JP3314800B2 - Electronic component with terminal and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal structure of an electronic component with terminals, and more particularly, to an electronic component having a structure for maintaining a high bonding strength of a terminal to an electronic component and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, there have been many demands for electronic devices from the market for miniaturization and weight reduction, and in order to meet these needs, electronic components used in electronic devices have also been required to be miniaturized and thinned. It is urgent.

In such a situation, when mounting electronic components on a substrate, surface mounting technology has been widely used, and the electronic components have been reduced in size and thickness and have been adapted to surface mounting technology. Shape.
FIG. 5 shows a coil as an example of an electronic component corresponding to the surface mounting technology.

An electronic component is formed by fixing a coil portion in which a wire 2 is wound around a drum-type magnetic core 1 to a terminal block 8 provided with terminals 9. However, since it is surface-mounted using the terminal plate 8 as in the present shape, it is necessary to fix the terminal plate 8 and the coil portion by bonding or the like, and an extra cost such as a bonding process or a terminal block is required. . Further, the effect of the terminal block 8 has been detrimental to downsizing and thinning.

In order to solve the above-mentioned problems, a method has been proposed in which the terminal block is omitted as shown in FIG. 6 and the terminal is directly bonded to the drum core and pulled out to the outside.

FIG. 6 (a) is a perspective view from above and FIG. 6 (b) is a perspective view from below. The terminal 10 is bonded to the drum core 1 around which the wire 2 is wound with an adhesive 11.

[0007] Since terminals for electronic components are made of metal, rust is generated by the influence of moisture in the air, temperature, and the like, and solder wettability when mounted on a substrate is often deteriorated. Therefore, generally, the terminals of the electronic components are plated on the surface of the terminals in order to improve the solderability when the terminals are mounted on a substrate.

[0008] Plating is performed before or after punching a metal plate into a terminal shape, and is performed on both the front and back surfaces of the terminal to prevent deterioration of solder wettability due to rust.

In the case of an electronic component in which the terminal 12 is bonded to a base material of an electronic device, for example, a drum core 1 wound with a wire 2 as shown in FIG. 7, the terminal 12 is provided on both surfaces of the terminal. The adhesive 5 adheres to the drum core 1 serving as the base through the plating on the upper surface of the plating 13.

[0010]

In the terminal bonded as described above, the plated portion is fixed by an adhesive, and the bonding strength is extremely weak. Therefore, if a force is applied to the electronic device due to vibration or impact, the terminals may be detached from the electronic components and damaged, not only impairing the function of the electronic components, but in the worst case, it may lead to an accident due to ignition or smoking. Therefore, it is necessary to design a device having an excessive protection function or to strengthen inspection at the time of manufacturing, which has a serious problem in designing and manufacturing.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a small electronic component having high terminal adhesive strength and high terminal soldering performance, and a method of manufacturing the same.

[0012]

According to the first aspect of the present invention, there is provided an electronic component in which a terminal is adhered and fixed to a base material, wherein the terminal is a metal having only one side plated. The plating wraps around the side of the terminal due to the shearing force when punching the board from the plated side,
Provided is an electronic component with terminals, wherein a non-plated surface opposite to a plated surface of the terminal is adhesively fixed to a base material.

[0013]

Further, the invention according to claim 2 is a method of manufacturing an electronic component in which a terminal is bonded and fixed to a base material,
This terminal is made by punching a metal plate with plating only on one side from the plated side so that the plating wraps around the side of the terminal due to shearing force, and the opposite side from the plated side of the terminal A method for manufacturing an electronic component with terminals, characterized in that an unplated surface is bonded and fixed to a base material.

[0015]

In a small electronic component which is intended to be made thinner and smaller by bonding the terminal to the base material, either the terminal strength or the solderability is impaired depending on the presence or absence of plating applied to the terminal. However, these are basic performances that electronic components must have. Therefore, in order to satisfy both performances, only one side of the terminal is plated, and the unplated metal surface is bonded and fixed to the base material.

Since the metal surface is directly bonded and fixed to the base material, the bonding strength can be kept high. Further, since the terminals are plated on the mounting surface side of the terminals, the portions wetted by the solder are not affected by rust and the solderability can be kept good.

Normally, terminals are plated on a metal plate,
The side of the terminal is not plated because it is stamped and bonded and fixed from a metal plate in the form of a lead frame, so even if the terminal is plated, the side is not plated because the side is not plated This may deteriorate the solderability.

Although it is conceivable to perform plating after punching from a metal plate, it is difficult to cope with this in terms of cost and the like.

Therefore, when punching a terminal in the form of a lead frame from a metal plate plated on one side, the terminal is punched from the plated surface toward the surface of the metal substrate. The shearing force at the time of punching affects the plated portion applied to the metal, and the metal goes around the side surfaces of the terminal due to elongation or the like in the metal base and the plating. An electronic component to which a terminal manufactured by such a method is bonded has good solder wettability on the side surface of the terminal, so that the solderability of the terminal to the substrate is good, and a sufficient strength of the terminal is obtained.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a drum-type coil with terminals as an embodiment of an electronic component formed by bonding terminals according to the present invention.

[0022] As shown in FIG.
The terminal 3 having the plated portion 4 on only one side is adhered to the drum core 1 on which the winding is performed by the adhesive 5. Since the terminal 3 is a single-side plated product, the metal base is directly adhered to the drum core 1 as the base material, so that the terminal strength is kept high.

Further, since the terminal 3 is punched in the direction of the metal base from the surface on which the plating is applied, FIG.
As shown in FIG. 5, the plated portion 4a extends around the side surface of the terminal.

For this reason, as shown in FIG. 2, when the terminals 3 are mounted on the substrate 7, the solder 6 is fixed to the side surfaces of the terminals by the wet solder due to the influence of the plating wrapping around the side surfaces, so that a fillet is formed. As a result, a good soldering state is obtained.

[0025]

The terminal strength of the terminal-equipped electronic component according to the present invention and the conventional terminal-equipped electronic component having both surfaces plated are measured as shown in the table of FIG.

It can be seen that the strength of the electronic component to which the terminal according to the present invention is bonded is remarkably improved as compared with the conventional electronic component.

Further, the electronic component with terminal according to the present invention and the electronic component with terminal of another configuration are provided at a temperature of 60 ° C. and a humidity of 95% R.
H was left in the environment for 240 hours, and then the wettability of the solder was compared. As a result, the results shown in the graph of FIG. 4 were obtained.
In this graph, single-sided plating 1 is a terminal punched from the plating surface in the direction of the metal substrate, and single-sided plating 2 is a terminal punched from the metal substrate to the plating surface. It can be seen that the electronic component to which the terminal according to the present invention is adhered has almost the same solder wettability as the electronic component to which the terminal whose both surfaces are plated is adhered.

As described above, from the results shown in FIGS. 3 and 4, the electronic component to which the terminal according to the present invention is bonded has excellent characteristics in both terminal strength and solderability, It is possible to provide a small-sized electronic component having high bonding strength and high terminal soldering performance.

[Brief description of the drawings]

FIG. 1 is an embodiment of an electronic component to which a terminal is bonded according to the present invention.

FIG. 2 is a conceptual diagram of soldering when mounting a terminal according to the present invention.

FIG. 3 is an adhesive strength comparison chart

FIG. 4 is a comparison graph of solder wettability

FIG. 5 is an example of a conventional small electronic component.

FIG. 6 shows an example of terminal bonding of a small electronic component.

FIG. 7 is a configuration diagram of a conventional small electronic component in which terminals are bonded.

[Explanation of symbols]

 1. Drum core 2. Wire 3. Terminal 4. Plating part applied to terminal 5. Adhesive 6. Board mounting solder 7. Substrate 8. Terminal block 9. Terminal applied to terminal block 10. Bonded to base material Terminals 11. Adhesive for bonding base material 12. Conventional terminals plated on both sides 13. Plated parts on both sides

Continuation of the front page (56) References JP-A-6-290948 (JP, A) JP-A-5-315492 (JP, A) JP-A-58-188147 (JP, A) Jpn. , U)

Claims (2)

(57) [Claims] An electronic component having a terminal adhered and fixed to a base material, wherein the terminal is formed by a shear force when a metal plate having only one surface plated is punched out from a plated surface side. Is provided around the side surface of the terminal, and the non-plated surface of the terminal opposite to the plated surface is bonded and fixed to the base material. With electronic components. 2. A method of manufacturing an electronic component in which a terminal is adhered and fixed to a base material, wherein the terminal is formed such that the plating goes around a side surface of the terminal by shearing force on a metal plate plated only on one side. A terminal which is manufactured by punching out from a side on which plating is applied, and wherein an unplated surface of the terminal opposite to the surface on which plating is applied is adhesively fixed to the base material. Of manufacturing electronic components with