JP3317185B2 - Manufacturing method of semiconductor pressure sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor pressure sensor , and more particularly to a method for manufacturing a CAN type pressure sensor having a package formed of CAN.

[0002]

2. Description of the Related Art FIG. 9 shows a schematic configuration diagram of a conventional CAN type pressure sensor. 1 is a semiconductor pressure sensor chip. 2
Is a terminal for drawing out the package. Reference numeral 5 denotes a pedestal, on which the semiconductor pressure sensor chip 1 is fixed by solder 7. Reference numeral 8 denotes a CAN that protects the semiconductor pressure sensor chip 1. A bonding wire 11 connects a connection electrode (not shown) on the semiconductor pressure sensor chip 1 to the terminal 2.

Generally, a semiconductor pressure such as a CAN type pressure sensor is used.
In the force sensor , wire bonding is used in which a connection electrode on the semiconductor pressure sensor chip 1 and a terminal 2 for drawing out the package are connected by a bonding wire 11. At this time, the metals to be connected are pressurized with each other and joined by applying ultrasonic vibration or the like.

[0004]

However, as shown in FIG. 9, when the step between the connection electrode and the terminal 2 becomes large due to the thickness of the semiconductor pressure sensor chip 1, the required length of the bonding wire 11 becomes large. And the weight of the bonding wire 11 pertaining to the connection part becomes a burden, and thus there is a problem that a bonding failure easily occurs. Further, if the length of the terminal 2 is increased as shown in FIG. 10 to prevent this, the ultrasonic vibration at the time of wire bonding escapes along the terminal 2 to cause a bonding failure.

[0005] The present invention has been made in view of the above, the step between the and it is an object of the connection electrode and the terminal by such a thickness of the semiconductor pressure sensor switch <br/>-up is to provide a stable method for manufacturing a semiconductor pressure sensor that allows to the connection between the semiconductor pressure sensor chip <br/> flop and the terminal even if increasing the length of the pin when is large.

[0006]

According to the first aspect of the present invention,
The semiconductor pressure sensor chip installed on the pedestal and the CAN
Cover that houses the semiconductor pressure sensor chip inside.
A cage and one end of the semiconductor protruding into the package;
Electrically connected to connection electrodes on the pressure sensor chip; and
The other end is connected to a terminal drawn out of the package.
A method for manufacturing a semiconductor pressure sensor comprising: using a flexible printed wiring board on which a circuit for electrically connecting a connection electrode on the semiconductor pressure sensor chip and the terminal is formed. , the semiconductor pressure sensor chip
After connecting the connection electrode and the circuit of the flexible printed wiring board using wireless bonding , the semiconductor pressure sensor chip is die-bonded to a pedestal using solder, and the terminals and the flexible printed wiring board are connected. and circuitry is characterized in the Turkey be connected using solder.

The invention according to claim 2 is provided on a pedestal.
A semiconductor pressure sensor chip and a CAN
Package containing conductor pressure sensor chip and one end
The semiconductor pressure sensor chip protruding into the package;
The other end is electrically connected to the connection electrode on the
Pressure with terminals drawn out of the memory
A method of manufacturing a sensor, use the flexible printed wiring board circuitry for electrically connecting the terminal and the connection electrode on the semiconductor pressure sensor <br/> chip is formed
Then , after fixing the semiconductor pressure sensor chip to the pedestal using solder, the connection electrodes and the terminals of the semiconductor pressure sensor chip are connected to the flexible printed wiring board by a turn.
Road to is characterized in the Turkey be connected using solder.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram of a semiconductor pressure sensor obtained by a manufacturing method according to an embodiment of the present invention. 1 is a semiconductor pressure sensor chip. 2 I Oh at the terminals of the package outside drawer, its one end
Projecting inside the package and the other end outside the package
That has been provided so as to be drawn to the part. 3 is a flexible printed circuit board, on the flexible printed wiring board 3 is a circuit for connecting the connection electrodes on the semiconductor pressure sensor chip 1 (not shown) and the terminal 2 is formed. Reference numeral 4 denotes a bump formed of solder or the like, between the connection electrode on the semiconductor pressure sensor chip 1 and the circuit on the flexible printed wiring board 3 and between the circuit on the flexible printed wiring board 3 and the terminal 2 for drawing out the package. Are connected to each other. Reference numeral 5 denotes a pedestal, on which the semiconductor pressure sensor chip 1 is fixed using solder 7. 8 is a CA for protecting the semiconductor pressure sensor chip 1 and the like.
N.

FIG. 2 shows a manufacturing process of the semiconductor pressure sensor according to the present embodiment. First, a circuit that connects the terminals 2 of the flexible printed wiring board 3 on the semiconductor pressure sensor chip 1 on the connection electrode (not shown) and a package external lead connections on the semiconductor pressure sensor chip 1 The bump 4 is formed at a portion connected to the electrode. (Figure 2
(See (a)) Next, the connection voltage of the semiconductor pressure sensor chip 1
The poles and the bumps 4 of the flexible printed wiring board 3 are connected using wireless bonding such as single point bonding. (See FIG. 2B) Next, the semiconductor pressure
The force sensor chip 1 is die-bonded to the pedestal 5 using the solder 7 and the terminals 2 and the flexible printed wiring board 3
Are also connected using the solder 7. (See FIG. 2 (c).) Finally, the semiconductor pressure sensor chip 1 is packaged using CAN8.
Seal in cage . According to (see FIG. 2 (d) see) present embodiment does not use a wire bonding connection between the connection electrode and the terminal 2 of the semiconductor pressure sensor chip 1, the semiconductor pressure sensor by such the thickness of the semiconductor pressure sensor chip 1 In the case where the step between the connection electrode on the chip 1 and the terminal 2 is large, the occurrence of bonding failure can be reduced even if the length of the terminal is increased.

FIG. 3 shows a semiconductor pressure sensor according to this embodiment.
This is another manufacturing process. First, a circuit is formed on the flexible printed wiring board 3 for connecting between the connection electrodes on the semiconductor pressure sensor chip 1 and the terminals 2 for leading out of the package, and is connected to the connection electrodes and the terminals 2 on the semiconductor chip 1. A bump 4 is formed on the portion. Next, the semiconductor pressure sensor chip 1 is die-bonded to the pedestal 5 using the solder 7 (see FIG. 3A). (See FIG. 3 (b))
The semiconductor pressure sensor chip 1 and the terminal 2 are connected to the flexible printed wiring board 3 using solder 7. (FIG. 3
(See (c)) Finally, sealing is performed using CAN8. According to this embodiment, the semiconductor pressure sensor chip 1 and the terminal 2 can be connected to the flexible printed wiring board 3 in the same process, so that the semiconductor pressure sensor is manufactured efficiently. It becomes possible.

FIG. 4 shows a reference example related to this embodiment.
Kicking diagrams showing manufacturing steps of a semiconductor pressure sensor. First, a semiconductor pressure sensor is placed on the flexible printed wiring board 3.
Forming a circuit which connects the connection electrode and the package terminals 2 for external lead on a chip 1, a semiconductor pressure sensor
The portion connecting the connection electrode and the terminal 2 of the sub chip 1 to form bumps 4. (See FIG. 4A) Next, the semiconductor pressure
The force sensor chip 1 is fixed to the pedestal 5 using solder 7. Next, the semiconductor pressure sensor chip 1 and the terminal 2 are connected to the flexible printed wiring board 3 in sequence using wireless bonding such as single point bonding (see FIG. 4B). (See FIG. 4 (c).) The semiconductor pressure sensor chip 1 and the terminal 2 may all be connected to the flexible printed wiring board 3 simultaneously by using gang bonding.

Finally, sealing is performed using CAN8. According to the present embodiment , the semiconductor pressure sensor chip 1 and the terminal 2 are connected to the flexible printed wiring board 3 in the same process, thereby efficiently increasing the semiconductor pressure.
The force sensor can be manufactured, and since the wireless bonding is used, the connection can be made more reliably than solder or the like, so that the yield is improved.

FIG. 5 shows another reference relating to the embodiment of FIG.
FIG. 3 is a schematic configuration diagram of a semiconductor pressure sensor obtained by a manufacturing method according to an example . In the semiconductor pressure sensor shown in FIG.
The flexible printed wiring board 3 of the semiconductor pressure sensor shown in FIG. 1 is joined to the CAN 8 using an adhesive 9.

[0014] A manufacturing process of a semiconductor pressure sensor in FIG. 6 in the present embodiment. First, a circuit which connects the connection electrode and the package terminals 2 for external lead on the semiconductor pressure sensor chip 1 on the flexible printed wiring board 3, the connection electrode and the terminal 2 of the semiconductor pressure sensor chip 1 The bumps 4 are formed at the portions to be connected. (FIG. 6 (a)
Next, the flexible printed wiring board 3 is CAN-bonded with an adhesive or the like using the surface on which no circuit is formed as an adhesive surface.
8 adhere to the inner wall. (See FIG. 6B) Next, the semiconductor
The pressure sensor chip 1 is fixed to the pedestal 5 using solder 7. Next, the semiconductor pressure sensor chip 1 and the terminal 2 and the flexible printed wiring board 3 are joined by heating and melting using the solder 7 (see FIG. 6C). (See FIG. 6D.) Finally, the CAN 8 is sealed. (See Fig. 6 (e)) Reference
According to the example , the flexible printed wiring board 3 and CAN8
Since there is no space between them, the semiconductor pressure sensor can be made compact, and the durability can be improved because the flexible printed wiring board 3 is fixed to the CAN 8.

If the soldering step shown in FIG. 6D is performed by pressurizing and heating bonding such as wireless bonding, the bonding is ensured and the yield can be improved.

FIG. 7 shows a further modification relating to the embodiment shown in FIG.
The semiconductor pressure obtained by the manufacturing method according to another reference example
It is a schematic structure figure of a sensor . The semiconductor pressure sensor shown in FIG.
In support, an insulating film 10 in place of the flexible printed wiring board 3 of the semiconductor pressure sensor shown in FIG. 5, the connection electrodes and the package terminals 2 for external lead on the semiconductor pressure sensor chip 1 on the insulating film 10 A circuit that connects between them is formed.

[0017] The method of manufacturing a semiconductor pressure sensor according to the present embodiment shown in FIG. First, a part of the inner wall of the CAN 8 is covered with the insulating film 1.
0 The covering insulating film semiconductor pressure sensor chip <br/> connection on flops first electrode and the package terminals 2 for external lead on the 10
During forming a circuit connecting the between the bumps 4 to the portion connecting the connection electrode and the terminal 2 of the semiconductor pressure sensor chip <br/> flop 1
To form (See FIG. 8 (a)) Next, a semiconductor pressure sensor
Fixed using the solder 7 the difference between chip 1 on the pedestal 5. Next, the semiconductor pressure sensor chip 1 and the terminal 2 and the bump 4 formed on the insulating film 10 are heat-fused and joined using the solder 7 (see FIG. 8B). (See FIG. 8 (c)) Finally,
The CAN 8 is sealed. (See FIG. 8D.) According to the present embodiment , even if the step between the connection electrode and the terminal 2 for leading out of the package becomes large due to the thickness of the semiconductor pressure sensor chip 1 or the like, the semiconductor pressure sensor chip 1 And the terminal 2 can be connected stably, and the semiconductor pressure
It is possible to directly form a circuit which connects the connection electrode and the package terminals 2 for external lead on a chip 1 to the package, can be a semiconductor pressure sensor compactly.

If the soldering step shown in FIG. 8 (c) is performed by using pressure and heat bonding such as wireless bonding, the bonding is ensured and the yield can be improved.

[0019]

As described above, according to the first aspect of the present invention, there is provided a semiconductor pressure sensor chip mounted on a pedestal.
Cover the semiconductor pressure sensor chip inside with CAN
Package and one end protruding into the package
Electrically connected to the connection electrode on the semiconductor pressure sensor chip
And the other end is drawn out of the package
A method for manufacturing a semiconductor pressure sensor having terminals.
Te, by using the semiconductor pressure sensor chip on the connection electrode and the end <br/> terminal and flexible <br/> Disability printed wiring board circuitry for electrically connecting are formed, said semiconductor pressure sensor of <br/> chip connection electrodes and the flexible printed circuit board
After connecting to the circuit using wireless bonding ,
Since the semiconductor pressure sensor chip is die-bonded to the pedestal using solder and the terminal and the circuit of the flexible printed wiring board are connected using solder, the connection electrode and the terminal on the semiconductor pressure sensor chip are connected. It is not necessary to use wire bonding for connection, and if the step between the connection electrode and the terminal is large due to the thickness of the semiconductor pressure sensor chip, etc.
The connection between the pressure sensor chip and the terminal can be stably performed.

According to the second aspect of the present invention, the pedestal is mounted on the base.
The semiconductor pressure sensor chip placed and the CAN
Package for housing the semiconductor pressure sensor chip in a part
And one end of the semiconductor pressure cell
And the other end is electrically connected to the connection electrode on the sensor chip.
And a terminal drawn out from the package.
A method of manufacturing a semiconductor pressure sensor, comprising:
Using a flexible printed circuit board on which a circuit is formed for electrically connecting the terminal and the connection electrodes on the pressure sensor chip, after fixing the semiconductor pressure sensor chip by using solder on a pedestal, said semiconductor Pressure sensor chip
Since the connection electrode and the terminals of flops to be connected with solder to the circuit of the flexible printed wiring board, it is not used a wire bonding connection between the connection electrode and the terminals on the semiconductor chip, the semiconductor pressure sensor chip When the step between the connection electrode and the terminal is large due to its thickness or the like, the connection between the semiconductor pressure sensor chip and the terminal can be performed stably and efficiently even if the length of the terminal is increased.

[Brief description of the drawings]

FIG. 1 is a diagram showing a structure obtained by a manufacturing method according to an embodiment of the present invention .
1 is a schematic configuration diagram of a semiconductor pressure sensor to be used .

2 is a diagram showing a manufacturing process of a semiconductor pressure sensor according to ibid present embodiment.

FIG. 3 is a view showing another manufacturing process of the semiconductor pressure sensor according to the embodiment.

FIG. 4 is a semiconductor in a reference example related to the embodiment;
It is a figure showing the manufacturing process of a pressure sensor .

FIG. 5 is a schematic configuration diagram of a semiconductor pressure sensor obtained by a manufacturing method according to another reference example related to the embodiment shown in FIG . 1 ;

FIG. 6 is a diagram showing a manufacturing process of the semiconductor pressure sensor according to the reference example shown in FIG.

7 is a schematic configuration diagram of a semiconductor pressure sensor obtained by a manufacturing method according to still another reference example related to the embodiment shown in FIG . 1 ;

FIG. 8 is a view showing a manufacturing process of the semiconductor pressure sensor according to the reference example shown in FIG. 7;

FIG. 9 is a schematic configuration diagram of a conventional CAN type pressure sensor.

FIG. 10 is a schematic configuration diagram of another conventional CAN pressure sensor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor pressure sensor chip 2 Terminal 3 Flexible printed wiring board 4 Bump 5 Pedestal 7 Solder 8 CAN 9 Adhesive 10 Insulating film 11 Bonding wire

Continuation of the front page (56) References JP-A-60-80230 (JP, A) JP-A-52-32267 (JP, A) JP-A-5-267403 (JP, A) JP-A-2-58253 (JP) JP-A-2-192743 (JP, A) JP-A-4-36238 (JP, U) JP-B-43-22625 (JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB (Name) H01L 21/60 311 H01L 23/12

Claims (2)

(57) [Claims] 1. A semiconductor pressure sensor chip mounted on a pedestal.
And the semiconductor pressure sensor chip inside with CAN
Package and one end protrudes into the package
And electrically connect with the connection electrodes on the semiconductor pressure sensor chip.
And the other end is pulled out of the package
Of manufacturing a semiconductor pressure sensor having a closed terminal
A is, with the semiconductor pressure sensor circuit for the connection electrode and the terminals on the chip for electrically connecting are formed Furekishibu <br/> Le printed wiring board, the semiconductor pressure sensor chip <br /> after connecting the connection electrode of flops and the flexible printed wiring board circuitry <br/> using wireless bonding, the terminal with die-bonding using solder the <br/> semiconductor pressure sensor chip on a pedestal the method of manufacturing a semiconductor pressure sensor, wherein the benzalkonium connecting the circuit of the flexible printed wiring board using a solder with. 2. A semiconductor pressure sensor chip mounted on a pedestal.
And the semiconductor pressure sensor chip inside with CAN
Package and one end protrudes into the package
And electrically connect with the connection electrodes on the semiconductor pressure sensor chip.
And the other end is pulled out of the package
Of manufacturing a semiconductor pressure sensor having a closed terminal
A is, with the semiconductor pressure sensor circuit for the connection electrode and the terminals on the chip for electrically connecting are formed Furekishibu <br/> Le printed wiring board, the semiconductor pressure sensor chip <br After fixing the pump to the pedestal using solder, the semiconductor pressure
The method of manufacturing a semiconductor pressure sensor and a connection electrode and the terminal of the sensor chip, wherein the benzalkonium be connected using solder to the circuit of the flexible printed wiring board.