JP3327189B2 - Method for manufacturing multilayer wiring TAB tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a TAB (tape automated bondinng) which is a kind of wireless bonding.
The present invention relates to a TAB tape used in a system, and more particularly to a method for manufacturing a multilayer wiring TAB tape in which wiring is formed over multiple layers.

[0002]

2. Description of the Related Art A conventional TAB tape generally has a one-layer wiring pattern formed thereon. Recently, a two-metal TAB tape has a wiring pattern provided on both sides.
A layer wiring TAB tape has appeared. The purpose of the two-metal TAB tape is to improve high-speed transmission. For example, the shorter the wiring from the IC chip to other components (devices), the higher the transmission speed. Therefore, wiring is provided on both surfaces to enable the components to be electrically connected to each other.

FIG. 5 shows an example of a two-metal TAB tape. In FIG. 5, wiring patterns 2 and 3 are formed by photo-etching a copper foil laminated on both sides of a polyimide film 1. In FIG. 5A, conduction between the wiring patterns 2 and 3 is performed by through holes, and the copper plating layers 4 provided in the through holes 1a formed in the polyimide film 1 form wiring patterns on both surfaces. There is electrical conduction between the two and three. In FIG. 5B, conduction between the wiring patterns 2 and 3 is performed by via holes, and the copper plating layer 5 provided in the via holes 1b on the polyimide film 1 causes the wiring patterns 2 and 3 on both surfaces to pass.
There is conduction between them.

[0004] Multi-layer wiring TAB with via holes formed
As a method of manufacturing the tape, the following method can be considered. Incidentally, the one in which the through hole is formed can be manufactured by the same method.

First, a sprocket hole is punched out of a polyimide double-sided copper-clad tape in which copper foil is laminated on both sides of a polyimide film by a press or the like. A photoresist is applied or laminated on one side of the polyimide double-sided copper-clad tape, and holes are made in the copper foil by performing exposure, development, backing, etching, and stripping of the photoresist. A hole is formed in the polyimide film by laser beam irradiation or chemical etching. Next, copper plating is applied to the surface on which the holes are formed, a photoresist is applied or laminated on the surface of the copper plating layer, and exposure, development, backing, etching, and photoresist stripping are performed. The wiring pattern of the layer is formed.

Next, a single-sided copper foil polyimide film in which a copper foil is laminated on one side and an adhesive is laminated on the other side is adhered to the second-layer wiring pattern with an adhesive. When the adhesive is cured, a photoresist is applied or laminated on the via hole side, and exposure, development, backing, etching, and removal of the photoresist are performed to form holes in the copper foil. A hole is formed in the polyimide film at the hole by laser beam irradiation or chemical etching. Copper plating is applied to the surface where the holes are formed, photoresist is applied or laminated on the surface of this copper plating layer, and exposure, development, backing, etching, and photoresist stripping are performed, so that the device holes are removed. Corresponding portions of copper are removed by etching. Further, the polyimide film is removed by performing laser beam irradiation or chemical etching on this portion to form a device hole. A third layer wiring pattern is formed by applying or laminating a photoresist on the via hole side, exposing, developing, backing, etching, and removing the photoresist.

[0007] Finally, a photoresist is applied or laminated on the copper foil surface on the opposite side, and exposure, development, backing, etching, and removal of the photoresist are performed to form a first-layer wiring pattern. Through the steps described above, the manufacture of the three-layer wiring TAB tape having the three-layer structure is completed.

[0008]

However, in the above-described method for manufacturing a three-layer wiring TAB tape, it is possible to stably bond a single-sided copper foil polyimide film with an adhesive after forming a second-layer wiring pattern. There is a problem that it is not possible, even when laminating polyimide films laminated copper foil, bubbles are caught between layers,
There is a problem that the reliability of adhesion between layers cannot be ensured due to partial peeling or the like, and the production of such a three-layer wiring TAB tape has not yet been put to practical use or commercialization. is the current situation.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a multilayer wiring TAB tape capable of manufacturing a multilayer wiring TAB tape having high reliability and good high-speed transmission. .

[0010]

[0011]

In order to achieve the object of the present onset Akira of the multi-layer wiring TAB
The method of manufacturing a tape includes laminating a first uncured resin layer on a conductive foil body, removing the first uncured resin layer corresponding to a conductive portion, and curing the first uncured resin layer. A first intermediate thin film body is manufactured, a conductive layer is laminated on at least the surface of the first intermediate thin film body on the cured resin layer side, and the conductive layer formed on at least the cured resin layer side is photo-etched. Forming a wiring pattern, laminating a second uncured resin layer on at least the surface of the cured conductive layer on the resin layer side, removing the second uncured resin layer corresponding to the conductive portion, and removing the second uncured resin layer; Curing the cured resin layer to produce a second intermediate thin film,
A conductive layer is laminated on at least the cured resin layer side surface of the second intermediate thin film body, and a wiring pattern is formed on at least one of the conductive layer and the conductive foil body by photoetching. I do.

The multilayer wiring TA obtained by the above manufacturing method
After laminating the uncured resin layer on the wiring pattern formed on the surface of the B tape, the uncured resin layer corresponding to the conductive portion is removed, and the uncured resin layer is cured to produce an intermediate thin film body. A series of steps of laminating a conductive layer on at least the surface of the cured resin layer of the intermediate thin film body and forming a wiring pattern on at least one of the conductive layer and the conductive foil body by photoetching. It may be added more than once.

Further, a step of removing the uncured resin layer to form a recess corresponding to a device hole may be added. The removal of the uncured resin layer corresponding to the recess may be performed by a laser beam. Further, the removal of the uncured resin layer corresponding to the recess may be performed by a chemical that dissolves the uncured resin.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a multilayer wiring TAB tape according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First, a film-like uncured resin layer 11 is laminated (laminated) on one side of a film-like copper foil 10 as shown in FIG. 1A using a dry film laminator. It was in such a state. As the copper foil 10, an electrolytic copper foil having a width of 70 mm and a thickness of 25 μm was used. The uncured resin layer 11 includes a photosensitive uncured resin layer 11b and a non-photosensitive uncured resin layer 11a, and as shown in FIG.
A commercially available product in which both sides of 1a were covered with the protective film 12 was used. The width of the uncured resin layer 11 is 7
One having a thickness of 0 mm and a thickness of 35 μm was used.

The photosensitive uncured resin includes a polyimide resin and an epoxy resin. There are two types of polyimide resins, a type used by laminating in a film form and a type used by coating in a liquid form. The epoxy resin is usually used in a liquid state after being coated.

Next, a sprocket hole was punched out of such a laminated film by a press or the like.

Next, a via hole is formed. That is,
After irradiating the photosensitive uncured resin layer 11b with light and exposing it to light, it is developed to form holes 13 in the photosensitive uncured resin layer 11b as shown in FIG. As a developing solution, a 0.5% lactic acid aqueous solution was used. Next, the non-photosensitive uncured resin layer 11a exposed from the hole 13 was etched to form a hole 14 as shown in FIG. As an etching solution, a 10% aqueous sodium hydroxide solution was used. Further, as shown in FIG. 1E, the photosensitive uncured resin layer 11b is removed. 10% removal solution
A lactic acid aqueous solution was used. After that, heat treatment is performed at 270 ° C.
The non-photosensitive uncured resin layer 11a was cured. The cured resin layer is represented by reference numeral 11A to distinguish it from the uncured resin layer 11a.

Next, after conducting the treatment, electroplating was carried out using an aqueous solution of copper sulfate to form a copper plating layer 15 as shown in FIG. 1 (f). By applying or laminating a photoresist on the surface of the copper plating layer 15 and performing exposure, development, backing, etching, and stripping of the photoresist, the wiring pattern of the second layer is formed as shown in FIG. 1
5a is formed. The etching of the copper plating layer 15 was performed by photoetching using a dry film.

Next, as shown in FIG. 2H, the holes 14 were filled with a primer 16, and an uncured resin layer 21 was laminated.
The width of the uncured resin layer 21 was 60 mm and the thickness was 35 μm. The uncured resin layer 21 is composed of a photosensitive uncured resin layer 21b and a non-photosensitive uncured resin layer 21a. The uncured resin layer 21b and the non-photosensitive uncured resin layer 21a are formed as described above. A commercially available product coated on both sides with a protective film was used.

Next, via holes were formed. That is,
After irradiating the photosensitive uncured resin 21b with light and exposing it to light, the photosensitive uncured resin 21b is developed and developed as shown in FIG.
A hole 23 was formed in 1b. As a developing solution, a 0.5% lactic acid aqueous solution was used. Next, the non-photosensitive uncured resin layer 21a exposed from the hole 23 was etched to form a hole 24 as shown in FIG. As an etching solution, a 10% aqueous sodium hydroxide solution was used.

Further, as shown in FIG. 2K, the photosensitive uncured resin layer 21b is removed. A 10% aqueous lactic acid solution was used as the removing solution. Thereafter, a heat treatment is performed at 270 ° C. to cure the non-photosensitive uncured resin layer 21a. The cured resin layer is represented by reference numeral 21A to distinguish it from the uncured resin layer 21a.

Next, after conducting, a copper plating layer 25 was formed by electroplating using an aqueous solution of copper sulfate, as shown in FIG. By applying or laminating a photoresist on the surface of the copper plating layer 25 and performing exposure, development, backing, etching, and stripping of the photoresist, as shown in FIG. An exposed portion 25a of the cured resin layer 21A was formed by removing a part thereof. The exposed portion 25a is formed in a portion corresponding to the device holes 11c and 21c (corresponding to the recess of the present invention) shown in FIG.

Next, the exposed portion 25a of the cured resin layer 21A formed on the copper plating layer 25 is irradiated with a laser beam to decompose and remove the cured resin, and the decomposition residue is further removed with potassium permanganate and sodium hydroxide. Is removed with an aqueous solution in which the device hole 1 is removed as shown in FIG.
1c and 21c were formed.

Next, the copper plating layer 25 was etched to form a third wiring pattern 25b. This etching was performed by photoetching using the dry film 26.

That is, as shown in FIG. 3 (o), a dry film 26 as a photoresist is laminated on the surface of the copper plating layer 25. Next, as shown in FIG. 3 (p), the dry film 26 was exposed and developed, the exposed surface 25c was formed on the copper plating layer 25, and a resist 27 was applied to the surface of the copper foil 10 as a backing. By etching the copper plating layer 25 with iron chloride and stripping the resist 27, FIG.
As shown in (q), a third-layer wiring pattern 25a was formed.

Next, a liquid photoresist is applied to the surface of the copper foil 10 and is exposed, developed, backed, etched, and stripped of the photoresist, thereby forming one layer as shown in FIG. An eye wiring pattern 10a was formed. A through hole 10b was formed in the copper foil 10 corresponding to the device holes 11c and 21c.

The hole diameter of the photoresist exposure mask in the above process is 150 μm. The finished hole diameter of the formed hole is 100 to 120 μm on the connection side and 1 on the exposed side.
It is 40 to 160 μm, and is a truncated hole extending to the exposed side. The thickness of the copper plating layers 15 and 25 is 10
〜20 μm.

The three-layer wiring TAB tape is manufactured by the above-described steps. In the subsequent steps, it may be necessary to further add a step such as application and plating of a solder resist. Can be applied.

Next, the operation of the method for manufacturing a multilayer wiring TAB tape according to the embodiment will be described.

In the three-layer wiring TAB tape according to the present embodiment, the uncured resin layers 11 and 21 are applied or laminated, so that the uncured resin layers 11 and 21 are applied or laminated stably. be able to. Further, it is possible to prevent bubbles from being caught between the uncured resin layers 11 and 21 and the layer to be laminated. Thereby, the adhesion between the layers can be enhanced, and defects such as delamination are less likely to occur. Therefore, the three-layer wiring TAB tape manufactured according to the present embodiment has high reliability. Since the function of electrically connecting the multilayer wiring pattern with the shortest distance is not lost, it is needless to say that high-speed transmission is provided.

It should be noted that the steps shown in FIGS.
(M) By proceeding to the subsequent steps, a two-layer wiring TAB tape can be manufactured. When a TAB tape was actually manufactured by this method, it could be manufactured in the same manner as the three-layer wiring TAB tape, and had the same quality.

In the above-described embodiment, a TAB tape in which a wiring pattern is electrically connected by a via hole has been described as an example. However, since a through hole is always combined with a via hole in three or more layers, the description is omitted.
The present invention can also be applied to a multi-layer wiring TAB tape that conducts through a through hole.

[0034]

As described above, according to the method for manufacturing a multilayer wiring TAB tape of the present invention, a multilayer wiring TAB tape having high reliability and good high-speed transmission can be manufactured.

[Brief description of the drawings]

FIG. 1 is a diagram showing steps of a method for manufacturing a multilayer wiring TAB tape according to an embodiment of the present invention.

FIG. 2 is a diagram showing steps of a method for manufacturing a multilayer wiring TAB tape according to one embodiment of the present invention.

FIG. 3 is a diagram showing steps of a method for manufacturing a multilayer wiring TAB tape according to one embodiment of the present invention.

FIG. 4 is a view showing a form of an uncured resin layer used in the manufacturing method shown in FIGS.

FIG. 5 is a view showing the structure of a conventional TAB tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Copper foil 10a 1st wiring pattern 10b hole 11 Uncured resin layer 11a Non-photosensitive uncured resin layer 11A Cured resin layer 11b Photosensitive uncured resin layer 11c Device hole (concave) 14 hole 15 Copper plating Layer 15a Second-layer wiring pattern 21 Uncured resin layer 21a Non-photosensitive uncured resin layer 21A Cured resin layer 21b Photosensitive uncured resin layer 21c Device hole (concave) 24 hole 25 Copper plating layer 25a Device hole 25b Third layer wiring pattern

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60

Claims (5)

(57) [Claims] 1. A lamination of a first uncured resin layer on a conductive foil body
And removing the first uncured resin layer corresponding to the conductive portion,
Curing the first uncured resin layer to form a first intermediate thin film body
Manufactured and at least a cured resin of the first intermediate thin film body
A conductive layer is laminated on the layer side surface, and at least
Photo-etching the conductive layer formed on the oil layer side
A line pattern is formed and at least the conductive layer on the cured resin layer side is
Laminating a second uncured resin layer on the surface of the conductive layer,
And removing the second uncured resin layer corresponding to
Curing the resin layer to produce a second intermediate thin film,
At least the surface of the intermediate thin film body on the cured resin layer side
Stacking a conductive layer, the conductive layer and the conductive foil body
Wiring pattern by photo-etching on at least one of
Of a multi-layer wiring TAB tape characterized by forming
Production method. 2. The method according to claim 1, which is obtained by:
Pattern formed on the surface of a multi-layered wiring TAB tape
After laminating an uncured resin layer on the
Removing the uncured resin layer, and curing the uncured resin layer
To produce an intermediate thin film, and at least harden the intermediate thin film.
A conductive layer is laminated on the surface of the
Photo-etching at least one of layer and conductive foil
Reduces the number of steps required to form a wiring pattern
How to manufacture a multilayer wiring TAB tape with at least one addition
Law. 3. A device housing wherein the uncured resin layer is removed.
2. A step of forming a recess corresponding to the tool.
Or the production of the multilayer wiring TAB tape according to any one of
Construction method. 4. Removal of an uncured resin layer corresponding to the recess.
4. The multilayer wiring T according to claim 3, wherein the step (b) is performed by a laser beam.
AB tape manufacturing method. 5. Removal of an uncured resin layer corresponding to the recess.
4. The method according to claim 3, wherein the step (c) is performed with a chemical that dissolves the uncured resin.
Of manufacturing a multilayer wiring TAB tape.