and the merit of reducing the stress of the IGBT is very large.

When the wiring length depends on the shape of the circuit component as in the present embodiment, a foil-shaped wiring board is effective, and the wiring board can be used by bending and bending.
The wiring length can also be shortened.

18 and 19 are a front view and a side view showing an embodiment of a snubber module for a power converter according to the present invention.

In this embodiment, the wiring of the snubber circuit shown in FIG. 16 is integrated on one resin substrate 25.
This embodiment is an application of the embodiment shown in FIG. 5 described above, and is an example in which wiring hatched in FIG. Of course, as in FIG. 5, the foil corresponding to the induction conductor 2 is in the floating potential state. By performing the integration in this way, the wiring length can be shortened and the inductance can be reduced. 20 is a configuration diagram showing an embodiment of a power module for a power conversion device according to the present invention, and FIG. 21 shows components mounted inside the module of FIG. 20 in an electric circuit.

In FIG. 20, the power module has a board portion 28 to which the diode 26 and the transistor 27 are attached, and a wiring 31 for connecting a predetermined position of the board portion 28 and a terminal provided on the outer surface of the module. The method of mounting the board portion 28 and each element mounted thereon is the same as that of the conventional module. That is, first, on the substrate 28, an insulating ceramic plate 29 such as AlN is formed.
Are fixed by solder, and the foil conductor 30 for connecting the electrodes of the diode 26 and the transistor 27 is fixed on the insulating ceramic plate 29, and the transistor 27 and the diode 2 are fixed.
Each electrode of 6 and the foil conductor 30 are electrically connected by a bonding wire.

The feature of this embodiment is that the wiring board to which the eddy current shown in the sixth embodiment is applied is used for the wiring connecting the electrodes provided on the board 28 to the terminals on the outer surface of the module. is there. According to the present embodiment, an eddy current flows through the induction conductor 2 provided in the wiring 31 in accordance with the change over time of the current generated when the transistor 27 and the diode 26 are respectively switched, and thus the fifth embodiment described above. Similarly, the combined inductance of the wiring 31 with respect to the wiring conductor 1 is reduced by the effect of the eddy current. This reduction in inductance is effective in reducing spike voltage, reducing noise by suppressing voltage oscillation, and reducing loss by reducing electromagnetic energy in wiring, as in the above-described embodiments. In addition, since the voltage value applied to the transistor 27 and the diode 26 is reduced as the inductance is reduced, the switching loss of these elements is also reduced, and as a result, the components related to heat dissipation of the module may be reduced in size or cost. is there. Although the present embodiment has been described with respect to the power module in which one phase of the inverter device is incorporated, the present invention can naturally be applied to other semiconductor modules.

FIG. 22 is a block diagram showing an embodiment of a power module for a power converter according to the present invention.
22 shows the components mounted inside the module of FIG. 22 in the form of an electric circuit.

In FIG. 22, the power module is provided with a substrate portion 28 in which a set of a diode 26 and a transistor 27 is mounted in parallel, and a wiring 31 for connecting a predetermined position of the substrate portion 28 and a terminal provided on the outer surface of the module. The mounting method of the board portion 28 and each element mounted thereon is the same as that of the conventional module. That is, first, an insulating ceramic plate 29 of AlN or the like is fixed on the substrate 28 by soldering, and a foil conductor 30 for connecting electrodes of the diode 26 and the transistor 27 is fixed on the insulating ceramic plate 29, so that the transistor 27 is formed. The electrodes of the diode 26 and the foil conductor 30 are electrically connected by bonding wires.

The feature of this embodiment is that the wiring board applying the eddy current shown in the sixth embodiment is used for a part of the wiring connecting the electrodes provided on the board portion 28 to the terminals on the outer surface of the module. This is to equalize the currents flowing through the sets of transistors 27 and diodes 26. According to the present embodiment, according to the time change of the current generated when the transistor 27 and the diode 26 are respectively switched,
The eddy current flows in the induction conductor 2 provided in a part of the wiring 31, and the wiring 3 is generated by the effect of the eddy current as in the sixth embodiment.
1 reduces the combined inductance of the wiring conductor 1. Due to this inductance reduction, the transistor 2
The combined inductance of the wiring 31 to 7-1 and the inductance of the wiring 31 to the transistor 27-2 are equalized, which can contribute to equalizing the currents flowing through the groups of the transistors 27 and the diode 26, spike voltage and switching. It can also contribute to loss equalization. As a result, it is possible to contribute to the safe operation of the module.
Although the present embodiment describes the power module in which the set of the diode 26 and the transistor 27 is connected in parallel, the present invention can be naturally applied to other semiconductor modules.

FIG. 24 is a diagram showing an embodiment of a power module for a power converter according to the present invention, and is a top view showing a part of the module. 25 is a side view of FIG. 24.

In FIG. 24, the power module is a substrate portion 28 to which a transistor 27 and a diode are attached.
And a foil conductor 30 provided at a predetermined position on the substrate portion 28.
And a wiring for connecting terminals provided on the outer surface of the module, and the method of mounting the board portion 28 and each element mounted thereon is the same as that of the conventional module.
That is, first, an insulating ceramic plate 29 of AlN or the like is fixed on the substrate 28 by soldering, and a transistor 27 or a foil copper body 30 for connecting an electrode of a diode is fixed on the insulating ceramic plate 29. The electrodes of the diode and the copper foil 30 are electrically connected by the bonding wires 47.

The feature of this embodiment is that the semiconductor, the foil conductor 30,
The insulating layer 1 covers the upper surface of the bonding wire 47.
That is, the induction conductor 2 in which 4 is stacked is provided. Although not shown, the induction conductor 2 is provided with a hole 39 for passing a wire connecting the module external terminal and the foil conductor 30 and a hole 39 for passing a gel material which flows into the module when the module is assembled. According to this embodiment, the transistor 2
7 and an eddy current is generated in the induction conductor 2 in accordance with a temporal change of the current generated when the diode is switched, and the wiring of the foil conductor 30 and the bonding wire 47 is caused by the effect of the eddy current as in the fifth embodiment. Inductance can be reduced. In particular, since the induction conductor 2 is arranged close to the bonding wire 47 as shown in FIG. 30, it is possible to contribute to the reduction of the wiring inductance of the bonding wire 47 due to the eddy current. By reducing the inductance, the spike voltage can be reduced as in the above-described embodiments.
It is effective in reducing noise by suppressing voltage oscillation and reducing loss by reducing electromagnetic energy in wiring. In addition, since the voltage value applied to the transistor 27 is reduced as the inductance is reduced, the switching loss is also reduced, and as a result, there is a possibility that the components related to the heat radiation of the module can be downsized or reduced in cost. Although the present embodiment has been described with respect to a part of the power module in which the transistor 27 is connected in parallel, the present invention can be naturally applied to the entire module and can be naturally applied to other semiconductor modules.

FIG. 34 is a block diagram showing an embodiment of a power module for a power converter according to the present invention, and FIG.
34 shows components mounted inside the module of FIG. 34 in the form of an electric circuit, and FIG. 36 shows a part of the cross section of FIG.

In FIG. 34, the power module has a substrate portion 28 to which a diode 26 and a transistor 27 are attached, and wirings 51, 52 and 5 for connecting a predetermined position of the substrate portion 28 and a terminal provided on the outer surface of the module.
3, 54, and the mounting method of the board portion 28 and each element mounted thereon is the same as that of the conventional module. That is, on the substrate 28, first, an insulating ceramic plate 29 such as AlN is formed to insulate the substrate 28 from the mounted circuit.
Is fixed by solder or an insulating resin or the like is fixed, and the diode 2 is mounted on the insulating ceramic plate 29.
6 and the foil conductor 30 for electrode connection of the transistor 27 are fixed, and each electrode of the transistor 27 and the diode 26 and the foil conductor 30 are electrically connected by a bonding wire.

The feature of this embodiment is that the wirings 51, 52, 53, 5 connecting the electrodes 30 to the terminals on the outer surface of the module are connected.
4 is arranged close to and parallel to the substrate 28 to a predetermined position. In particular, the wirings 51, 52, 5 shown in FIG.
The distance d46 between 3, 54 and the substrate 28 is set to 3 mm or less so that at least the reduction rate of the inductance is 60% or more from the experimental results of FIG. According to this embodiment,
In accordance with the change over time of the current generated when the transistor 27 and the diode 26 are respectively switched, an eddy current flows directly under the wiring in the substrate 28 similarly to the principle shown in FIG. 9, and its equivalent circuit is shown in FIG. As shown, the combined inductance of the wirings 51, 52, 53, 54 with respect to the substrate 28 is reduced. By reducing the inductance, the spike voltage can be reduced as in the above-described embodiments.
Noise can be reduced by suppressing the voltage oscillation, and malfunctions due to electromagnetic coupling between the semiconductor control wirings 51 and 52 and the semiconductor input / output wirings 53 and 54 can be suppressed. Further, by reducing the electromagnetic energy of the semiconductor input / output wirings 53 and 54, it is effective in reducing the loss, and the voltage value applied to the transistor 27 and the diode 26 at the time of switching is reduced,
The loss generated in these semiconductor elements will be reduced. Therefore, there is a possibility that the components related to the heat radiation of the module can be downsized or the cost can be reduced. Although the present embodiment has been described with respect to the power module having the built-in parallel circuit of the switch element and the diode used in the inverter device, the present invention can be naturally applied to other semiconductor modules.

FIG. 26 is a top view showing an embodiment of the control circuit board for the power converter according to the present invention. Figure 2
7 is a side view of FIG.

Although not shown in FIG. 26, the control circuit board 50 (hereinafter referred to as the printed wiring board 50) has a driver circuit for driving the power semiconductor element and a microcomputer for controlling the driver circuit. Further, a peripheral circuit, a power supply for a control circuit and the like are mounted, and the mounting method is the same as that of the conventional printed wiring board. That is, the foil conductor 30 is laminated on the printed wiring board 50, and the circuit components 49 are fixed to the foil conductor 30 to form a control circuit.

The feature of this embodiment is that jumper wiring is performed on the printed wiring board 50 using the wiring board to which the eddy current shown in the sixth embodiment relating to the main circuit wiring is applied. The wiring board using this eddy current is the induction conductor 2
Insulators 14 are laminated on both sides of the printed wiring board 5
The wiring conductor 1 is fixed to the upper surface of the insulator 14 provided on the side not in contact with 0, and each connection terminal 5 is connected.
Although not shown, the induction conductor 2 may have a configuration in which it is electrically contacted with one end of the connection terminal 5. According to the present embodiment, in order to switch the power semiconductor element, it is necessary to supply drive power from the driver circuit to the power semiconductor element, and at the time of switching, the control circuit, particularly the power wiring to the driver circuit and the signal to the power semiconductor element. A current that changes with time due to switching flows through the wiring. When the jumper wiring using the eddy current is used for these wirings, the wiring inductance can be reduced by the effect of the eddy current as in the sixth embodiment relating to the main circuit, and the interference with other control signal wirings can be prevented. It can be reduced. As a result, the malfunction of the control circuit can be reduced, and a highly reliable power converter can be configured.

Next, a method of manufacturing the wiring board according to the present invention described in the above embodiment will be described. 28, 29,
FIG. 30 is a side view and a configuration diagram showing the wiring board and the manufacturing method.

FIG. 28 is a side view of the wiring board. The wiring conductor 1 and the insulator 14 or the high resistance body 14 and the induction conductor 2 are shown in FIG.
FIG. 3 is a side view showing a part of a wiring board in which the wirings are arranged in parallel. Although not shown, the connection terminal is formed by a method using a bolt, solder bonding, bonding, or the like. FIG. 29 shows a manufacturing method by thermocompression bonding using a roller, and although not shown, the roller 44 is provided with a heater. Roller 44 in a heated state
Then, the wiring conductor 1 and the insulator 14 or the high resistance body 14 and the induction conductor 2 whose adhesive surfaces are coated with a thermosetting adhesive are overlapped and inserted, and thermocompression-bonded to fix them. FIG. 30 shows a manufacturing method by thermocompression bonding using a press machine, and although not shown, the press machine 45 is provided with a heater. The wiring machine 1 and the insulator 14 whose adhesive surfaces are coated with a thermosetting adhesive are applied to the press machine 45 in a heated state.
Alternatively, the high-resistance element 14 and the induction conductor 2 are superposed on each other, placed on a press plate, and thermocompression bonded to fix them.

The present invention described in all the above-mentioned embodiments can naturally be applied to a power converter using another power semiconductor element such as a gate turn-off thyristor.

[0092]

As described above, according to the present invention, the inductance of the wiring for electrically connecting the power converter can be significantly reduced. As a result, the spike voltage applied to the power element can be reduced, which contributes to the safe operation of the element and reduces the electromagnetic energy of the wiring. As a result, the snubber circuit loss is reduced and the voltage and current oscillations are reduced. It is possible to suppress the noise to reduce the noise and reduce the electromagnetic radiation noise. Further, it has various effects such as reduction of switching loss of elements and miniaturization of heat radiation fins, and it is possible to realize advantageous characteristics for each power conversion device.

[Brief description of drawings]

FIG. 1 is a side view of a main circuit showing an embodiment of a power conversion device of the present invention.

FIG. 2 is a top view of FIG.

FIG. 3 is a diagram illustrating the principle of inductance reduction of FIG. 1.

FIG. 4 is a wiring side view showing an embodiment of the power conversion device of the present invention.

FIG. 5 is a wiring side view showing an embodiment of the power conversion device of the present invention.

FIG. 6 is an external view of a main circuit showing an embodiment of the power conversion device of the present invention.

FIG. 7 is a wiring side view showing an embodiment of the power conversion device of the present invention.

FIG. 8 is a top view of FIG.

9 is a diagram for explaining the principle of inductance reduction in FIG. 7. FIG.

FIG. 10 is a side view of a main circuit showing an embodiment of the power conversion device of the present invention.

11 is a top view of FIG.

12 is a diagram illustrating the principle of inductance reduction of FIG.

FIG. 13 is a top view of FIG.

FIG. 14 is an equivalent circuit diagram of FIG.

15 is a diagram illustrating the principle of inductance reduction of FIG.

FIG. 16 is an external view of a snubber circuit showing an embodiment of the power converter of the present invention.

FIG. 17 is included in FIG.

FIG. 18 is a front view of a snubber module showing an embodiment of the power converter of the present invention.

FIG. 19 is a side view of a snubber module showing an embodiment of the power converter of the present invention.

FIG. 20 is a configuration diagram of a power module showing an embodiment of the power conversion device of the present invention.

FIG. 21 is a circuit diagram showing the components and wiring of FIG.

FIG. 22 is a configuration diagram of a power module showing an embodiment of the power conversion device of the present invention.

FIG. 23 is a circuit diagram showing the components and wiring of FIG. 22.

FIG. 24 is a top view of a power module showing an embodiment of the power conversion device of the present invention.

FIG. 25 is a side view of FIG. 24.

FIG. 26 is a top view of a control circuit board showing an embodiment of the power conversion device of the present invention.

FIG. 27 is a side view of FIG. 26.

FIG. 28 is a sectional view of the wiring board of the present invention.

FIG. 29 is a configuration diagram showing a method for manufacturing a wiring board of the present invention.

FIG. 30 is a configuration diagram showing a method for manufacturing a wiring board of the present invention.

FIG. 31 is a configuration diagram of a wiring board used for an experiment of the wiring board of the present invention.

32 is a graph showing the experimental results of FIG.

FIG. 33 is a graph showing the experimental results of FIG. 31.

FIG. 34 is a configuration diagram of a power module showing an embodiment of the power conversion device of the present invention.

FIG. 35 is a circuit diagram showing the components and wiring of FIG. 34.

FIG. 36 is a side view of FIG. 34.

[Explanation of symbols]

1, 15, 43 ... Wiring conductors, 2, 40 ... Induction conductors, 3 ...
Power supply, 4, 19 ... IGBT module, 5, 9 ... Connection terminal,
6, 7 ... Insulation collar, 8, 10 ... Tightening bolts, 11
... conductive color, 12, 13 ... terminals, 14 ... high-resistance body (insulator), 16 ... snubber capacitor, 17 ... snubber diode, 18 ... resistance, 20 ... terminals C1, 21 ... terminals E1, 22 ... terminal C2, 23 ... Terminal E2, 24 ... Terminal E
1-C2, 25 ... Resin substrate, 26 ... Diode, 27 ...
Transistor, 28 ... Substrate part, 29 ... Insulating ceramic plate, 30 ... Foil conductor, 31-1 ... Connection wiring to power terminal C1, 31-2 ... Connection wiring to load output terminal E1-C2,
31-3 ... Wiring for connecting to the power terminal E2, 31-4 ... Wiring for connecting to the power terminal C, 31-5 ... Wiring for connecting to the power terminal E, 32 ... Magnetic field created by current of wiring, 33 ... Eddy current, 34
... loop current, 35 ... electrical equivalent circuit of wiring conductor 1, 3
6 ... Electrically equivalent circuit of induction conductor 2, 37 ... Arrow indicating the direction of flow of induced current (combined eddy current), 38 ... Combined resistance, 39 ... Hole, 41 ... Counter magnetic field, 42 ... Induced current and its flow Direction arrows, 44 ... Roller, 45 ... Press machine, 46 ... Interval d, 47 ... Bonding wire, 48 ... Module case, 49 ... Control circuit component, 50 ... Printed circuit board, 51 ... Semiconductor control input wiring, 52 ... semiconductor control output wiring, 53 ... semiconductor input wiring, 54 ... semiconductor output wiring.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuo Kato 7-1-1 Omika-cho, Hitachi-shi, Ibaraki Hitachi Ltd. Hitachi Research Laboratory (72) Inventor Junzo Kawakami 7-chome, Omika-cho, Hitachi-shi, Ibaraki No. 1 in Hitachi Research Laboratory, Hitachi, Ltd. (56) Reference JP-A-8-149795 (JP, A) JP-A-8-126302 (JP, A) JP-A-6-231625 (JP, A) JP Flat 8-88966 (JP, A) Actual development Sho 63-159867 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H02M 1/00-3/44

Claims (16)

(57) [Claims] 1. A plurality of wiring conductors, which connect elements constituting a circuit and through which a time-varying current flows, are insulated from the wiring conductors, are close to the wiring conductors, and are connected to the wiring conductors. possess a separate conductor is parallel-arranged the wiring conductors, another conductor to the wiring conductor, a loop the circuit is formed
The same loop shape as that of the wiring conductor, and a shape of a conductor different from the plurality of wiring conductors and the wiring conductor.
The wiring board is characterized by a plate shape . 2. The wiring board according to claim 1, wherein the plurality of wiring conductors and a conductor other than the wiring conductors have a plate shape thickness of 0.5 mm or less. 3. The wiring conductor according to claim 1 or 2 , wherein the plurality of wiring conductors are different from the wiring conductors.
A wiring board, wherein the wiring conductor and an insulating portion for insulating between the wiring conductor and a conductor different from the wiring conductor are laminated and formed, and arranged. 4. The loop-shaped wiring conductor formed by the plurality of wiring conductors according to claim 1 , and the loop for the loop-shaped wiring conductor. A wiring board, wherein a conductor different from a loop-shaped wiring conductor formed of another conductor is arranged inside or outside of the wiring board so as to cover the upper surface or the lower surface. 5. Any one of claims 1 to 4
The wiring board according to the item 1, wherein the other conductor and the reference potential are connected by a resistor. 6. The wiring board according to claim 5, wherein the resistance of the resistor is 1 kΩ or more. 7. A first terminal connected to the element, a second terminal connected to another element different from the element, and a connection between the first terminal and the second terminal. A wiring conductor that allows a time-varying current to flow, a plate-shaped conductor plate that is arranged in parallel with the wiring conductor, and an insulating portion that electrically insulates the wiring conductor and the plate-shaped conductor plate. And the width of the plate-shaped conductor plate is larger than the width of the wiring conductor. 8. The wiring board according to claim 7, wherein the conductor plate, the insulating portion, and the plate-shaped conductor plate are formed and arranged in a laminated manner. 9. The wiring board according to claim 7 or 8 , wherein the plate-shaped conductor plate is a substrate having a resistance value of 1 kΩ or more. 10. The method according to any one of claims 7 to 9 , wherein the plate-shaped conductor plate is electrically connected to either the first terminal or the second terminal. Wiring board characterized by having. 11. The insulating portion according to claim 7 , wherein the insulating portion covers either the wiring conductor or the plate-shaped conductor plate, and the wiring conductor and the wiring conductor are connected to each other. A wiring board, characterized in that it is arranged so as to overlap with the plate-shaped conductor plate with the insulating portion interposed therebetween. 12. A wiring board according to claim 7 , wherein the wiring conductor and the plate-shaped conductor plate have a thickness of 0.5 mm or less. 13. A wiring board according to claim 7 , wherein the plate-shaped conductor plate has holes. 14. A wiring conductor for connecting an input portion or an output portion of an element of a power conversion device for controlling passage or interruption of a current supplied from a power source to a load, and the wiring conductor. Is electrically insulated, and has a plate-shaped induction conductor that generates an induction current based on the current flowing in the wiring conductor, and the wiring conductor and the plate-shaped induction conductor are laminated via an insulating member. The electric power conversion device is characterized in that the width of the plate-shaped induction conductor is wider than the width of the wiring conductor, and the inductance of the wiring conductor is reduced by the current flowing through the wiring conductor. 15. A snubber circuit connected in parallel between an input section and an output section of a power semiconductor element of a power conversion device for controlling the flow and interruption of a current supplied from a power source to a load, the snubber circuit comprising: A wiring conductor that connects between the elements of the circuit, and a wiring conductor that is electrically insulated from the wiring conductor, and has a plate-shaped induction conductor that generates an induced current based on the current flowing in the wiring conductor, and the wiring conductor, The plate-shaped induction conductor is laminated via an insulating member, the width of the plate-shaped induction conductor is wider than the width of the wiring conductor, and the inductance of the wiring conductor is reduced by the current flowing through the wiring conductor. A power converter characterized by the above. 16. A wiring conductor for connecting a terminal portion of a module having a built-in power semiconductor element of a power conversion device for controlling the flow and interruption of a current supplied from a power source to a power semiconductor element, the module comprising: Has a metal substrate and an insulating layer on the metal substrate and a foil conductor fixed to the metal substrate, the power semiconductor element is fixed to the foil conductor, the wiring conductor is formed of the same conductor as the terminal portion, The foil conductor is connected from the terminal portion, the wiring conductor is arranged in parallel to the metal substrate of the module up to a predetermined foil conductor or the vicinity of the power semiconductor, and the distance from the metal substrate is 3 mm or less. A power conversion device characterized in that the inductance of the wiring conductor is reduced by a current flowing through the wiring conductor.