JP3316710B2 - Exposure equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus, and more particularly to a scanning projection exposure apparatus which performs projection exposure by moving a first substrate and a second substrate relative to a projection optical system.

[0002]

2. Description of the Related Art In recent years, liquid crystal display panels have been frequently used as display elements for word processors, personal computers, televisions, and the like. A liquid crystal display panel is manufactured by patterning a transparent thin-film electrode on a glass substrate into a desired shape by a photolithography technique. As an apparatus for the lithography, a mirror projection type aligner that exposes an original pattern formed on a mask to a photoresist layer on a glass substrate via a projection optical system is used.

FIG. 8 is a view showing the structure of a conventional mirror projection type aligner. FIG. 8A is a perspective view showing the entire structure of the aligner, and FIG. 8B is a view showing the structure of a projection optical system of the aligner. It is a lens sectional view shown.
In FIG. 8A, the mask 71c is illuminated in an arcuate illumination field 72a by an illumination optical system (not shown). As shown in FIG. 8 (b), the light path of the light from the illumination field 72a is deflected by 90 ° at the first reflection surface 73a of the trapezoidal mirror 73, and is again transmitted through the concave mirror 74 and the convex mirror 75 to the concave mirror 74. Is reflected by The light path of the light reflected by the concave mirror 74 is deflected by 90 ° at the second reflection surface 73b of the trapezoidal mirror. Thus, plate 7
6, an image of the mask 71 c, that is, an image 7 of the illumination field 72 a
2b is formed.

In the illustrated aligner, so-called scanning exposure is performed while moving the plate 76 and the mask 71c in the X direction in the figure, and the circuit pattern on the mask 71c is transferred to a predetermined area of the plate 76. Recently, it has been desired to increase the size of a liquid crystal display panel. Along with the demand for the enlargement, it is desired to enlarge the exposure area even in the aligner as described above.

[0005]

In the conventional exposure apparatus described above, the exposure area is divided and exposed in order to enlarge the exposure area. Specifically, as shown in FIG. 8A, the exposure area on the plate 76 is divided into four exposure areas 76a to 76d.
The mask 71a and the region 76a are scanned and exposed, and the circuit pattern of the mask 71a is transferred to the region 76a. Next, the mask 71a and the mask 71b are exchanged, and the plate 76 is moved stepwise in the XY plane in the drawing so that the exposure area of the projection optical system and the area 76b overlap. Then, the mask 71b and the region 76b
Are scanned and exposed to transfer the circuit pattern of the mask 71b onto the region 76b. Hereinafter, masks 71c and 71d
The same process was repeated for the regions 76c and 76d, and the circuit patterns of the masks 71c and 71d were transferred to the regions 76c and 76d, respectively.

As described above, when exposing an exposure area, exposure is performed a plurality of times for one exposure area, so that the throughput (the amount of exposed substrate per unit time) is low. Further, in the case of the division exposure, a joint is generated between the adjacent exposure areas, and therefore, it is necessary to increase the joint accuracy. For this reason, the magnification error of the projection optical system needs to be close to 0, and a great improvement in alignment accuracy is required, resulting in a disadvantage that the cost of the apparatus is increased.

On the other hand, it is conceivable to increase the size of the projection optical system in order to collectively scan and expose one large exposure area without performing division exposure. However, in order to increase the size of the projection optical system, it is necessary to manufacture a large-sized optical element with extremely high precision, which results in an increase in manufacturing cost and an increase in the size of the apparatus. In addition, there is a disadvantage that an increase in the size of the projection optical system causes an increase in aberration, that is, a reduction in imaging performance. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide an exposure apparatus capable of collectively scanning and exposing a large exposure area with good imaging performance without reducing throughput. And

[0008]

In order to solve the above-mentioned problems, according to the present invention, a first substrate and a second substrate are relatively moved with respect to a projection optical system, and the first substrate and the second substrate are moved on the first substrate. An exposure apparatus for projecting and exposing the pattern formed on the second substrate via the projection optical system, wherein the projection optical system forms an equal-size erect image of the pattern formed on the first substrate. The movement of a plurality of exposure regions formed on the second substrate via the plurality of projection optical units, each of which includes a plurality of projection optical units at least on the image side formed on the second substrate and which is telecentric on the image side. An exposure apparatus is provided, comprising: control means for controlling the total length along the direction to be substantially constant in a direction orthogonal to the moving direction.

According to a preferred aspect of the present invention, the projection optical unit is an Offner-type optical system including at least one concave mirror and at least one convex mirror. The projection optical unit may further include a first partial optical system that forms an intermediate image of the pattern formed on the first substrate, and a second partial optical system that re-images the intermediate image on the second substrate.
It is preferable to provide a partial optical system.

[0010]

As described above, according to the present invention, in a scanning type exposure apparatus, an equal-size erect image of a circuit pattern formed on a mask serving as a first substrate (an image in which the right, left, up, down, and lateral magnifications are positive).
Is projected onto a plate as a second substrate through a projection optical system including a plurality of projection optical units. The plurality of exposure regions formed on the plate via each of the plurality of projection optical units are such that the sum of the lengths in the scanning direction is constant in the scanning orthogonal direction, that is, over the entire surface of the plate. The exposure light quantity is configured to be constant. As described above, since the plurality of projection optical units are arranged so that the total sum of the widths of the exposure regions along the scanning direction is constant in the scanning orthogonal direction, each projection optical unit is small and the exposure region is small. However, one large exposure area can be obtained as a whole by one scanning exposure.

In addition, since each projection optical unit is small, it is possible to minimize the occurrence of aberration and perform scanning exposure with good imaging performance. Each projection optical unit is composed of two partial optical systems, each of which is formed on a plate by an aperture shape of a field stop arranged at a position where an intermediate image of a mask pattern is formed via a first partial optical system. When defining the exposure area, the end of the opening has a triangular shape, and preferably overlaps the triangular end of the adjacent opening in the scanning direction. When the partial optical system is an Offner-type optical system, it is preferable that the central opening except for both ends of the opening is defined by two arcs or two broken lines.

[0012]

An embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view illustrating a configuration of an exposure apparatus according to an embodiment of the present invention. FIG. 2 is a diagram showing a configuration of a projection optical system of the exposure apparatus of FIG. In FIG. 1, the direction (scanning direction) in which the mask 8 on which a predetermined circuit pattern is formed and the plate 9 made of a glass substrate coated with a resist are integrally conveyed is defined as the X axis, and within the plane of the mask 8. X
The direction perpendicular to the axis is the Y axis, and the normal direction of the mask 8 is Z
Axis.

In FIG. 1, the exposure apparatus of the present embodiment includes an illumination optical system 10 for uniformly illuminating a mask 8 in an XY plane in the figure. Below the mask 8, a projection optical system including a plurality of projection optical units 2a to 2g is provided. Each projection optical unit has the same configuration. Further below the projection optical system, a plate 9
It is mounted on a stage so as to be substantially parallel to the Y plane. During the scanning exposure, the mask 8 and the plate 9 are moved integrally in the direction of the arrow (X0 direction) in the figure.

FIG. 2 is a diagram schematically showing the configuration of each projection optical unit. The illustrated projection optical unit includes a first partial optical system (21 to 23), a field stop 24, and a second partial optical system (25 to 27). First
The partial optical system (21 to 23) and the second partial optical system (25
To 27) are Offner-type optical systems, each having the same configuration.

The first partial optical system includes an isosceles trapezoidal prism 21 having a first reflection surface 21a for deflecting light from the mask 8 in the X-axis direction (right side in the figure), and an isosceles trapezoidal prism 21
A concave mirror 22 for reflecting the light reflected by the first reflecting surface 21a in the left direction in the figure, and a convex mirror 23 arranged coaxially with the optical axis of the concave mirror 22 to face the concave mirror 22. As described above, the first partial optical system and the second partial optical system have exactly the same configuration. In FIG. 2, the components of the second partial optical system are denoted by the same reference numerals as those of the first partial optical system, but redundant description of the configuration of the second partial optical system is omitted.

The illumination light transmitted through the mask 8 is deflected rightward in FIG. 1 by a first reflection surface 21 a of a trapezoidal prism 21 and is incident on a concave mirror 22. The light reflected by the concave mirror 22 to the left in the figure is reflected by the convex mirror 23 to the right in the figure, and again enters the concave mirror 22. The light reflected again to the left in the figure by the concave mirror 22 is deflected downward in the figure by the second reflection surface 21b of the isosceles trapezoidal prism 21, and is deflected by the first partial optical system and the second partial optical system. A primary image of the pattern of the mask 8 is formed therebetween. Thus, the first partial optical system (21 to 2)
The primary image formed by 3) is an equal-magnification image of the mask 8 having a positive lateral magnification in the X direction and a negative lateral magnification in the Y direction. Note that a field stop 24 is disposed at a position where the primary image is formed.

The light from the primary image through the field stop 24 is
The light is deflected rightward in the figure by the first reflection surface 25 a of the trapezoidal prism 25, and enters the concave mirror 26. The light reflected by the concave mirror 26 in the left direction in the figure is reflected by the convex mirror 27 to the right in the figure, and enters the concave mirror 26 again. The light reflected again to the left in the figure by the concave mirror 26 is deflected downward in the figure by the second reflecting surface 25b of the isosceles trapezoidal prism 25, and a secondary image of the pattern of the mask 8 is formed on the plate 9. Is done.

As described above, the first partial optical system and the second
The second partial optical system forms an equal-magnification image of a primary image having a positive lateral magnification in the X direction and a negative lateral magnification in the Y direction. Therefore, the secondary image formed on the plate 9 via the first and second partial optical systems is:
An equal-size erect image of the mask 8 (an image having a positive lateral magnification in both the X and Y directions). Here, the projection optical unit composed of the first and second Offner-type partial optical systems is a telecentric optical system on both sides (both on the object side and on the image side). In the projection optical unit shown in FIG. 2, the concave mirror 22 of the first partial optical system and the concave mirror 26 of the second partial optical system are both configured to face the left side in the figure, whereby the projection optical unit Thus, the size of the projection optical system can be reduced.

FIGS. 3A and 3B are diagrams showing a first example of the shape of the aperture of the field stop. FIG. 3A shows the aperture formed in the field stop, and FIG. The relationship with the visual field region is shown. As shown by the broken line in FIG.
In the Offner-type optical system, the maximum visual field region defined as a region where the aberration is sufficiently small is substantially semicircular. Therefore, the shape of the opening 24A formed in the field stop 24 is defined in the semi-annular maximum viewing area.

In FIG. 3B, the width of the opening 24A in the direction orthogonal to the scanning direction (corresponding to the horizontal direction in the figure) is 24.
M, of which two arcs 2 are 24L wide and
Central opening 24 defined by 4c and 24d
In a, the width in the scanning direction (corresponding to the vertical direction in the figure) is configured to be constant (24 W). In order to maximize the scanning speed, the width 24W of the central opening 24a in the scanning direction is preferably selected so as to be maximum with respect to the maximum visual field area. Meanwhile, width 2
Opening portions 24b at both ends other than the 4L central opening portion 24a
(Indicated by a broken line in the drawing) is formed in a triangular shape so that the width in the scanning direction decreases linearly toward the end.

FIGS. 4A and 4B are diagrams showing a second example of the shape of the aperture of the field stop. FIG. 4A shows the aperture formed in the field stop, and FIG. The relationship with the visual field region is shown. In FIG. 4B, the width in a direction orthogonal to the scanning direction of the opening 24B (corresponding to the horizontal direction in the figure) is 2
4M, of which the width is 24L, and the width of the central opening 24a defined by the two polygonal lines 24c and 24d is constant (24W) in the scanning direction (corresponding to the vertical direction in the figure). It is configured as follows. In order to maximize the scanning speed, the width 24W of the central opening 24a in the scanning direction is preferably selected so as to be maximum with respect to the maximum visual field area.

On the other hand, the opening portions 24b at both ends (broken portions in the drawing) other than the central opening portion 24a having a width 24L are formed in a triangular shape so that the width in the scanning direction decreases linearly toward the end. ing. Thus, in the opening of the field stop shown in FIG. 3, the center opening is defined by two arcs, whereas in the opening of the field stop shown in FIG. 4, the center opening is formed by two broken lines. The specified point is basically different.

In FIG. 1, field areas 8a to 8g are defined on the mask 8 by field stops arranged in the projection optical units 2a to 2g, respectively. These images in the visual field regions 8a to 8g are formed as equal-size erect images in the exposure regions 9a to 9g on the plate 9 via the projection optical system. Here, the projection optical units 2a to 2a
“d” is arranged such that the corresponding visual field regions 8 a to 8 d are linearly arranged in the Y direction, that is, the scanning orthogonal direction in the drawing. On the other hand, the projection optical units 2e to 2g have the corresponding visual field regions 8e to 8g in the Y direction.
They are arranged so as to be arranged in a straight line different from a to 8d.

The optical axes of the projection optical units 2a to 2d and the optical axes of the projection optical units 2e to 2g are both parallel to the X-axis, and the isosceles trapezoidal prisms of the projection optical units 2a to 2d and the projection optical units 2e to 2d. The projection optical units 2a to 2d of the first group are opposed to the projection optical units 2e to 2g of the second group so that the 2g isosceles trapezoidal prisms are close to each other. Further, along the Y direction, the projection optical units 2a, 2e, 2
The first group and the second group are arranged alternately in the order of b, 2f, 2c, 2g, and 2d.

The first group of projection optical units 2a to 2d and the second group of projection optical units 2e to 2g are arranged in the same direction so as to widen the X-direction interval between the field regions 8a to 8d and the field regions 8e to 8g. You may. However, in this case, the amount of scanning (the amount of movement of the mask 8 and the plate 9 in the X direction) for performing the scanning exposure is increased, and the throughput is undesirably reduced.

The visual field regions 8a to 8g on the mask 8
Are defined by the apertures of the field stops in the respective projection optical units. Therefore, the illumination optical system 1
For 0, it is not necessary to provide an optical system for strictly defining the visual field regions 8a to 8g. In this manner, on the plate 9, the exposure regions 9a to 9d are formed linearly along the Y direction via the projection optical units 8a to 8d, and are exposed via the projection optical units 8e to 8g.
g is formed linearly along the Y direction. These exposure regions 9a to 9g are provided on the mask 8 as viewing regions 8a to 8g.
It is an erect image at the same magnification of g.

FIG. 5 is a view showing the arrangement of the field stop on the mask, and shows the planar positional relationship between the mask 8 and the field areas 8a to 8g defined by the projection optical units 2a to 2g. I have. In FIG. 5, a rectangular circuit pattern PA is formed on the mask 8, and a light-shielding portion LSA is provided so as to surround the circuit pattern PA. The illumination optical system 10 illuminates at least illumination regions 111a to 111g surrounded by broken lines in the drawing with substantially uniform illuminance.

In the illumination regions 111a to 111g, the field regions 8a to 8g defined in a crescent shape as shown by oblique lines in the drawing are accommodated by the field stops of the corresponding projection optical units 2a to 2g. ing. Here, the convex sides of the viewing areas 8a to 8d and the viewing area 8
e to 8g are arranged so that the convex sides thereof are opposed to each other, and the triangular end of each viewing area and the corresponding triangular end of the adjacent viewing area overlap in the X direction (scanning direction). It has become.

As described above, the first group of visual field areas 8a to 8a
The reason for arranging d and the second group of viewing areas 8e to 8g alternately in the Y direction is that each projection optical unit is a double-sided telecentric optical system, so that the area occupied by the projection optical units 2a to 2g in the XY plane is respectively This is because it becomes larger than the corresponding visual field regions 8a to 8g.
That is, the visual field regions 8a to 8 defined by the visual field stops of the projection optical units 2a to 2d arranged linearly.
In d, an interval occurs in the Y direction between the regions. As a result, only the projection optical units 2a through 2d
In this case, it becomes impossible to secure a continuous exposure area in the Y direction. Therefore, the projection optical unit 2e
2 to 2g are added, and the corresponding viewing areas 8e to 8g complement the intervals in the Y direction between the viewing areas 8a to 8d, thereby securing a continuous exposure area in the Y direction.

The visual field regions 8a and 8d are positioned so as to intersect with the boundary between the light-shielding portion LSA and the circuit pattern PA in the central portion where the length in the scanning direction is constant. . Thus, the mask 8
In the upper visual field areas 8a to 8g, the sum of the lengths of the visual field areas along the scanning direction (X direction) is equal to the scanning orthogonal direction (Y
Direction) at any position. That is, the exposure areas 9a to 9g which are the same-size erect images of the visual field area.
Also, the sum of the lengths of the viewing areas along the scanning direction (X direction) becomes constant at an arbitrary position in the scanning orthogonal direction (Y direction). As a result, the plate 9
A uniform exposure light amount distribution can be obtained over the entire upper surface.

FIG. 6 is a diagram showing the configuration of another projection optical unit. The projection optical unit shown in FIG. 6 is basically different from the projection optical unit shown in FIG. 2 which comprises two Offner-type partial optical systems and a field stop, and comprises one Offner-type optical system and does not have a field stop. Different. Further, the projection optical unit in FIG. 6 has the same configuration as each of the partial optical systems in FIG. 2, except that the first reflecting surface of the isosceles trapezoidal prism is a roof surface.

In the projection optical unit shown in FIG. 6, the illumination light transmitted through the mask 8 is applied to the roof surface 51 of the isosceles trapezoidal prism 51.
The light is deflected to the right in the figure at a, and enters the concave mirror 52. The light reflected by the concave mirror 52 in the left direction in the figure is reflected by the convex mirror 53 to the right in the figure, and enters the concave mirror 52 again. Light reflected again by the concave mirror 52 in the left direction in the figure is deflected downward in the figure by the reflection surface 51b of the trapezoidal prism 51, and an equal-size erect image of the pattern of the mask 8 is formed on the plate 9.

As described above, the image direction in the optical axis orthogonal direction (the direction orthogonal to the paper plane in the figure) in the object plane and the image plane is reversed by the roof surface 51a. For this reason, when the pattern on the mask 8 is an erect image on the plate 9 in which the lateral magnification in the direction along the optical axis (X direction) and in the direction orthogonal to the optical axis in the object plane and image plane (Y direction) are both positive. Formed. Therefore, in a scanning exposure apparatus having a projection optical system formed by combining a plurality of such projection optical units, the mask 8
And the scanning direction of the plate 9 can be matched.

Since the projection optical unit of FIG. 6 does not have a field stop, the illumination optical system 10 controls the mask 8.
The upper viewing area must be strictly defined. However, since the projection optical unit of FIG. 6 is constituted by one Offner-type optical system, the amount of optical aberration is smaller than that of the projection optical unit having two Offner-type partial optical systems as shown in FIG. Small and good imaging performance can be obtained.

As described above, in the present embodiment, one large exposure area as a whole can be seamlessly obtained by one scanning exposure through a plurality of projection optical units.
In addition, since the individual projection optical units are small, it is possible to minimize the occurrence of aberration and perform scanning exposure with good imaging performance. Furthermore, the field stop and the exposure area corresponding to each projection optical unit can be defined by the field stop of each projection optical unit so that a uniform exposure light amount distribution can be obtained over the entire surface to be exposed. As a result, there is no need to provide an optical system for strictly defining the field of view in the illumination optical system.

Next, with reference to FIG. 7, a desirable arrangement relationship of the projection optical units in each of the above embodiments will be described. FIG. 7 is an XY plan view showing a relationship between two sets of projection optical units and a field area (exposure area). FIG.
In FIG. 7, members having the same functions as those of the above-described embodiment are denoted by the same reference numerals.

In FIG. 7, the projection optical unit 2a for forming an image of the field of view 8a on the object plane (the mask plane in the embodiment) shows only an isosceles trapezoidal prism 21A, a concave mirror 22A and a convex mirror 23A. The projection optical unit 2b that forms an image of the visual field region 8b on the object plane shows only an isosceles trapezoidal prism 21B, a concave mirror 22B, and a convex mirror 23B. Here, the optical axis Axa of the projection optical unit 2a
The distance d between the optical axis Axb of the projection optical unit 2b and the projection optical unit 2b in the Y direction is defined as 24L, the width in the Y direction on the inner side (center side of the arc) in the arc-shaped field of view, and 24M as the Y in the field of view.
When setting the maximum width in the direction,

It is desirable that d = 24L + (24M−24L) / 2 (1) is satisfied.

Here, two sets of projection optical units 2a, 2a
If b does not satisfy the above conditional expression (1), it is not preferable because the visual field regions do not overlap on the object plane or the width of the visual field region in the X direction (scanning direction) is not constant.
Note that the conditional expressions (1) hold even if the above 24L and 24M are not the widths in the visual field region on the object plane, but are the widths in the exposure area on the image plane (plate surface in the embodiment) or the field stop. Also, the above conditional expression (1) satisfies 2
The present invention can be applied to a case where there are more than one set of projection optical units, and can be applied to a case where the projection optical unit is a Dyson type. Here, in the case where the projection optical unit is of the Dyson type, when the field of view of the Dyson-type optical system is, for example, trapezoidal, 24L is defined as a short side of a pair of parallel sides in the trapezoidal field of view, and 24M is defined as a long side. do it.

[0039]

As described above, according to the present invention, a large exposure area can be collectively scanned and exposed with good imaging performance without lowering the throughput.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a configuration of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a projection optical system of the exposure apparatus of FIG.

3A and 3B are diagrams illustrating a first example of the shape of an opening of a field stop. FIG. 3A illustrates an opening formed in a field stop.
(B) shows the relationship between the shape of the opening and the maximum viewing area.

FIGS. 4A and 4B are diagrams showing a second example of the shape of the opening of the field stop, and FIG. 4A shows an opening formed in the field stop;
(B) shows the relationship between the shape of the opening and the maximum viewing area.

FIG. 5 is a diagram showing an arrangement of a field stop on a mask, and shows a planar positional relationship between field regions 8a to 8g defined by projection optical units 2a to 2g and a mask 8;

FIG. 6 is a diagram showing a configuration of another projection optical unit.

FIG. 7 is a diagram illustrating an arrangement relationship of a plurality of projection optical units.

8A and 8B are diagrams showing a configuration of a conventional mirror projection type aligner, in which FIG. 8A is a perspective view showing an entire configuration of the aligner, and FIG. 8B is a lens cross section showing a configuration of a projection optical system of the aligner. FIG.

[Explanation of symbols]

 2 Projection optical unit 8 Mask 9 Plate 10 Illumination optical system 21 Equilateral trapezoidal prism 22 Concave mirror 23 Convex mirror 24 Field stop

Continuation of front page (56) References JP-A-52-15266 (JP, A) JP-A-4-251812 (JP, A) US Patent 4,696,889 (US, A) US Patent 4,768,880 (US, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027 G03F 7/20 G02B 9/00-17/08 INSPEC (DIALOG)

Claims (14)

(57) [Claims] A first substrate and a second substrate that are relatively moved with respect to a projection optical system to transfer a pattern formed on the first substrate to the second substrate via the projection optical system; In an exposure apparatus for projecting and exposing on a substrate, the projection optical system forms a plurality of projections at least on the image side that are telecentric at least on the image side, wherein the projection optical system forms an equal-size erect image of the pattern formed on the first substrate on the second substrate. An optical unit, wherein a sum of lengths of the plurality of exposure regions formed on the second substrate along the moving direction via each of the plurality of projection optical units is in a direction orthogonal to the moving direction. An exposure apparatus, comprising: control means for performing control so as to be substantially constant throughout the exposure apparatus. 2. The projection optical unit according to claim 1, wherein at least one
2. The exposure apparatus according to claim 1, wherein the exposure apparatus is an Offner-type optical system including one concave mirror and at least one convex mirror. 3. The projection optical unit includes: a first partial optical system that forms an intermediate image of a pattern formed on the first substrate; and a re-imaging of the intermediate image on the second substrate. The exposure apparatus according to claim 1, further comprising a second partial optical system that causes the second partial optical system to perform the exposure. 4. An exposure apparatus according to claim 3, wherein said control means is a field stop arranged at a position of said intermediate image. 5. The field stop has a generally semi-annular opening, and the opening has a central opening region and two openings sandwiching the central opening region.
In the central opening region, the opening length along the moving direction is constant, and in the peripheral opening region, the opening length along the moving direction is linear toward the end. 5. The exposure apparatus according to claim 4, wherein the peripheral aperture region overlaps with a peripheral aperture region corresponding to an aperture of an adjacent field stop in the scanning direction. . 6. The exposure apparatus according to claim 5, wherein a boundary line that is not adjacent to the peripheral opening region among the boundary lines of the central opening region is defined by two arcs. 7. The exposure apparatus according to claim 5, wherein a boundary line that is not adjacent to the peripheral opening region among the boundary lines of the central opening region is defined by two broken lines. Claim 8. The first substrate and the second
Forming on the first substrate by relatively moving the second substrate
The obtained pattern is transferred to the second base through the projection optical system.
In an exposure method of projecting and exposing on a plate, A plurality of projection optical units that are telecentric at least on the image side.
Of a pattern formed on the first substrate using a knit
Forming an equal-size erect image on the second substrate; The second through each of the plurality of projection optical units
A plurality of exposure regions formed on the substrate are moved along the moving direction.
The sum of the measured lengths is in a direction orthogonal to the moving direction.
An exposure method characterized by being substantially constant. 9. The projection optical unit has at least one
Off with one concave mirror and at least one convex mirror
9. The method according to claim 8, wherein the optical system is a knurled optical system.
Exposure method. 10. The plurality of projection optical units,
Forming an intermediate image of the pattern formed on the first substrate
A first partial optical system and the intermediate image on the second substrate
And a second partial optical system for re-imaging.
The exposure method according to claim 8 or 9, wherein: 11. The plurality of projection optical units,
Having a field stop located at the position of the intermediate image
The exposure method according to claim 10, wherein: 12. The field stop has a generally semi-annular opening.
Has a mouth, The opening has a central opening region and two openings sandwiching the central opening region.
Consists of two peripheral aperture areas, An opening along the moving direction in the central opening area
The length is constant, and the peripheral opening area is in the moving direction.
So that the length of the opening along it varies linearly towards the end
The peripheral aperture area is adjacent to the field stop.
Overlap with the corresponding peripheral opening area of the opening in the scanning direction.
12. The method according to claim 11, wherein the object is duplicated. Exposure method described in
Law. Claim 13 Of the boundary line of the central opening area,
The boundary line that is not adjacent to the peripheral opening area is defined by two arcs
13. The dew-forming device according to claim 12, wherein the dew is defined.
Light method. 14. Of the boundary line of the central opening area,
The boundary line that is not adjacent to the peripheral opening area is indicated by two broken lines.
13. The method according to claim 12, wherein
Exposure method.