JP3355685B2 - Electronic component insertion device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting apparatus for automatically inserting an axial electronic component into a predetermined hole of a printed circuit board used for electronic equipment and the like.

[0002]

2. Description of the Related Art A conventional electronic component insertion apparatus has a configuration as shown in FIG. That is, a pair of lead wires 2a, 2b led out to both ends of the electronic component 1 are pressed by a pair of pushers 6a, 6b and levers 7a, 7b corresponding thereto, and a pair of movable cutters 3a, 3b and a pair of fixed cutters are pressed. 4a, 4b, the pair of guides 5a, 5b is lowered, and the lead wires 2a, 2b are aligned with the guide grooves provided in the guides 5a, 5b, so that the lead wires 2a, 2b are cut.
b is bent, that is, formed into an insertion shape. afterwards,
The levers 7a and 7b swing to the rear side in FIG. 4, and the electronic component 1 held by the guide grooves is inserted into the printed board by the lowering of the pushers 6a and 6b.

[0003]

However, in the conventional configuration as described above, when the shape of the guide groove is set to the maximum lead wire diameter as shown in FIGS. 6 (a) and 6 (b), When molding an electronic component having a small lead wire diameter as shown in c) and (d), the lead wire is formed in a C-shape, and as shown in FIG. 7B, the pushers 6a and 6b are lowered to lead wires. When the lead wires 2a and 2b come out below the guides 5a and 5b, the lead wires 2a and 2b spread, and the lead wire 2
a, 2b cannot be inserted.

As shown in FIG. 8 (b), when the lead wire diameter is small, the lead wires 2a, 2b and the guides 5a, 5
b was point contact and could not be held by the guide groove, and the electronic component was inclined or dropped before or during the lowering of the pusher, so that the lead wire could not be inserted into the insertion hole.

On the other hand, when the shape of the guide groove is set to the minimum lead wire diameter, the guides 5a and 5b are independent of the levers 7a and 7b in the lateral direction in order to form an electronic component having a large wire diameter. There was a problem that a movable mechanism was required and the device became complicated.

[0006] The present invention is to solve the above problems,
It is an object of the present invention to provide an electronic component insertion device capable of stably inserting an electronic component into a predetermined position without being affected by a lead wire diameter of the electronic component to be inserted.

[0007]

To achieve the above object, an electronic component insertion device according to the present invention comprises a pair of pushers and a pair of levers for holding a pair of leads of an electronic component, and a pair of levers for cutting the leads. Movable cutter and a pair of fixed cutters
And Potter, a pair of guides and for forming a lead wire
A pair of guide grooves provided on the guide, a pair
Each guide can be divided around the bottom of the guide groove
The width of the guide groove according to the wire diameter of the lead wire.
It is characterized in that it is changed while keeping the contact state with the contact .

Further, as another means, the electronic component insertion device of the present invention comprises a pair of pushers and a pair of levers for sandwiching a pair of leads of the electronic component, a pair of movable cutters and a pair of movable cutters for cutting the leads . A fixed cutter , a pair of guides for forming a lead wire, and a
A pair of guide grooves, and divide the pair of guides into three parts, and change the width of the guide grooves according to the diameter of the lead wire.
At the same time, contact the lead wire with the guide at three points
It is characterized by being pinched .

[0009]

In the configuration of the electronic component insertion device, since the width of the guide groove changes according to the lead wire diameter of the electronic component,
The bending angle of the lead wire can be made constant without being affected by the lead wire diameter.

As another operation, the lead wire can be stably held by the guide groove by sandwiching the lead wire with the guide, and the electronic component can be inserted without falling or falling before or during the lowering of the pusher. It is possible to do.

[0011]

(Embodiment 1) A first embodiment of the present invention will be described below with reference to FIGS.

FIGS. 1A and 1B show one side of a pair of guides according to the present invention. 9a and 9b are guides, and 10 is a spring. As shown in FIG. 1C, guides 9a and 9b
Is divided at the bottom of the guide groove, and is adjusted to the one having the smallest lead wire diameter in a state where the guides 9a and 9b are in contact with each other. As shown in FIG. 1D, when the lead wire diameter is increased, the guides 9a and 9b are separated and the guide grooves are widened, and the width of the guide grooves is fixed by a spring 10.

FIGS. 2A to 2D show the molding operation of the present invention. As shown in FIGS. 2A and 2B, when the lead wire diameter is small, guides 9a, 9b and 9c, 9d
Are in contact with each other, but as shown in FIGS. 2C and 2D, when the wire diameter is large, the guides 9a and 9b and the guides 9c and 9d expand by the wire diameter and the wire diameter is large. Enables molding of electronic components.

(Embodiment 2) A second embodiment of the present invention will be described below with reference to FIGS. 3 (a) and 3 (b).

In FIGS. 3A and 3B, 11a, 1
Reference numerals 1b and 11c denote divided guides, and reference numeral 2 denotes a lead wire. The lead wire 2 is vertically sandwiched between the guides 11a and 11b from both sides, and the lead wire 2 and the guide 11c are brought into contact with each other, so that the formed shape can be made constant.

(Embodiment 3) A third embodiment of the present invention will be described below with reference to FIG.

In FIG. 4, 12a and 12b are guides,
13 is a feed screw. In the configuration of the first embodiment of the present invention, the guide groove is changed not by the spring but by the feed screw 13, and the width of the guide groove is set in advance by the feed screw 13. The feed screw 13 is a left screw in the portion 12a and a right screw in the portion 12b. By turning the feed screw 13, the field of the guide groove can be changed. In addition, by connecting the rotary drive to the feed screw, it is possible to change the width of the guide groove to data of the wire diameter set in advance or data of the wire diameter measured at the time of insertion.

[0018]

As is clear from the above embodiment, the present invention is not limited to the lead wire diameter by switching the width of the guide groove according to the lead wire diameter when forming the lead wire of the electronic component. Molding can be performed under the same conditions, the holding by the guide is stabilized, and the electronic component can be stably inserted into a predetermined position.

[Brief description of the drawings]

1A is a front view of a guide according to a first embodiment of the present invention; FIG. 1B is a plan view of the embodiment; FIG. Operation explanation diagram

FIG. 2A is a front view of a main part of an electronic component insertion device according to a first embodiment of the present invention; FIG. 2B is a plan view of the main part; FIG. Front view (d) Plan view

3A is a plan view of a guide according to a second embodiment of the present invention. FIG. 3B is a plan view of a guide according to a second embodiment of the present invention.

4A is a front view of a guide according to a third embodiment of the present invention, and FIG.

FIG. 5 is a front view of a conventional electronic component insertion device.

6A is a front view showing the operation of the guide in the conventional configuration. FIG. 6B is a plan view of the same. FIG. 6C is a front view showing the operation of the guide in the conventional configuration.

FIG. 7A is a diagram illustrating a problem in a conventional configuration. FIG. 7B is a diagram illustrating the problem.

8A is an explanatory view of a problem in the conventional configuration. FIG. 8B is an explanatory view of the same problem.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electronic component 2, 2a, 2b Lead wire 3a, 3b Movable cutter 4a, 4b Fixed cutter 5a, 5b, 9a, 9b, 9c, 9d, 11a, 11
b, 11c, 12a, 12b Guide 6a, 6b Pusher 7a, 7b Lever 8 Printed circuit board 10 Spring 13 Feed screw 14 Insertion hole

Continued on the front page (72) Inventor Hideaki Watanabe 1006 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. A pair of lead wires of a leaded component are sandwiched.
A pair of pushers and a pair of levers, and the lead wire.
A pair of cuttingMovablecutterAnd a pair of fixed cutters
And a pair of guides for forming the lead wire and a guide thereof.
A pair of guide grooves provided in theversusGuy of
Each of the guides can be divided around the bottom of the guide groove
The width of the guide groove according to the diameter of the lead wire.
It is characterized by changing while keeping the contact state with the wire
Electronic component insertion device. 2. A pair of pushers and a pair of levers for sandwiching a pair of leads of a component, a pair of movable cutters and a pair of fixed cutters for cutting the leads, a pair of guides for forming the leads, and a pair of guide grooves provided on the guide, said divided into three parts with a pair of guides, at the same time varying the width of the guide groove in accordance with the wire diameter of the lead wire, 3 the lead wire guide An electronic component insertion device characterized by being held in contact at a point.