JP3282467B2 - Method and apparatus for manufacturing TAB tape carrier - Google Patents
Method and apparatus for manufacturing TAB tape carrierInfo
- Publication number
- JP3282467B2 JP3282467B2 JP26660195A JP26660195A JP3282467B2 JP 3282467 B2 JP3282467 B2 JP 3282467B2 JP 26660195 A JP26660195 A JP 26660195A JP 26660195 A JP26660195 A JP 26660195A JP 3282467 B2 JP3282467 B2 JP 3282467B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- chemical polishing
- roughened surface
- polishing liquid
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Landscapes
- Wire Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＴＡＢテープキャリ
アの製造方法及びその製造装置に係り、特に銅箔の粗化
面の化学研磨技術に関するものである。The present invention relates to a method for manufacturing a TAB tape carrier and an apparatus for manufacturing the same, and more particularly to a technique for chemically polishing a roughened surface of a copper foil.
【０００２】[0002]
【従来の技術】ＴＡＢテープキャリアは、ポリイミドテ
ープに銅箔をラミネートした後、フォトレジストを塗布
してレジストパターンを形成し、そのパターンに基づき
銅箔をエッチングしてリードパターンを形成し、形成さ
れたリードパターンの一部、例えばインナリードにめっ
きを施したものである。2. Description of the Related Art A TAB tape carrier is formed by laminating a copper foil on a polyimide tape, applying a photoresist to form a resist pattern, etching the copper foil based on the pattern, and forming a lead pattern. A part of the lead pattern, for example, the inner lead is plated.
【０００３】ここに、テープに銅箔をラミネートするに
際し、テープに対する銅箔の接着力を強くするために、
銅箔の裏面は凹凸を設けて粗化面としてある。ところ
が、十分なボンディング強度を得るためには、均一なめ
っき厚みと、インナリード幅のばらつきの少ないものが
要求されるため、研磨処理により粗化面を平滑化する必
要がある。化学研磨処理により銅箔を平滑化する場合、
テープ全体を浸漬するが、もともと光沢面となっている
銅箔表面はリード強度の点から化学研磨しないことが望
ましく、化学研磨処理は裏面の粗化面のみ行うべきであ
る。Here, when laminating a copper foil on a tape, in order to increase the adhesive strength of the copper foil to the tape,
The back surface of the copper foil is roughened by providing irregularities. However, in order to obtain a sufficient bonding strength, it is required to have a uniform plating thickness and a small variation in inner lead width. Therefore, it is necessary to smooth the roughened surface by polishing. When smoothing copper foil by chemical polishing,
Although the entire tape is immersed, it is desirable that the originally glossy copper foil surface is not chemically polished from the viewpoint of lead strength, and the chemical polishing treatment should be performed only on the roughened surface on the back surface.
【０００４】そこで従来は銅箔表面を保護するために、
フォトレジスト塗布後に化学研磨処理を行っていた。す
なわち図５に示すように、ＴＡＢテープキャリアを製造
するには、ポリイミドテープをパンチングしてデバイス
ホール、スプロケットホール、アウタリードホール等の
開口部を形成し（ステップ５１）、これらの開口部を形
成したテープに銅箔をラミネートし（ステップ５２）、
リードパターン形成用のフォトレジストを塗布し（ステ
ップ５３）、塗布後銅箔の粗化面を平滑化するために化
学研磨処理を行ない（ステップ５４）、所定のリードパ
ターンの描かれたフォトマスクを載せて露光・現像し
（ステップ５５）、材料露出部をエッチングしてリード
パターンを形成し（ステップ５６）、ソルダ印刷を行な
い（ステップ５６）、最後にインナリード等の所定部分
にめっきを施している（ステップ５７）。Therefore, conventionally, in order to protect the copper foil surface,
After the photoresist was applied, a chemical polishing treatment was performed. That is, as shown in FIG. 5, in order to manufacture a TAB tape carrier, openings such as device holes, sprocket holes, and outer lead holes are formed by punching a polyimide tape (step 51), and these openings are formed. Laminating copper foil on the tape (step 52)
A photoresist for forming a lead pattern is applied (step 53), and after the application, a chemical polishing process is performed to smooth the roughened surface of the copper foil (step 54), and a photomask on which a predetermined lead pattern is drawn is removed. The substrate is exposed and developed (Step 55), the exposed material is etched to form a lead pattern (Step 56), solder printing is performed (Step 56), and finally, a predetermined portion such as an inner lead is plated. (Step 57).
【０００５】このように従来は、銅箔の粗化面の平滑化
をフォトレジストの塗布後に行なっていたが、この銅箔
の粗化面を平滑化するための化学研磨処理工程は、図６
に示すように、化学研磨液槽３１内に複数のガイドロー
ル３２を配置した化学研磨装置を用いて、Ｈ2 Ｏ2 を含
んだ酸化性の強い化学研磨液３３中に全体を浸漬したＴ
ＡＢテープ３４を蛇行走行させることにより行なってい
た。As described above, conventionally, the roughened surface of the copper foil has been smoothed after the application of the photoresist. However, the chemical polishing process for smoothing the roughened surface of the copper foil has been described in FIG.
As shown in FIG. 2 , T was immersed in a chemically oxidizing chemical liquid 33 containing H 2 O 2 using a chemical polishing apparatus having a plurality of guide rolls 32 arranged in a chemical polishing liquid tank 31.
This is performed by meandering the AB tape 34.
【０００６】[0006]
【発明が解決しようとする課題】上述したように従来の
技術では、フォトレジスト塗布後に強酸の化学研磨液中
にＴＡＢテープ全体を浸漬して銅箔を化学研磨するた
め、化学研磨の不必要な表面銅箔の保護膜としてフォト
レジストは役だっている。しかしながら、リードパター
ンを形成する上でもっとも重要なフォトレジストがピン
ホール等の欠陥を有すると、その部分が化学研磨液にお
かされ、ＴＡＢテープのパターン形成時、パターン不良
を発生し、歩留りを低下させる大きな要因になってい
た。As described above, in the prior art, the entire TAB tape is immersed in a chemical polishing solution of a strong acid after the photoresist is applied to chemically polish the copper foil. Photoresist serves as a protective film for the surface copper foil. However, if the most important photoresist for forming a lead pattern has a defect such as a pinhole, that part is exposed to a chemical polishing solution, and when a pattern is formed on a TAB tape, a pattern defect occurs and the yield is reduced. It was a big factor to make.
【０００７】なお、化学研磨液の噴出孔を有するパイプ
を研磨液槽内に設け、化学研磨液中で噴出孔から銅箔の
粗化面に化学研磨液の液流を与えることによって粗化面
を優先的に研磨するようにしたものが提案されている
（特開平５−２７５４９６号公報）。これによれば銅箔
の光沢面の化学研磨量を粗化面に対して相対的に低く抑
えることはできる。しかし、テープ全体を化学研磨液中
に浸漬しているため、銅箔の光沢面にも強酸の化学研磨
液が接触することに変りはなく、銅箔の光沢面が研磨さ
れることは避けられない。したがって、この提案の技術
をフォトレジスト塗布後に適用しても、上述した従来技
術と同様な問題が生じる。[0007] A pipe having a chemical polishing liquid ejection hole is provided in the polishing liquid tank, and a chemical polishing liquid flow is applied from the ejection hole to the roughened surface of the copper foil in the chemical polishing liquid. Has been proposed in which polishing is preferentially performed (JP-A-5-275496). According to this, the amount of chemical polishing of the glossy surface of the copper foil can be suppressed relatively lower than that of the roughened surface. However, since the entire tape was immersed in the chemical polishing solution, the chemical polishing solution of strong acid was still in contact with the glossy surface of the copper foil, and polishing of the glossy surface of the copper foil was avoided. Absent. Therefore, even if this proposed technique is applied after the application of the photoresist, the same problem as the above-described conventional technique occurs.
【０００８】本発明の目的は、上述した従来技術の問題
点を解消して、銅箔の光沢面を侵すことなく粗化面のみ
を均一に化学研磨することが可能なＴＡＢテープキャリ
アの製造方法及びその製造装置を提供することにある。An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a method of manufacturing a TAB tape carrier capable of uniformly chemically polishing only a roughened surface without affecting a glossy surface of a copper foil. And a manufacturing apparatus therefor.
【０００９】[0009]
【課題を解決するための手段】ＴＡＢテープキャリアの
製造方法は、テープにラミネートした銅箔の粗化面を研
磨する工程を備え、銅箔の粗化面を研磨する際、空気中
に化学研磨液の噴流を形成し、噴流に銅箔の粗化面を接
触させて粗化面のみを研磨するようにしたものである。
化学研磨液中ではなく、空気中に形成される化学研磨液
の噴流に銅箔の粗化面のみを接触させるので、テープ全
体を化学研磨液中に浸漬するものと異なり、銅箔の光沢
面に液がまわりこまない。したがって、銅箔の光沢面は
研磨されず、銅箔の粗化面のみが研磨される。このため
銅箔が研磨され過ぎて、銅箔より形成されるリードの強
度が弱くなることがなくなる。また銅箔の粗化面が平滑
になるので、均一なめっきと、ばらつきの少ないインナ
リードが得られ、ボンディング性を良好にすることがで
きる。A method of manufacturing a TAB tape carrier includes a step of polishing a roughened surface of a copper foil laminated on a tape. When the roughened surface of the copper foil is polished, chemical polishing is performed in air. A jet of liquid is formed, and the roughened surface of the copper foil is brought into contact with the jet to polish only the roughened surface.
Since only the roughened surface of the copper foil is brought into contact with the jet of chemical polishing liquid that is formed in the air, not in the chemical polishing liquid, the glossy surface of the copper foil is different from that in which the entire tape is immersed in the chemical polishing liquid. The liquid does not flow around. Therefore, the glossy surface of the copper foil is not polished, and only the roughened surface of the copper foil is polished. Therefore, the copper foil is not polished too much, and the strength of the lead formed from the copper foil does not decrease. Further, since the roughened surface of the copper foil becomes smooth, uniform plating and inner leads with little variation can be obtained, and the bonding property can be improved.
【００１０】また、本発明のＴＡＢテープキャリアの製
造装置は、テープにラミネートした銅箔の粗化面を化学
研磨液槽で研磨するＴＡＢテープキャリアの製造装置に
おいて、化学研磨液槽を蓋で覆い、この蓋に、化学研磨
液を空気中に噴流させる噴流口を銅箔の粗化面に対して
平行に設け、噴流口からの噴流により銅箔の粗化面のみ
を研磨するようにしたものである。したがって化学研磨
液槽の蓋に噴流口を設け、これより噴流した化学研磨液
をオーバーフローさせるだけの簡単な構造で、銅箔の光
沢面の研磨を抑え、銅箔の粗化面のみを研磨することが
できる。The TAB tape carrier manufacturing apparatus according to the present invention is a TAB tape carrier manufacturing apparatus for polishing a roughened surface of a copper foil laminated on a tape with a chemical polishing liquid tank, wherein the chemical polishing liquid tank is covered with a lid. In this lid, a jet port for jetting the chemical polishing liquid into the air is provided in parallel with the roughened surface of the copper foil, and only the roughened surface of the copper foil is polished by the jet from the jet port. It is. Therefore, a jet port is provided in the lid of the chemical polishing liquid tank, and the polishing of the glossy surface of the copper foil is suppressed, and only the roughened surface of the copper foil is polished with a simple structure that only overflows the chemical polishing liquid jetted from this. be able to.
【００１１】また、本発明のＴＡＢテープキャリアの製
造装置は、テープにラミネートした銅箔の粗化面を化学
研磨液槽内で研磨するＴＡＢテープキャリアの製造装置
において、化学研磨液槽を内槽と外槽の２槽構造とし、
内槽を蓋で覆い、該蓋に、化学研磨液を空気中に噴流さ
せる噴流口を銅箔の粗化面に対して平行に設け、化学研
磨液を内槽に導入して噴流口から噴流させ、銅箔の粗化
面を研磨した噴流後の化学研磨液を外槽に集めて内槽に
戻す循環ポンプを設けたものである。したがって化学研
磨液槽を２槽構造とし、化学研磨液を内槽に導入して噴
流口から噴流させ、噴流によりオーバーフローした化学
研磨液を外槽に集め、これを循環させるだけの簡単な構
造で、銅箔の光沢面の研磨を抑え、銅箔の粗化面のみを
連続的に研磨することができる。The TAB tape carrier manufacturing apparatus according to the present invention is a TAB tape carrier manufacturing apparatus for polishing a roughened surface of a copper foil laminated on a tape in a chemical polishing liquid tank. And an outer tank,
The inner tank is covered with a lid, and a jet port for jetting the chemical polishing liquid into the air is provided on the lid in parallel with the roughened surface of the copper foil, and the chemical polishing liquid is introduced into the inner tank and jetted from the jet port. Then, a circulation pump is provided which collects the chemical polishing liquid after the jet flow, which has polished the roughened surface of the copper foil, in the outer tank and returns it to the inner tank. Therefore, the chemical polishing liquid tank has a two-tank structure, and the chemical polishing liquid is introduced into the inner tank and jetted from the jet port, and the chemical polishing liquid overflowed by the jet is collected in the outer tank and is simply circulated. The polishing of the glossy surface of the copper foil can be suppressed, and only the roughened surface of the copper foil can be continuously polished.
【００１２】この場合、噴流口が、噴流口の幅の開度を
銅箔の幅に応じて調整自在とする噴流口調整手段を備え
ていることが、種類により銅箔の幅が異なっても、銅箔
の光沢面への化学研磨液のまわりこみを有効に防ぐこと
ができる。また、内槽を外槽に対して深さ方向に移動し
て、銅箔の粗化面に対する噴流の接触度を調整するレベ
ル調整手段を設けることが、化学研磨液を銅箔の粗化面
に必ず接触させることができる。さらに、内槽内に化学
研磨液の流れを整流する整流手段を設けることが、噴流
口での化学研磨液の流れを均一にして、均一な化学研磨
を行うことができる。そして、ＴＡＢテープキャリアの
製造装置を多段に設けて任意の製造装置の化学研磨液を
ブランクにしたりすることが、銅箔の粗化面の研磨量を
任意に制御することができる。In this case, the jet port is provided with jet port adjusting means for adjusting the opening degree of the jet port width in accordance with the width of the copper foil. In addition, it is possible to effectively prevent the chemical polishing liquid from entering the glossy surface of the copper foil. Further, it is possible to provide a level adjusting means for moving the inner tank in the depth direction with respect to the outer tank and adjusting the contact degree of the jet with the roughened surface of the copper foil. Can always be contacted. Further, the provision of a rectifying means for rectifying the flow of the chemical polishing liquid in the inner tank makes the flow of the chemical polishing liquid at the jet port uniform so that uniform chemical polishing can be performed. By providing a TAB tape carrier manufacturing apparatus in multiple stages and blanking the chemical polishing liquid of an arbitrary manufacturing apparatus, the polishing amount of the roughened surface of the copper foil can be arbitrarily controlled.
【００１３】なお、本発明の化学研磨液の種類は制限さ
れない。例えば、過酸化水素系、硝酸系、過酸化物系
等、いずれでもよい。また化学研磨液の条件も任意でよ
い。The type of the chemical polishing liquid of the present invention is not limited. For example, any of a hydrogen peroxide system, a nitric acid system, and a peroxide system may be used. The condition of the chemical polishing liquid may be arbitrary.
【００１４】[0014]
【発明の実施の形態】以下に本発明の実施の形態を図面
を用いて詳細に説明する。図１は銅箔の粗化面を化学研
磨処理するための化学研磨ユニット３０の構成図で、
（ａ）は要部の詳細断面図、（ｂ）は噴流口１５の平面
図である。また図２は化学研磨ユニット３０を多段に配
設した化学研磨装置の縦断面図、図３は銅箔１をラミネ
ートしたＴＡＢテープ２の断面図である。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a configuration diagram of a chemical polishing unit 30 for chemically polishing a roughened surface of a copper foil,
(A) is a detailed sectional view of a main part, and (b) is a plan view of the jet port 15. FIG. 2 is a longitudinal sectional view of a chemical polishing apparatus in which chemical polishing units 30 are arranged in multiple stages, and FIG. 3 is a sectional view of a TAB tape 2 on which a copper foil 1 is laminated.
【００１５】図３に示すようにＴＡＢテープ２は、銅箔
１をポリイミドテープ３にラミネートして構成される。
なお、５は銅箔の光沢面を示し、６、７及び８はポリイ
ミドテープ３に形成された開口部であり、それぞれスプ
ロケットホール、アウタリードホール、デバイスホール
を示す。このＴＡＢテープ２の銅箔１の粗化面４を化学
研磨する化学研磨ユニット３０は図１に示すように構成
される。As shown in FIG. 3, the TAB tape 2 is formed by laminating a copper foil 1 on a polyimide tape 3.
Reference numeral 5 indicates a glossy surface of the copper foil, and reference numerals 6, 7, and 8 indicate openings formed in the polyimide tape 3, which indicate a sprocket hole, an outer lead hole, and a device hole, respectively. A chemical polishing unit 30 for chemically polishing the roughened surface 4 of the copper foil 1 of the TAB tape 2 is configured as shown in FIG.
【００１６】化学研磨液１４を入れる化学研磨液槽１１
は、内槽１２と外槽１３の２槽構造となっている。内槽
１２に化学研磨液１４を空気中に噴流する噴流口１５を
設ける。この噴流口１５は、幅が固定の開口１６と、噴
流口１５の口幅２５を調整してＴＡＢテープ２の光沢面
５に化学研磨液１４が回り込まないようにする噴流口調
整プレート１７とから構成される。Chemical polishing liquid tank 11 for storing chemical polishing liquid 14
Has a two-tank structure of an inner tank 12 and an outer tank 13. A jet port 15 for jetting the chemical polishing liquid 14 into the air is provided in the inner tank 12. The jet port 15 is composed of an opening 16 having a fixed width and a jet port adjusting plate 17 for adjusting the port width 25 of the jet port 15 so that the chemical polishing liquid 14 does not flow around the glossy surface 5 of the TAB tape 2. Be composed.
【００１７】開口１６は、内槽１２に取り付けた蓋２４
に、ＴＡＢテープ２の銅箔１の粗化面４に対して平行に
設けられる。噴流口調整プレート１７は、開口１６の両
側に沿った蓋２４の上部に設けられ、開口１６の幅方向
に進退してプレート１７間の距離を変えることにより、
噴流口１５の口幅２５を銅箔１の幅に応じて調整自在と
する。噴流口調整プレート１７は、Ｌ字部材によって構
成され、起立部１７ａの先端部をオーバーフロー方向に
切り落とし、化学研磨液１４がオーバーフロー位置に止
まらず、外槽１３内に直ちに落下するようにして、切れ
をよくしてある。また、Ｌ字部材の水平部１７ｂは蓋２
４にねじ１８で止められ、ねじ止め位置を変えることに
よって銅箔１の幅に応じて噴流口調整プレート１７の位
置を調整できるようになっている。一般に、ＴＡＢテー
プ２のテープ幅２８には３５ｍｍ、４８mm、７０mmの３
種類が用いられる。そして、これらにラミネートされる
銅箔１の幅は２０mm〜６０mmであるから、噴流口調整プ
レート１７により調整しうる噴流口１５の口幅２５も、
同じ範囲としてある。The opening 16 is provided with a lid 24 attached to the inner tank 12.
Is provided in parallel with the roughened surface 4 of the copper foil 1 of the TAB tape 2. The jet port adjusting plate 17 is provided on the upper portion of the lid 24 along both sides of the opening 16, and moves forward and backward in the width direction of the opening 16 to change the distance between the plates 17.
The width 25 of the jet port 15 is adjustable according to the width of the copper foil 1. The jet port adjusting plate 17 is formed of an L-shaped member, and cuts off the tip of the upright portion 17a in the overflow direction, so that the chemical polishing liquid 14 does not stop at the overflow position but immediately falls into the outer tank 13 so as to be cut off. Is better. The horizontal portion 17b of the L-shaped member is
4, the position of the jet port adjusting plate 17 can be adjusted according to the width of the copper foil 1 by changing the screwing position. Generally, the TAB tape 2 has a tape width 28 of 35 mm, 48 mm, and 70 mm.
Type is used. Since the width of the copper foil 1 to be laminated thereon is 20 mm to 60 mm, the opening width 25 of the jet port 15 which can be adjusted by the jet port adjusting plate 17 is also
There is the same range.
【００１８】また、ＴＡＢテープ２の銅箔１の粗化面４
を化学研磨液１４に必ず接触させることが重要であるた
め、内槽１２はその外壁に取り付けたレベルアジャスト
ボルト１９によって外槽１３内に支持され、外槽１３に
対して深さ方向に移動して、ＴＡＢテープ２に対する噴
流口調整プレート１７の高さをコントロールして、銅箔
１の粗化面４に対する噴流の接触度を調整できるように
なっている。因みにＴＡＢテープ２と噴流口調整プレー
ト１７との間隙ｄは２mm程度に設定するとよい。この程
度の間隙だと、ＴＡＢテープ２により噴流を上からちょ
うど押え込むような形になり、銅箔の粗化面を均一に研
磨できるからであり、これよりも間隙が大きいと研磨が
不均一になり、逆に小さいと噴流しなくなるからであ
る。The roughened surface 4 of the copper foil 1 of the TAB tape 2
Since it is important that the inner tank 12 is always brought into contact with the chemical polishing liquid 14, the inner tank 12 is supported in the outer tank 13 by a level adjust bolt 19 attached to the outer wall thereof, and moves in the depth direction with respect to the outer tank 13. Thus, by controlling the height of the jet outlet adjusting plate 17 with respect to the TAB tape 2, the degree of contact of the jet with the roughened surface 4 of the copper foil 1 can be adjusted. Incidentally, the gap d between the TAB tape 2 and the jet port adjusting plate 17 is preferably set to about 2 mm. If the gap is as large as this, the jet flow is pressed down from above by the TAB tape 2, and the roughened surface of the copper foil can be polished uniformly. If the gap is larger than this, the polishing becomes uneven. On the contrary, if it is small, it will not jet.
【００１９】外槽１３の底部には化学研磨液１４の導入
管２１と排出管２２とがそれぞれ取り付けられ、そのう
ち、導入管２１は内槽１２の底部に設けた導入管挿通孔
２６にＯリングなどのシール材２７を介して挿通され、
内槽１２の上下動を許容しつつ、化学研磨液１４を漏れ
ないように内槽１２内に導入できるようにしてある。導
入管２１と排出管２２とは化学研磨液槽１１の外部で循
環ポンプ２３に接続され、循環ポンプ２３から押し出さ
れた化学研磨液１４は、導入管２１から内槽１２内に導
入され、噴流口１５から噴流して銅箔１の粗化面４を研
磨し、研磨後はオーバーフローして外槽１３内に集めら
れ、排出管２２を通って循環ポンプ２３に戻るようにな
っている。An introduction pipe 21 and a discharge pipe 22 for the chemical polishing liquid 14 are attached to the bottom of the outer tank 13, of which the introduction pipe 21 is inserted into an introduction pipe insertion hole 26 provided at the bottom of the inner tank 12 by an O-ring. Is inserted through a sealing material 27 such as
The chemical polishing liquid 14 can be introduced into the inner tank 12 so as not to leak while allowing the inner tank 12 to move up and down. The introduction pipe 21 and the discharge pipe 22 are connected to a circulation pump 23 outside the chemical polishing liquid tank 11, and the chemical polishing liquid 14 pushed out from the circulation pump 23 is introduced from the introduction pipe 21 into the inner tank 12, The roughened surface 4 of the copper foil 1 is polished by jetting from the port 15, and after polishing, overflows and is collected in the outer tank 13, and returns to the circulation pump 23 through the discharge pipe 22.
【００２０】ところで噴流でただオーバーフローするだ
けでは化学研磨液流中にエアーを抱込んだりして、流量
バランスがくずれるので、内槽１２内には、化学研磨液
１４の流れを整流する整流プレート２０を設けてある。
この整流プレート２０には、２mmφ〜５mmφの穴加工を
施してある。However, if the jet flow merely overflows, the flow rate of the chemical polishing liquid 14 is lost due to the entrapment of air in the chemical polishing liquid flow. Is provided.
The rectifying plate 20 is formed with a hole of 2 mmφ to 5 mmφ.
【００２１】このように構成された化学研磨ユニット３
０は、研磨厚さをコントロールするため、図２に示すよ
うに多段に（図示例では３段）配設し、厚さをうすくす
る時はいくつかのユニット３０の槽内をブランクにして
バイパスさせる。The chemical polishing unit 3 configured as described above
In order to control the polishing thickness, 0 is provided in multiple stages (three stages in the illustrated example) as shown in FIG. 2, and when the thickness is reduced, the tanks of some units 30 are blanked and bypassed. Let it.
【００２２】さて、図３に示すＴＡＢテープ２の粗化面
４をＨ2 Ｏ2 を含んだ酸化性の化学研磨液で、銅箔１の
光沢面５にダメージを与えることなく化学研磨するに
は、上述した化学研磨ユニット３０に対してＴＡＢテー
プ２を走行させ、片面のみの化学研磨を行えばよい。あ
らかじめ、噴流口調整プレート１７を動かして、噴流口
１５の口幅２５をＴＡＢテープ２の銅箔１の幅に合わせ
る。また、レベルアジャストボルト１９を動かしてＴＡ
Ｂテープ２に対する噴流口調整プレート１７の高さを調
整する。そして、循環ポンプ２３を動かして化学研磨液
１４を循環させる。Now, the roughened surface 4 of the TAB tape 2 shown in FIG. 3 is chemically polished with an oxidizing chemical polishing solution containing H 2 O 2 without damaging the glossy surface 5 of the copper foil 1. The TAB tape 2 may be run with respect to the chemical polishing unit 30 described above to perform chemical polishing on only one side. The jet port adjusting plate 17 is moved in advance so that the jet port 15 has an opening width 25 that matches the width of the copper foil 1 of the TAB tape 2. Also, move the level adjustment bolt 19 to set the TA
The height of the jet port adjusting plate 17 with respect to the B tape 2 is adjusted. Then, the chemical polishing liquid 14 is circulated by operating the circulation pump 23.
【００２３】内槽１２に送り込まれた化学研磨液１４は
整流プレート２０を通って整流されるので、エアーを抱
込まず、流量バランスも取れた状態で噴流口１５から空
気中に噴流される。噴流口１５が銅箔１の粗化面４に対
して平行に設けられているので、噴流口１５からの噴流
により銅箔１の粗化面４に化学研磨液１４が接触して粗
化面４が研磨される。このとき、噴流口１５の口幅２５
をＴＡＢテープ２の銅箔１の幅に合わせてあるので、噴
流口１５からオーバーフローした研磨後の化学研磨液１
４は、ポリイミドテープ３の銅箔１よりも外側にはみ出
している部分に阻止されるとともに、噴流口調整プレー
ト１７先端の切り落としにより、速やかにプレート１７
の外壁を伝わって外槽１３内に導かれるため、銅箔１の
光沢面５への回り込みは生じない。このため銅箔１の粗
化面４のみが研磨される。なお、外槽１３に集められた
化学研磨液は循環ポンプ２３により内槽１２に戻され
る。The chemical polishing liquid 14 sent to the inner tank 12 is rectified through the rectifying plate 20, so that the chemical polishing liquid 14 is jetted into the air from the jet port 15 in a state where the flow is balanced without entrapping the air. Since the jet port 15 is provided in parallel with the roughened surface 4 of the copper foil 1, the chemical polishing liquid 14 comes into contact with the roughened surface 4 of the copper foil 1 due to the jet from the jet port 15 and the roughened surface. 4 is polished. At this time, the mouth width 25 of the jet port 15
Is adjusted according to the width of the copper foil 1 of the TAB tape 2.
4 is blocked by the portion of the polyimide tape 3 protruding outside of the copper foil 1 and is quickly cut off by cutting off the tip of the jet port adjusting plate 17.
The copper foil 1 is guided into the outer tank 13 along the outer wall of the copper foil 1, so that the copper foil 1 does not run around the glossy surface 5. Therefore, only the roughened surface 4 of the copper foil 1 is polished. The chemical polishing liquid collected in the outer tank 13 is returned to the inner tank 12 by the circulation pump 23.
【００２４】ここで、上述した銅箔１の化学研磨処理
は、化学研磨液１４が銅箔１の光沢面５に回り込まない
ので、フォトレジスト塗布後に行なうようにしても、ピ
ンホールが原因のパターン不良は生じない。しかし、フ
ォトレジスト塗布後に化学研磨処理をするのでなく、図
４に示すように、フォトレジスト塗布（ステップ４４）
前に銅箔１の粗化面４を化学研磨処理すると（ステップ
４３）、かりに化学研磨液１４が銅箔１の光沢面５に回
り込んだとしても、パターン不良に至らない。Since the chemical polishing treatment of the copper foil 1 described above does not flow around the glossy surface 5 of the copper foil 1 even if the chemical polishing liquid 14 is applied after the photoresist is applied, the pattern caused by the pinholes may be formed. No failure occurs. However, instead of performing a chemical polishing process after the photoresist is applied, as shown in FIG. 4, the photoresist is applied (step 44).
If the roughened surface 4 of the copper foil 1 is previously subjected to the chemical polishing treatment (step 43), even if the chemical polishing liquid 14 reaches the glossy surface 5 of the copper foil 1, no pattern failure occurs.
【００２５】このように本実施の形態によれば、銅箔１
の粗化面４のみが研磨され、銅箔１の光沢面５が侵され
ないので、大きなリード強度を確保することができる。
また、粗化面４が研磨により平滑化されるので、後に行
なわれるエッチング工程（ステップ４６）においてイン
ナリード幅のばらつきを少なくすることができ、さら
に、めっき工程（ステップ４８）において均一なめっき
厚みが得られるため、十分なボンディング強度を得るこ
とができる。As described above, according to the present embodiment, the copper foil 1
Since only the roughened surface 4 is polished and the glossy surface 5 of the copper foil 1 is not affected, a large lead strength can be secured.
Further, since the roughened surface 4 is smoothed by polishing, variations in the inner lead width can be reduced in an etching step (step 46) performed later, and a uniform plating thickness can be obtained in the plating step (step 48). Is obtained, so that a sufficient bonding strength can be obtained.
【００２６】[0026]
【発明の効果】本発明によれば、空気中の噴流に銅箔の
粗化面を接触させることにより、銅箔の光沢面を侵すこ
となく粗化面のみを均一に化学研磨することができるの
で、パターン不良が低減し、歩留りを大幅に向上でき
る。According to the present invention, the roughened surface of the copper foil is brought into contact with the jet stream in the air, so that only the roughened surface can be chemically polished uniformly without affecting the glossy surface of the copper foil. Therefore, pattern defects are reduced, and the yield can be greatly improved.
【図１】本発明の実施の形態による化学研磨ユニットの
要部の詳細断面図である。FIG. 1 is a detailed sectional view of a main part of a chemical polishing unit according to an embodiment of the present invention.
【図２】本実施の形態による化学研磨ユニットを多段化
した化学研磨装置の縦断面図である。FIG. 2 is a longitudinal sectional view of a chemical polishing apparatus in which a chemical polishing unit according to the present embodiment is multi-staged.
【図３】本実施の形態に係るポリイミドテープと銅箔を
貼り合わせたＴＡＢテープの断面図である。FIG. 3 is a cross-sectional view of a TAB tape obtained by bonding a polyimide tape and a copper foil according to the present embodiment.
【図４】本実施の形態によるＴＡＢテープキャリアの製
造工程図である。FIG. 4 is a manufacturing process diagram of the TAB tape carrier according to the present embodiment.
【図５】従来例のＴＡＢテープキャリアの製造工程図で
ある。FIG. 5 is a manufacturing process diagram of a conventional TAB tape carrier.
【図６】従来の化学研磨装置の縦断面図である。FIG. 6 is a longitudinal sectional view of a conventional chemical polishing apparatus.
１ 銅箔 ２ ＴＡＢテープ ４ 粗化面 ５ 光沢面 １１ 化学研磨液槽 １２ 内槽 １３ 外槽 １４ 化学研磨液 １５ 噴流口 １６ 開口 １７ 噴流口調整プレート １９ レベルアジャストボルト ２０ 整流プレート ２３ 循環ポンプ ２４ 蓋 ２５ 噴流口の口幅 DESCRIPTION OF SYMBOLS 1 Copper foil 2 TAB tape 4 Roughened surface 5 Glossy surface 11 Chemical polishing liquid tank 12 Inner tank 13 Outer tank 14 Chemical polishing liquid 15 Spout port 16 Opening 17 Spout port adjustment plate 19 Level adjust bolt 20 Straightening plate 23 Circulation pump 24 Lid 25 Spout width
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−94435（ＪＰ，Ａ) 特開 平４−141371（ＪＰ，Ａ) 特開 平６−21040（ＪＰ，Ａ) 特開 平６−170341（ＪＰ，Ａ) 特開 平５−275496（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 311 B23K 1/08 320 H01L 21/306 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-94435 (JP, A) JP-A-4-141371 (JP, A) JP-A-6-21040 (JP, A) JP-A-6-21040 170341 (JP, A) JP-A-5-275496 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60 311 B23K 1/08 320 H01L 21/306
Claims (7)
磨する工程を備え、銅箔の粗化面を研磨する際、空気中
に化学研磨液の噴流を形成し、該噴流に銅箔の粗化面を
接触させて粗化面のみを研磨するようにしたＴＡＢテー
プキャリアの製造方法。A polishing step for polishing a roughened surface of a copper foil laminated on a tape, wherein a polishing jet of a chemical polishing liquid is formed in the air when polishing the roughened surface of the copper foil; A method for producing a TAB tape carrier, wherein only the roughened surface is polished by contacting the roughened surface.
学研磨液槽で研磨するＴＡＢテープキャリアの製造装置
において、化学研磨液槽を蓋で覆い、該蓋に、化学研磨
液を空気中に噴流させる噴流口を銅箔の粗化面に対して
平行に設け、噴流口からの噴流により銅箔の粗化面のみ
を研磨するようにしたことを特徴とするＴＡＢテープキ
ャリアの製造装置。2. A TAB tape carrier manufacturing apparatus for polishing a roughened surface of a copper foil laminated on a tape with a chemical polishing liquid tank, wherein the chemical polishing liquid tank is covered with a lid, and the chemical polishing liquid is put on the lid in air. A TAB tape carrier manufacturing apparatus, characterized in that a jet port for jetting the copper foil is provided in parallel to the roughened surface of the copper foil, and only the roughened surface of the copper foil is polished by the jet from the jet port.
学研磨液槽内で研磨するＴＡＢテープキャリアの製造装
置において、化学研磨液槽を内槽と外槽の２槽構造と
し、内槽を蓋で覆い、該蓋に、化学研磨液を空気中に噴
流させる噴流口を銅箔の粗化面に対して平行に設け、化
学研磨液を内槽に導入して噴流口から噴流させ、銅箔の
粗化面を研磨した噴流後の化学研磨液を外槽に集めて内
槽に戻す循環ポンプを設けたＴＡＢテープキャリアの製
造装置。3. A TAB tape carrier manufacturing apparatus for polishing a roughened surface of copper foil laminated on a tape in a chemical polishing liquid tank, wherein the chemical polishing liquid tank has a two-tank structure of an inner tank and an outer tank. Is covered with a lid, a jet port for jetting the chemical polishing liquid into the air is provided on the lid in parallel with the roughened surface of the copper foil, and the chemical polishing liquid is introduced into the inner tank and jetted from the jet port. A TAB tape carrier manufacturing apparatus provided with a circulating pump for collecting a chemical polishing liquid after jetting after polishing a roughened surface of a copper foil in an outer tank and returning it to the inner tank.
幅に応じて調整自在とする噴流口調整手段を備えている
請求項２または３に記載のＴＡＢテープキャリアの製造
装置。4. The TAB tape carrier according to claim 2, wherein said jet port is provided with jet port adjusting means for adjusting an opening of the jet port width in accordance with the width of the copper foil. apparatus.
て、銅箔の粗化面に対する噴流の接触度を調整するレベ
ル調整手段を設けた請求項３に記載のＴＡＢテープキャ
リアの製造装置。5. The TAB tape according to claim 3, further comprising a level adjusting means for adjusting the degree of contact of the jet with the roughened surface of the copper foil by moving the inner tank in the depth direction with respect to the outer tank. Carrier manufacturing equipment.
流手段を設けた請求項３または請求項５に記載のＴＡＢ
テープキャリアの製造装置。6. The TAB according to claim 3, wherein a rectifying means for rectifying the flow of the chemical polishing liquid is provided in the inner tank.
Tape carrier manufacturing equipment.
Ｂテープキャリアの製造装置を多段に設けたＴＡＢテー
プキャリアの製造装置。7. The TA according to claim 2, wherein
A TAB tape carrier manufacturing apparatus provided with multi-stage B tape carrier manufacturing apparatuses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26660195A JP3282467B2 (en) | 1995-10-16 | 1995-10-16 | Method and apparatus for manufacturing TAB tape carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26660195A JP3282467B2 (en) | 1995-10-16 | 1995-10-16 | Method and apparatus for manufacturing TAB tape carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09115962A JPH09115962A (en) | 1997-05-02 |
| JP3282467B2 true JP3282467B2 (en) | 2002-05-13 |
Family
ID=17433086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26660195A Expired - Fee Related JP3282467B2 (en) | 1995-10-16 | 1995-10-16 | Method and apparatus for manufacturing TAB tape carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3282467B2 (en) |
-
1995
- 1995-10-16 JP JP26660195A patent/JP3282467B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09115962A (en) | 1997-05-02 |
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