JP3315088B2 - IC socket structure and IC mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC socket structure for detachably mounting a flat package type IC (semiconductor integrated circuit), and more particularly to an IC socket structure and an IC suitable for use in a burn-in test and a handler test. To a method of mounting the substrate on a substrate.

[0002]

2. Description of the Related Art It is known that not only semiconductor products but also most products have a high failure rate both immediately after shipment and at the end of the product life, and are low during a stable period. This phenomenon is called a “bathtub curve” because the trend of the failure rate is similar to the shape of a bathtub when viewed in time. The burn-in test is performed by using the bathtub curve theory. The IC is operated at a high temperature of 100 ° C. or more, and a failure near the border line is detected in a short time to perform screening (removal).
This is one of the shipping inspection techniques.

In this type of test, dozens of ICs are set on a dedicated board called a burn-in board, and an operation test is performed by putting many boards at a time in a high-temperature chamber. Since it must be easy to remove after the test, here is a removable IC
You need a socket.

FIG. 3 is a schematic view of a conventional detachable IC socket. Reference numeral 1 denotes an IC of a flat package type (a package having a flat tip of a lead pin 1a). The IC 1 is positioned and mounted in the concave portion 3 of the socket body 2, and the IC 1 is applied with an appropriate force by means not shown. Press down from above to set on the burn-in board.

At the bottom of the recess 3, a lead pin 1a of the IC 1 is provided.
In this example, four terminal groups 4 are provided because the IC 1 is of a quad type in which the lead pins 1a are provided on four side surfaces in this example. However, two of them are hidden behind the wall of the concave portion 3 and cannot be seen.

FIG. 4 is a detailed view of a main part of the terminal group 4. As shown in FIG. The terminal group 4 is configured by arranging a large number of metal terminals 5 at equal pitches.
The IC contact part 5a with which the tip of a contacts is formed, a beam part 5b elastically holding the contact part 5a, a base part 5c seated on the bottom of the concave part 3, and a pin 5d penetrating the bottom of the concave part 3 integrally. Is formed.

The tip of the pin 5d is inserted into a hole of a burn-in board (not shown) and soldered to fix the IC socket 2 to the board.

[0008]

However, in such a conventional IC socket, the terminal group 4 is provided in the recess of the socket main body 2 and is integrated with the socket main body 2. When a defect such as fatigue, breakage or deformation occurs, even if the number is only one, there is a problem that the entire IC socket becomes unusable. In addition, since the tips of the pins 5d of the metal terminals 5 are soldered to the burn-in board, when mounting dozens of IC sockets on the burn-in board in the burn-in test, many IC sockets having defective metal terminals are generated. In that case, the entire board had to be destroyed, which was extremely uneconomical.

[0009]

SUMMARY OF THE INVENTION Accordingly, the present invention provides a metal terminal portion formed separately from a socket body so that even if a defective metal terminal occurs, only the metal terminal portion can be replaced. To significantly improve economic efficiency.

According to the present invention, there is provided a metal terminal which is used on a substrate having a wiring provided on a surface thereof and which is in contact with a lead pin of an IC and a wiring on the substrate to conduct the IC and the substrate. In the IC socket structure having a plurality of terminals, a terminal holding means for holding the plurality of metal terminals side by side, an IC socket main body having a storage portion for storing the terminal holding means, and detachably attached to the IC socket main body. And a pressing member for pressing the terminal holding means so that the metal terminal comes into contact with the wiring on the substrate.

According to this structure, the terminal holding means having a plurality of metal terminals is formed separately from the IC socket main body and housed in the IC socket main body. In the case of failure, the terminal holding means including the defective terminal can be removed and replaced.

According to the present invention, in order to solve the above-mentioned problems, in the above IC socket structure, the terminal holding means holds a metal terminal group corresponding to a lead pin group for each side surface of the IC. In particular, leads provided on each side of the IC
Before forming a metal terminal group corresponding to one of the pin groups
The lead pin for holding a plurality of metal terminals side by side;
It is preferable to provide a number of terminal holding means corresponding to the number of groups.
New

According to this configuration, the terminal holding means is an IC.
Since the metal terminal group corresponding to the lead pin group for each side surface is held, if one or several metal terminals become defective, only the terminal holding means for holding the metal terminal group including the defective terminal is used. Can be removed and replaced.

The present invention, in order to solve the above problems, the
In any one of the IC socket structures, the metal terminal may include a body portion sandwiched by the terminal holding means, an IC contact portion in contact with a lead pin of the IC, and And a substrate wiring contact portion in contact with the wiring.

According to this structure, since the board wiring contact portion is folded into the outer surface of the terminal holding means, the board holding contact portion of the metal terminal and the wiring on the board surface can be formed simply by placing the terminal holding means on the wiring on the board. Can be contacted.

The present invention, in order to solve the above problems, the
In any one of the IC socket structures, the storage portion of the IC socket main body is a through hole penetrating the substrate.

According to this structure, since the housing portion of the IC socket body penetrates through the board, the terminal holding means is directly mounted on the board, and the board wiring contact portion of the metal terminal and the wiring on the board surface are connected. Can contact.

According to the present invention, there is provided an IC for solving the above problems.
In the method of mounting on a substrate with a wiring on the surface,
An IC socket body having an accommodating portion is placed on the surface of the substrate , and one of a group of lead pins provided on each side of the IC is provided.
The plurality of metal terminals so as to form a corresponding metal terminal group.
The number of lead pins that hold the metal terminals side by side
A corresponding number of terminal holding means are housed in the housing, and
The terminal holding means is pressed by a pressing member detachably attached to the C socket body, and the metal terminal is brought into contact with the wiring on the substrate.

According to this method, since the terminal holding means having a plurality of metal terminals formed separately from the IC socket main body is housed in the IC socket main body, one or several metal terminals become defective. In this case, the terminal holding means including the defective terminal can be removed and replaced.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show an embodiment of an IC socket structure according to the present invention. The present IC socket structure is configured to conduct a quad-type IC having lead pins protruding from four side surfaces of a package to a substrate having wiring on the surface. Here, the substrate with wiring on the surface refers to a substrate having connection terminals other than a printed board or the like on which pattern wiring is performed and various types of substrates in which the connection terminals are exposed on the substrate surface. Say.

The IC socket structure shown in FIG. 1 has a socket body 10, four metal terminal portions 16 to 19, and pressing means 20.

The socket body 10 has a recess 1 with an open top.
1 is formed. On the bottom surface of the recess 11, four through holes 12 to 15 which are further deeper are formed.

Since all four metal terminal portions 16 to 19 have the same configuration, the metal terminal portion 16 at the upper right of the drawing will be described as a representative. The metal terminal portion 16 has a plurality of metal terminals 16b and a base member 16c that holds the metal terminals 16b in a side-by-side manner. Base member 16
c is made of two plate-like bodies and is formed of an insulating material. Each metal terminal 16b is connected to an adjacent metal terminal 16b.
It is held by the base member 16c at a certain interval so as to maintain insulation from the base member 16c.

FIG. 2 is a detailed sectional view of the metal terminal portion 16. Each metal terminal 16b is connected to two of the base members 16c.
It is sandwiched and held by the plate-like bodies from above and below.
Each metal terminal 16b has an IC contact portion 16a in contact with the lead pin 21a of the IC 21, a body portion (16b) sandwiched by the base member 16c, and a board wiring contact portion 16d in contact with the wiring of the substrate 22 wired on the surface. And

As shown in FIG. 2, the IC contact portion 16a is formed by bending one end of a metal terminal 16b into a substantially L-shape.
It comes into contact with the lead pin 21a of C21.
On the other hand, the other end of the metal terminal 16b is substantially U-shaped.
6c is folded into the outer surface. Also, the base member 16c
Since the body of the metal terminal 16b is sandwiched between two plate-like members, the base member 16c has an upper surface where the metal terminal is not exposed.

The metal terminal 16 held by the base member 16c
The number b is a number corresponding to the number of lead pins of each side surface of the IC to be mounted, and the shape of each metal terminal 16b is formed so as to match the shape of the lead pin of the IC.

As shown in FIG. 1, the planar shape of the base member 16c of the metal terminal portion 16 is rectangular, and its length in the longitudinal direction is Da, and its length (width) in the short direction is Db. The through hole 12 of the socket body 10 is
Is formed in accordance with the shape of the metal terminal portion 16 so that large and small rectangles are arranged in parallel in the longitudinal direction. Here, the larger rectangle has a length Da ′ in the longitudinal direction and a length (width) Db ′ in the lateral direction.
a 'is approximately equal to the longitudinal length Da of the base member 16c, and Db' is approximately equal to the lateral length Db of the base member 16c. The smaller rectangle has a shape for storing the metal terminal exposed from the base member 16c.

Therefore, when the metal terminal portion 16 is housed in the through hole 12, the larger rectangle of the through hole 12
Each side of the base member 16c is firmly held. Here, the metal terminal portion 16 and the through hole 12 have been described, but the metal terminal portions 17 to 19 are also accommodated in the through holes 13 to 15, respectively. Further, since the positions of the metal terminal portions 16 to 19 when being stored in the socket body 10 are determined by the positions of the through holes 12 to 15, the positions of the through holes 12 to 15 are It is determined according to the type of the target IC.

The pressing member 20 has an outer diameter of the socket body 1.
The recesses 11 are substantially coincident with the recesses 11 of 0, and are fitted into the socket body 10. The base members 1 of the metal terminal portions 16 to 19 are respectively provided at the bottoms of the four sides of the pressing member 20.
A concave portion corresponding to the shape of 6c is provided. When the pressing member 20 is fitted into the socket body 10, the metal terminal portions 16 to 19 accommodated in the through holes 12 to 15 of the socket body 10 are fitted into the concave portions of the pressing member 20, so that the metal terminal portions 16 to 19 are fitted. 19 base members 16c
Is pressed by a pressing member.

In FIGS. 1 and 2, the means (or mechanism) for pressing down the IC is omitted.

Next, a method for conducting the IC and the substrate to test the IC on a substrate such as a burn-in board will be described.

First, the socket body 10 is placed at a predetermined position on the board. Next, the metal terminal portions 16 to 19 are respectively housed in the through holes 12 to 15 of the socket body 10, the pressing member 20 is fitted into the concave portion 11, and the socket body 10 is screwed or the like.
Attach to Therefore, the upper surfaces of the metal terminal portions 16 to 19 are fitted into the concave portions of the pressing member 20 and pressed by the bottom surface of the pressing member 20. Therefore, the board wiring contact portion 16d of the metal terminal 16b contacts the wiring of the board. Then Figure 2
As shown in (1), the IC 21 is arranged on the IC socket such that the lead pins 21a thereof are in contact with the IC contact portions of the metal terminals 16b of the metal terminal portions 16 to 19.

In this manner, the IC and the substrate are electrically connected via the IC socket structure, so that a signal exchange and a power supply path can be secured between the IC and the substrate.

Terminal holding means 1 for holding metal terminal 16b
6 to 19 are only housed in the through holes 12 to 15 of the socket body 10, so if one of the metal terminals 16b becomes defective due to, for example, fatigue, breakage or deformation, the pressing member 20 is moved to the socket body. , And only the specific metal terminal portion including the defective metal terminal 16b needs to be replaced, so that there is no waste that the entire IC socket becomes unusable. Therefore, it is sufficient to supply a metal terminal part which is much cheaper than an IC socket as a replacement part.
An extremely economical IC socket structure can be provided, and in particular, a remarkable effect of significantly reducing the cost of the burn-in test can be obtained.

Further, each metal terminal portion has a metal terminal 16b.
By changing the length, the number, the pitch, and the like, IC socket structures corresponding to various types of ICs can be provided, and a certain degree of versatility can be achieved.

In this specification, a burn-in test is taken as an example of the application of the detachable IC socket. However, this is only an example having the greatest economic effect, and does not exclude other applications. In addition, although the quad type is taken as an example of the IC type, the present invention can also be applied to a type (for example, a dual-in type) in which lead pins come out from two side surfaces by adjusting the number and positions of metal terminals.

[0038]

According to the present invention, the terminal holding means having a plurality of metal terminals is formed separately from the IC socket main body and is housed in the IC socket main body. When the terminal becomes defective, the terminal holding means including the defective terminal can be removed and replaced.

According to the present invention, since the terminal holding means holds the metal terminal group corresponding to the lead pin group for each side of the IC, when one or several metal terminals become defective, Only the terminal holding means for holding the metal terminal group including the defective terminal can be removed and replaced.

According to the present invention, since the board wiring contact portion is bent into the outer surface of the terminal holding means, the terminal holding means is simply placed on the wiring on the board and the board wiring contact portion of the metal terminal and the wiring on the board surface are provided. Can be contacted.

According to the present invention, since the accommodating portion of the IC socket body penetrates the substrate, the terminal holding means is directly mounted on the substrate, and the metal wiring contact portion of the substrate and the wiring on the substrate surface are connected. Can contact.

According to the present invention, since the terminal holding means having a plurality of metal terminals formed separately from the IC socket main body is housed in the IC socket main body, one or several metal terminals become defective. In this case, the terminal holding means including the defective terminal can be removed and replaced.

As described above, according to the present invention, even when a defective metal terminal occurs, only the metal terminal portion can be replaced,
As compared with the conventional technique in which the entire C socket is replaced, an advantageous effect that a great improvement in economy can be achieved can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic assembly diagram of one embodiment.

FIG. 2 is a preferred cross-sectional view of a metal terminal portion of one embodiment.

FIG. 3 is a schematic external view of a conventional example.

FIG. 4 is a detailed view of a main part of a conventional metal terminal group.

[Explanation of symbols]

 10: Socket body 12-15: Through hole (storage part) 16a: IC contact part 16b: Metal terminal 16c: Base member (terminal holding means) 16-19: Metal terminal part 20: Pressing member 21: IC 21a: Lead pin

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-121135 (JP, A) JP-A-2-27677 (JP, A) JP-A-6-252294 (JP, A) JP-A-49-49 115779 (JP, A) Japanese Utility Model Showa 64-2177 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 33/76

Claims (4)

(57) [Claims] 1. A used on the substrate on which the wiring is on the surface, I
In the IC socket structure in which a plurality have a metal pin contact each wiring lead pins group and the substrate provided for each C side of the conduction between the substrate and the IC, lead pin group provided for each side of the IC One of
The plurality of metal ends so as to form a corresponding metal terminal group.
The number of the lead pins that hold the
The number of the terminal holding means is, the IC socket body having an accommodating portion for accommodating the terminal holding means detachably attached to the IC socket body, the terminal so that the metal terminal is in contact with the wiring on the substrate IC, characterized in that it comprises a pressing member for pressing the retaining means
Socket structure. 2. The method according to claim 1 , wherein said metal terminal is held between said terminal holding means.
Contact between the body and the lead pin of the IC
Part, which is folded into the outer surface of the terminal holding means and
And a substrate wiring contact portion in contact with said wiring.
The described IC socket structure. 3. The IC socket body according to claim 2, wherein
The through-hole which penetrates through the substrate is a through-hole.
Item 3. An IC socket structure according to Item 2. 4. An IC is mounted on a substrate having a surface wired.
Mounting an IC socket body having a storage portion on the substrate surface.
And one of the lead pin groups provided on each side of the IC.
The plurality of metal ends so as to form a corresponding metal terminal group.
The number of the lead pins that hold the
And a pressing portion detachably attached to the IC socket body.
Pressing the terminal holding means with a material to bring the metal terminals into contact with the wiring on the substrate.
Mounting how the IC to be butterflies.