JPH07161223A - Conductive paste and multilayer ceramic capacitor - Google Patents

Conductive paste and multilayer ceramic capacitor

Info

Publication number
JPH07161223A
JPH07161223A JP31055893A JP31055893A JPH07161223A JP H07161223 A JPH07161223 A JP H07161223A JP 31055893 A JP31055893 A JP 31055893A JP 31055893 A JP31055893 A JP 31055893A JP H07161223 A JPH07161223 A JP H07161223A
Authority
JP
Japan
Prior art keywords
conductive paste
glass frit
ceramic capacitor
external electrode
containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31055893A
Other languages
Japanese (ja)
Inventor
Tomotake Sanada
智毅 眞田
Original Assignee
Murata Mfg Co Ltd
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Mfg Co Ltd, 株式会社村田製作所 filed Critical Murata Mfg Co Ltd
Priority to JP31055893A priority Critical patent/JPH07161223A/en
Publication of JPH07161223A publication Critical patent/JPH07161223A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14Conductive material dispersed in non-conductive inorganic material
    • H01B1/16Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Abstract

(57) [Abstract] [Purpose] In the conductive paste for external electrodes of ceramic chip parts, internal defects such as delamination are unlikely to occur, the formed external electrodes have high adhesive strength, and the board after mounting on a circuit board Provided is a paste capable of obtaining a ceramic chip part that is less likely to be damaged by bending, and a ceramic capacitor using the paste. [Constitution] The conductive paste contains a glass frit containing PbO, B 2 O 3 and SiO 2 as main components and containing 1 to 20% by weight of at least one kind of TiO 2 and Al 2 O 3 . Further, the monolithic ceramic capacitor contains a glass frit containing PbO, B 2 O 3 and SiO 2 as main components and containing at least one kind of TiO 2 or Al 2 O 3 in an amount of 1 to 20% by weight in its external electrodes. .

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste used for forming an external electrode of a ceramic chip part, and a ceramic chip part using the same.

[0002]

2. Description of the Related Art Generally, an external electrode of a ceramic chip component is formed by the following method. That is, first, Ag
A conductive paste is prepared in which powders of conductive components such as the above and powders of glass frit are dispersed in an organic vehicle in which a resin is dissolved in an organic solvent as a binder. Then, after applying this conductive paste to the ceramic chip body and drying,
Baking is performed to remove organic substances, and a conductive coating film composed of a conductive component and glass frit is formed. After that, Ni plating, Sn or solder plating is sequentially formed on the surface of this conductive film to form an external electrode. Here, lead-based, zinc-based, borosilicate-based, or the like is used as the glass frit in the conductive paste.

[0003]

However, in the conventional external electrode, in the plating step after baking the conductive paste, a problem which is considered to be caused by the invasion of the plating solution into the ceramic chip element often occurred. In other words, internal defects such as delamination and crack generation of laminated chip parts, decrease in adhesive strength of external electrodes of chip parts, or problems such as chip parts being easily damaged by bending of board after mounting on circuit board is there. Therefore, it has been considered to prevent the plating solution from entering the ceramic chip body by increasing the amount of glass frit in the conductive paste or by using a chemically stable glass frit with a high melting point. It was

However, in a recently developed ceramic chip component using a lead oxide-based raw material, for example, a small-sized, high-capacity monolithic ceramic capacitor excellent in bias characteristics, the ceramic has a high reactivity with a glass frit. Therefore, even if a conductive paste containing a glass frit with a high melting point is baked, the ceramic deteriorates due to the reaction with the glass frit and loses the original capacitor characteristics, and the plating solution easily penetrates and the characteristics of the capacitor increase. It had a problem of causing deterioration.

Therefore, an object of the present invention is to suppress the reactivity of the glass frit with the ceramic when used as an external electrode of a ceramic chip component, so that internal defects such as delamination are less likely to occur, and the external electrode thus formed is prevented. It is an object of the present invention to provide a conductive paste capable of obtaining a ceramic chip component that has high adhesive strength and is less likely to be damaged by bending the substrate after being mounted on the circuit substrate, and a ceramic chip component using the conductive paste.

[0006]

In order to achieve the above object, the conductive paste of the present invention is a conductive paste used as an external electrode of a ceramic chip component, comprising Pb.
A glass frit containing O, B 2 O 3 and SiO 2 as main components and containing 1 to 20% by weight of at least one kind of TiO 2 or Al 2 O 3 is characterized.

Further, the ceramic chip component of the present invention is
In a laminated ceramic capacitor comprising an internal electrode layer arranged via a dielectric ceramic layer and an external electrode connected to the internal electrode layer, the external electrode comprises PbO, B 2
TiO 2 or Al 2 containing O 3 and SiO 2 as main components
It is characterized by containing a glass frit containing 1 to 20% by weight of at least one kind of O 3 .

It is particularly preferable that the dielectric ceramic layer of the monolithic ceramic capacitor contains lead oxide.

[0009]

When the conductive paste of the present invention is baked on a ceramic chip body, the reaction of the glass frit component in the conductive paste with the ceramic containing lead oxide as a main component is suppressed. Therefore, the ceramic does not deteriorate excessively, the original characteristics are not lost, and the plating solution does not easily enter.

[0010]

EXAMPLES Examples of the conductive paste of the present invention will be described below. First, 15 types of glass frits shown in Table 1 were prepared as follows. That is, Pb 3 O 4 and H of the starting materials were used so that the glass frit has the composition ratio shown in Table 1.
3 BO 4, SiO 2, a mixture of TiO 2 and Al (OH) 3, was melted at a high temperature, vitrified by rapid cooling.
Then, the obtained glass was crushed to obtain a glass frit. In Table 1, the mark * indicates outside the scope of the present invention, and the others are within the scope of the present invention.

Next, 15 kinds of conductive pastes were prepared for each glass frit. That is, Ag powder 66w
t%, glass frit 5 wt%, vehicle containing ethyl cellulose resin dissolved in butyl cellosolve 29 wt%
The mixture was mixed and kneaded and dispersed with a three-roll to prepare a conductive paste.

Then, the above-mentioned conductive paste is applied and dried on the exposed ends of the internal electrodes of the monolithic ceramic capacitor body using a lead oxide-based raw material prepared in advance, and baked at 650 ° C. in the atmosphere. To form a conductive coating. Thereafter, the surface of this conductive coating was plated with Ni, and then Sn was plated thereon to form an external electrode.

Next, a substrate bending test and an external electrode adhesive strength test were conducted on the 15 types of monolithic ceramic capacitors produced above. Board bending test is JIS
It was performed according to C 6429 Annex 2. That is, first, a thickness of 1.6 mm using a glass cloth base epoxy resin.
The produced monolithic ceramic capacitor was soldered to the copper clad laminate. After that, the surface on the opposite side of the copper clad laminate with this laminated ceramic capacitor attached was pressed with a pressure rod to bend the copper clad laminate, and the amount of deflection at which the laminated ceramic capacitor began to break was taken as the value of board bending strength. .

The external electrode adhesion strength test is conducted by soldering lead wires to the ends of both external electrodes of the monolithic ceramic capacitor and then pulling both lead wires in the axial direction at a constant speed to determine the breaking strength of the external electrodes. It was considered as strength.

FIG. 1 shows a glass frit (Sample No. 15) containing no TiO 2 and Al 2 O 3 and TiO 2 .
Glass frit containing 2 (Sample No. 2 to Sample N)
o. The results of the adhesive strength test of the external electrode and the board bending strength test of the laminated ceramic capacitor in which the external electrode is formed of the conductive paste prepared by using 5) are shown below.
Similarly, FIG. 2 shows a glass frit (Sample No. 15) to which TiO 2 and Al 2 O 3 are not added and Al 2 O 3
Glass frit (Sample No. 6 to Sample No.
The results of the adhesive strength test of the external electrode and the board bending strength test of the laminated ceramic capacitor in which the external electrode is formed of the conductive paste prepared by using 10) are shown. Further, FIG. 3 shows a laminated ceramic capacitor in which an external electrode is formed of a conductive paste produced using a glass frit (Sample No. 11 to Sample No. 14) to which TiO 2 and Al 2 O 3 are added. 3 shows the adhesive strength and the bending strength of the substrate.

As shown in FIGS. 1, 2 and 3, in the laminated ceramic capacitor using the conductive paste of the present invention as an external electrode, compared with the conventional case in which TiO 2 or Al 2 O 3 is not added, Both the adhesive strength of the external electrodes and the bending strength of the substrate are high. In addition, the addition amount of TiO 2 and Al 2 O 3 is set to 1 to 20 wt%, respectively.
This is because when it exceeds 0 wt%, the adhesive strength value of the external electrode and the bending strength value of the substrate are almost saturated by the addition of 20 wt%, and further improvement in characteristics cannot be expected.

Sample No. The presence or absence of delamination was confirmed for the laminated ceramic capacitors in which the external electrodes were formed using the conductive paste containing the glass frit of 3, 8, and 15. The results are shown in Table 2. Table 2
As shown in FIG. 6, in the laminated ceramic capacitor using the conductive paste of the present invention as an external electrode, the occurrence of delamination is suppressed as compared with the conventional case where TiO 2 or Al 2 O 3 is not added.

In the above embodiments, the case of the monolithic ceramic capacitor has been described, but it goes without saying that the same effect can be obtained as an external electrode of a ceramic chip component such as another L chip or LCR chip. .

Further, in the above embodiment, the glass-free
Pb as starting material for3OFour, H3BOFour, SiO
2, TiO2And Al (OH)3I am using
It is not limited to these. That is, Pb3O
FourInstead of PbO or Pb 2O3Lead oxides such as Pb
CO3, Pb (OH)2Or known lead such as organic acid lead
Compounds can be used. Also, H3BOFourInstead of
R, B2O3Oxides such as or and BO or (HBO
2)xA known boron compound such as, for example, can be used. It
In addition, SiO2Instead of, silicon oxide such as SiO, S
iB3And SiB6Silicon boride or organic acid of silicon
A known silicon compound such as a compound can be used. That
TiO2Instead of Ti2O3Titanium oxide, etc.
Thing, PbTiO3Titanate such as Ti2(COFour)3
Organic acid titanium or Ti (OH)2Titanium water, etc.
Known titanium compounds such as oxides can be used.
Also, Al (OH)3Instead of Al2O3Etc. al
Mi oxide, organic oxide of aluminum or alco of aluminum
A known aluminum compound such as xide can be used.

[0020]

As is apparent from the above description, when the external electrode of the ceramic chip component is formed by the conductive paste of the present invention, the reactivity of the constituent glass frit component with the ceramic can be suppressed. Therefore, it is possible to obtain a ceramic chip component which has few internal defects such as delamination, has high adhesive strength of the formed external electrodes, and is not easily damaged by bending of the board after being mounted on the circuit board.

[0021]

[Table 1]

[0022]

[Table 2]

[Brief description of drawings]

FIG. 1 is a graph showing the relationship between the amount of TiO 2 in a glass frit and the performance of chip parts.

FIG. 2 is a graph showing the relationship between the amount of Al 2 O 3 in a glass frit and the performance of chip parts.

FIG. 3 is a graph showing the relationship between the ratio of the amounts of Al 2 O 3 and TiO 2 in the glass frit and the performance of chip parts.

Claims (3)

[Claims]
1. A conductive paste used as an external electrode of a ceramic chip component, which contains PbO, B 2 O 3 and SiO 2 as main components and contains at least one kind of TiO 2 or Al 2 O 3 in an amount of 1 to 20% by weight. A conductive paste containing a glass frit containing.
2. A multilayer ceramic capacitor comprising an internal electrode layer arranged via a dielectric ceramic layer and an external electrode connected to the internal electrode layer, wherein the external electrode contains PbO, B 2 O 3 and SiO 2 . Ti as the main component
1-2 at least one kind of O 2 or Al 2 O 3
A laminated ceramic capacitor containing 0% by weight of a glass frit.
3. The laminated ceramic capacitor according to claim 2, wherein the dielectric ceramic layer of the laminated ceramic capacitor contains lead oxide.
JP31055893A 1993-12-10 1993-12-10 Conductive paste and multilayer ceramic capacitor Pending JPH07161223A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31055893A JPH07161223A (en) 1993-12-10 1993-12-10 Conductive paste and multilayer ceramic capacitor

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP31055893A JPH07161223A (en) 1993-12-10 1993-12-10 Conductive paste and multilayer ceramic capacitor
GB9424863A GB2285264B (en) 1993-12-10 1994-12-09 Conductive paste and multilayer ceramic capacitor
SG1996006013A SG55096A1 (en) 1993-12-10 1994-12-09 Conductor paste and multilayer ceramic capacitor
US08/353,559 US5561587A (en) 1993-12-10 1994-12-09 Conductive paste and multilayer ceramic capacitor

Publications (1)

Publication Number Publication Date
JPH07161223A true JPH07161223A (en) 1995-06-23

Family

ID=18006689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31055893A Pending JPH07161223A (en) 1993-12-10 1993-12-10 Conductive paste and multilayer ceramic capacitor

Country Status (4)

Country Link
US (1) US5561587A (en)
JP (1) JPH07161223A (en)
GB (1) GB2285264B (en)
SG (1) SG55096A1 (en)

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Also Published As

Publication number Publication date
US5561587A (en) 1996-10-01
SG55096A1 (en) 1998-12-21
GB2285264B (en) 1998-02-11
GB9424863D0 (en) 1995-02-08
GB2285264A (en) 1995-07-05

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