JP3346932B2 - Solvent composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to degreasing and cleaning of printed circuit boards, electronic parts such as ICs, precision machine parts, glass substrates and the like.
The present invention relates to a solvent composition used for flux cleaning, draining cleaning, dust removal, and the like.

[0002]

_2. Description of the Related Art For cleaning various kinds of fats and oils, CCl ₂ FCClF ₂ (hereinafter referred to as R1) which is excellent in nonflammability, low toxicity and stability.
13) or a mixed solvent composition of R113 and a solvent soluble therein. R113 has characteristics such as selectively dissolving various kinds of dirt without invading a base material such as metal, plastic, and elastomer. Therefore, various precision mechanical parts, various electronic parts made of metal, plastic, elastomer, etc., and optical elements are used. It was optimal for cleaning parts and the like.

[0003]

SUMMARY OF THE INVENTION Conventionally used R
Despite its various advantages, 113 is chemically very stable, has a long life in the troposphere, diffuses into the stratosphere, and is decomposed by ultraviolet rays to generate chlorine radicals. Since chlorine radicals cause a chain reaction with stratospheric ozone and destroy the ozone layer, regulations on the production and consumption are being implemented. For this reason, instead of the conventional R113, an alternative solvent that is less likely to destroy the ozone layer is being actively searched for.

An object of the present invention is to provide a novel fluorinated hydrocarbon-based solvent composition which can be used as an alternative solvent having an extremely small effect on the ozone layer while satisfying the excellent characteristics of the conventional R113. Aim.

[0005]

DISCLOSURE OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and firstly, n-hexane (hereinafter, referred to as n-HEX) and cyclohexane (hereinafter, referred to as n-HEX).
c-HEX) (C-HEX), C ₃ HC
l ₂ F ₅ compound (hereinafter, referred to as R225 acids) (b) and C
Comprises ₆ F ₁₄ such (c) Contact and alcohols with (d),
(A), (b), (c) and (d) relative to the total amount of (a), (b), (c) and (d) the proportion of 1 to 20% by weight, 15 to 60% by weight, 20-60% by weight
And 1 to 10% by weight of a solvent composition .

[0006] R225s include 1,1-dichloro-2,
2,3,3,3-pentafluoropropane CF ₃ CF ₂
CHCl ₂ (hereinafter, referred to as R225ca), 1,3-dichloro-1,1,2,2,3-pentafluoropropane CF ₂ ClCF ₂ CHClF (hereinafter, referred to as R225cb) or other isomers, and R225ca and R225cb At least one selected from A preferred mixing ratio of the mixture comprising R225ca and R225cb is such that R225ca / R225ca /
R225cb = 0.01 to 99.99% by weight / 0.01
９９99.99% by weight. More preferably, R22
5ca / R225cb = 40-60% by weight / 40-60
% By weight.

In the present invention, C ₆ F ₁₄ is tetradecafluorohexane CF ₃ (CF ₂ ) ₄ CF ₃ (hereinafter referred to as R
51-14) or an isomer thereof, and the isomer is undecafluoro-2- (trifluoromethyl)
Pentane (CF ₃ ) ₂ CF (CF ₂ ) ₂ CF ₃ (hereinafter, referred to as
R51-14my), undecafluoro-3-
(Trifluoromethyl) pentane CF ₃ CF ₂ CF (C
F ₃ ) CF ₂ CF ₃ (hereinafter, referred to as R51-14mcy). In the present invention, C ₆ F ₁₄ is represented by R
51-14, R51-14my and R51-14mc
It is preferably at least one selected from y.

A preferred example of C ₆ F ₁₄ is R51-14
R51-14, alone or in an amount of 65 to 77% by weight,
6% by weight of R51-14my and 2 to 12% by weight of R
It is a mixture consisting of 51-14 mcy. R51-1
4, a more preferable mixture ratio of the mixture consisting of R51-14my and R51-14mcy is R51-14 /
R51-14my / R51-14mcy = 70 to 75% by weight / 18 to 22% by weight / 5 to 10% by weight.

As alcohols, MeOH, EtO
H, 1-propanol (n-propanol), 2-Pr
OH (i-propanol), 1-butanol (n-butanol), 2-butanol (sec-butanol),
-Methyl-1-propanol (i-butanol), 1,
Alcohols having 1 to 5 carbon atoms such as 1-dimethylethanol (t-butanol) are preferable, and MeOH, EtO
1 to 3 carbon atoms such as H, 1-propanol and 2-PrOH
Are more preferred.

[0010]

[0011]

[0012] The mixing ratio of the at least one n-HEX and c-HEX (a), R225 compound (b), C ₆ F ₁₄ such (c) and alcohols (d) are, (a), (b) ,
1 to 20 with respect to the total amount of (c) and (d)
%, 15-60% by weight, 20-60% by weight and 1%
-10% by weight.

When n-HEX and c-HEX are used in combination, the mixing ratio of both is not particularly limited. Preferably, n-HEX / c-HEX = 0.1 to 99.9.
/0.1 to 99.9% by weight, more preferably 1 to 99%
/ 1 to 99% by weight.

In order to mainly increase the solubility, for example, one or more of the following compounds are added in an amount of 1 to 50% by weight, preferably 1 to 30% by weight, more preferably 1 to 30% by weight.
A range of 20% by weight can be included in the composition of the present invention.

N-pentane, 2-methylbutane, 2,2
-Dimethylpropane, 3-methylpentane, 2,2-dimethylbutane, 2,3-dimethylbutane, n-heptane, 2-methylhexane, 3-methylhexane, 2,3
-Dimethylpentane, 2,4-dimethylpentane, n-
Octane, 2,2,3-trimethylpentane, 2,2
Hydrocarbons such as 4-trimethylpentane, cyclopentane, methylcyclopentane, methylcyclohexane and ethylcyclohexane.

Dichloromethane, cis-1,2-dichloroethylene, trans-1,2-dichloroethylene,
Chlorinated hydrocarbons such as trichlorethylene and tetrachloroethylene.

Ketones such as acetone, methyl ethyl ketone, methyl butyl ketone and methyl isobutyl ketone.

Ethers such as diethyl ether, methyl cellosolve, tetrahydrofuran and 1,4-dioxane;

Chlorinated fluorinated hydrocarbons such as 2,2-dichloro-1,1,1-trifluoroethane and 1,1-dichloro-1-fluoroethane.

Methyl acetate, ethyl acetate, propyl acetate,
Esters such as butyl acetate.

In order to mainly improve the stability, for example, one or more of the following compounds may be used in an amount of 0.001 to 0.001.
10% by weight, preferably in the range of 0.001 to 5% by weight, can be included in the composition of the present invention.

Nitro compounds such as nitromethane, nitroethane, nitropropane and nitrobenzene.

Diethylamine, triethylamine, i-
Amines such as propylamine, n-butylamine and i-butylamine.

Phenol, o-cresol, m-cresol, p-cresol, thymol, pt-butylphenol, t-butylcatechol, catechol, isoeugenol, o-methoxyphenol, bisphenol A, isoamyl salicylate, benzyl salicylate, salicylic acid Phenols such as methyl and 2,6-di-t-butyl-p-cresol.

2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2'-hydroxy-3'-tert-butyl-5'-methylphenyl) -5-chlorobenzotriazole, Triazoles such as 2,3-benzotriazole and 1-[(N, N-bis-2-ethylhexyl) aminomethyl] benzotriazole.

The solvent composition of the present invention has the same dissolving power as the conventional R113 system, and can be suitably used for various applications. Specific applications include greases, oils, waxes, removers for inks, paint solvents, extractants, glass, ceramics, plastics, rubber, various metal products, especially IC parts, electrical equipment, precision machinery, Examples include cleaning agents for optical lenses and the like and removal of dust. As a cleaning method, hand wiping, dipping, spraying, rocking, ultrasonic cleaning, steam cleaning, a method combining these, or the like may be employed.

[0027]

【Example】

[0028]

[0029]

[0030]

[0031]

[0032]

[0033]

[0034]

[0035]

[0036]

[0037]

[0038]

[0039]

[0040]

[0041]

[0042]

[Examples 1 to 22] Using the solvent compositions shown in Tables 1 to 3 , a washing test of machine oil was performed. That is, the SUS-304 test piece (25
mm × 30 mm × 2 mm) in machine oil (Daphne Cut AS-40H manufactured by Idemitsu Oil Co., Ltd.), and then dipped in the solvent composition of the present invention shown in Tables 1 to 5 for 5 minutes. Degree of removal of machine oil (◎: good removal, ○: almost good, △: trace residue,
X: considerably remaining) and the results are shown in column A of Tables 1-3 . In the table, methylcyclopentane is referred to as MCP.

The cleaned test flux with Example 2 3-4 4] solvent composition shown in Table 4-5. That is, a flux (Speedy flux AGF-JI: manufactured by Asahi Chemical Laboratory) is applied to the entire surface of a printed board made of glass epoxy (50 mm × 100 mm × 1.6 mm), and a wave soldering machine is used at a soldering temperature of 260 ° C. after soldering, the tables 4 to immersion washing in a solvent composition of the present invention shown in 3 minutes performing Te. Removal of the flux (◎: good removal Friendly, ○: almost good, △: slight amount remained, ×: considerable residual) is determined, and the results are shown in Column B in Table 4-5.

Similarly, using the solvent compositions shown in Tables 4 and 5 , a test for removing adhered water is performed. That is, 30 mm x 18
After dipping the glass plate in mm × 5 mm in pure water, Tables 4 in the solvent composition of the present invention shown in 5 immersed to perform draining 20 seconds, the by immersing the glass plate taken out in anhydrous MeOH moisture The removal state of the adhering water is determined from the increased amount. The degree of removal of adhering water (◎: excellent removal, ○: almost good, Δ: trace residual, ×: considerable residual) was determined, and the results are shown in Table 4
It is shown in column C of 5.

[0046]

[0047]

[0048]

[0049]

[0050]

[0051]

[0052]

[0053]

[0054]

[0055]

[0056]

[0057]

[0058]

[0059]

[0060]

[0061]

[0062]

[0063]

[Table 1]

[0064]

[Table 2]

[0065]

[Table 3]

[0066]

[Table 4]

[0067]

[Table 5]

[0068]

According to the present invention, the solvent composition of the present invention is
There are advantages such as satisfying the excellent characteristics possessed by the compound and hardly affecting the ozone layer.

────────────────────────────────────────────────── (56) References US Patent 5304322 (US, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C11D 7/50 C11D 7/30 C07C 19/08

Claims (2)

(57) [Claims] 1. A least one n- hexane and cyclohexane _{(a), C 3 HCl 2} F 5 compound (b), C ₆ F
₁₄ (c) and alcohols (d), (a)
(A) to the total amount of (b), (c) and (d),
The proportions of (b), (c) and (d) are each 1 to 20
%, 15-60% by weight, 20-60% by weight and 1%
A solvent composition that is from 10 to 10% by weight. 2. The method according to claim 1, wherein the C ₃ HCl ₂ F ₅ is CF ₃ CF ₂ CHC.
0.01 to 99.99% by weight of l ₂ and CF ₂ ClCF
_A mixture comprising 0.01 to 99.99% by weight of ₂ CHClF, wherein C ₆ F ₁₄ is CF ₃ (CF ₂ ) ₄ CF ₃ 65 to 77.
_{Wt%, (CF 3) 2 CF} (CF 2) 2 CF 3 16~2
6% by weight and CF ₃ CF ₂ CF (CF ₃ ) CF ₂ CF
_{3 to} 12% by weight of a mixture or CF ₃ (CF
_{2) 4} CF ₃ a solvent composition of claim 1.