JP3354890B2 - Processing method and processing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for correcting a displacement of a tip end of a processing tool caused by an individual difference of the processing tool when the processing tool is replaced in a metal industry, an electronics industry, a machine industry, or the like. Related to methods and processing equipment.

[0002]

2. Description of the Related Art In a machining technique such as an electrolytic machining technique, an electric discharge machining technique, and a machining technique, when a machining tool is exchanged in the middle of machining, a shape error of the machining tool and a positional shift at the time of machining tool exchange may cause a problem. Since the position of the tip of the processing tool is different before and after replacement, there is a problem that the processing accuracy is reduced. In order to solve this problem, conventionally, when exchanging a processing tool, processing has been performed by correcting the positional deviation of the tip of the processing tool mainly by the following method.

1. A mechanism for observing the tip of a processing tool from two directions is provided, and the obtained image is processed to detect the position of the tip. At the time of processing, a correction value corresponding to a deviation from a reference position is provided. The deviation of the position of the tip end of the processing tool was corrected by giving. 2. Perform hole processing or line processing on the standard sample with the indicated reference position, observe the position of the processed hole or line, determine the deviation from the reference position, and correct according to the obtained value. The deviation of the position of the tip of the processing tool was corrected by giving a value.

[0004]

However, the above method has the following problems. First,
1. The method of (1) requires a mechanism for observing the tip of the processing tool in addition to the processing apparatus, and thus has a problem that the apparatus becomes complicated. Further, since the processing tool tip position is detected by the image processing, the detection accuracy of the tip position is limited by the resolution of the obtained image and the image processing ability. When the detection accuracy of the tip position decreases, the processing accuracy also decreases.Therefore, when performing processing with high processing resolution, it is necessary to detect the distal end of the processing tool, which is inevitably miniaturized, with high accuracy. In such a case, there is a problem that an extremely high-precision observation mechanism is required.

[0005] Next, 2. In the method of (1), first, processing such as hole processing or line processing is performed on the standard material, and the processed hole or line is observed to determine the deviation from the reference position, and the correction value is calculated. There is a problem that a new standard sample is required every time the tool is changed.
An object of the present invention is to eliminate the above-mentioned problems of the conventional processing technology.

[0006]

In order to solve the above-mentioned problems, in the working method according to the present invention, the displacement of the tip of the working tool caused when the working tool is replaced is corrected in the following procedure. First, use a position correction sample having a concave structure in which the side surface is inclined, having symmetry with respect to the center line in the vertical direction, such as a conical shape or a polygonal pyramid shape. The processing tool and the position correction sample are relatively moved so as to be disposed at an arbitrary position inside the structure. Next, at least one of the processing tool and the position correction sample is moved in the horizontal direction, and a plurality of positions where the tip of the processing tool contacts the side surface of the concave structure are detected. Next, from the detected position, the movement position when the center of the tip of the processing tool is located on the center line of the concave structure is calculated and used as a reference position, and when performing processing, the reference position is used. By controlling the movement position as a reference, the displacement of the position of the processing tool tip is corrected.

By correcting the displacement of the tip of the processing tool by the above procedure, the processing apparatus does not need a mechanism for observing the tip of the processing tool. The accuracy of detecting the position of the part does not decrease, and the problem that the processing apparatus becomes complicated does not occur. Further, since the standard sample is not processed, a new standard sample is not required every time the processing tool is replaced, and the same standard sample can be used repeatedly.

Here, the processing phenomena that can be used in the present invention include electrolytic processing in which processing is performed by an electrochemical reaction that occurs when a voltage is applied between a processing tool and a workpiece in an electrolyte solution, Examples include electrical discharge machining utilizing a discharge phenomenon caused by applying a voltage between a tool and a workpiece, and mechanical processing in which a workpiece is physically contacted with a workpiece to perform machining. It is not limited to this.

Further, the processing apparatus according to the present invention holds a position correction sample having a concave structure having a symmetry with respect to a vertical center line, such as a conical shape or a polygonal pyramid shape, and a side surface inclined. Holding means, moving means for arbitrarily changing the relative position of the processing tool and the position correction sample, and a contact state for detecting the contact state when the tip of the processing tool contacts the side surface of the concave structure Detection means, contact position storage means for storing the position of the processing tool or the position correction sample when contact is detected by the contact state detection means, and a plurality of contact positions stored by the contact position storage means A reference position calculating means for calculating a moving position when the center of the tip portion of the processing tool is located on the center line of the concave structure and setting the moving position as a reference position, and It is characterized by having a reference position storage means for storing the calculated reference position.

According to the processing apparatus of the present invention, the position of the processing tool tip can be corrected by the following procedure. First, the moving tool for arbitrarily changing the relative position between the processing tool and the position correction sample causes the tip of the processing tool to be set at an arbitrary position inside the concave structure of the position correction sample. Next, by the same moving means, at least one of the processing tool and the position correction sample is horizontally moved to detect the contact between the tip of the processing tool and the side surface of the concave structure of the position correction sample. The movement position at the time of contact is stored by the contact position storage means at the same time. Next, based on the stored contact position, the movement position when the center of the tip of the processing tool is positioned on the center line of the concave structure of the position correction sample is calculated by the reference position calculation means, and at the same time, the reference position storage means Remember by When performing the machining, the machining is executed while correcting the position of the tip end of the machining tool by controlling the movement position based on the reference position.

Here, separation distance setting means for arbitrarily setting the distance between the tip of the processing tool and the surface to be processed of the workpiece,
By providing an electrochemical reaction control means for applying an arbitrary voltage or current between the processing tool and the workpiece, an electrochemical reaction can be used as the processing phenomenon, but is not limited thereto. is not. A separation distance setting means for arbitrarily setting a distance between a tip of the processing tool and a processing surface of the workpiece; and a voltage control means for applying an arbitrary voltage between the processing tool and the workpiece. Is provided, the discharge phenomenon can be used as the machining phenomenon, but is not limited thereto.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1 FIG. 1 shows an embodiment of a processing apparatus according to the present invention. This processing apparatus includes a processing tool 102 for processing a workpiece 101, a processing phenomenon control device 103 for controlling a processing phenomenon between the workpiece 101 and the processing tool 102, and a processing center It has a concave structure having a symmetry and an inclined side surface, and a position correction sample 104 used when correcting the tip position of the processing tool 102, and a workpiece 101 and a position correction sample 104 below the position correction sample 104. XY-axis stage 105 which is installed on the side and can move the workpiece 101 and the position correction sample 104 in the XY-axis directions (horizontal direction).
A Z-axis stage 106 installed below the XY-axis stage 105 and capable of moving the workpiece 101 and the position correction sample 104 in the Z-axis direction (vertical direction);
A movement position control device 107 for controlling the movement positions of the XY-axis stage 105 and the Z-axis stage 106;
02, the tip of the machining electrode 102 is contacted with the contact state detecting device 108 for detecting the contact state when the tip of the sample 02 contacts the side surface of the concave structure of the sample 104 for position correction. A contact position storage device 109 that stores the movement position of the XY-axis stage 105 when the contact of the correction sample 104 with the side surface of the concave structure is detected.
And an XY-axis stage when the center of the tip of the processing tool 102 is located on the center line of the concave structure of the position correction sample 104 based on the information on the plurality of contact positions stored in the contact position storage device 109. The reference position calculating device 110 includes a reference position calculating device 110 that calculates the movement position of the reference position 105 and sets the reference position as a reference position, and a reference position storage device 111 that stores the reference position calculated by the reference position calculating device 110.

The position correcting sample 104 has a concave structure having symmetry with respect to a vertical center line and inclined side surfaces. For example, as shown in FIG.
A conical concave structure symmetrical with respect to B ′ has a flat plate shape formed on the surface. The XY-axis stage 105 and the Z-axis stage 106 are driven in the XY-axis direction and the Z-axis direction by an electric drive unit under the control of the movement position control device 107, and the movement amount and the movement position are electrically measured. It has become so.

The contact state detecting device 108 measures, for example, the electric resistance value between the processing tool 102 and the position correcting sample 104, and detects the contact state based on a change in the electric resistance value at the time of contact. Hereinafter, a processing method according to the present embodiment will be described with reference to FIGS. 1, 3, and 4. FIG.
Represents a conical concave structure formed on the surface of the position correction sample 104 shown in FIG. FIG.
3 shows a flowchart when processing is performed by correcting the position of the distal end of the processing tool 102 in the present embodiment.

First, as shown in FIG.
The XY-axis stage 105 is arranged such that the tip of the XY-axis stage 2 is located at an arbitrary position inside the concave structure of the position correction sample 104.
And the Z-axis stage 106 is driven. Next, the XY-axis stage 105 is moved in the positive direction of the X-axis, and the processing tool 10 is moved.
2 is detected by the contact state detecting device 108 when the front end portion contacts the side surface, and the movement position (X1) in the X direction when the contact is detected is stored in the contact position storage device 109.
Remember by Similarly, move the XY-axis stage 105 to X
The contact point on the opposite side is detected by moving in the negative direction of the axis, and the movement position (X2) in the X direction when the contact is detected is stored by the contact position storage device 109.

Next, by the same procedure, the XY-axis stage 105 is moved in the Y-axis direction to detect the contact position between the tip of the processing electrode 102 and the side surface of the concave structure of the position correcting sample 104. The movement position (Y1, Y2) in the Y direction when the contact is detected is stored. Next, based on the four contact positions stored in the contact position storage device 109, the reference position calculation device 110 calculates the movement position when the center of the tip of the processing electrode 102 is located on the center line of the concave structure. The reference position is stored in the reference position storage device 111. At this time, the reference position (X0, Y0) is (X0,
Y0) = ((X1 + X2) / 2, (Y1 + Y2) / 2). Next, the XY-axis stage 105 and the Z-axis stage 106 are driven such that the tip of the processing electrode 102 faces the surface of the workpiece 101. Then, the XY axis stage 105 is driven along a desired processing pattern with reference to the reference position stored in the reference position storage device 111 to correct the position of the tip of the processing tool. Processing is performed by exciting the processing phenomenon.

Here, the reference position (X0, Y0) can be detected by the same procedure even if the concave structure of the position correcting sample 104 has a quadrangular pyramid shape as shown in FIG. . In the example in which the reference position of the processing tool is detected using the present embodiment, as the processing electrode 102, the tip of the platinum-iridium alloy wire is sharpened to a tip diameter of 1 μm by electrolytic etching, and the other portions are removed. A resin-coated one was used. As the position correction sample 104, a conical concave structure having a diameter of 500 μm and a depth of 500 μm was formed on a 10 mm × 10 mm × 1 mm aluminum flat plate by machining. used.

According to the above procedure, the position correction sample 10
By detecting the reference position of the processing tool 102 using No. 4, the position of the distal end of the processing tool 102 can be corrected with high accuracy using a simple device. Embodiment 2 FIG. 6 shows, as an embodiment of the present invention, a processing apparatus in which an electrochemical reaction is used for a processing phenomenon.

This processing apparatus detects a workpiece 101 immersed in a processing solution 602 in a processing solution container 601, a processing electrode 102 for performing electrolytic processing on the workpiece 101, and a reference position of the processing electrode 102. Sample 104 for position correction used at this time and a reference electrode 603 serving as a reference for the electrode potential
A potential / current control device 604 for controlling the potential and current of the workpiece 101 and the processing electrode 102; and a workpiece 101 and a position correction sample 104 installed below the processing solution container 601 in the XY axis direction. An XY-axis stage 105 that can be moved in the (horizontal direction), and a workpiece 101 and a position correction sample 104 that are installed below the XY-axis stage 105 and are moved in the Z-axis direction (vertical direction). -Axis stage 106 capable of moving and XY-axis stage 10
5 and a movement position control device 107 for controlling the movement position of the Z-axis stage 106, and a reference position detection device 605 for detecting a reference position serving as a reference for the movement position of the machining electrode 102.
It has.

The potential / current control device 604 is used to
By applying a voltage between the electrode 101 and the processing electrode 102, the current flowing between the processing electrode 102 and the workpiece 101 can be set to a current required for processing. Further, a potentiometer and an ammeter are incorporated, and can be used when detecting contact between the processing electrode 101 and the position correction sample 104.

The processing electrode 102 is a rod-shaped body, the tip of the electrode facing the surface to be processed is sharpened, only a part of the tip is exposed, and the other part is covered with an insulator. . As the material of the rod-shaped body, for example, carbon, tungsten, platinum or the like is used. The reference electrode 603 is, for example,
A cylindrical body of glass, a liquid junction is provided at the tip of the side immersed in the processing solution, and a thin line made of silver is provided at the center of the cylindrical body so as to reach the glass film portion, and the thin line is immersed. To fill the silver chloride solution.

The reference position detecting device 605 includes the processing electrode 10
And a contact state detecting means for detecting the contact state when the tip of the second member comes into contact with the side surface of the concave structure of the position correcting sample 104;
And a plurality of contact positions stored in the contact position storage means for storing a movement position of the XY-axis stage 105 when a contact between the tip of the XY stage 02 and the side surface of the position correction sample 104 is detected. Position correction sample 1 based on the information of
Reference position calculation means for calculating the movement position of the XY axis stage 105 when the tip of the processing electrode 102 is positioned on the center line of the concave structure of No. 04 as a reference position, and a reference calculated by the reference position calculation means. Reference position storage means for storing the position is provided.

When electrolytic processing is performed on the workpiece 101 using this apparatus, first, the reference position detecting device 605 detects the reference position of the processing electrode 102 according to the procedure described in the first embodiment. Next, the XY-axis stage 10 is moved so that the tip of the machining electrode 102 faces the surface of the workpiece 101 with a certain distance therebetween.
5 and the Z-axis stage 106 are driven. Then, based on the reference position stored in the reference position storage means as a reference, the XY axis stage 105 is driven along a desired processing pattern, and at the same time, the processing electrode 102 and the workpiece 101 using the potential / current control device 604. The machining is performed by applying a current during.

In the embodiment in which the working electrode is replaced by using this embodiment, and a straight line having a width of 50 μm and a length of 1 mm is formed on the metal plate by etching, two working electrodes are used.
After processing the first 500 μm using the first processing electrode, the remaining 500 μm was processed using the second processing electrode. At this time, the scanning speed during processing is 2 μm / s, the distance between the tip of the processing electrode 102 and the processing surface of the workpiece 101 is 10 μm, and the applied current during processing is Ion = 5.
A pulse current of 00 μA, Ton = 0.3 seconds, and Toff = 0.3 seconds was used.

As the working electrode 102, a platinum-iridium alloy wire whose tip was sharpened to a tip diameter of 1 μm by electrolytic etching, and a portion other than the tip was covered with a resin was used. A chromium plate was used as the workpiece 101, and a silver / silver chloride electrode was used as the reference electrode 603. The processing solution was 62.7 g / l of sulfamic acid.
And a chromium electrolytic etching solution in which boric acid was mixed at 37.3 g / l.

The sample 104 for position correction is 10 mm × 10
500 mm in diameter for a 1 mm x 1 mm aluminum plate
A conical concave structure having a thickness of 500 μm and a depth of 500 μm was formed by machining. As a processing procedure, first, the reference position of the first processing electrode is detected by the reference position detection device 605 using the sample 104 for position correction, and the workpiece is detected based on the detected reference position of the first processing electrode. Perform a linear processing of 500μm length on a chrome plate which is
Next, the processing electrode was replaced, a second processing electrode was installed, a reference position was similarly detected, and processing was performed using the first processing electrode with reference to the detected reference position of the second processing electrode. From the end point of the straight line, straight line processing with a length of 500 μm was continuously performed.

As a result, a linear pattern having a width of 50 μm and a length of 1 mm was obtained. As a result of observing the processed linear pattern, the processed portion was processed using the first processed electrode and the second processed electrode. No shift in the processing position was found at the boundary between the portions. Therefore, it can be seen that if the method for correcting the position of the processing tool tip according to the present invention is used, the processing electrode can be replaced without lowering the processing accuracy. Third Embodiment FIG. 7 shows a third embodiment of the present invention, which has a configuration substantially similar to that of the second embodiment, but in which a processing electrode used for processing can be replaced. Exchange mechanism 701
The feature is that is attached. As shown in FIG. 8, for example, as shown in FIG. 8, the machining electrode exchange mechanism 701 includes a machining electrode (A) 102A and a machining electrode (B) 1 having different distal end diameters.
Working electrode mounting arm 801 to which 02B is mounted
And a Z axis rotation mechanism 802 that can rotate the machining electrode mounting arm 801 around the Z axis.
The processing electrode to be used can be arranged on the position correction sample 104 or the processing surface of the processing object 101 immersed in the processing solution.

According to this apparatus, before performing the machining,
Processing electrode (A) 102A and processing electrode (B) 102B
The reference position can be detected in advance for both of the processing electrodes. Therefore, it is not necessary to detect the reference position when exchanging the machining electrode, and the machining can be performed continuously, so that the machining time can be reduced. Further, it is not necessary to simultaneously install the position correction sample 104 and the workpiece 101 in the processing solution container 601.

According to this, the same effect as in the first embodiment can be obtained. Fourth Embodiment FIG. 9 shows a fourth embodiment of the present invention, and shows a processing apparatus using an electric discharge phenomenon as a processing phenomenon. In this embodiment, a workpiece 101 immersed in a processing fluid 902 in a processing fluid container 901 and a workpiece 101
A machining electrode 102 that is disposed to face the workpiece 101 to perform electric discharge machining on the workpiece 101, a position correction sample 104 used when detecting a reference position of the machining electrode 102, and a workpiece 101.
A discharge current control device 903 for controlling a discharge current flowing between the workpiece and the machining electrode 102, and a workpiece 101 and a position correction sample 104 which are installed below the machining fluid container 901 and are arranged in the XY axis direction (horizontal direction). XY that can be moved to
A Z-axis stage 105, a Z-axis stage 106 installed below the XY-axis stage 105, and capable of moving the workpiece 101 and the position correction sample 104 in the Z-axis direction (vertical direction); Movement position control device 107 for controlling movement of 105 and Z-axis stage 106
And a reference position detection device 605 for detecting a reference position serving as a reference for the movement position of the processing electrode 102.

The discharge current control device 903 is connected to the machining electrode 10
By applying a voltage between the workpiece 2 and the workpiece 101, a pulse-like discharge current required for machining can be generated between the machining electrode 102 and the workpiece 101. In addition, a potentiometer and an ammeter are incorporated, and the processing electrode 102 and
It can also be used when detecting contact with the sample for position correction 104.

The processing electrode 102 is a rod-shaped body, and is made of brass, a zinc alloy, an aluminum alloy, or the like. The processing liquid 902 is an insulating oily liquid, and white kerosene, silicone oil, machine oil, or the like is used. According to this device, the same effect as in the first embodiment can be obtained. Fifth Embodiment FIG. 10 shows a fifth embodiment of the present invention, in which a processing apparatus for removing the workpiece 101 by physical contact between the processing tool 102 and the workpiece 101 is described. Is shown.

In the present embodiment, a processing tool 102 is disposed to face a workpiece 101 and processes the workpiece 101 by physical contact, and a position used when a reference position of the processing tool 102 is detected. Correction sample 104 and processing tool 10
Tool rotation device 1001 capable of rotating the workpiece 2
And the workpiece 101 and the position correction sample 104
An XY-axis stage 105 that can be moved in the axial direction (horizontal direction), and a work 101 and a position correction sample 104 that are installed below the XY-axis stage 105 are moved in the Z-axis direction (vertical direction). A Z-axis stage 106 that can be moved, a movement position control device 107 that controls movement of the XY-axis stage 105 and the Z-axis stage 106, and a reference position detection that detects a reference position that is a reference of a movement position of the processing electrode 102. An apparatus 605 is provided.

When the workpiece 101 is subjected to removal processing using this apparatus, first, the reference position of the processing tool 102 is detected by the reference position detection device 605 according to the procedure described in the first embodiment. Next, the processing tool 10
2 so that the front end of the workpiece 2 faces the surface of the workpiece 101.
The Y-axis stage 105 and the Z-axis stage 106 are driven. Next, using the processing tool rotation device 1001, the processing tool 10
2 is rotated, the XY-axis stage 105 is driven based on the reference position stored in the reference position storage means, and the workpiece 101 and the processing tool 102 are brought into contact with each other at a desired position, thereby removing the workpiece 101. I do.

According to this device, the same effect as in the first embodiment can be obtained.

[0035]

According to the present invention, the following effects can be obtained. First, when correcting the displacement of the tip of the processing tool, no additional device such as a device for observing the tip of the processing tool is required. The reference position can be detected.

In the present invention, the reference position is obtained by calculation by detecting the position where the tip of the processing tool contacts the sample for correcting the position of the processing tool. As in the case of using the method of observing and performing image processing to detect the position of the tip of the processing tool, the position detection accuracy of the tip of the processing tool is not limited by the resolution of the image or the image processing capability, so that high accuracy is achieved. Accurate position detection can be realized.

Furthermore, unlike the method of observing the result of drilling or wire processing, a new standard sample is not required every time the processing tool is replaced, and the same standard sample can be used repeatedly. is there.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a first embodiment of a processing apparatus according to the present invention.

FIG. 2 is a schematic diagram showing an example of a position correction sample used in the present invention.

FIG. 3 is a schematic view showing a first example of a concave structure formed on a position correcting sample used in the present invention.

FIG. 4 is a flowchart showing a procedure of a processing method according to the present invention.

FIG. 5 is a schematic view showing a second example of a concave structure formed on a position correcting sample used in the present invention.

FIG. 6 is a schematic diagram showing a second embodiment of the processing apparatus of the present invention.

FIG. 7 is a schematic diagram showing a third embodiment of the processing apparatus of the present invention.

8 is a schematic view showing an example of a machining electrode exchange mechanism used in the machining apparatus of FIG.

FIG. 9 is a schematic diagram showing a fourth embodiment of the processing apparatus of the present invention.

FIG. 10 is a schematic diagram showing a fifth embodiment of the processing apparatus of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 101 workpiece 102 processing tool 103 processing phenomenon control device 104 position correction sample 105 XY-axis stage 106 Z-axis stage 107 moving position control device 108 contact state detection device 109 contact position storage device 110 reference position calculation device 111 reference position storage device

────────────────────────────────────────────────── (5) References JP-A-2-167626 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B23Q 15/00-15/28 B23H 7 / 26 G05B 19/18-19/46

Claims (12)

(57) [Claims] 1. A tip portion is sharpened and an insulating coating is applied to portions other than the tip portion.
The processed tool and the workpiece are arranged so as to face each other, and a physical or chemical processing phenomenon occurs between the tip of the processing tool and the workpiece, whereby the workpiece is processed. In a processing method of processing a surface, the processing tool and the position correction sample have a symmetry with respect to a vertical center line, and a position correction sample having a concave structure in which a side surface is inclined. Relatively moving the tip of the processing tool at an arbitrary position inside the concave structure, moving at least one of the processing tool and the position correction sample in the horizontal direction, A plurality of positions where the tip of the processing tool contacts the side surface of the concave structure are detected, and a movement position when the tip of the processing tool is located on the center line of the concave structure is calculated based on the contact position. The reference position A processing method characterized in that the processing is executed while correcting the displacement of the tip of the processing tool by controlling the movement position based on the position. 2. The processing method according to claim 1, wherein the concave structure has a conical shape, a quadrangular pyramid shape, or a triangular pyramid shape. 3. The processing method according to claim 1, wherein the detection of the contact position is performed by measuring a change in electrical resistance between the processing tool and the position correction sample. 4. The processing method according to claim 1, wherein the processing phenomenon is an electrochemical reaction caused by applying a voltage between the processing tool and the workpiece in an electrolyte solution. 5. The machining method according to claim 1, wherein the machining phenomenon is a discharge phenomenon caused by applying a voltage between the processing tool and the workpiece. 6. The method according to claim 6, wherein the detecting of the contact position is performed by measuring a change in a potential difference between at least one of the processing tool and the position correction sample with respect to a reference electrode indicating a reference potential of the electrolyte solution. The processing method according to claim 4, characterized in that: 7. A holding means for holding a processing tool and a workpiece in opposition to each other, and a moving means for arbitrarily changing a relative position between the processing tool and the workpiece, In a processing apparatus for processing a processed surface of the workpiece by generating a physical or chemical processing phenomenon between the workpiece and the workpiece, the processing apparatus has a symmetry with respect to a vertical center line, Holding means for holding a position correction sample having a concave structure having an inclined structure, moving means for arbitrarily changing a relative position between the processing tool and the position correction sample, and a tip of the processing tool having the concave structure. A contact state detecting means for detecting a contact state when contacting the side surface of the contact point; a contact position storing means for storing a moving position when a contact is detected by the contact state detecting means; and a contact position storing means. A reference position calculation unit that calculates a movement position when the tip of the processing tool is located on the center line of the concave structure based on the plurality of stored contact positions, and sets the movement position as a reference position; A processing apparatus comprising a reference position storage means for storing a reference position calculated by the means. 8. The processing apparatus according to claim 7, wherein the concave structure has a conical shape, a quadrangular pyramid shape, or a triangular pyramid shape. 9. An electric resistance measuring device for measuring an electric resistance between the processing tool and the position correction sample, wherein the contact state detecting means is provided between the processing tool and the position correction sample. The processing apparatus according to claim 7, wherein the contact state is detected by measuring a change in electric resistance. 10. The processing phenomenon is an electrochemical reaction caused by applying a voltage between the processing tool and the workpiece in an electrolyte solution, wherein the tip of the processing tool and a workpiece between the processing tool and the workpiece are processed. A separation distance setting means for arbitrarily setting a distance to a processing surface, and an electrochemical reaction control means for applying an arbitrary voltage or current between the processing tool and the workpiece. Item 8. The processing apparatus according to Item 7. 11. The processing phenomenon is a discharge phenomenon caused by applying a voltage between the processing tool and the workpiece, and is a phenomenon in which a tip of the processing tool and a processing surface of the workpiece are processed. The processing apparatus according to claim 7, further comprising a separation distance setting unit that arbitrarily sets a distance between the processing tool and the workpiece, and a voltage control unit that applies an arbitrary voltage between the processing tool and the workpiece. 12. A reference electrode, which is a reference for a potential of the electrolyte solution, and a potential difference measuring device for measuring a potential difference between at least one of the processing tool and the position correction sample with respect to the reference electrode, The state detecting means is
The processing apparatus according to claim 10, wherein a contact state is detected by measuring a change in at least one potential difference between the processing tool and the position correction sample with respect to the reference electrode.