JP3347092B2 - Substrate adsorption / heating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for adsorbing and heating a substrate, which is used for mounting a bare chip on a substrate to be mounted at high density.

[0002]

2. Description of the Related Art One of the high-density mounting technologies, LLC (L
The “ad Less Chip” method is a method of directly mounting a bare chip on which a gold bump is formed, on an interposer substrate, on a solder-plated pad with the gold bump corresponding thereto. In this method, a bare chip is heated by a heater in a mounting head and a heater in a suction / heating stage (suction / heating stage) on which a substrate is mounted, thereby performing gold-solder connection. In this case, since the thermal shrinkage of the substrate before and after mounting has a great effect on the quality, the required temperature must be reliably controlled for heating the substrate, and the above-described adsorption / heating stage is a necessity. is there.

[0003]

However, the conventional adsorption and
For the heating stage, it is necessary to prepare a stage block corresponding to the substrate size, and since each stage block is equipped with a heater and a temperature sensor, the stage block itself becomes large. The stage is changed every time the board size is changed.
At that time, wiring work for the heaters and sensors was also required, and the replacement work was time-consuming, and the setup work involved a large loss.

[0004] Further, newly producing a dedicated stage block corresponding to the substrate size is disadvantageous in terms of production cost, and there is also a problem that the production delivery time becomes long.

The present invention has been made based on the above circumstances. It is an object of the present invention to divide a stage block into upper and lower parts, provide a heater and a temperature sensor in a lower stage block, and An object of the present invention is to provide a substrate suction / heating apparatus having a configuration in which a stage block is replaced according to a substrate of each size, thereby simplifying the replacement operation and greatly reducing the cost for replacement.

[0006]

Therefore, in the present invention,
A substrate for mounting a PGA package was arranged on the suction / heating stage, and the substrate was sucked by applying a suction force to suction recesses opened in a required arrangement on the upper surface of the stage to suck the substrate, and provided on the stage side. While controlling the temperature with the temperature sensor, the substrate is heated by the heating means.
In the heating apparatus, the stage is provided with a said temperature sensor over <br/> and heating means in communication with a suction source predetermined
The suction flow passage is opened on the upper surface, and the other flow passages are open on the upper surface.
The lower stage block with a flat surface
A passage portion formed corresponding to the size and communicating with the flow passage
Is provided on the lower surface, and the lower surface is flat except for the passage portion.
Then, the passage portion is communicated with the suction concave portion so that the substrate can be enlarged.
Upper stage block that can be replaced according to the size
Characterized in that it consists of a click.

In this case, according to the present invention, as an embodiment, the lower stage block detachably attaches a plug member to the suction flow passage which does not correspond to the passage portion of the upper stage block. It is preferred that it has a configuration .

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of a substrate suction / heating apparatus of the present invention will be specifically described with reference to the drawings. Here, P is placed on the adsorption / heating stage.
The substrate 1 for mounting the GA package is arranged, the suction force is applied to the suction concave portions 12 opened in a required arrangement on the upper surface of the stage, the substrate 1 is suctioned, and the temperature is detected by the temperature sensor 6 provided on the stage side. For example, the stage is provided with the temperature sensor 6 and the heating unit 5 while being controlled, and is heated by a heating unit 5 such as an electric heater, and a suction source (not shown) such as a vacuum pump. A lower stage block 3 (in this embodiment, a large number of vertical holes arranged on the upper surface of the lower stage block 3) having a predetermined suction flow channel 7 opened to the upper surface thereof communicating with the lower stage block 3; A lower surface is provided with a passage portion 10 communicating with the flow passage 7 and the upper stage block 2 communicating the passage portion 10 with the suction concave portion 12.

In this case, as an embodiment of the present invention,
The lower stage block 3 is configured such that a plug member 9 is detachably attached to some suction flow passages (indicated by reference numeral 8) that do not correspond to the passage portions 10 of the upper stage block 2. In addition, the upper stage block 2 has a passage portion 10 corresponding to the size of the substrate 1 to be attracted and heated.

More specifically, as shown in FIG. 4, the passage portion 10 is a groove formed in a girder shape on the lower surface of the upper stage block 2. It communicates with the recess 12. Reference numeral 4 denotes a mounting table for supporting the above-mentioned stage block, which is provided with a passage 4A for supplying a suction force to the suction flow passages 7, 8.
In the figure, reference numeral 14 denotes an L-shaped positioning corner member of the upper stage block 2 provided on the lower stage block 3.

A feature of the present invention is that the upper stage block 2 and the lower stage block 3 are divided into two stages. Therefore, when the size of the substrate 1 is changed, the upper stage It has an element that can be set up by replacing only blocks.

More specifically, in FIG. 2, the upper stage block 2 is processed in accordance with the substrate size of the substrate 1 (external dimensions of the substrate sheet and dimensions of the inner surface of the sheet). Side stage block 3
It is placed on top and integrated with a suitable coupling means such as bolting means. It should be noted that there is no problem in the adhesion between the two joining surfaces because the adhesion is ensured by the adsorption action.

In the suction / heating stage having such a structure, which is divided vertically into two stages, the substrate 1 is transferred to the suction concave portion 12 of the upper stage block 2 via the passage portion 10 via the passage portion 10. Vacuum is drawn through the suction passage 7 in the side stage block 3. For this purpose, a suction source such as a vacuum pump functions.

In this state, the heating means 5 operates to heat the lower stage block 3 until the temperature measured by the temperature sensor 6 reaches a required value. Heating is performed on the block and finally on the substrate 1.

In this embodiment, the arrangement of the suction passage 7 provided in the lower stage block 3 is devised so that it does not interfere with the location where the heating means (heater) 5 and the temperature sensor 6 are installed. Have been. A plug member 9 is detachably attached to the opening of the flow passage 8 on the lower stage block 3 outside the size of the upper stage block 2.

When the size of the substrate is changed, for example, as shown in FIGS.
The size of the upper stage block 2 ′ and the arrangement of the suction concave portions 12 are changed according to the arrangement arrangement of the PGA package. In this case, the lower stage block 3
When the number of the flow passages 8 to be plugged changes in accordance with the size of the upper stage block 2 ', only the operation of attaching and detaching the plugging member 9 can be used.

[0017]

The present invention has been described in detail above. When the substrate size is changed, it is possible to cope by changing only the upper stage block, and the time required for the stage changing operation is greatly reduced. Effects such as minimizing the cost and production delivery time for producing a new stage can be obtained.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a vertical sectional side view showing a main part for explaining the function of the present invention.

FIG. 3 is a plan view of a substrate showing an arrangement state of a PGA package.

FIG. 4 is a plan, cross-sectional, and bottom view of the upper stage block.

FIG. 5 is also a plan view, a cross-sectional view, and a bottom view of the lower stage block.

FIG. 6 is a longitudinal sectional view of a main part showing a state in which a substrate whose package arrangement has been changed according to the present invention is provided.

FIG. 7 is a plan view showing the state of the substrate.

FIG. 8 is also a plan view, a cross-sectional view, and a bottom view of an upper stage block to be replaced corresponding to a changed board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 1 'Substrate 2, 2' Upper stage block 3 Lower stage block 4 Mounting table 4A passage 5 Heating means (electric heater) 6 Temperature sensor 7 Suction conduction passage 8 Closed conduction passage 9 Closure member 10 Passage Part 11 Vertical hole 12 Suction recess 14 Corner member

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/34 H01L 21/60

Claims (2)

(57) [Claims] 1. A substrate for mounting a PGA package is arranged on a suction / heating stage, and a suction force is applied to suction concave portions opened in a predetermined arrangement on the upper surface of the stage to suction the substrate, and While controlling the temperature with the temperature sensor provided on the stage side, it was heated by the heating means,
In the substrate suction / heating apparatus, the stage includes the temperature sensor and the heating unit, and a suction source.
Opening a predetermined suction flow passage communicating with the upper surface,
A lower stage block whose upper surface is flat except for the road,
It is formed corresponding to the size of the substrate, and is connected to the flow passage.
The lower surface is provided with a passage portion through which the passage passes.
And the passage portion communicates with the suction concave portion.
Upper stage that can be replaced according to the size of the substrate.
A substrate adsorption / heating device, comprising: a storage block . 2. The lower stage block has a structure in which a stopper member is detachably attached to the suction flow passage that does not correspond to a passage portion of the upper stage block. Item 1. Adsorption of substrate
Heating equipment.