JP3286587B2 - Liquid crystal panel and luminescent matrix panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel having an image display function and a light emitting matrix panel .

[0002]

2. Description of the Related Art Recent advances in microfabrication technology, liquid crystal material technology, packaging technology, and the like have made it possible to provide television images and various image displays on a commercial basis with practically no problem using a liquid crystal panel of 5 to 50 cm diagonal. ing. Further, by forming an RGB colored layer on one of the two glass substrates constituting the liquid crystal panel, color display is easily realized. In particular, in a so-called active type liquid crystal panel in which a switching element is incorporated for each picture element, an image having little crosstalk, high-speed response, and a high contrast ratio is guaranteed.

[0003] These liquid crystal panels have one scanning line.
Generally, a matrix organization of about 100 to 1000 lines and about 200 to 2,000 signal lines is used, but recently, a large screen and high definition have been simultaneously advanced.

FIG. 3 is a perspective view showing a mounted state of the liquid crystal panel. A driving signal is supplied to the electrode terminal group 6 of the scanning lines formed on the glass substrate 2 which is one of the transparent insulating substrates constituting the liquid crystal panel 1. A COG (Chip-On-Glass) method for directly connecting the driving semiconductor integrated circuit chip 3 or a TCP film 4 having a gold-plated copper foil terminal (not shown) based on, for example, a polyimide resin thin film is used. By mounting means such as a TCP method of pressing and fixing to the electrode terminal group 5 of the signal line with an adhesive containing a conductive medium,
An electric signal is supplied to the image display unit. Here for convenience 2
Although two mounting schemes are shown at the same time, it goes without saying that one of the mounting schemes is appropriately selected in practice.

Reference numerals 7 and 8 denote wiring paths for connecting the image display section of the liquid crystal panel 1 to the electrode terminal group 5 for signal lines and the electrode terminal group 6 for scanning lines. It is not necessary to be made of the same conductive material. 9 is a glass substrate which is another transparent insulating substrate having a transparent conductive counter electrode common to all liquid crystal cells, and two glass substrates 2 and 9 constituting the liquid crystal panel 1 are made of resinous fiber or Opposite to each other at a predetermined distance of about several μm by a spacer material such as beads, the gap is formed at the peripheral portions of the glass substrates 2 and 9 by a sealing material made of an organic resin and a sealing material. It is a closed space sealed with
This closed space is filled with liquid crystal.

When a color display is realized by a liquid crystal panel, a color layer having a thickness of 1 or both containing one or both of a dye and a pigment called a colored layer is provided on the closed space side of the glass substrate 9.
Since an organic thin film having a thickness of about 2 μm is provided to provide a color display function, in this case, the glass substrate 9 is also called a color filter. Then, depending on the properties of the liquid crystal material, a polarizing plate is stuck on one or both of the upper surface of the glass substrate 9 and the lower surface of the glass substrate 2, and the liquid crystal panel 1 functions as an electro-optical element.

In the above liquid crystal panel 1, the liquid crystal cell is composed of a transparent conductive picture element electrode formed on one glass substrate 2 and a transparent conductive pixel electrode formed on the other glass substrate 9 (color filter). And a liquid crystal filled between the electrodes. Recently, in a commercially available IPS type liquid crystal panel capable of expanding a viewing angle, a liquid crystal cell is composed of a pair of comb electrodes formed on one glass substrate and a liquid crystal filled between two glass substrates. , A transparent electrode is not required on the color filter, but the details are omitted here.

In order to display an image on the liquid crystal panel 1,
As described above, it is necessary to supply an electric signal to the terminal electrodes 5 and 6 of the signal line and the scanning line by the TCP mounting or the COG mounting. In recent years, COG mounting has tended to be frequently used in order to reduce mounting costs or to further increase the reliability of mounting by reducing the number of connection points.

However, in the COG mounting, a system such as a power supply line, an input signal line, and a clock line common to the driving semiconductor integrated circuit chip cannot be supplied to each driving semiconductor integrated circuit chip 3. As shown in the plan view of the periphery of the liquid crystal panel in FIG. 4, the liquid crystal panel appropriately forms (about 20 to 40) conductive first wiring patterns 10 on the periphery of the glass substrate 2 which is an active substrate. There is a need to.

Since the formation of the scanning lines and the signal lines is also essential for the formation of the active elements, these first wiring patterns 10 can be formed simultaneously with the formation of the active elements. Further, since the first wiring pattern 10 can be easily formed by forming an insulating layer on the surface of the first wiring pattern 10, the first wiring pattern 10 is disposed below the driving semiconductor integrated circuit chip 3, for example, as shown in FIG. Thus, the space can be effectively used to contribute to the narrowing of the frame of the liquid crystal panel 1.

However, the COG mounting cannot be practically used unless a bus flexible film is used in combination with a diagonal screen size of 6 inches (15 cm) or more where the resistance value of the first wiring pattern 10 is high. It is. That is,
Since the conductive lines such as scanning lines and signal lines formed on the glass substrate 2 as the active substrate have a thickness of at most about 0.5 μm, the resistance cannot be sufficiently reduced. The resistance of the wiring pattern 10 increases,
The first wiring pattern 10 alone cannot be used. More specifically, even if aluminum having a thickness of about 0.3 μm is used for the wiring path material and a sheet resistance of 0.1 Ω / cm ² is obtained, the wiring width is small. If the wiring length is 50 μm and the wiring length is 25 cm, the resistance value of the wiring path reaches 500Ω, and it is apparent that this cannot be used for a power supply line of mA or more. Similarly, for input signal lines and clock lines, the wiring resistance is added to the input resistance of the semiconductor integrated circuit chip 3 for driving, and high speed (100
At KHz or more), it is also easily understood that the signal waveform becomes dull and the driving semiconductor integrated circuit chip 3 does not operate.
Therefore, conventionally, as shown in the plan view of the peripheral portion when the liquid crystal panel is mounted in the COG method in FIG. 5, a bus flexible in which a conductive thin film is formed on a flexible film in the same manner as the TCP film 4 is used. The film 11 is connected to the first wiring pattern 10
Is provided in parallel over a length of 20 to 50 cm, and
Since the connection between the parallel lines is orthogonal, a multi-layer structure of several layers or more is performed.

[0012]

In the conventional mounting of the liquid crystal panel in the COG method, a very expensive bus flexible film must be provided in parallel with the first wiring pattern over a length of 20 to 50 cm. In addition, there is a problem that mounting cost is increased and connection around a liquid crystal panel is complicated.

[0013] The present invention is to solve the problems in the COG type mounting of the conventional panel, not only to achieve a reduction in implementation cost, it simplifies the connection of the panel, and improving the reliability of the equipment Liquid crystal panel and light emitting matrix
The purpose is to provide a panel .

[0014]

Means for Solving the Problems A liquid crystal panel according to the present onset <br/> bright you solve this problem, example Bei liquid crystal filled between two glass substrates, one of the one substrate The driving semiconductor integrated circuit chip is directly mounted on the peripheral portion on the surface of the device, and the electric connection to the power supply line, input signal line, clock line, etc. of the driving semiconductor integrated circuit chip is directly mounted on the driving semiconductor integrated circuit chip straight formed on the peripheral portion on one surface of one of substrates
A linear first wiring pattern, a second wiring pattern formed on a peripheral portion on the other surface of one substrate , and a conductive thin film connecting the first wiring pattern and the second wiring pattern And in the direction orthogonal to the first wiring pattern
This is done through the provided flexible film. Also,
Luminescent matrix panel according to the present invention that solves the above problems
The drive semiconductor on the periphery of one side of the substrate.
Driving semiconductor integrated circuit by directly mounting the integrated circuit chip
Electrical connection to chip power lines, input signal lines, clock lines, etc.
This is based on the direct mounting of the driving semiconductor integrated circuit chip.
A first linear arrangement formed at the periphery on one side of the plate;
Line pattern and formed on the periphery on the other side of the substrate
A second wiring pattern, the first wiring pattern and the second wiring pattern;
A conductive thin film for connecting to a line pattern;
Flexible filter provided in a direction orthogonal to the wiring pattern of
Made through LUM.

[0015]

[0016]

[0017]

[0018]

Embodiments of the present invention will be described below with reference to the drawings. (Embodiment) FIG. 1 is a diagram showing a CO of a liquid crystal panel according to an embodiment of the present invention.
FIG. 2 is a plan view of the peripheral portion when the G system is mounted.
FIG. 4 is a cross-sectional view taken along the line A ′, and the same reference numerals are used for the same portions as in FIG. 4 showing a plan view of the peripheral portion of the conventional liquid crystal panel and FIG. 5 showing a plan view of the peripheral portion when the conventional liquid crystal panel is mounted in the COG system. The description will be made with reference to FIG.

As shown in FIGS. 1 and 2, in the present embodiment, first, a driving semiconductor integrated circuit chip 3 on a peripheral portion on one surface of a glass substrate 2 which is an active substrate of a liquid crystal panel. Is formed in a region where is mounted. In order to form the first wiring pattern 10, a conductive thin film previously formed on the glass substrate 2 for forming scanning lines and signal lines may be used and formed at the same time as the scanning lines and signal lines. . Preferably, these conductive layers are laminated to reduce the resistance value or prevent disconnection.

Reference numerals 12 and 13 denote insulating layers formed on the glass substrate 2, which are indispensable for forming active elements such as insulated gate transistors on the glass substrate 2 as an active substrate. And a passivation insulating layer. An opening 14 that partially exposes the first wiring pattern 10 is formed in the insulating layer 13 which is the uppermost passivation insulating layer of the glass substrate 2.

A liquid crystal panel is formed from the completed glass substrate 2 as an active substrate and the glass substrate 9 as a color filter using a sealing material, and liquid crystal is injected between the glass substrate 2 and the glass substrate 9 and then sealed with a sealing material. The liquid crystal injection port is sealed. In this way, the second wiring pattern 15 is formed on the other surface of the glass substrate 2 in a peripheral portion which does not hinder the attachment of the polarizing plate in a state where the liquid crystal panel is formed into a panel.
In this case, since the two glass substrates 2 and 9 are already formed as a liquid crystal panel, the second wiring pattern 1
Even if some foreign matter or dust is generated in the formation process of No. 5, the characteristics and yield of the liquid crystal panel are not affected at all.

To form the second wiring pattern 15, a conductive resin such as a silver paste is coated on the other surface of the glass substrate 2 by drawing using a dispenser or printing by offset printing or the like. A method of evaporating the solvent is considered. Alternatively, a conductive tape in which a plurality of narrow conductive thin films are formed on an adhesive may be attached on the other surface of the glass substrate 2. In some cases, a flexible conductive TCP tape may be attached to the other surface of the glass substrate 2 using an adhesive.

Whichever method is selected, the width is 50 to 10
Even if the wiring path is about 0 μm and has a length exceeding 20 cm, it is easy to keep the resistance value within 10 to 100Ω. If a printed or metal thin film ribbon or tape is used as described above, the film thickness is 10 μm.
This is because it is easy to form or set as thick as described above.

After the second wiring pattern 15 is formed on the other surface of the glass substrate 2, the driving semiconductor integrated circuit chip 3 is mounted on the peripheral portion on one surface of the glass substrate 2, and the conductive thin film 16 is formed. Flexible film 17 having glass substrate 2
Of the conductive thin film 1 from one side to the other side of the
6, the first wiring pattern 10 and the second wiring pattern 15 are connected to complete the liquid crystal panel. Numeral 18 schematically shows a metal bump electrode for connecting the conductive thin film 16 formed on the flexible film 17 to the first wiring pattern 10 and the second wiring pattern 15. For example, other means such as pressure welding using an anisotropic conductive rubber (ACF) can be adopted.

The number of the flexible films 17 may be appropriately arranged in accordance with the length of the second wiring pattern 15.
It is needless to say that it is not necessary to arrange as many drive semiconductor integrated circuit chips 3 as there are.

As described above, according to the structure and manufacturing method of the liquid crystal panel in the present embodiment, the thick second wiring pattern having a sufficiently low resistance value is formed on the back surface of the glass substrate 2 which is the active substrate. 15 are arranged,
By connecting the second wiring pattern 15 and the first wiring pattern 10 formed on the surface of the glass substrate 2 via a flexible film 17 having a conductive thin film 16, a conventional long bus flexible film is formed. You do not need to use. The above operation and effect can also be obtained in other liquid crystal panels, for example, in an IPS type color liquid crystal panel that enlarges the viewing angle.

[0027]

As described above, according to the liquid crystal panel of the present invention, the second panel formed on the other surface of the active substrate is formed.
The wiring pattern can be a thick wiring pattern having a sufficiently low resistance value. Therefore, the wiring pattern is formed on the second wiring pattern and one surface of the active substrate via a flexible film having a conductive thin film. By connecting to the first wiring pattern, it is not necessary to perform multilayer wiring with a long bus flexible film as in the related art. As a result, not only the mounting cost is reduced, but also the connection around the liquid crystal panel is simplified, and the effect of improving the reliability as a device is obtained.

Note that the suppression of the resistance value of the wiring pattern for the driving semiconductor chip circuit obtained by the present invention is not limited to the active type color liquid crystal panel, but also to the simple type liquid crystal panel having no built-in active element. Similarly, it is also effective in a reflection type liquid crystal panel.

It is further noted that the present invention is similarly effective for a light-emitting matrix panel such as a PDP. This is because, even in a PDP, terminal electrodes for mounting are arranged on one main surface of a peripheral portion of a glass substrate, but nothing is usually formed as a dead space on the glass substrate on the opposite side. is there.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a CO of a liquid crystal panel according to an embodiment of the present invention.
Peripheral plane layout when G method is mounted

FIG. 2 is a cross-sectional view taken along line AA ′ of FIG.

FIG. 3 is a perspective view of a mounted state of a liquid crystal panel.

FIG. 4 is a plan view of a peripheral portion of a conventional liquid crystal panel.

FIG. 5 is a plan view of a peripheral portion when a conventional liquid crystal panel is mounted in a COG method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2, 9 Glass substrate 3 Driving semiconductor integrated circuit chip 4 TCP film 5, 6 Electrode terminal group 7, 8 Wiring path 10 First wiring pattern 11 Bus flexible film 12, 13 Insulating layer 14 Opening 15 Second Wiring pattern 16 conductive thin film 17 flexible film 18 metal bump electrode

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G09F 9/00 G02F 1 / 1343,1 / 1345,1 / 135 G02F 1 / 136,1 / 1365,1 / 1368

Claims (2)

(57) [Claims] 1. A liquid filled between the two glass substrates crystal
The liquid crystal panel including the driving semiconductor integrated circuit chip is directly mounted on the peripheral portion on one surface of the one substrate, the driving semiconductor integrated circuit chip of the power line, input signal line, the clock line or the like the electrical connections, the driving semiconductor integrated circuit chip and one first on the periphery linear formed on the surface of the wiring pattern of the one board mounted directly and the other of said one substrate A second wiring pattern formed at a peripheral portion on a surface; and a conductive thin film connecting the first wiring pattern and the second wiring pattern.
Along with a direction perpendicular to the first wiring pattern.
Liquid crystal panel made through a flexible film. 2. A driving semiconductor on a peripheral portion on one surface of a substrate.
Directly mounting the semiconductor integrated circuit chip, and
Supply power to circuit chip power lines, input signal lines, clock lines, etc.
The air connection is directly mounted on the driving semiconductor integrated circuit chip
Straight line formed on the peripheral portion on one surface of the substrate
A first wiring pattern in a shape of a circle and a periphery of the other surface of the substrate.
A second wiring pattern formed on an edge, and the first wiring pattern;
Conductivity for connecting a line pattern and the second wiring pattern
Having a conductive thin film and orthogonal to the first wiring pattern.
Through the flexible film provided in the direction
Luminescent matrix panel .