JP3327870B2 - Ultrasonic signal processor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a plant (PWR)
The present invention relates to an ultrasonic signal processing apparatus for performing non-destructive inspection by ultrasonic flaw detection (UT) for equipment / piping, motor equipment / piping, steel products, aerospace bodies, and the like.

[0002]

2. Description of the Related Art In ultrasonic flaw detection, an ultrasonic pulse is emitted to a base material to be inspected, and the presence or absence of a flaw is examined nondestructively by detecting an echo from the flaw by a sensor.

As shown in FIG. 9 (a), when no flaw exists in the base material, nothing is detected by the sensor S.
When a flaw K exists in the base material as shown in FIG. 9B, a flaw echo is detected by the sensor S. on the other hand,
As shown in FIG. 9 (c), the adherent F
When there is such a foreign substance, the sensor S detects a crack Fw of the foreign substance and an echo from the distribution boundary of the foreign substance even if the base material is sound. This is called a pseudo echo.

[0004] It is important for inspection to discriminate whether the echo obtained by the inspection is a flaw echo or a pseudo echo.
In the prior art, there are two methods for distinguishing such a flaw echo from a pseudo echo: (1) a method based on estimation of an echo generation position, and (2) a method based on the frequency characteristics of the echo.
There are types. Hereinafter, these methods will be described in order.

(1) Method of Estimating Echo Generation Position As shown in FIG. 10, the echo generation position is determined by the traveling path (estimated) of the ultrasonic wave determined by various parameters D1, D2, L1, L2, θ1, θ2. ) And the speed of sound of the passing medium. Thus, if the echo generation position is inside the subject, it is identified as a flawed echo, and if it is outside it, it is identified as a pseudo echo.

As a method for improving the accuracy of specifying the depth of the echo generation position, various methods as shown in FIG. 11 (dB drop method, evaluation level method, method using only echo height, bevel edge Partial echo method) has been proposed.

(2) A method based on the frequency characteristics of the echo Focusing on the difference between the frequency characteristics of the flaw echo and the pseudo echo, an echo having a frequency distribution different from the frequency distribution of the flaw echo serving as a sample prepared in advance is distinguished from the pseudo echo. Is what you do.

[0008]

However, in the method based on the estimation of the echo generation position shown in the above (1), when there is a foreign substance in close contact with the subject, only the depth from the external surface of the foreign substance is detected. is there. In determining whether the echo generation position is inside the subject, the design value of the distance between the sensor and the surface of the subject and the thickness of the subject is used. For this reason, when the error is large and the thickness of the foreign matter is thin, there is a problem that the flaw echo and the pseudo echo cannot be accurately distinguished. In addition, when it is necessary to obtain the thickness of the subject, the thickness of the deposit, and the depth of the flaw of the subject, there is a problem that these cannot be accurately measured.

In general, when the flaw echo and the pseudo echo have very similar frequency characteristics (for example, a pseudo echo is generated from a crack of an extraneous matter that is very thin with respect to the thickness of the base material of the subject). There are many. In such a case, the above (2)
However, even if the method based on the frequency characteristics of the echo described in (1) is used, there is a problem that the flaw echo and the pseudo echo cannot be accurately distinguished.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide an ultrasonic signal processing apparatus capable of accurately distinguishing a flaw echo from a pseudo echo.

It is another object of the present invention to provide an ultrasonic signal processing apparatus capable of accurately measuring the thickness of a subject, the thickness of a substance attached thereto, and the depth of a flaw in the subject.

[0012]

(1) An ultrasonic signal processing apparatus according to the present invention emits an ultrasonic wave to a subject, and detects a vertical sensor signal and an oblique angle sensor signal detected by a vertical sensor and an oblique angle sensor. An ultrasonic signal processing device for identifying flaws in the subject by using a means for detecting the position of the inner surface of the subject based on a vertical sensor signal obtained from the vertical sensor; and the detected subject. Means for displaying a first cross-sectional image including the position of the inner surface, means for detecting the position of the outer surface of the subject from the first cross-sectional image, and a vertical sensor for detecting the position of the outer surface of the subject. Means for converting the position on the signal to the position on the oblique angle sensor signal; means for detecting the position of the inner surface of the subject based on the oblique angle sensor signal obtained from the oblique angle sensor; Position of the inner surface of the subject Means for displaying a second cross-sectional image including: means for additionally displaying the position of the external surface of the subject obtained by the conversion on the second cross-sectional image; and displaying the position of the external surface of the object additionally Means for comparing the position of the outer surface of the subject with the position of the evaluation target on the second cross-sectional image thus determined to determine whether or not the evaluation target is a flaw. I do.

[0013]

[0014]

[0015]

[0016]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) In this embodiment, as a sensor that emits an ultrasonic pulse to a base material as a subject and detects its echo, a vertical type that detects an echo in a direction perpendicular to the base material surface is used. A sensor and an oblique sensor that detects echoes in oblique directions are used. By moving the base material or the vertical sensor / oblique angle sensor, the base material can be scanned, and echoes at each point on the base material can be observed. Ultrasonic signals obtained at a plurality of observation points by the vertical sensor and the oblique angle sensor are sent to an ultrasonic signal processing device.

FIG. 1 is a block diagram showing a configuration of an ultrasonic signal processing apparatus according to the first embodiment of the present invention.

This ultrasonic signal processing device includes a pseudo echo identification device 1. The pseudo echo identification device 1 includes a base material inner surface detecting device 2 for a vertical sensor, a corrected cross section C scope display device 3, a base material outer surface detecting device 4, a base material outer surface converting device 5, and a base material inner surface for an oblique angle sensor. It comprises a detection device 6, a corrected B scope display device 7, a base metal outer surface display device 8, and an evaluation device 9.

The base material inner surface detecting device 2 for a vertical sensor inputs an ultrasonic signal obtained by a vertical sensor, and generates a base material inner surface echo generation time for each time-series signal observed at each observation point. Ask for.

The corrected cross-section C-scope display device 3 processes the ultrasonic signal obtained by the vertical sensor by using the base material inner surface echo occurrence time obtained by the base material inner surface detecting device 2 for the vertical sensor. Displays the corrected cross section C scope.

The base metal outer surface detecting device 4 detects the generation time of the base metal outer surface echo in the vertical sensor signal from the corrected cross section C scope displayed by the corrected cross section C scope display device 3.

The base material outer surface conversion device 5 converts the base material outer surface echo generation time in the vertical sensor signal obtained by the base material outer surface detector 4 into the base material outer surface echo generation time in the oblique angle sensor signal. .

On the other hand, the base material inner surface detecting device 6 for the oblique angle sensor
Inputs the ultrasonic signal obtained by the oblique angle sensor and obtains the time of occurrence of the surface echo in the base material for each time-series signal observed at each observation point.

The corrected B scope display device 7 processes the ultrasonic signal obtained by the oblique angle sensor using the occurrence time of the base material inner surface echo obtained by the oblique angle sensor base material inner surface detecting device 6. Accordingly, the correction B scope is displayed.

The base metal outer surface display device 8 displays the base metal outer surface echo generation time in the oblique angle sensor signal obtained by the base metal outer surface conversion device 5 in a corrected cross-section display displayed on the corrected B scope display device 7. Display additional.

The evaluation device 9 includes a correction B scope display device 7
By comparing the base metal outer surface position displayed by the base metal outer surface display device 8 with the position of the evaluation target echo, it is determined whether the evaluation target echo is a flaw echo or a pseudo echo.

Next, the operation of the first embodiment will be described. Base material inner surface detection device 2 for vertical sensor
Is an input of ultrasonic signals obtained at a number of observation points by a vertical sensor, and the motherboard of the time-series signal A (X, Y, T) observed at the time T at the observation points (X, Y). The inner surface echo generation time T3 (X, Y) is obtained by the procedure shown in FIG.

That is, the processing for each observation point (step S
In 1), an amplitude generation time T1 equal to or larger than a threshold value is extracted from the time-series signal A (X, Y, T) which is a measured value (step S11), and the maximum amplitude A1 of the T1 waveform is obtained (step S12). ), And find a rising position T2 of the T1 waveform (r
Is a constant of 0 <r <1, and a point immediately before the amplitude becomes larger than A1 × r is T2) (step S13).

T2 obtained at the observation point position (X, Y) is defined as T2 (X, Y), and T2 (X, Y) is smoothed by a two-dimensional median filter to T3 (X, Y). (This reduces the effect of measurement noise), and T3 (X, Y) is set as the inner surface echo occurrence time at each observation point (step S
2).

The corrected cross-section C scope display device 3 converts the ultrasonic signal A (X, Y, T) obtained by the vertical sensor into the base material inner surface echo obtained by the base material inner surface detecting device 2 for the vertical sensor. The signal A2 (X, Y) shifted in the time direction by the occurrence time T3 (X, Y)
Y, T). That is, A2 (X, Y, T) = A (X, Y, T + T3 (X, Y)) (1) is obtained. In this A2 (X, Y, T), T is a constant value 1,
2,..., That is, A2 (X, Y, 1), A2
(X, Y, 2),... Are displayed in the C scope. This is called a correction section C scope. FIG. 3 shows an example of the corrected cross-section C scope display.

In the example of FIG. 3, a series of images (23) to (40) showing the outer surface of the base material in a time series are shown. In this figure, a color tone display by a pseudo color is used as the C scope, and the magnitude of the signal amplitude is displayed, for example, as black <blue <green <yellow <red. Has become.) In the upper part of the image (29), etc.
A portion corresponding to the outer surface EDM flaw appears as a laterally extended shadow.

The base metal outer surface detecting device 4 detects the generation time of the base metal outer surface echo in the vertical sensor signal from the corrected cross section C scope displayed by the corrected cross section C scope display device 3. The occurrence time of the base material outer surface echo is calculated in the corrected section C
In the scope display, when the inner surface echo subsides (the display color continuously changes from green to black) in the direction in which T becomes larger from T = 0, the amplitude uniformly appears (the display color changes from yellow to yellow). (Turns red), which is T4 (X, Y).

The base material outer surface conversion device 5 calculates the base material outer surface echo generation time T4 (X, Y) in the vertical sensor signal obtained by the base material outer surface detection device 4 by using the base material outer surface in the oblique angle sensor signal. This is converted into an echo generation time T5 (X, Y). This conversion is based on the fact that the sound speed of the ultrasonic wave by the vertical sensor in the base material is V
1. The sound velocity of the ultrasonic wave by the oblique angle sensor in the base material is V2,
When the angle between the traveling direction of the ultrasonic wave by the oblique angle sensor in the base material and the normal vector of the inner surface of the base material is θ, T5 (X, Y) = T4 (X, Y) × V1 / V2 / Cos (θ) (2)

The base material inner surface detecting device 6 for the oblique angle sensor receives an ultrasonic signal obtained by the oblique angle sensor and generates a base material inner surface echo of a time series signal observed at each observation point. Find the time. However, since the oblique angle sensor cannot receive the internal surface echo with the single-ended type (in which transmission and reception are performed by the same probe), the echo obtained by the internal surface echo detection receiver is used. FIG. 4 shows a procedure for detecting the base material inner surface echo occurrence time T6 (X, Y).

That is, the processing for each observation point (step S
In 3), a time-series signal A ′ (X, Y, T) which is a measured value
, An amplitude generation time T1 ′ equal to or greater than the threshold value is extracted (step S31), the maximum amplitude A1 ′ of the T1 ′ waveform is obtained (step S32), and the rising position T of the T1 ′ waveform
2 ′ is obtained (r ′ is a constant of 0 <r ′ <1 and a point immediately before the amplitude becomes larger than A1 ′ × r ′ is T2 ′) (step S33). Further, a correction amount Td up to the inner surface position is obtained from the arrangement of the oblique angle sensor position and the inner surface echo receiver (step S34).

Then, T2 'obtained at the observation point position (X, Y)
Is defined as T2 ′ (X, Y), and T2 ′ (X, Y) −Td (X, Y) is smoothed by a two-dimensional median filter to T6 ′.
(X, Y) (this reduces the influence of measurement noise), and T6 (X, Y) is set as the inner surface echo occurrence time at each observation point (step S4).

The corrected B scope display device 7 converts the ultrasonic signal A '(X, Y, T) obtained by the oblique angle sensor into the base material obtained by the oblique angle sensor base material inner surface detecting device 6. A signal A2 '(X, Y, T) shifted by the surface echo generation time T6 (X, Y) is obtained. That is, A2 '(X, Y, T) = A' (X, Y, T + T6 (X, Y)) (3) is obtained. In this A2 '(X, Y, T), X is a constant value X
The cross section of 0, that is, A2 '(X0, Y, 1) is displayed in a pseudo color tone diagram. This is called a correction B scope. X0 is a position including the echo to be evaluated.

The base material outer surface display device 8 displays the base material outer surface echo generation time in the oblique angle sensor signal obtained by the base material outer surface conversion device 5 in a corrected sectional display displayed on the corrected B scope display device 7. Display additional. FIG. 5 shows an example of the display of the base material outer surface position by the correction B scope.

Also in FIG. 5, similar to FIG. 3, a color tone display using pseudo colors is used, and the magnitude of the signal amplitude is displayed, for example, black <blue <green <yellow <red (actually, It is shaded in the submitted drawing). FIG.
In the image shown in (1), shadows corresponding to the respective portions of the inner surface of the base material, the outer surface of the base material, and the outer surface of the attached matter appear as three vertically extending shadows. In addition, end echoes appear on the left side of the outer surface of the base material, and evaluation target echoes 1, 2, and 3 appear on the right side.

The evaluation device 9 includes a correction B scope display device 7
By comparing the base material outer surface position displayed by the base material outer surface display device 8 with the position of the evaluation target echo, it is determined whether the evaluation target echo is a flaw echo or a pseudo echo. That is, if the position of the evaluation target echo is inside the base material outer surface position (the smaller of the time), the echo is a flaw in the base material, and the evaluation target echo position is outside the base material outer surface position. If so, the echo is determined to be a pseudo echo. In the example of FIG. 5, the evaluation target echo 1 and the evaluation target echo 2 are determined to be echoes from a flaw in the base material, and the evaluation target echo 3 is determined to be a pseudo echo.

The features of the invention shown in the first embodiment are summarized as follows.

Correction of vertical sensor signal Echo from the boundary surface between the base material and the deposit (ie, the outer surface of the base material), which is a fine signal, is detected by the C-scope display of the cross section, and the base material and the deposit are detected. A point that accurately specifies the position of the boundary surface with.

(For the oblique angle sensor and the vertical sensor) In the inner surface detecting device, a point for specifying the inner surface position by smoothing the inner surface position obtained from the time series signals at a number of observation points.

The boundary position between the base material and the adhered substance obtained from the vertical sensor signal is converted into the position based on the oblique angle sensor signal, and the boundary surface position based on the oblique angle sensor signal is accurately obtained. A point that specifies whether the echo to be evaluated is an echo from a flaw in the base material or a pseudo echo due to an attached matter based on the relationship with the position of the echo.

As described above, according to the first embodiment, it is possible to accurately distinguish a flaw echo from a pseudo echo.

(Second Embodiment) In the second embodiment, the same elements as those in the first embodiment are denoted by the same reference numerals, and redundant description will be omitted. Hereinafter, a description will be given mainly of a portion different from the first embodiment.

FIG. 6 is a block diagram showing the configuration of an ultrasonic signal processing device according to the second embodiment of the present invention. The ultrasonic signal processing device includes a base material pressure measuring device 10. The base material pressure measuring device 10 is a base material pressure measuring device 10.
Is a vertical sensor base material inner surface detecting device 2, a corrected cross-section C scope display device 3, and a base material outer surface detecting device 4, and
It comprises a base material pressure calculating device 11. The input / output and functions of the vertical sensor base material inner surface detecting device 2, the corrected cross section C scope display device 3, and the base material outer surface detecting device 4 are as follows.
This is the same as in the embodiment.

The base material pressure calculator 11 calculates the base material pressure from the base material outer surface echo occurrence time obtained by the base material outer surface detector 4.

Next, the operation of the second embodiment will be described. The base material thickness calculating device 11 calculates the base material outer surface echo generation time T4 obtained by the base material outer surface detection device 4.
From (X, Y), the base material thickness W1 (X, Y) is calculated by the following equation. Here, V1 indicates the sound speed of the ultrasonic wave by the vertical sensor in the base material. W1 (X, Y) = T4 (X, Y) × V1 / 2 (4) The features of the invention shown in the second embodiment are summarized as follows.

Correction of vertical sensor signal Cross-section C scope display detects a fine signal, an echo from the boundary surface between the base material and the attached matter (that is, the outer surface of the base material), and detects the echo between the base material and the attached matter. A point in which the position of the boundary surface is accurately specified, and the base material pressure is accurately specified using the boundary surface position.

(For the oblique angle sensor and the vertical sensor) In the inner surface detecting device, a point for specifying the inner surface position by smoothing the inner surface position obtained from the time series signals at a number of observation points.

As described above, according to the second embodiment, it is possible to accurately measure the base material pressure.

(Third Embodiment) In the third embodiment, the same elements as those in the above-described embodiment are denoted by the same reference numerals, and duplicate description will be omitted. The following description focuses on the differences from the above-described embodiment.

FIG. 7 is a block diagram showing a configuration of an ultrasonic signal processing device according to the third embodiment of the present invention. This ultrasonic signal processing device includes an attached matter thickness measuring device 12. The attached matter thickness measuring device 12 includes a base material inner surface detecting device 2 for a vertical sensor, a corrected cross section C scope display device 3, a base material outer surface detecting device 4, and an attached matter outer surface detecting device 1.
3 and an attached matter thickness calculating device 14. In addition,
The input / output and functions of the vertical sensor base material inner surface detecting device 2, corrected cross-section C scope display device 3, and base material outer surface detecting device 4 are the same as those in the first embodiment.

The adhering substance outer surface detecting device 13 obtains the occurrence time of the adhering substance outer surface echo from the corrected cross section C scope displayed by the corrected cross section C scope display device 3.

The adhering material thickness calculating device 14 appends the occurrence time of the base material outer surface echo obtained by the base material outer surface detecting device 4 and the adhering material outer surface echo occurrence time obtained by the adhering material outer surface detecting device 13. Calculate the body pressure of the kimono.

Next, the operation of the third embodiment will be described. The extraneous matter outer surface detecting device 13 uses the corrected cross-sectional C-scope displayed by the corrected cross-sectional C-scope display device 3 to determine the occurrence time of the extraneous matter surface echo at T7 (X, Y)
To identify. On the outer surface of the attached matter, the amplitude is maximized after the inner surface echo is reduced (the display color is continuously changed from green to black) in the direction in which T increases from T = 1 in the corrected cross-section C scope display. It is time to become. This time for each observation point is defined as the extraneous matter outer surface echo generation time T7 (X, Y).

If no extraneous matter is adhered, the outer surface echo of the base material has the maximum amplitude, so that T7 (X, Y) = T4
(X, Y).

The attached material thickness calculating device 14 calculates the base material outer surface time T4 (X, Y) obtained by the base material outer surface detecting device 4 and generates the attached material outer surface echo obtained by the attached material outer surface detecting device 13. From time T7 (X, Y), the thickness W2 (X, Y) of the deposit is calculated by the following equation. Here, V3 indicates the sound speed of the ultrasonic wave by the vertical sensor in the attached matter.

W3 (X, Y) = (T7 (X, Y) −T4 (X, Y)) × V3 / 2 (5) The features of the invention shown in the third embodiment can be summarized as follows. It becomes as follows.

Correction of vertical sensor signal Cross-section C scope display detects a fine signal, an echo from the boundary surface between the base material and the adhered substance (ie, the outer surface of the base material) and detects the echo between the base material and the adhered substance. The point where the position of the boundary surface is accurately specified, and the wall pressure of the attached matter is accurately specified using the boundary surface position.

(For the oblique angle sensor and the vertical sensor) In the inner surface detecting device, a point for specifying the inner surface position by smoothing the inner surface position obtained from time series signals at a number of observation points.

As described above, according to the third embodiment, it is possible to accurately measure the thickness of the deposit.

(Fourth Embodiment) In the fourth embodiment, the same reference numerals are given to the same components as those in the above-described embodiment, and the overlapping description will be omitted. The following description focuses on the differences from the above-described embodiment.

FIG. 8 is a block diagram showing a configuration of an ultrasonic signal processing device according to the fourth embodiment of the present invention. This ultrasonic signal processing device includes a flaw depth measuring device 15. The flaw depth measuring device 15 includes a base material inner surface detecting device 2 for a vertical sensor, a corrected cross section C scope display device 3 and a base material outer surface detecting device 4, an enhanced corrected cross section C scope display device 16, and a flaw end. It comprises a detector 17 and a flaw depth calculator 18. The input / output and functions of the vertical sensor base material inner surface detecting device 2, corrected cross-section C scope display device 3, and base material outer surface detecting device 4 are the same as those in the first embodiment.

Highlighted Correction Cross Section C Scope Display 16
Displays an enhanced correction cross-section C scope by processing the ultrasonic signal obtained by the vertical sensor using the base material inner surface time obtained by the base material inner surface detecting device 2 for the vertical sensor.

The flaw end detecting device 17 is provided with an enhanced correction section.
The occurrence time of the flaw end echo is obtained from the enhanced correction cross section C scope displayed by the C scope display device 16.

The flaw depth calculator 18 calculates the “generation time of the base metal outer surface echo” obtained by the base metal outer surface detector 4,
Then, the depth of the flaw is calculated from the “flaw-end echo occurrence time” obtained by the flaw-end detecting device 17.

Next, the operation of the fourth embodiment will be described. Highlighted corrected cross section C scope display device 1
6 is an ultrasonic signal A (X, Y,
T2 is obtained by shifting the signal A2 in the time direction by the base material inner surface time T3 (X, Y) obtained by the base material inner surface detecting device 2 for the vertical sensor.
An edge-enhanced signal A3 (X, Y, T) is obtained by performing a filtering process F on (X, Y, T). That is, A2 (X, Y, T) = A (X, Y, T + T3 (X, Y)) (6) For each T, A3 (X, Y, T) = F (A2 ( X, Y, T)) ... (7) Here, F is a two-dimensional filter having an edge enhancement effect, and an example of F is a two-dimensional median filter subtraction filter. This means that a) an arbitrary two-dimensional signal is B (X, Y) b) a two-dimensional median filter result of B (X, Y) is B2 (X, Y)
Y) C) When the subtraction filter result of the two-dimensional median filter of B (X, Y) is B3 (X, Y), B2 (X, Y) = median ｛B (Xi, Yj): | Xi−X | ≦ d1 and | Yj−Y | ≦ d2｝ (8) where d1 and d2 indicate constant parameters indicating a window frame, and median indicates a median value.

B3 (X, Y) = F (B (X, Y)) = B (X, Y) −B2 (X, Y) (9) B2 is a drift component (low-frequency component) of B (X, Y), and by subtracting it from B (X, Y), the edge component (high-frequency component) of B3 (X, Y) is emphasized. Signal.

The distribution of the flaws in the corrected cross section has a higher frequency than the change in the wall pressure of the base material. Therefore, by emphasizing the edges, the echoes of the flaws are removed by removing the components of the outer surface echo and the inner surface echo of the base material. Can be emphasized. here,
F is not specified for the filter of this example, and if a flaw direction can be specified, an optimum emphasizing filter may be selected depending on conditions such as applying a differential filter in a direction orthogonal to the flaw direction.

In this A3 (X, Y, T), T is a constant value 1,
2,... At each time, that is, A3 (X, Y, 1), A4
(X, Y, 2),... Are displayed in the C scope. This is called an enhanced correction section C scope.

The flaw end detecting device 17 detects the occurrence time of the flaw end echo from the enhanced correction cross-section C scope displayed by the enhanced correction cross-section C scope display device T8.
Specify (X, Y). The flaw edge echo refers to an echo generated by the tip of a flaw generated in the base material.

In the enhanced type correction cross section C scope display,
In the direction in which T becomes larger from T = 0, the time at which the flaw echo can be first confirmed is the flaw end echo generation position T8.
(X, Y). The flaw edge echo is a small signal and is difficult to confirm by the conventional display method. However, the flaw is emphasized by the enhanced correction cross-section C scope display, and can be confirmed as a two-dimensional connection, so that it is easy to detect.

T8 at a position where no flaw echo can be confirmed
(X, Y) = T4 (X, Y).

The flaw depth calculator 18 calculates the base material outer surface time T4 (X, Y) obtained by the base material outer surface detector 4, and
From the flaw end echo occurrence time T8 (X, Y) obtained by the flaw end detecting device 17, the flaw maximum depth D and the maximum value R of the ratio of the flaw depth to the wall pressure are calculated by the following equations. Here, V1 indicates the sound speed of the ultrasonic wave by the vertical sensor in the base material.

D = max (T4 (X, Y) −T8 (X, Y)) × V1 / 2 (10) R = max ((T4 (X, Y) −T8 (X, Y)) / T8 (X, Y))) (11) The features of the invention shown in the fourth embodiment are summarized as follows.

Correction of vertical sensor signal Cross-section C scope display detects a fine signal, an echo from the boundary surface between the base material and the attached matter (that is, the outer surface of the base material) and detects the echo between the base material and the attached matter. A point where the position of the boundary surface is accurately specified, and the depth is accurately determined without using the boundary surface position.

[0096] By the display of the emphasized correction cross section C scope,
The point that the flaw edge echo occurrence time, which has been difficult to detect in the past, is accurately specified, and the depth is accurately determined without using this.

(For the oblique angle sensor and the vertical sensor) A point for specifying the inner surface position by smoothing the inner surface position obtained from the time series signals at a number of observation points in the inner surface detecting device.

As described above, according to the fourth embodiment, it is possible to accurately measure the depth of a flaw.

The present invention is not limited to the above-described embodiments, but can be implemented with appropriate modifications without departing from the scope of the invention. For example, the above-described first to fourth embodiments may be appropriately combined and implemented.

[0083]

As described above in detail, according to the ultrasonic signal processing apparatus of the present invention, the position of the inner surface of the subject is detected based on the vertical sensor signal obtained from the vertical sensor. A first cross-sectional image including the position of the inner surface of the subject is displayed, the position of the outer surface of the subject is detected from the first cross-sectional image, and the detected position of the outer surface of the subject is determined by a vertical sensor signal. The above position is converted into a position on the oblique angle sensor signal. On the other hand, the position of the inner surface of the subject is detected based on the oblique angle sensor signal obtained from the oblique angle sensor, and a second cross-sectional image including the detected position of the inner surface of the subject is displayed. Then, the position of the outer surface of the subject obtained by the conversion is additionally displayed on the second sectional image, and the position of the outer surface of the subject is additionally displayed on the second sectional image in which the position of the outer surface of the subject is additionally displayed. By comparing the position of the outer surface of the sample with the position of the evaluation target, it is determined whether or not the evaluation target is a flaw.

As described above, by converting the boundary surface position (external surface position of the subject) between the subject and the attached matter obtained from the vertical sensor signal into a position on the oblique angle sensor signal, Can be determined with high accuracy, and the relationship between this boundary surface position and the position of the evaluation target can be determined, so that flaw echoes and pseudo echoes can be accurately distinguished.

According to the ultrasonic signal processor of the present invention, the position of the inner surface of the subject is detected based on the vertical sensor signal obtained from the vertical sensor, and the detected position of the inner surface of the subject is detected. Is displayed, the position of the outer surface of the subject is detected from the cross-sectional image, and the thickness of the subject is calculated using the detected position of the outer surface of the subject.

As described above, the position of the boundary between the subject and the attached matter (the position of the outer surface of the subject) determined by the vertical sensor signal is accurately determined, and the thickness of the subject is determined based on the position of the boundary. Is calculated, the thickness can be accurately measured.

According to the ultrasonic signal processing apparatus of the present invention, the position of the inner surface of the subject is detected based on the vertical sensor signal obtained from the vertical sensor, and the detected position of the inner surface of the subject is detected. Is displayed, and the position of the outer surface of the subject is detected from the cross-sectional image. On the other hand, the position of the outer surface of the attached matter is detected from the cross-sectional image. Then, based on the detected position of the outer surface of the subject and the detected position of the outer surface of the attached matter, the body pressure of the attached matter is calculated.

As described above, the position of the boundary surface (external surface position of the subject) between the subject and the deposit obtained by the vertical sensor signal is accurately obtained, and the position of the outer surface of the deposit is accurately detected. , The body pressure of the attached matter can be calculated with high accuracy.

Further, according to the ultrasonic signal processing apparatus of the present invention, the position of the inner surface of the subject is detected based on the vertical sensor signal obtained from the vertical sensor, and the detected position of the inner surface of the subject is detected. A first cross-sectional image including
The position of the outer surface of the subject is detected from the first cross-sectional image. On the other hand, a second cross-sectional image including the detected position of the inner surface of the subject, which is a second cross-sectional image that has been subjected to a predetermined filtering process in which the position of the flaw of the subject is emphasized, is displayed. The position of the end of the flaw is detected from the second cross-sectional image. The depth of the flaw is calculated based on the detected position of the outer surface of the specimen and the detected position of the end of the flaw.

As described above, the boundary surface position (external surface position of the subject) between the subject and the adhering matter determined by the vertical sensor signal is accurately obtained, and the position of the flaw of the subject is detected from the cross-sectional image in which the flaw is emphasized. Since the depth of the flaw of the subject is calculated based on the detected position of the end of the flaw with high accuracy, the depth of the flaw of the subject can be accurately measured.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an ultrasonic signal processing device according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing a processing procedure of the “vertical sensor base material inner surface detecting device” in the embodiment;

FIG. 3 is a halftone image showing an example of “correction section C scope display” in the embodiment.

FIG. 4 is a flowchart showing a processing procedure of a “base material inner surface detecting device for oblique angle sensor” in the embodiment.

FIG. 5 is a halftone image showing an example of “base metal outer surface position” display by “correction B scope display” in the embodiment.

FIG. 6 is a block diagram showing a configuration of an ultrasonic signal processing device according to a second embodiment of the present invention.

FIG. 7 is a block diagram showing a configuration of an ultrasonic signal processing device according to a third embodiment of the present invention.

FIG. 8 is a block diagram showing a configuration of an ultrasonic signal processing device according to a fourth embodiment of the present invention.

FIG. 9 is a diagram for explaining a flaw echo and a pseudo echo.

FIG. 10 is a diagram for explaining a method based on estimation of an echo generation position.

FIG. 11 is a diagram showing various methods for specifying the depth of an echo generation position.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Pseudo-echo discriminating device 2 ... Base material inner surface detecting device for a vertical sensor 3 ... Corrected cross section C scope display device 4 ... Base material outer surface detecting device 5 ... Base material outer surface converting device 6 ... Inside the base material for oblique angle sensor Surface detection device 7 ... Corrected B scope display device 8 ... Base material outer surface display device 9 ... Evaluation device 10 ... Base material thickness measurement device 11 ... Base material thickness calculation device 12 ... Adhesion thickness measurement device 13 ... Adhesion Outer surface detecting device 14 ... Thickness calculating device 15 ... Flaw depth measuring device 16 ... Enhanced correction cross section C scope display device 17 ... Flaw end detecting device 18 ... Flaw depth calculating device

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-88653 (JP, A) JP-A-58-151555 (JP, A) JP-A-11-51912 (JP, A) JP-A-Heisei 4- 242109 (JP, A) Patent 2889568 (JP, B2) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01N 29/00-29/28 G01B 17/00-17/02

Claims (1)

(57) [Claims] An ultrasonic signal processing apparatus for emitting ultrasonic waves to a subject and identifying flaws in the subject using vertical sensor signals and oblique angle sensor signals detected by a vertical sensor and an oblique angle sensor. In, means for detecting the position of the subject inner surface based on a vertical sensor signal obtained from the vertical sensor, means for displaying a first cross-sectional image including the detected position of the subject inner surface, Means for detecting the position of the outer surface of the subject from the first cross-sectional image; and converting the detected position of the outer surface of the subject from a position on the vertical sensor signal to a position on the oblique angle sensor signal. Means for detecting the position of the inner surface of the subject based on the oblique angle sensor signal obtained from the oblique angle sensor; and displaying a second cross-sectional image including the detected position of the inner surface of the subject. Means, the second Means for additionally displaying the position of the outer surface of the subject obtained by the conversion on the cross-sectional image of the above; Means for comparing the position of the evaluation target with the position of the evaluation target to identify whether or not the evaluation target is a flaw.