JP3300335B2 - display - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a semiconductor device having a semiconductor layer made of silicon.

[0002]

2. Description of the Related Art It has been studied to fabricate a semiconductor device having a semiconductor layer made of silicon, for example, a thin film transistor on a substrate having an insulating surface.

However, when a semiconductor device is formed on a substrate having low heat resistance, such as a glass substrate, it is difficult to increase the crystallinity of a silicon film constituting the semiconductor device, so that the performance of the manufactured semiconductor device is improved. It was difficult.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to manufacture a semiconductor device which can be manufactured at a low temperature and has high performance.

[0005]

Means for Solving the Problems To solve the above problems, one of the inventions disclosed in this specification is a process for forming a silicon oxide film on a glass substrate and using disilane or trisilane as a reaction gas. Forming an intrinsic non-single-crystal semiconductor layer on the silicon oxide film by a reduced pressure CVD method, heating the semiconductor layer at a temperature not exceeding 700 ° C., and crystallizing the semiconductor layer. Forming a gate insulating film.

In this structure, the low pressure CVD method is performed at a temperature lower by 100 to 200 ° C. than a crystallization temperature of silicon.

In this structure, the non-single-crystal semiconductor is an amorphous semiconductor.

In this structure, the crystallization step of the semiconductor layer is performed at a temperature in the range of 450 to 700 ° C.

Further, in this structure, the concentration of oxygen atoms in the semiconductor layer is not more than 7 × 10 ¹⁹ atoms / cm ³ .

Another aspect of the invention disclosed in this specification is a step of forming a silicon oxide film on a glass substrate and a low pressure CVD method using disilane or trisilane as a reaction gas. A step of forming an intrinsic non-single-crystal semiconductor layer and a step of heating the semiconductor layer to crystallize the semiconductor layer. A method for manufacturing a semiconductor device, which is added to a semiconductor layer.

In this structure, the semiconductor layer is 1 × 1
It is characterized by containing boron at a concentration in the range of 0 ¹⁵ to 1 × 10 ¹⁷ atoms / cm ³ .

Further, in this structure, the concentration of oxygen atoms in the semiconductor layer is not more than 7 × 10 ¹⁹ atoms / cm ³ .

One of the other inventions disclosed in this specification is a reduced pressure C using disilane or trisilane as a reaction gas.
A step of forming a semiconductor layer containing silicon on an insulating surface by a VD method, and a step of crystallizing the semiconductor layer by heating, wherein a Raman shift of the semiconductor layer after the crystallization is a single crystal silicon A method for manufacturing a semiconductor device, characterized in that the frequency is shifted to a lower frequency side than that indicated by (1).

One of the other inventions disclosed in this specification is a reduced pressure C using disilane or trisilane as a reaction gas.
A step of forming a semiconductor layer containing silicon on an insulating surface by a VD method, and a step of crystallizing the semiconductor layer by heating, wherein the semiconductor layer after the crystallization is measured by Raman half width at half maximum. A method for manufacturing a semiconductor device, characterized by having a crystal grain size in the range of up to 500 °.

In the above structure, the insulating surface is a silicon oxide film formed on a glass substrate.

One of the other inventions disclosed in this specification is a reduced pressure C using disilane or trisilane as a reaction gas.
Forming an intrinsic non-single-crystal semiconductor layer containing silicon on an insulating surface by a VD method;
A step of heating at a temperature not exceeding ℃ to crystallize, a step of patterning the crystallized semiconductor layer into island-like semiconductors after the crystallization step, and a step of forming a gate insulating film on the crystallized semiconductor layer. Forming a semiconductor device.

According to another invention disclosed in this specification, in manufacturing a semiconductor device including at least a P-channel transistor and an N-channel transistor, silicon is formed by a low-pressure CVD method using disilane or trisilane as a reaction gas. Forming a non-single-crystal semiconductor layer on an insulating surface, and heating the semiconductor layer at a temperature not exceeding 700 ° C. to crystallize the P-channel transistor and the N-channel transistor. A method for manufacturing a semiconductor device, characterized in that boron is added to the semiconductor device so as to control the threshold voltages to be substantially the same.

With the above structure, a semiconductor device which can be manufactured at a low temperature and has high performance can be manufactured. Examples will be described below.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION

[0020]

[Embodiment 1] A flat display is attracting attention instead of a CRT as a display of OA equipment and the like, and expectation for a large area is particularly strong. As other applications of flat displays, development of wall-mounted TVs is also proceeding at a rapid pace. Also, demands for flat display colorization and high definition have been considerably increased.

A liquid crystal display device is known as a typical example of the flat display. In this method, an electric field is applied to a liquid crystal composition held between a pair of glass substrates with an electrode interposed therebetween to change the state of the liquid crystal composition, and display is performed by utilizing the difference between the states. In order to drive the liquid crystal, there are a type provided with a thin film transistor (hereinafter referred to as a TFT) and other switching elements, and a type having a simple matrix configuration. In any case, a driver circuit for sending a signal for driving the liquid crystal to each wiring in the vertical and horizontal (X, Y) directions is provided around the display.

The driver circuit is usually constituted by a single crystal silicon MOS integrated circuit (IC). This I
C is provided with pad electrodes corresponding to the respective display electrodes, and a printed board is interposed between the two. First, the pad electrodes of the IC are connected to the printed board, and then the printed board is connected to the display. Was. This printed circuit board is an insulating substrate made of glass epoxy or paper epoxy or a substrate made of flexible plastic, and the occupied area must be equal to or larger than the display. Similarly, the volume had to be considerably increased.

Such a conventional display has the following disadvantages due to the above-described configuration.

That is, the X direction of the matrix wiring, the Y direction
Since the same number of connections as the number of display electrodes or source (drain) wirings or gate wirings in the direction are made with the printed circuit board, there is a limit on the spacing between the connectable connection parts due to mounting technology. A high definition display could not be produced.

A printed board, an IC, and connection wiring are required in addition to the display main body, and the required area and volume are several times larger than the display main body.

There are many connection points between the display body and the printed circuit board and between the printed circuit board and the IC, and the connection parts are considerably heavy, so that an excessive force is applied to the connection parts and the reliability of the connection is low.

On the other hand, as a method of solving such a drawback, it has been proposed that, in a display, particularly a display device using an active element as a switching element, the active element and the peripheral circuit are formed by TFTs on the same substrate. I have. However, according to this configuration, the aforementioned 3
Although the two disadvantages can be almost completely solved, another new problem has arisen.

Peripheral circuits other than active elements can be TF
Because of T, the number of elements formed on the same substrate increases,
The manufacturing yield of the TFT has decreased. Accordingly, the production yield of the display has also been reduced.

The peripheral circuit portion has a very complicated device structure as compared with the device structure of the active device portion. Therefore, the circuit pattern becomes complicated, the manufacturing process technology becomes more sophisticated, and the cost increases. In addition, naturally, the number of multi-layer wirings is increased, and the number of process steps is increased and the manufacturing yield of the TFT is lowered.

Since a transistor constituting a peripheral circuit requires a high response speed, a polycrystalline semiconductor is usually used. Therefore, in order to polycrystallize the semiconductor layer,
High temperature processing was required, and an expensive quartz substrate or the like had to be used.

The present embodiment is for solving the above-mentioned six problems in a moderately balanced manner, and relates to a liquid crystal display device having a low cost and a high production yield.

That is, a first substrate on which a pixel matrix having a plurality of gate lines, a plurality of source (drain) lines, and a thin film transistor having a complementary structure is formed, and a second substrate disposed opposite to the first substrate. A liquid crystal display device comprising a substrate and a liquid crystal composition held between the pair of substrates, wherein a peripheral circuit connected to an X or Y matrix wiring formed on the first substrate is provided. At least a part of the peripheral circuit is a thin film transistor formed by the same process as a complementary structure similar to the active element connected to the pixel, and the remaining peripheral circuit is constituted by a semiconductor chip.

Further, the connection between the IC and the substrate as the remaining peripheral circuits which are not formed into TFTs is performed by providing an IC chip directly on the substrate and connecting each connection terminal to a COG (Chip On Glass).
It can be realized by a method or a TAB (Tape Automated Bonding) method in which each IC chip is provided on a flexible organic resin substrate and the resin substrate and the display substrate are connected.

That is, in the present embodiment, not all the peripheral circuits of the liquid crystal display device are made into TFTs, but only a simple part of the element structure, only a functional part having a small number of elements, or a circuit in which a general-purpose IC is difficult to obtain. Only part, and even IC
Only the high cost parts are made into TFTs, so that the production yield of the liquid crystal display device can be improved and the production cost can be reduced.

Further, by forming a part of the peripheral circuit as a TFT, an external IC which has conventionally required a considerable number is required.
And the manufacturing cost.

Further, since the active element and the peripheral circuit are formed by a complementary type (CTFT) thin film transistor formed by the same process, the driving capability of the pixel is improved.
The redundancy can be given to the peripheral circuit, and the liquid crystal display device with a sufficient margin can be driven.

Further, if all the peripheral circuits are formed into TFTs, the size of the display substrate must be increased in both the X and Y directions, and the occupied area of the entire display device increases. Only a small size of the substrate is required, and the display device can be easily adjusted to the external dimensions of the computer or the device using the display device, and the display device occupies a small area and volume.

Parts where the element structure in the peripheral circuit is complicated,
For example, a high-level fabrication technology is required to turn the element structure that requires multilayer wiring or the part with the function of an amplifier into a TFT, but the part that is technically difficult by turning part of the TFT into a TFT. By using a conventional IC, a portion having a simple element structure or a simple function can be formed into a TFT, and a display device can be realized at low cost and high yield.

Further, by forming only a part of the TFT, the number of thin film transistors in the peripheral circuit portion can be considerably reduced. If the functions of the peripheral circuits in the X and Y directions are the same, the number is almost half. Become. As described above, by reducing the number of elements to be TFTs, the production yield of the substrate can be improved, and a display device in which the area and volume of the substrate can be reduced can be realized at low cost.

Furthermore, by using a semi-amorphous semiconductor of a new concept instead of the conventionally used polycrystalline or amorphous semiconductor for the semiconductor layer used for the TFT, the semiconductor layer can be manufactured at a low temperature, and the carrier of the carrier can be reduced. A TFT with very high mobility and high response speed can be realized.

This semi-amorphous semiconductor is an LPC
It is obtained by performing a thermal crystallization treatment after forming a film by a VD method, a sputtering method, a PCVD method, or the like. The following description will be made by using a sputtering method as an example.

That is, when a single-crystal silicon semiconductor is used as a target in the sputtering method and sputtering is performed with a mixed gas of hydrogen and argon, atomic silicon is separated from the target by sputtering (impact) of heavy atoms of argon, and the silicon is formed. While flying on a substrate having a surface, a cluster of tens to hundreds of thousands of atoms solidified at the same time leaves the target as a cluster and flies to the surface to be formed.

During the flight, hydrogen bonds to the dangling bonds of silicon in the outer periphery of the cluster and forms a region having a relatively high order on the surface to be formed in a bonded state. In other words, on the film formation surface, there is high order
A state of a mixture of clusters having -H bonds and pure amorphous silicon is realized. This is heat-treated in a non-oxidizing gas at 450 ° C.
The Si-H bond reacts with another Si-H bond to form a Si-Si bond.

This bond pulls each other,
Highly ordered clusters tend to transfer phase to a higher ordered state, ie crystallization. However, between adjacent clusters, Si-Si bonded to each other pulls between the clusters. As a result, the crystal has lattice distortion, and the crystal peak in laser Raman is measured shifted from the single crystal of 520 cm ⁻¹ to a lower wave number side.

Since the Si-Si bonds between the clusters anchor (connect) each other, the energy bands of the respective clusters can be electrically connected to each other via the anchoring points. Therefore, it is fundamentally different from polycrystalline silicon in which a crystal grain boundary acts as a carrier barrier, and a carrier mobility of 10 to ²⁰⁰ cm ² / V Sec can be obtained.

In other words, a semi-amorphous semiconductor based on the above definition can be expected to have a state in which although it has apparent crystallinity, there is substantially no crystal grain boundary electrically. Of course, the annealing temperature is 450 ° C.
When crystallization accompanied by crystal growth of 1000 ° C. or more is performed instead of the intermediate temperature annealing at 700 ° C., oxygen and the like in the film are bent out to the grain boundaries due to the crystal growth, and a barrier is formed. This is a material (polycrystal) having the same crystal and grain boundaries as a single crystal.

Further, when the degree of anchoring between clusters in this semiconductor is further increased, the carrier mobility is further increased. For this purpose, when the amount of oxygen in the film is reduced to 7 × 10 ¹⁹ cm ^−3, preferably 1 × 10 ¹⁹ cm ⁻³ or less,
Further, in addition to crystallization at a temperature lower than 600 ° C., high carrier mobility can be obtained.

In this embodiment, description will be made using a liquid crystal display device having an m × n circuit configuration as shown in FIG. That is, only the analog switch array circuit portion 1 among the peripheral circuit portions connected to the wiring in the X direction in FIG. 1 is formed into a TFT 5 in the same manner as the active element provided in the pixel 6, and the peripheral circuit connected to the Y direction wiring. As for the part, only the analog switch array circuit part 2 is converted to a TFT, and the other peripheral circuit parts are IC4.
And is connected to the substrate by the COG method. Where TF
The T-shaped peripheral circuit portion is formed as a CTFT (complementary configuration) similarly to the active element provided in the pixel.

FIG. 2 shows an actual arrangement of electrodes and the like corresponding to this circuit configuration. FIG. 2 shows only a portion corresponding to 2 × 2 for the sake of simplicity.

First, a method for manufacturing a TFT on a liquid crystal display device used in this embodiment will be described with reference to FIGS. FIG.
In (A), a silicon oxide film as a blocking layer 51 is formed on a glass 50 that can withstand a heat treatment at an inexpensive temperature of 700 ° C. or less, for example, about 600 ° C., such as quartz glass, using a magnetron RF (high frequency) sputtering method.
It is made to a thickness of 0 °. The process conditions were a 100% oxygen atmosphere, a film formation temperature of 15 ° C., an output of 400 to 800 W, and a pressure of 0.5 Pa. The film formation rate using quartz or single crystal silicon as a target was 30 to 100 ° / min.

A silicon film was formed thereon by an LPCVD (low pressure gas phase) method, a sputtering method or a plasma CVD method. When formed by the reduced pressure gas phase method, the temperature is 1
450-550 ° C lower by 00-200 ° C, for example 530 ° C
CVD of disilane (Si ₂ H ₆ ) or trisilane (Si ₃ H ₈ )
The film was supplied to the apparatus to form a film. Reactor pressure is 30 ~ 300
Pa. The deposition rate was 50-250 ° / min.
Threshold voltage (Vt) between NTFT and PTFT
In order to control substantially the same as in h), boron may be added at a concentration of 1 × 10 ¹⁵ to 1 × 10 ¹⁸ cm ⁻³ during film formation using diborane.

When the sputtering method is used, the back pressure before the sputtering is set to 1 × 10 ⁻⁵ Pa or less, and single crystal silicon is used as a target in an atmosphere in which hydrogen is mixed with 20 to 80% of argon. For example, argon was 20% and hydrogen was 80%.
The film formation temperature was 150 ° C., the frequency was 13.56 MHz, the sputter output was 400 to 800 W, and the pressure was 0.5 Pa.

When a silicon film is formed by the plasma CVD method, the temperature is, for example, 300 ° C., and monosilane (SiH ₄ ) or disilane (Si ₂ H ₆ ) is used. These were introduced into a PCVD apparatus, and a high-frequency power of 13.56 MHz was applied to form a film.

The coatings formed by these methods are:
Oxygen is 5 × 10^{twenty one}cm^-3The following is preferred. This acid
If the element concentration is high, it is difficult to crystallize and the thermal annealing temperature
High or long thermal annealing times must be used.
If the amount is too small, the lamp is turned off by the backlight.
Current increases. Therefore 4 × 10¹⁹~ 4 × 10 ^{twenty one}
cm^-3Range. Hydrogen is 4 × 10²⁰cm^-3And silicon 4
× 10^{twenty two}cm^-3Was 1 atomic%. Also,
To promote crystallization for source and drain
The oxygen concentration is 7 × 10¹⁹cm^-3Below, preferably 1 × 10¹⁹
cm^-3The following is the channel formation of the TFT that constitutes the pixel
5 x 10²⁰~ 5 × 10
^{twenty one}cm^-3You may add so that it may become. At that time, peripheral circuits
Since the constituent TFTs are not irradiated with light,
Less carrier contamination and higher carrier mobility
Is effective for high frequency operation.
You.

Next, the silicon film in an amorphous state is
After fabrication to a thickness of ~ 5000mm, for example 1500mm, 4
Medium-temperature heat treatment in a non-oxide atmosphere at a temperature of 50 to 700 ° C. for 12 to 70 hours, for example, 600 hours in a hydrogen atmosphere.
It was kept at a temperature of ° C. Since a silicon oxide film having an amorphous structure is formed on the surface of the substrate under the silicon film, no specific nucleus is present in this heat treatment, and the whole is annealed uniformly. That is, it has an amorphous structure at the time of film formation, and hydrogen is simply mixed therein.

By the annealing, the silicon film shifts from an amorphous structure to a highly ordered state, and a part of the silicon film exhibits a crystalline state. In particular, a region having a relatively high order in a state after the formation of silicon is particularly likely to be crystallized to be in a crystalline state. However, since the silicon existing between these regions is bonded to each other, silicon mutually pulls each other. When measured by laser Raman spectroscopy, a single crystal silicon peak 522 is obtained.
A peak shifted to a lower frequency side than cm ⁻¹ is observed. Its apparent particle size is 50 to 5 when calculated from the half width.
Although it is a microcrystal with a size of 00Å, there are actually a large number of regions with high crystallinity and a cluster structure, and a semi-amorphous structure film in which each cluster is bonded to each other by silicon (anchoring). Could be formed.

As a result, the coating is substantially grain bowed.
The state that can be said that there is no dali (hereinafter referred to as GB)
Present. Carrier anchored between each cluster
So-called GB
Higher carrier mobility than clearly existing polycrystalline silicon
Become. That is, hole mobility (μh) = 10 to 200 cm ^Two 
/ VSec, electron mobility (μe) = 15-300 cm^Two 
/ VSec.

On the other hand, when the film is polycrystallized by high-temperature annealing at 900 to 1200 ° C. instead of annealing at the above-described medium temperature, impurities in the film are segregated due to solid phase growth from nuclei. , GB contain many impurities such as oxygen, carbon, and nitrogen, and have a high mobility in the crystal. However, a barrier is formed in the GB to hinder the movement of carriers there. As a result, a mobility of 10 cm ² / Vsec or more cannot be easily obtained. That is, in this embodiment, a silicon semiconductor having a semi-amorphous or semi-crystalline structure is used for such a reason.

In FIG. 3A, a silicon film is subjected to photoetching using a first photomask, and a PTFT region 22 (channel width 20 μm) is placed on the right side of the drawing in the NTFT.
Region 13 was formed on the left side.

On this, a silicon oxide film was formed as a gate insulating film to a thickness of 500 to 2000 {for example, 1000}. This was made under the same conditions as those for forming the silicon oxide film as the blocking layer. During the film formation, a small amount of fluorine may be added to fix the sodium ions.

Thereafter, 1 to 5 × 10 ²¹ cm of phosphorus is placed on the upper side.
^-3 silicon film or molybdenum (Mo), tungsten (W), MoSi ₂ or
A multilayer film with WSi ₂ was formed. This was patterned using a second photomask to obtain FIG. 3 (B). A gate electrode 55 for PTFT and a gate electrode 56 for NTFT were formed. For example, the channel length is 10 μm, the gate electrode is made of 0.2 μm of silicon as a gate electrode, and 0.3 μm of molybdenum is placed thereon.
It was formed to a thickness of μm. In FIG. 3C, a photoresist 57 is formed using a photomask, and a PTF is formed.
Boron is added to the source 59 for T
It was added by ion implantation at a dose of × 10 15 cm -2. Next, as shown in FIG. 3D, a photoresist 61 was formed using a photomask. Source 6 for NTFT
4. As the drain 62, phosphorus was added at a dose of 1 to 5 × 10 ¹⁵ cm ⁻² by ion implantation.

These steps were performed through the gate insulating film 54. However, in FIG. 3B, the gate electrodes 55, 56
May be used as a mask to remove silicon oxide on the silicon film, and then boron and phosphorus may be directly ion-implanted into the silicon film.

Next, annealing was performed again at 600 ° C. for 10 to 50 hours. The source 59 of the PTFT and the source 64 and the drain 62 of the drain 58NTFT were formed as P + and N + by activating impurities. Gate electrode 5
Channel formation regions 60 and 63 are formed below 5 and 56 as semi-amorphous semiconductors.

In this way, a C / TFT can be manufactured without applying a temperature to 700 ° C. or more in all steps, even though it is a self-aligned system. Therefore, it is not necessary to use an expensive substrate such as quartz as a substrate material, and this is a process very suitable for the large pixel liquid crystal display device of this embodiment.

In this embodiment, the thermal annealing is performed as shown in FIG.
(D) was performed twice. However, the annealing in FIG. 3A may be omitted depending on the desired characteristics, and both may be replaced by the annealing in FIG. 3D to shorten the manufacturing time. In FIG. 4A, a silicon oxide film is formed on the interlayer insulator 65 by the above-described sputtering method. This silicon oxide film may be formed by an LPCVD method, a photo CVD method, or a normal pressure CVD method. For example, it was formed to a thickness of 0.2 to 0.6 μm, and then a window 66 for an electrode was formed using a photomask. Further, aluminum is formed on the whole by sputtering, and leads 71 and 72 and contacts 67 and
After fabricating No. 68 using a photomask, the surface was coated with an organic resin 69 for planarization, for example, a translucent polyimide resin, and the electrode hole was formed again using the photomask.

As shown in FIG. 4B, the two TFTs have a complementary structure, and their output terminals are connected to an electrode of one pixel of the liquid crystal device as a transparent electrode. A tin oxide film). It is etched using a photomask and the electrodes 7
0 was configured. This ITO film was formed at room temperature to 150 ° C., and was achieved by oxygen at 200 to 400 ° C. or annealing in air. Thus, PTFT 22 and NTF
The same glass substrate 50 as T13 and the electrode 70 of the transparent conductive film
Made above. The electrical characteristics of the obtained TFT are PTF
At T, the mobility is 20 (cm ² / Vs) and Vth is -5.9 (V).
In the NTFT, the mobility is 40 (cm ² / Vs) and Vth is 5.0.
(V).

FIG. 2 shows an arrangement of electrodes and the like in a pixel portion of the liquid crystal display device. NTFT 13 is connected to the first scanning line 1
5 at the intersection of the data line 21 and the first scanning line 15
NTFTs for other pixels are similarly provided at the intersections between the data lines 14 and the data lines 14. On the other hand, PTFT is the second scanning line 1
8 and the data line 21. Also,
An NTFT for another pixel is provided at the intersection of the adjacent first scanning line 16 and data line 21. A matrix configuration using such a C / TFT is provided. The NTFT 13 is connected to the first scanning line 15 via a contact at the input end of the drain 64, and the gate 56 is connected to the data line 21 on which a multilayer wiring is formed.
The output terminal of the source 62 is connected to the pixel electrode 1 through a contact.
7 is connected.

On the other hand, the PTFT 22 has an input terminal of the drain 58 connected to the second scanning line 18 via a contact,
The gate 55 is connected to the data line 21 and the output terminal of the source 59 is connected to the pixel electrode 17 via a contact in the same manner as the NTFT. Thus, the pixel 23 made of the transparent conductive film and the C / TF are interposed (inside) between the pair of scanning lines 15 and 18.
T constituted one pixel. By repeating such a structure left, right, up and down, a 2 × 2 matrix is enlarged to 640 × 480, 1280 × 960.
Large-pixel liquid crystal display device.

As described above, a CMOS configuration is provided in which the NTFT 13 and the PTFT 22 manufactured by the same process as the switching element are provided.

As described above, one of the substrates is completed.
The other substrate is bonded by a conventional method, and STN liquid crystal is injected between the substrates. Next, as the remaining peripheral circuits, I
Use C4. This IC 4 is connected to each of the X-direction wiring and the Y-direction wiring of the substrate by COG.
This IC 4 is only connected to connection leads for supplying power and data from the outside, and there is no FPC for connection on one side of the board. The number is considerably reduced and reliability is improved. As described above, the liquid crystal display device of this example was completed.

In this embodiment, only the analog switch array part 1 of the peripheral circuits on the X direction side is connected to the analog switch array part 2 of the peripheral circuits on the Y direction side only.
FT and C / TF in the same process as the switching element
Although the peripheral circuit portion is configured by IC4, the configuration is not particularly limited to this configuration. Considering the yield at the time of forming the TFT, the problem of the process technology at the time of forming the TFT, and the like, Only the portion that is easy to make into a TFT may be made into a TFT.

In this embodiment, since a semi-amorphous semiconductor is used as the semiconductor film, the mobility is at least ten times higher than that of a TFT using a non-single-crystal semiconductor. Therefore, it can be used satisfactorily even for TFTs in peripheral circuits that require a high response speed, and is manufactured by the same process as an active element without the need to specially crystallize TFTs in a peripheral circuit portion as in the related art. I was able to.

Further, since the active element connected to the liquid crystal pixel has a C / TFT structure, the operation margin is expanded, the pixel potential does not fluctuate, and a constant display level can be ensured. However, there is an advantage that even if the defect is not good, a noticeable defect is not displayed.

With the structure shown in this embodiment, it is no longer impossible to increase the definition of the liquid crystal display due to the limitation of the external connection technology. Further, unnecessary connection between the wiring in the X direction or the wiring in the Y direction and the external peripheral circuit could be minimized, so that the reliability at the connection portion was improved.

Since only some of the peripheral circuits are formed into TFTs,
The exclusive area of the display board itself can be reduced,
In addition, the substrate can be freely designed to the required dimensions and shape. In addition, it is possible to avoid a problem in manufacturing a TFT and to make only a portion having a high manufacturing yield into a TFT. Therefore, the manufacturing cost could be reduced.

Since a semi-amorphous semiconductor is used as the semiconductor film used for the TFT, a response speed which can be sufficiently used for peripheral circuits can be obtained. A TFT for a circuit could be formed at the same time.

This embodiment clarifies the threshold value by connecting complementary TFTs to each of the pixels in the matrix, increases the switching speed, and expands the operation margin. Some compensation can be provided. The number of photomasks required for fabrication is N
It is only twice as large as in the conventional example using only TFTs.
Since the mobility of the carrier is ten times or more as large as that in the case of using amorphous silicon, the size of the TFT can be reduced, and even if two TFTs are provided in one pixel, the aperture ratio hardly decreases. It has many features.

Therefore, as compared with the conventional active TFT liquid crystal device using only NTFT, it is possible to achieve a several steps of manufacturing yield and a vividness of the screen.

[Reference Example] FIG. 5 shows a schematic external view of the liquid crystal display device of this embodiment. The basic circuit and the like are exactly the same as in the first embodiment. In FIG. 5, a part of the peripheral circuit connected to the wiring in the Y direction, which is configured by IC4, is a COG.
An IC is formed directly on a substrate by the method. This I
C4 is provided separately on the upper and lower portions of the substrate.

In this case, in the connection between the pad electrode of the IC 4 and the Y-directional wiring, the interval can be narrowed as compared with the case where the IC is formed on only one side. Therefore, it has a feature that a higher definition display pixel can be designed. Further, since the IC is provided on the substrate, the volume is hardly increased, and a thinner liquid crystal display device can be provided.

In each of the above embodiments, the TFTs of the active elements have a CMOS configuration. However, the present invention is not limited to this configuration, and may be composed of only NTFTs and PTFTs. The configuration increases the number of elements.

The position where the TFT is formed on the substrate is indicated by X
A TFT is formed not only on one side connected to the wiring in the direction or the Y direction, but also on the other side, and the TFTs are alternately formed.
By connecting T, the density of the TFT is reduced by half, thereby improving the manufacturing yield of the TFT.

[0083]

According to the present invention, a semiconductor device which can be manufactured at a low temperature and has high performance can be manufactured.

[Brief description of the drawings]

FIG. 1 is a diagram showing a liquid crystal display device having an m × n circuit configuration.

FIG. 2 is a diagram illustrating an arrangement of pixel portions of a liquid crystal display device.

FIG. 3 is a diagram schematically illustrating a manufacturing process of a TFT.

FIG. 4 is a diagram schematically illustrating a manufacturing process of a TFT.

FIG. 5 is a diagram showing another embodiment.

[Explanation of symbols]

 1, 2, ... Peripheral circuit 4 ... IC 5 ... Peripheral circuit made into TFT 6 ... Pixel 13 NTFT 22 PTFT

Claims (12)

(57) [Claims] A display including a pixel portion and a driver circuit portion electrically connected to the pixel portion, wherein the pixel portion has a pixel including a first thin film transistor; An analog switch array including a second thin film transistor and an integrated circuit using a single crystal semiconductor including a circuit other than the analog switch array, wherein the first thin film transistor and the second thin film transistor
The display , wherein each of the transistors has a gate insulating film containing fluorine, and the integrated circuit is mounted on a printed circuit board. 2. A display, comprising: a pixel portion; and a driver circuit portion electrically connected to the pixel portion, wherein the pixel portion has a pixel including a first thin film transistor; An analog switch array including a second thin film transistor and an integrated circuit using a single crystal semiconductor including a circuit other than the analog switch array, wherein the first thin film transistor and the second thin film transistor
The display , wherein each of the transistors has a gate insulating film containing fluorine, and the integrated circuit is electrically connected to the analog switch array using TAB (Tape Automated Bonding). 3. A display comprising: a pixel portion; and a driver circuit portion electrically connected to the pixel portion, wherein the pixel portion has a pixel including a first thin film transistor; An analog switch array including a second thin film transistor and an integrated circuit using a single crystal semiconductor including a circuit other than the analog switch array, wherein the first thin film transistor and the second thin film transistor
Each of the transistors has a gate insulating film containing fluorine, the integrated circuit is mounted on a substrate on which the first thin film transistor and the second thin film transistor are formed,
And a display electrically connected to the analog switch array. 4. A display comprising: a pixel portion; and a driver circuit portion electrically connected to the pixel portion, wherein the pixel portion has a pixel including a first thin film transistor; An analog switch array including a second thin film transistor and an integrated circuit using a single crystal semiconductor including a circuit other than the analog switch array, wherein the first thin film transistor and the second thin film transistor
A display , wherein each of the transistors has a gate insulating film containing fluorine, and wherein the integrated circuit is electrically connected to the analog switch array using COG (Chip On Glass). 5. The display according to claim 1, wherein the first thin film transistor and the second thin film transistor are formed by the same process. 6. The display according to claim 1, wherein the first thin film transistor and the second thin film transistor are covered with the same flattening film. 7. The display according to claim 6 , wherein said flattening film is an organic resin film. 8. The display according to claim 1, wherein the single crystal semiconductor is single crystal silicon. 9. A computer using the display according to any one of claims 1 to 8. 10. An office automation device using the display according to any one of claims 1 to 8. 11. A television using the display according to any one of claims 1 to 8. 12. The method according to claim 1, wherein
The thickness of the gate insulating film is 50 to 200 nm.
A display, comprising: a display;