JP3312462B2 - Schenkel DC high voltage power supply - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Schenkel type DC high-voltage power supply in which a ripple voltage superimposed on a DC output voltage is reduced.

[0002]

2. Description of the Related Art FIG. 3 is a basic circuit diagram of a balanced type Schenkel DC high voltage power supply used as an acceleration voltage source for charged particles in an ion implantation apparatus, an electron beam irradiation apparatus and the like. The high-voltage power supply includes a high-frequency oscillation power supply unit 1 of several tens of kHz as a whole and a rectifier / multiplier unit 2 fed from the power supply unit. Plates oscillating tube 3 in the high-frequency oscillator power supply unit 1 is connected to the positive terminal of the DC power source 5 via the primary coil 4 ₁ of the booster coil 4, the cathode of the oscillating tube is grounded. One end of each of the secondary U-phase coil 4 ₂ and the V-phase coil 4 ₂ ′ of the booster coil 4 is a U-phase high-frequency electrode (RF) electrode 6 having a shape obtained by dividing a cylinder in the rectification multiplier 2 into a V-phase high-frequency (RF) ) The other end of each of these coils is grounded via ripple adjusting coils 7, 7 '.

FIG. 4 is a diagram showing the configuration of the booster coil 4. The booster coil is housed in a pressure vessel 8 filled with a high-pressure insulating gas. Communicating. Booster coil is constituted by symmetrically arranged primary and secondary coil portions on both sides of the central insulating plate 21, a coil part 4 ₁₁ of the primary coil provided on both surfaces of the two insulating plates 22, a plurality of each coil portion 4 ₂ u, 4 ₂ v of the secondary coil are provided on both surfaces of the insulating plate 23. Each insulating plate 21, 22 and 23 are fastened by a plurality of insulators made of bolt 24, the entire coil portion 4 ₁₁ of the primary coil is connected in series the primary coil 4 ₁ is configured, the secondary coil each coil portion 4 ₂ u connected in series secondary U-phase coil 4 _2, and the secondary V-phase coil 4 ₂ 'constitute the respective coil portions in series connection. Then, by attaching the central insulating plate 21 to the support member 25 fixed to the pressure vessel 8, the booster coil 4 is installed in the same vessel.

A large number of narrow shield electrodes 10, 10 'are provided inside each of the high-frequency electrodes 6, 6', and the stray capacitance between the high-frequency electrodes and the shield electrodes functions as a rectifying and multiplying capacitor. Between the ground point and the shield electrodes 10 and 10 'of the lowest pressure stage, the shield electrode 10 of each stage
A rectifier 12 having the polarity shown is connected between the shield electrodes 10 ′ and 10 ′ of the highest voltage stage and the shield electrodes 10 ′ and 10 of the higher voltage stage and between the shield electrodes 10, 10 of the highest voltage stage and the high voltage terminal electrode 11. (There is also a type in which the shield electrode of the lowest pressure stage is connected to the ground point without passing through the rectifier, and the shield electrode of the highest pressure stage is connected to the high-voltage terminal electrode without passing through the rectifier.)

A grid biased to the negative potential of the oscillation tube 3 of the high-frequency oscillation power supply unit 1
An excitation voltage is applied from the pickup coil 13 inductively coupled to the secondary coil, whereby the high-frequency oscillation power supply unit 1 oscillates, and the oscillation frequency is determined by the inductance of the secondary coil of the booster coil 4 and the secondary coil. And the resonance frequency of the resonance circuit formed by the stray capacitance in a parallel relationship. The stray capacitance between the high-frequency electrodes 6 and 6 ′ connected to the secondary U-phase coil 4 ₂ and the V-phase coil 4 ₂ ′ of the booster coil 4 and the shield electrodes 10 and 10 ′ of each stage is 2 A DC voltage is generated by sequentially rectifying and multiplying the next coil voltage, and a DC output voltage having a high positive polarity is obtained at the high voltage terminal electrode 11.

[0006]

The balanced type (full-wave rectification type) Schenkel DC high voltage power supply has an advantage that the high frequency induction component in the DC output voltage becomes zero in principle due to the symmetry of the circuit components. However, in practice, it is impossible to manufacture a high-frequency electrode, a shield electrode, and the like completely symmetrically due to limitations in working and installation. Accordingly, the high-frequency induction component does not become zero, and the ripple voltage superimposed on the DC output voltage increases. Accordingly, 'to the ground side of the ripple adjustment coil 7, 7 placed outside the pressure tank' secondary coil 4 _2, 4 ₂ of the boost coil 4 is connected to, by adjusting the inductance of the resonant circuit adjustment coil By adjusting the balance state of the voltage applied to the rectifier / multiplier 2,
Ripple due to high frequency induction is reduced. However, such inductance adjusting coils 7, 7 'are generally large in size and are used, for example, in mega volt (MV) class DC high-voltage power supplies, so that the inductance can be finely adjusted by continuously shorting the coil sides. In the case of including the container, the size is about 2 m square. Further, in order to connect to the adjustment coil, it is necessary to draw out the ground-side connection wires of the secondary coils 4 ₂ and 4 ₂ ′ to the outside of the pressure tank.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a Schenkel type DC high voltage power supply which does not use an inductance adjusting coil and reduces high frequency induction ripple superimposed on a DC output voltage.

[0008]

SUMMARY OF THE INVENTION The present invention is directed to a Schenkel type DC high voltage power supply in which two high-frequency electrodes are supplied from two secondary coils of a booster coil.
It is characterized in that the position of the primary coil of the booster coil arranged between the secondary coils is adjustable.

[0009]

When the position of the primary coil is adjusted, the degree of inductive coupling with each secondary coil changes, and the balance of the voltage applied to each high-frequency electrode can be adjusted. The position of the primary coil is adjusted so that the ripple superimposed on the DC output voltage is minimized.

[0010]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of a booster coil unit in a Schenkel-type DC high-voltage power supply device, and the same reference numerals as those in FIGS. Secondary U-phase coil 4 of boost coil 4
₂ is constituted by connecting in series each coil portion 4 ₂ u arranged on both sides of the mounting insulating plate 31 and the plurality of insulating plates 23, and the insulating plates are fastened by a plurality of insulating bolts 24. By doing so, they are integrally configured. Similarly, for the secondary V-phase coil 4 ₂ ′ of the booster coil, each coil portion 4 ₂ v is provided on both surfaces of the mounting insulating plate 32 and the plurality of insulating plates 23, and each insulating plate is made of a plurality of insulators. It is fastened with bolts 24.

[0011] Secondary U-phase coil 4 ₂ and the secondary V-phase coil 4 ₂ '
Of the primary coil 4 ₁ of the booster coil 4 which is disposed intermediate the
Arranged on both sides of the mounting insulator plate 30 which is provided with each coil portion 4 ₁₁ on both sides of the insulating plate 22, it is integrally formed by fastening the insulating plates 21 and 22 by a plurality of insulators made of bolts 24 ing.

[0012] The primary coil 4 ₁ of the mounting insulating plate 30, 2
The insulating plate 31 for mounting the next U-phase coil and the insulating plate 32 for mounting the secondary V-phase coil are formed in a triangular shape as a whole as shown in the arrangement top view of FIG. In order to attach the plate to the pressure vessel 8 at three places, respectively, three support members 33, 34,
35 is fixed to the pressure vessel at an angle of, for example, 40 °.

The generally triangular secondary U-phase coil mounting insulating plate 31 and the secondary V-phase coil mounting insulating plate 32 are fixed at their respective top ends to the support members 34 and 35 using bolts. that is, the primary coil 4 ₁ of mounting the insulating plate 30, so that the position of the primary coil is adjustable,
It is attached to the support member 33.

As shown in FIG. 1, a female screw bearing 37 to which a thread portion of an operation shaft 36 is screwed is fixed to each top end of a generally triangular mounting insulating plate 30 for supporting a primary coil. The operation shaft 36 is supported by bearings 38 attached to the support members 33. The operation shaft 36 is connected to an external operation shaft 40 that penetrates the pressure vessel airtightly through a bevel gear 38. By rotating the external operation shaft 40, the operation shaft 36 supported by the bearing 37 rotates,
The mounting insulating plate 30 to which the female screw bearing 37 screwed to the screw portion of the operation shaft is fixed moves upward or downward in accordance with the rotation direction of the external operation shaft. By rotating operation little by little external operation shaft 40 of three of substantially the apex portion of the triangular mounting insulating plate 30 in turn, the primary coil 4 ₁ and the secondary U-phase coil 4 ₂ and the secondary V Phase coil 4 ₂ '
Can be finely adjusted.

Secondary U-phase and V-phase coils 4 of boost coil 4
One end of ₂ and 4 ₂ ′ is the two high-frequency electrodes (reference numerals 6 and 6 ′ in FIG. 3) in the rectification multiplier of the Schenkel DC high-voltage power supply.
, And the other ends of these coils are connected to a ground point. By oscillating the high-frequency oscillation power supply unit and supplying power to the rectifying multiplier unit, a high DC output voltage is generated at the high-voltage terminal electrode (reference numeral 11 in FIG. 3). External operation shaft 40 of three rotating operations, secondary U-phase coil 4 ₂ and the secondary V
Move the intermediate to the primary coil 4 ₁ position of the booster coil 4 disposed in the phase coils 4 ₂ ', the primary coil and the secondary U-phase coil, the inductive coupling of the secondary V-phase coil relatively By adjusting, the balance state of the applied voltages to the two high-frequency electrodes is relatively adjusted, and the position of the primary coil is adjusted so that the high-frequency induced ripple superimposed on the DC output voltage is minimized. By sequentially operating the three external operation shafts 40 little by little, the minimum ripple state can be easily obtained.

[0016] In the above embodiment, turning the external operating shaft 40, showed rotates the operating shaft 36 via the bevel gear 38, the upper lid ₈₁ of the pressure vessel 8, the vertical direction in FIG. 1 An external operation shaft that penetrates airtightly is provided, and this shaft is
The operation shaft 36 may be rotated by connecting the threaded portion 6 with a joint using a joint. Alternatively, a reversible rotary motor such as a pulse motor may be attached to the support member 33, and the operation shaft 36 may be rotated by driving and controlling the motor from outside.

The primary coil 4 _first moving stroke end position, provided with a limit switch for detecting the intermediate position,
It may be used as a reference for the coil position operation.

[0018]

According to the present invention, as described above, it is possible to reduce the high frequency induced ripple superimposed on the DC output voltage by adjusting the position of the primary coil of the boosting coil. It is not necessary to provide a large inductance adjusting coil, and it is not necessary to draw out the connection line of the secondary coil out of the pressure tank.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a booster coil unit, which is a main part of an embodiment of the present invention.

FIG. 2 is a layout top view of a step-up coil unit.

FIG. 3 is a basic circuit diagram of a balanced Schenkel DC high-voltage power supply.

FIG. 4 is a configuration diagram of a conventional booster coil unit.

[Explanation of symbols]

4 Boost coil 4 ₁ Primary coil 4 ₂ Secondary U-phase coil 4 ₂ 'Secondary V-phase coil 30 Primary coil mounting insulating plate 33 Support member 36 Operating shaft 37 Screw bearing 38 Bearing 39 Bevel gear 40 External operating shaft

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H02M 7/10 H02M 7/04

Claims (1)

(57) [Claims] 1. In a Schenkel-type DC high-voltage power supply device in which two high-frequency electrodes are fed from two secondary coils of a booster coil, a primary coil of a booster coil disposed between the two secondary coils is provided. A Schenkel-type DC high-voltage power supply device whose position is adjustable.