JPH02151100A - Cutting/forming equipment for electronic parts lead - Google Patents

Abstract

PURPOSE:To remove restriction conditions for object parts and object boards by a method wherein a small unit is constituted of a cutting blade part and a forming part, different small units having the same constitution are arranged so as to face each other and have a variable interval, and the interval between the cutting blade part and the forming part is made variable. CONSTITUTION:A small unit 3 of one side is constituted by combining a forming part 1 and a cutting blade part 2. A small unit 6 forming a pair together with the small unit 3 is similarly constituted of a forming part 4 and a cutting blade part 5. The interval of these small units 3 and 6 can be varied. The interval between the forming parts 1 and 4, and the interval between the cutting blade part 2 and 5 are also made variable. Thereby, the length of a lead leg bent at the time of formation becomes variable, so that flexible correspondence with the size of electronic parts body diameter and the board thickness is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a cutting/forming device for electronic component lead wires of an electronic component automobile insertion device.

(Prior Art) As shown in FIG. 6, a conventional electronic component lead wire cutting/forming device has a cutting blade section 11, 12 and a forming section 13, 14 that face each other and are configured to move integrally. The spacing between the small units was changed according to the insertion pitch. In other words, when the insertion pitch is narrow (Pl), Fig. 2 (a
), when the insertion pitch was wide (P2), the mutual spacing was changed as shown in FIG. 2(b).

(Problems to be Solved by the Invention) According to the above-mentioned conventional method, although the insertion pitch can be accommodated by setting an arbitrary interval, the distance between the fulcrum part of molding and the cutting part is fixed, so after molding The length Q of the bent lead wire leg is fixed, and for example, for electronic parts with large body diameters or thick circuit boards, the length Q of the bent lead wire legs is fixed. As shown in d), there is a possibility that the tip of the lead wire protrudes from the bottom surface of the board, making it impossible to clinch the lead wire, which limits the range of parts that can be inserted and the board that can be inserted.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component lead wire cutting/forming apparatus that eliminates the conventional drawbacks and eliminates restrictions on target parts and target boards.

(Means for Solving the Problems) The electronic component lead wire cutting/forming device of the present invention includes a cutting blade section and a forming section for electronic component lead wires, forming one small unit, and having the same configuration as this small unit. The other small units are arranged so as to face each other and at a variable interval from each other, and the cutting blade part and the molding part are arranged at a variable interval from each other.

(Function) According to the present invention, since the distance between the cutting blade part and the molding part is variable, when the diameter of the electronic component body is large or the thickness of the printed circuit board is thick, the cutting blade part and the molding part can be The distance between the molded parts is made long, and the length of the bent lead wire after molding is made long, so that clinch can be formed on the bottom surface of the substrate.

(Example) An example of the present invention will be described based on FIGS. 1 to 5.

FIG. 1 is an explanatory diagram of the operation of the electronic component lead wire cutting/forming apparatus of the present invention. In the figure, 1 is a molding part and 2 is a cutting blade part, and these two parts are combined to form a small unit 3 on one side. Further, a small unit 6 is configured to be paired with the small unit 3, and similarly consists of a molded part 4 and a cutting blade part 5, and the distance between these small units 3 and 6 can be varied. Furthermore, the distance between the molding parts 1 and 4 and the cutting blade parts 2 and 5 can be varied.

The length of the bent lead wire after molding is equal to the distance between the molding fulcrum 7 and the cutting blade 8, as shown in FIG.

Therefore, when the diameter of the electronic component body is large or the thickness of the board is thick as shown in Figures 2(e) and (d), there is little space for the lead wire tips to protrude from the bottom of the board, and there is sufficient lead wire. Can't clinch. Therefore, as shown in FIG. 4, the distance between the molded parts 1, 4 and the cutting blade parts 2, 5 is increased.

When the lead wires of electronic components are cut and molded, a length sufficient to clinch the lead wires from the bottom surface of the board can be secured, as shown in FIG.

Note that this is a means for varying these intervals.

In order to obtain an arbitrary insertion pitch, the small units 3 and 6 are
Variation using a feed screw is suitable. In addition, regarding the distance variable means between the molded parts 1, 4 and the cutting blade parts 2, 5, the lengths can be trimmed when clinching the lead wires after insertion, so precise positioning is not required, and air drive Two-stage switching is also possible.

(Effects of the Invention) According to the present invention, the cutting blade portion and the molding portion constitute one small unit, and the same small units are arranged so as to face each other.
In addition, since the cutting blade part and the molding part are arranged so that the distance between them is variable, the length of the bent lead wire leg during molding can be changed, and the diameter of the electronic component body can be changed. It can be flexibly adapted to the thickness of the sheath substrate, and its practical effects are great.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of the operation of an electronic component lead wire cutting/forming device according to an embodiment of the present invention, Fig. 2 is a state diagram during insertion by the conventional method, and Fig. 3 is a state diagram during electronic component molding according to the present invention. Fig. 4 is a state diagram when the insertion pitch and lead wire bending length during molding are changed, Fig. 5 is a state diagram showing the effect of the present invention, and Fig. 6 is a state diagram of conventional electronic component lead wire cutting. - It is a cross-sectional view of the cutting/forming part of the molding device. 1.4... Molding part, 2,5... Cutting blade part. 3.6...Small unit, 7...Forming fulcrum part,
8... Cutting blade. Patent applicant: Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] The cutting blade part and the molding part of the electronic component lead wire constitute one small unit, and another small unit having the same configuration as the small unit is arranged so as to face each other and to have a variable interval from each other. . An electronic component lead wire cutting/forming device, wherein the cutting blade portion and the forming portion have a variable interval from each other.