JP3324253B2 - Conductive paste for forming terminal electrodes of electronic components - Google Patents
Conductive paste for forming terminal electrodes of electronic componentsInfo
- Publication number
- JP3324253B2 JP3324253B2 JP00394694A JP394694A JP3324253B2 JP 3324253 B2 JP3324253 B2 JP 3324253B2 JP 00394694 A JP00394694 A JP 00394694A JP 394694 A JP394694 A JP 394694A JP 3324253 B2 JP3324253 B2 JP 3324253B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- glass frit
- terminal electrode
- borosilicate
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は導電性ペースト、特に積
層セラミックコンデンサなどの電子部品の端子電極形成
用導電性ペーストに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste, and more particularly to a conductive paste for forming terminal electrodes of electronic parts such as a multilayer ceramic capacitor.
【０００２】[0002]
【従来の技術】従来の技術を積層セラミックコンデンサ
を例に説明する。積層セラミックコンデンサは厚さ数μ
ｍの内部電極層と厚さ数十μｍのセラミック誘電体層と
が交互に積層されて一体焼成されたコンデンサ素子と端
子電極とを有している。この端子電極は導電性ペースト
を用いて形成される。なお、回路基板への半田付け性能
を保証するため、電解メッキ法を用いてニッケルメッキ
およびハンダ、もしくはスズメッキを行い完成品を得
る。2. Description of the Related Art The prior art will be described by taking a multilayer ceramic capacitor as an example. Multilayer ceramic capacitors have a thickness of several μ
A capacitor element and terminal electrodes are formed by alternately laminating m internal electrode layers and ceramic dielectric layers having a thickness of several tens of μm and integrally firing. This terminal electrode is formed using a conductive paste. In addition, in order to guarantee the soldering performance to the circuit board, nickel plating and solder or tin plating are performed using an electrolytic plating method to obtain a finished product.
【０００３】従来上記のような積層セラミックコンデン
サの端子電極形成用導電性ペーストとして銀系の導電性
粉末と、ガラスフリットとしてホウケイ酸亜鉛系もしく
はホウケイ酸鉛系のガラスフリットを有機ビヒクルに分
散させてなるものが知られている。Conventionally, a silver-based conductive powder as a conductive paste for forming a terminal electrode of a multilayer ceramic capacitor as described above and a zinc borosilicate-based or lead borosilicate-based glass frit as a glass frit are dispersed in an organic vehicle. Is known.
【０００４】このような導電性ペーストによる端子電極
の形成はコンデンサ素子の端面にペーストを塗布し、ペ
ースト中の導電粉末とガラスフリットを焼成し、コンデ
ンサ素子と電気的、機械的に接続されている。To form a terminal electrode using such a conductive paste, the paste is applied to the end face of the capacitor element, the conductive powder in the paste and the glass frit are fired, and the terminal element is electrically and mechanically connected to the capacitor element. .
【０００５】[0005]
【発明が解決しようとする課題】上記のような従来の端
子電極導電性ペーストはガラスフリットにホウケイ酸亜
鉛系を用いた場合、酸化亜鉛（以下ＺｎＯと略す）が、
焼成過程においてコンデンサ素子中に容易に侵入する。
このＺｎＯとコンデンサ素子との反応によって、図２に
示すようにコンデンサ素子７にクラック８を生じさせる
場合がある。特にチタン酸バリウムを主成分とするコン
デンサ素子７においては、クラック８を発生しやすいと
いう課題がある。In the conventional terminal electrode conductive paste as described above, when zinc borosilicate is used for the glass frit, zinc oxide (hereinafter abbreviated as ZnO) is used.
It easily penetrates into the capacitor element during the firing process.
The reaction between ZnO and the capacitor element may cause a crack 8 in the capacitor element 7 as shown in FIG. In particular, the capacitor element 7 containing barium titanate as a main component has a problem that cracks 8 are easily generated.
【０００６】また、ガラスフリットとしてホウケイ酸鉛
系を用いた場合は、焼成後電解メッキ処理を行う際、次
に示すようなスズの還元反応を生じてしまう。When lead borosilicate is used as the glass frit, a reduction reaction of tin occurs as follows when performing electrolytic plating after firing.
【０００７】 ＰｂＯ＋Ｓｎ2+⇔ＳｎＯ＋Ｐｂ2+ このため端子電極のコンデンサ素子との接着力の低下が
おこりコンデンサの信頼性を劣化させるという課題があ
る。PbO + Sn 2+ ⇔SnO + Pb 2+ Therefore, there is a problem that the adhesive strength of the terminal electrode to the capacitor element is reduced and the reliability of the capacitor is deteriorated.
【０００８】上記のような課題を解決するため本発明
は、コンデンサ素子にクラックが発生することなく、耐
メッキ性や端子電極とコンデンサ素子との接着強度が良
好な端子電極形成用導電性ペーストを提供するものであ
る。[0008] In order to solve the above problems, the present invention provides a method for forming a terminal electrode having good plating resistance and good adhesive strength between the terminal electrode and the capacitor element without cracking of the capacitor element. To provide a conductive paste for use.
【０００９】[0009]
【課題を解決するための手段】上記のような課題を解決
するため本発明は、導電性粉末とアルカリ金属酸化物を
含有し、ＰｂＯ，ＺｎＯを全く含まないホウケイ酸アル
カリガラスフリットを導電性粉末に対して２〜１２重量
％有機ビヒクルに分散させてなり、上記ホウケイ酸アル
カリガラスフリットのアルカリ金属酸化物含有量が５〜
３０重量％である導電性ペーストを作成し端子電極を形
成することを特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method for preparing a conductive powder and an alkali metal oxide.
Borosilicate containing no PbO and ZnO
2-12 weight of potash glass frit based on conductive powder
% Borosilicate, dispersed in an organic vehicle
The alkali metal oxide content of the potash glass frit is 5
It is characterized in that a terminal paste is formed by preparing a conductive paste of 30% by weight .
【００１０】[0010]
【作用】以上のようにガラスフリットにＺｎＯおよびＰ
ｂＯをまったく用いない本発明の端子電極形成用導電性
ペーストを用いることによって、クラックの発生および
メッキ処理後の端子電極とコンデンサ素子の接着力の低
下を抑え、信頼性を向上する。As described above, ZnO and P are added to the glass frit.
Conductivity for forming terminal electrode of the present invention without using bO at all
The use of the paste suppresses the occurrence of cracks and a decrease in the adhesive force between the terminal electrode and the capacitor element after the plating process, and improves reliability.
【００１１】[0011]
【実施例】（実施例１） 導電性金属粉末とガラスフリットを（表１）に示す割合
で配合し、その混合物７０重量％と有機質ビヒクル３０
重量％を混合してペースト状とした。このペーストを図
１に示すようにチタン酸バリウムを主成分とするセラミ
ック誘電体層２と内部電極層１とが交互に積層され一体
焼成されたコンデンサ素子３に塗布し、１３０℃で５分
間乾燥した後最高温度８５０℃で焼成し端子電極４を形
成した。さらに端子電極４の表面に電解メッキ膜処理に
よってニッケルメッキ５および、ハンダメッキ６を施し
た。この試料については端子の電極面積が０．８ｍｍ×
０．８ｍｍであり、この端子電極とコンデンサ素子との
接着強度を測定し、試料内部のクラックの発生の有無を
確認しその結果も（表１）に併せて示す。EXAMPLES (Example 1) Conductive metal powder and glass frit were blended in the proportions shown in (Table 1), 70% by weight of the mixture and organic vehicle 30.
% By weight to form a paste. As shown in FIG. 1, this paste is applied to a capacitor element 3 in which ceramic dielectric layers 2 containing barium titanate as a main component and internal electrode layers 1 are alternately laminated and integrally fired, and dried at 130 ° C. for 5 minutes. After that, firing was performed at a maximum temperature of 850 ° C. to form a terminal electrode 4. Further, the surface of the terminal electrode 4 was subjected to nickel plating 5 and solder plating 6 by electrolytic plating film treatment. For this sample, the electrode area of the terminal was 0.8 mm ×
0.8 mm, the distance between this terminal electrode and the capacitor element is
The adhesive strength was measured, and the presence or absence of cracks inside the sample was confirmed. The results are also shown in (Table 1).
【００１２】なお、ガラスフリット組成は、アルカリ性
金属酸化物Ｌｉ 2 Ｏ、Ｎａ 2 ＯにＳｉＯ 2 、Ｂ 2 Ｏ 3 を（表
１）に示すように添加したものである。（表１）からわ
かるようにＰｂＯ，ＺｎＯを全く含まないホウケイ酸ア
ルカリガラスフリットを導電性粉末に対して２〜１２重
量％含み、このホウケイ酸アルカリガラスフリットのア
ルカリ金属酸化物含有量が５〜３０重量％である本発明
の導電性ペーストは電解メッキ処理後接着強度の劣化も
みられず、回路基板への半田付け性能を保証するため、
電解メッキ法を用いてニッケルメッキ、および、ハン
ダ、もしくはスズメッキを行っても何ら問題のない導電
皮膜が得られている。また、信頼性を大きく損なうクラ
ックについても発生していない。The glass frit composition is alkaline.
SiO 2 and B 2 O 3 are added to metal oxides Li 2 O and Na 2 O (Table
It was added as shown in 1). (Table 1) As can be seen from PbO, it contains 2 to 12% by weight relative to the conductive powder borosilicate alkali glass frit that does not contain any ZnO, A of borosilicate alkali glass frit
The present invention wherein the content of the alkali metal oxide is 5 to 30% by weight
The conductive paste does not show any deterioration in the adhesive strength after the electrolytic plating process, and in order to guarantee the soldering performance to the circuit board,
A conductive film having no problem even when nickel plating, soldering, or tin plating is performed using an electrolytic plating method has been obtained. Also, cracks that significantly impair reliability have not occurred.
【００１３】[0013]
【表１】 [Table 1]
【００１４】[0014]
【発明の効果】以上のように電子部品の端子電極にホウ
ケイ酸亜鉛ガラスおよびホウケイ酸鉛ガラスを用いず、
すなわちＺｎＯ，ＰｂＯをまったく含まないホウケイ酸
アルカリガラスを用いた導電性ペーストを用いることに
よって電子部品素子に対しクラックの発生しない耐メッ
キ性の良好な端子電極形成用導電性ペーストを提供する
ことができた。As described above, zinc borosilicate glass and lead borosilicate glass are not used for terminal electrodes of electronic parts,
That is, by using a conductive paste using alkali borosilicate glass containing no ZnO or PbO, it is possible to provide a conductive paste for forming a terminal electrode having good plating resistance without cracks in electronic component elements. Was.
【図１】本発明の電子部品の端子電極形成用導電性ペー
ストを用いて構成した積層セラミックコンデンサの断面
図FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor formed using a conductive paste for forming a terminal electrode of an electronic component of the present invention.
【図２】積層セラミックコンデンサのコンデンサ素子に
クラックが発生した状態を示す要部の断面図FIG. 2 is a sectional view of a main part showing a state in which a crack has occurred in a capacitor element of the multilayer ceramic capacitor.
１ 内部電極層 ２ セラミック誘電体層 ３ コンデンサ素子 ４ 端子電極 ５ ニッケルメッキ ６ ハンダもしくはスズメッキ Reference Signs List 1 internal electrode layer 2 ceramic dielectric layer 3 capacitor element 4 terminal electrode 5 nickel plating 6 solder or tin plating
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01B 1/22 H01B 1/16 H01G 4/12 361 H05K 1/09 Continuation of the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01B 1/22 H01B 1/16 H01G 4/12 361 H05K 1/09
Claims (1)
し、ＰｂＯ，ＺｎＯを全く含まないホウケイ酸アルカリ
ガラスフリットを導電性粉末に対して２〜１２重量％有
機ビヒクルに分散させてなり、上記ホウケイ酸アルカリ
ガラスフリットのアルカリ金属酸化物含有量が５〜３０
重量％である電子部品の端子電極形成用導電性ペース
ト。[Claim 1] contains a conductive powder and an alkali metal oxide, PbO, made by dispersing any borosilicate alkali glass frit that does not contain ZnO 2-12 wt% organic vehicle to the conductive powder, the Alkali borosilicate
The alkali metal oxide content of the glass frit is 5 to 30
A conductive paste for forming a terminal electrode of an electronic component in weight% .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00394694A JP3324253B2 (en) | 1994-01-19 | 1994-01-19 | Conductive paste for forming terminal electrodes of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00394694A JP3324253B2 (en) | 1994-01-19 | 1994-01-19 | Conductive paste for forming terminal electrodes of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07211133A JPH07211133A (en) | 1995-08-11 |
| JP3324253B2 true JP3324253B2 (en) | 2002-09-17 |
Family
ID=11571293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00394694A Expired - Lifetime JP3324253B2 (en) | 1994-01-19 | 1994-01-19 | Conductive paste for forming terminal electrodes of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3324253B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110209A (en) | 2001-10-02 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Electronic component |
| JP3888446B2 (en) * | 2002-03-25 | 2007-03-07 | 株式会社村田製作所 | Ceramic electronic component and method for manufacturing ceramic electronic component |
| JP4269795B2 (en) * | 2003-06-13 | 2009-05-27 | 株式会社村田製作所 | Conductive paste and inductor |
| US7285232B2 (en) * | 2004-02-19 | 2007-10-23 | Murata Manufacturing Co., Ltd | Conductive paste and ceramic electronic component |
| JP4333594B2 (en) * | 2004-02-19 | 2009-09-16 | 株式会社村田製作所 | Conductive paste and ceramic electronic components |
-
1994
- 1994-01-19 JP JP00394694A patent/JP3324253B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07211133A (en) | 1995-08-11 |
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