JP3279121B2 - Solder state output device and solder inspection system using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION In a process of inspecting a solder portion on a substrate, the state of the solder portion on the substrate is calculated by irradiating the substrate with light and receiving the reflected light to calculate light receiving data. The present invention relates to a solder state output device that outputs a state of a solder part based on inspection data, and a solder inspection system using the same.

[0002]

2. Description of the Related Art FIG. 11 shows a process of mounting components on a substrate (hereinafter, simply referred to as a component mounting process).

In a cream solder printing process A shown in FIG. 1, cream solder printing is applied to a solder portion of a substrate, that is, a land portion to which a mounted component is to be soldered, by a cream solder printing apparatus.

Next, in an inspection step B, a solder inspection device or a solder inspection system inspects the printing state of the cream solder at each solder portion on the substrate,
The board that has passed the inspection is sent to the component mounting step C.

[0005] In the component mounting step C, the component is mounted on the substrate on which the cream solder has been printed and applied by a mounter.

Subsequently, in a reflow soldering step D, the substrate on which the components are mounted is placed in a reflow furnace and heated to melt the cream solder and solder the components to the substrate.

Finally, in an inspection step E, the state of the solder portion of the board to which the component has been soldered by the reflow soldering process is inspected by a solder inspection device or a solder inspection system.

[0008] The above-mentioned solder inspection apparatus is composed of a light projecting unit, a light receiving unit, a control processing unit and the like.

The light projecting unit has a fluorescent light source, a neon light source, a laser light source, an X-ray light source, etc., and irradiates light from the light source to a solder part. ON / OFF of the light source is controlled by the control processing unit.

The light receiving section has a CCD color camera or a photomultiplier tube, and a color image signal of a reflected light image, an image signal of a light cutting line formed on a soldered portion by laser light irradiation, or a photoelectron by X-ray irradiation. Light reception data obtained by receiving light reflected from the substrate, such as an image signal, is sent to the control processing unit.

The control processing unit controls the operations of the light projecting unit and the light receiving unit, and inspects the amount and shape of the cream solder or the amount of the solder, the glossiness, the shape, etc., based on the received light data from the light receiving unit. Data is calculated, and based on the inspection data, the printing state of the cream solder or the quality of the solder state is determined.

Next, the operation of the solder inspection apparatus having the above configuration will be described.

The light projecting unit irradiates light to the solder part of the substrate, the light receiving unit receives the reflected light, obtains light receiving data such as a color image signal of a reflected light image, and sends the received light data to the control processing unit.

The control processing section calculates inspection data indicating the printing state of the cream solder or the state of the solder based on the light receiving data input from the light receiving section, and determines the quality of the solder portion based on the inspection data. Do
This pass / fail judgment result is output.

Further, the above-mentioned solder inspection system automates the inspection of a solder part in the above-mentioned solder inspection apparatus,
It is composed of an automatic solder inspection device installed in-line, and an inspection result output device that is installed off-line and outputs the result of the pass / fail judgment of the solder part in response to a request from the operator.

The quality control method of the solder part in the component mounting process is performed by observing the trend of occurrence of defective products in the inspection process, and when the occurrence of defective products increases, the cream solder in the upstream process is used. Investigate the causes of increased defects, such as printer and reflow furnace abnormalities.

[0017]

However , in the above-described method for controlling the quality of a solder portion, the quality of the solder portion is judged based on the result of the solder inspection performed by the solder inspection apparatus, that is, when a defective product is generated, the abnormality in the upstream process is determined. Therefore, it cannot be said that this is an efficient quality control method, and often a large number of defective products are generated or a production plan is delayed due to a stoppage of a line for handling an abnormal process.

The present invention is to solve such a conventional problem. In a component mounting process, it is possible to prevent the deterioration of the quality of a solder portion on a substrate and to efficiently control the quality of the solder state output device. It is an object of the present invention to provide an inspection system using the device.

[0019]

In order to achieve the above object, a solder state output device according to the present invention includes data processing means for generating and outputting information indicating a time transition of inspection data in the device. It is a thing.

The solder state output device according to claim 1 of the present invention irradiates a substrate with light and calculates inspection data indicating the state of a solder portion on the substrate from light reception data obtained by receiving the reflected light. The solder state output device according to claim 7 outputs the state of the solder part based on the inspection data. The solder state output device according to claim 7 generates the state of the solder part on the board based on the inspection data created by the board inspection apparatus. It outputs the state of the solder part.

Further, the solder inspection system of the present invention
Light is illuminated on the substrate, and the reflected light is received.
Inspection data showing the condition of the solder part on the board from the data
A board inspection device for calculating the
Output the status of the soldered part based on the inspection data
Solder inspection system configured with a solder status output device
The inspection data is provided to the solder status output device.
Data processing that creates and outputs information indicating the time transition of data
It is provided with a management means.

[0022]

Therefore, according to the present invention, the data processing means prepares the temporal transition information of the inspection data and outputs this temporal transition information, whereby the quality trend of the solder portion of the board can be grasped accurately. Therefore, it is possible to prevent the deterioration of the quality of the solder part, and it is possible to efficiently control the quality.

[0023]

1 is a schematic diagram showing a first embodiment of a solder state output device according to the present invention.

In FIG. 1, the present solder status output device is
It comprises a light projecting unit 1, an imaging unit 2, an X-axis table unit 3, a Y-axis table unit 4, and a control processing unit 5.

The control processing unit 5 includes an imaging controller 6, an image processing unit 7, a determination unit 8, a storage unit 9, an input unit 10, a display unit 11, a data processing unit 12, and a control unit 13.

The light projecting unit 1 has a white light source 14 and blue light sources 15 and 16 which are ring-shaped color fluorescent lamps, and the luminous intensity and ON / OFF of these light sources are controlled by an image pickup controller 6.

FIG. 2 is a configuration diagram of the light projecting unit 1. In the figure, a white light source 14 and a blue light source 15, 1
6 are arranged on concentric circles so that the center thereof coincides with the imaging center axis 21 of the imaging unit 2, and have different ring radii r ₁ , r ₂ , r ₃ , and are different from the substrate surface 22. By changing the heights h ₁ , h ₂ and h ₃ ,
Angle of elevation from the point of intersection of
₁ , θ ₂ , and θ ₃ . Where θ
₁ > θ ₂ > θ ₃ and the elevation angle θ ₁ of the white light source 14 is 90
° is desirable.

The image pickup unit 2 is a color television camera such as a CCD camera, and is integrated with the light projecting unit 1, and picks up an image of a solder portion of the board 17 to be inspected according to a command from the image pickup controller 6.

The X-axis table unit 3 is provided with the light projecting unit 1 and the image pickup unit 2. Then, the imaging unit 2 is moved in the X direction.

The Y-axis table unit 4 has a substrate stage on the upper side. A substrate 17 to be inspected is set on the substrate stage, and in order to sequentially image the soldered parts, in accordance with a command from the imaging controller 6, Inspect substrate 17 for Y
Move in the direction.

The imaging controller 6 has an interface for connecting the light projecting unit 1, the imaging unit 2, the X-axis table unit 3 and the Y-axis table unit 4 to the control unit 13, and the like. , The operations of the light projecting unit 1, the imaging unit 2, the X-axis table unit 3, and the Y-axis table unit 4 are controlled.

The image processing unit 7 A / D converts an analog color image signal obtained by the imaging unit 2 into digital color image data in accordance with a command from the control unit 13, and binarizes the color image data. Perform image processing such as processing.

The judging section 8 judges the quality of the board by comparing the inspection data of each solder portion of the board inputted from the control section 13 with the preset upper limit value and lower limit value. The result is output to the control unit 13.

The storage unit 9 has a memory such as a RAM,
Various data output from the image processing unit 7, the data processing unit 12, and the control unit 13 in accordance with a command from the control unit 13 while being used as a work area of the image processing unit 7, the data processing unit 12, and the control unit 13. Is stored.

The input section 10 has a keyboard and the like, and an operator inputs various data and instructions by operating the input section 10.

The display unit 11 includes a display such as a CRT,
And a printer, and displays or prints out various data such as a pass / fail judgment result sent from the control unit 13 and information on temporal transition of inspection data.

The data processing section 12 creates, from the inspection data of each board, temporal transition information of the inspection data indicating a temporal transition of the state of the solder part.

The control unit 13 has a microprocessor or the like, and in accordance with various data and instructions input from the input unit 10 by the operator in accordance with the procedure shown in FIG. 3, the imaging controller 6, the image processing unit 7, and the determination unit 8 , The operation of the storage unit 9, the display unit 11, and the data processing unit 12, and the inspection of the solder part on the substrate is performed.

FIG. 3 is a flowchart showing an inspection procedure in the embodiment of the present invention.

In FIG. 3, in step ST 1, the operator inspects the printing state of the cream solder in the inspection step B shown in FIG. 11 or inspects the state of the solder subjected to the reflow soldering processing in the inspection step E. Set.

Next, in ST2, the operator inputs that the inspection is to be performed, and in ST3, the operator sets the substrate to be inspected on the substrate stage of the Y-axis table unit 4, and inputs that the setting is completed.

In ST4, the control unit 13 sends the X-axis table unit 3 and the Y-axis table unit 4 via the imaging controller 6.
Is operated to move the solder part of the substrate to be inspected to the imaging position of the imaging unit 2 and to inspect the printing state of the cream solder, the white light source 14 of the light emitting unit 1 is turned on, and the blue light source 1 is turned on.
In order to irradiate the substrate with only white light by turning off the light sources 5 and 16 and to inspect the state of the solder subjected to the reflow soldering process, the blue light sources 15 and 16 are turned on, and the white light source 14 is turned off and the blue light source is turned off. Only the substrate is irradiated.

Then, an analog color image signal obtained by imaging the reflected light image from the solder part by the imaging unit 2 is subjected to A / D conversion processing by the image processing unit 7 to obtain digital color image data.

In order to inspect the printing condition of the cream solder, if the reflected light image due to the irradiation of white light is picked up by the image pickup unit 2, a color image of a portion having irregular reflection characteristics such as a cream solder surface, a copper foil land portion and the like is obtained. Is obtained.

FIG. 4 shows an example of a color image of the cream solder surface and its surroundings.

In FIG. 4, 31 is a land portion of a copper foil,
Reference numeral 32 denotes a portion on which cream solder is printed (cream solder surface), and reference numeral 33 denotes a land portion of the copper foil exposed because cream solder was not printed.

When the printing and application are performed normally, the cream solder is uniformly printed on the land portion 31, and the area of the cream solder surface 32 and the land portion 31 are substantially equal.

In the color image, since the exposed land portions 33 are made of copper foil, they are colored red. On the other hand, since the cream solder is gray, the cream solder surface 32 is colored gray.

Therefore, the control unit 13 sets the inspection area 34 shown in FIG. 4 in the color image data, and operates the image processing unit 7 to extract an area colored in the cream solder color in the inspection area 34. Then, binarized data in which the data of the extracted area is “1” is created.

The control unit 13 calculates the area of the cream solder surface 32 from the binarized data, for example, when inspecting the amount of cream solder applied by printing. Since the height of the cream solder applied by printing is considered to be substantially constant, the above-mentioned area value is used as the inspection data of the amount of cream solder, and this inspection data is sent to the determination unit 8 and the data processing unit 12.

The judging section 8 judges the quality of the cream solder by comparing the inspection data of the cream solder quantity inputted from the control section 13 with the upper limit and the lower limit of the preset cream solder quantity. , And outputs the determination result to the control unit 13.

Next, when inspecting the state of the solder which has been subjected to the reflow soldering, since the solder surface has a specular reflection characteristic, the solder image is obtained from the color image of the reflected light image due to the irradiation of the white light incident from a substantially vertical direction. It is difficult to inspect the state, and a color image obtained by imaging the reflected light image by irradiating blue light from an oblique direction with the imaging unit 2 is used.

FIG. 5 is an explanatory view showing the principle of detecting a solder surface by a blue light source. In the figure, an elevation angle from a ring-shaped blue light source 41 having a center on an imaging center axis (a direction perpendicular to the substrate surface) 21 of the imaging unit 2 to a reference surface (a surface parallel to the substrate surface) 42. The blue light incident on the solder surface 43 of the substrate at θ has an inclination angle i ₁ with respect to the reference surface 42 and an incident angle i _{2 with} respect to a curved surface element having the solder surface 43.
(= I ₁ ) and is reflected at a reflection angle i ₃ (= i ₁ = i ₂ ). If this reflection direction matches the direction of the imaging center axis 21, this curved surface element is colored blue in a color image obtained by the imaging unit 2. Here, since the inclination angle, the incident angle, and the reflection angle are equal, this is represented by i (=
If i ₁ = i ₂ = i ₃ ), when the reflection direction of the blue light coincides with the direction of the imaging center axis 21, the angle between the inclination angle (or the incident angle or the reflection angle) i and the elevation angle θ is θ = 90 ° −2i.

Actually, since the incident light from the blue light source 41 has a light having an incident angle of 2Δi from i-Δi to i + Δi, a curved surface element having an inclination angle of i-Δi to i + Δi is detected. .

In the light projecting section 1 of this embodiment shown in FIG. 2, two blue light sources having different elevation angles are arranged and the width of the incident angle Δi is set to a large value, so that the reflected light image by this blue light is obtained. In the color image obtained by imaging
Almost the entire surface of the solder surface having a three-dimensional curved surface is colored blue.

FIG. 6 shows an example of a solder surface after the reflow soldering process and a color image around the solder surface.

In the sectional view of FIG. 6, reference numeral 51 denotes a solder surface;
Reference numeral 52 denotes a mounted component, and in a color image,
Reference numeral 53 denotes a blue colored area of the solder surface 51.

Accordingly, the control section 13 sets the inspection area 54 shown in FIG. 6 in the color image data, operates the image processing section 7 and extracts the blue colored area 53 in the inspection area 54. Then, binarized data in which the data of the extracted area is set to “1” is created.

When inspecting the amount of solder, for example, the control unit 13 calculates the area of the region 53 colored blue from the binary data, and uses this area value as inspection data of the amount of solder. The inspection data is sent to the determination unit 8 and the data processing unit 12.

The judging section 8 judges the quality of the solder by comparing the inspection data of the solder quantity inputted from the control section 13 with the preset upper and lower limits of the solder quantity. Is output to the control unit 13.

When inspecting the glossiness of the solder, an area 53 colored blue is extracted from the inspection area 54 of the color image data, and an average value of the blue signal level is calculated in the extracted area. And sends the inspection data to the determination unit 8 and the data processing unit 12.

The judging unit 8 judges whether the glossiness of the solder is good or not by comparing the inspection data of the glossiness inputted from the control unit 13 with a preset lower limit value. Output to

The above inspection is performed for all solder parts on the board.

Returning to FIG. 3, in ST5, the control section 13 displays the quality judgment result of the board on the display section 11, and in ST6, operates the Y-axis table section 4 via the imaging controller 6 to remove the board to be inspected. After moving to the carry-out position, the operator removes the substrate to be inspected from the substrate stage of the Y-axis table unit 4.

Finally, in ST 7, the control unit 13 displays on the display unit 11 the temporal transition information of the inspection data created by the data processing unit 12.

Then, returning to ST2, the substrate is sequentially inspected by repeating the above inspection procedure.

FIG. 7 shows an example of temporal transition information created by the data processing section 12, and FIG. 7 shows a case of inspection data of the amount of solder.

In FIG. 7, reference numeral 61 denotes a temporal change in the amount of solder, 62 denotes an upper limit value in pass / fail judgment, and 63 denotes a lower limit value in pass / fail judgment.

The temporal transition information of the amount of solder shown in FIG. 7 is created as follows. The data processing unit 12 sequentially extracts the inspection data of the solder amount of the solder part specified in advance from the inspection data of each board to be inspected sent from the control unit 13 in ST4 of FIG. A graph shown in FIG. 7 is created by using the amount of inspection data as the amount of solder in each substrate.

Further, the average value of the inspection data of the solder amount in all the solder portions on the board may be calculated, and this average value may be used as the solder amount in each board.

Further, the substrate may be divided into a plurality of regions, and temporal transition information may be created for each region.

FIG. 8 is a display example of the time transition information of the amount of cream solder. The substrate to be inspected is divided into six regions, and the average value of the inspection data of the amount of cream solder is calculated for each region. Is the amount of cream solder in each area, and the temporal transition information is displayed for each area.

In FIG. 8, reference numeral 71 denotes a substrate to be inspected.
a to f indicate the divided areas. Further, reference numeral 72 denotes a temporal transition of the cream solder amount, 73 denotes an upper limit value in the pass / fail judgment, and 74 denotes a lower limit value in the pass / fail judgment.

As can be seen from the figure, the cream solder amount in the areas a to f changes between the upper limit 73 and the lower limit 74.
Although it is not determined to be defective, it can be seen that the cream solder amount in the regions a and f is gradually reduced, and it can be predicted that a solder portion which becomes defective due to the insufficient cream solder amount will soon occur in the regions a and f. .

However, before that, the clogging of the openings in the mask sheet of the solder printing machine in the cream solder printing step (step A shown in FIG. 10), which is the upstream step, and the printing of the areas a and f of the substrate. If the solder printing press is examined and an abnormality is found, it is possible to prevent the occurrence of a large number of defects by detecting the abnormality.

Next, FIG. 9 is a display example of the temporal transition information of the glossiness of the solder, in which five solder portions located at the four corners and the center on the substrate are specified, and the time of the glossiness of the solder at the specific portion is specified. This is a display of the target transition information.

In FIG. 9, reference numeral 81 denotes a substrate to be inspected.
g to k indicate the specified solder sites. Reference numeral 82 denotes a temporal transition of the solder gloss, and reference numeral 83 denotes a lower limit value in the quality judgment.

As shown in the figure, the solder gloss in the areas g to k has changed to a value larger than the lower limit value 83, and is not determined to be defective. However, the solder gloss in the solder parts g to i has decreased. I understand.

The cause of the decrease in the solder gloss may be an unstable temperature of the reflow furnace in the reflow soldering step (step D shown in FIG. 11) which is an upstream step, contamination of impurities in the furnace, and the like. If a furnace is examined and abnormalities are dealt with, mass occurrence of defects can be prevented.

The light projecting section 1 of the first embodiment of the above-mentioned solder state output device is constituted by a ring-shaped color fluorescent light source.
Alternatively, it may be constituted by a laser light source or the like which irradiates a fan-shaped plane light to a solder part from an oblique direction.

For example, when a laser light source is used, the imaging section 2 located directly above the solder portion captures an image of a light cutting line formed at the solder portion by plane laser light, and the shape of the light cutting line is determined based on the shape of the light cutting line. The height of the cream solder surface,
Alternatively, the inspection data regarding the three-dimensional shape such as the fillet angle of the solder is calculated. When an X-ray light source is used, a light receiving unit such as a photomultiplier tube is used instead of the imaging unit 2 to receive photoelectrons emitted from a solder part.

As described above, according to the first embodiment of the solder state output device of the present invention, the data processing unit 12 uses the inspection data of each mounting board input from the control unit 13 to determine the time of the state of the solder part. Time transition information of the test data indicating the temporal transition, and the temporal transition information is displayed on the display unit 10.
, The quality trend of the solder part can be accurately grasped, so that the deterioration of the quality of the solder part can be prevented,
Quality control can be performed efficiently.

Next, FIG. 10 is a system configuration diagram showing an embodiment of a solder inspection system of the present invention using a second embodiment of the solder state output device of the present invention.

The solder inspection system of the present invention shown in FIG. 10 is used in the inspection step B or the inspection step E in FIG.

In FIG. 10, reference numeral 91 denotes an automatic solder inspection device incorporated in a production line 92 in a component mounting process, and reference numeral 93 denotes a second embodiment of the solder status output device of the present invention.

The automatic solder inspection apparatus 91 is composed of a floppy disk drive, a data output section 95 having a network connection section connected to a LAN cable 94, and the like, and calculates various inspection data indicating the state of the solder portion of the board to be inspected. Then, the quality of the substrate to be inspected is determined based on the inspection data, and the inspection file including the substrate number of the substrate to be inspected, the inspection time, the inspection data, and the quality determination result is written to the floppy disk 96 by the data output unit 95. Write or output to LAN cable 94.

The solder state output device 93 includes a data input section 97, a storage section 98, an input section 99, a display section 100, a data processing section 101, and a control section 102.

The data input section 97 has a floppy disk drive and a network connection section connected to the LAN cable 94, and receives the inspection file output from the automatic solder inspection apparatus 91 from the LAN cable 94,
Alternatively, the data is read from the floppy disk 96. Whether the delivery of the inspection file is performed by the LAN cable 94 or the floppy disk 96 is selected by the user.

The storage unit 98 has a memory such as a RAM, is used as a work area for the data processing unit 101 and the control unit 13, and outputs from the data processing unit 12 and the control unit 102 in accordance with an instruction from the control unit 102. The stored various data is stored.

The input unit 99 has a keyboard and the like, and an operator operates the input unit 99 to input various data and instructions.

The display unit 100 has a display such as a CRT and a printer, and displays or prints out various data such as pass / fail judgment results sent from the control unit 102 and information on time transition of inspection data. Whether the temporal transition information of the inspection data is displayed on a display or printed out by a printer is selected by an operator.

The data processing unit 101 creates time transition information of the inspection data indicating the time transition of the state of the solder part from the inspection time and the inspection data of each board inputted from the automatic board inspection apparatus.

The control section 102 has a microprocessor or the like, and controls the data input section 97, the storage section 98, the display section 100, and the data processing section 101 in accordance with various data and instructions input from the input section 99 by the operator. The operation is controlled, and the result of the pass / fail judgment of the substrate, the information on the temporal transition of the inspection data, and the like are displayed on the display of the display unit 100 or printed out from the printer.

Next, the operation of the embodiment of the solder inspection system of the present invention having the above configuration will be described.

The automatic solder inspection apparatus 91 calculates various inspection data indicating the state of the solder part from the received light data obtained by irradiating the solder part of the board to be inspected carried in from the manufacturing line 92 with light. The quality of the substrate to be inspected is determined based on the inspection data. The inspection data and the pass / fail judgment result are sent to the data output unit 95, and the data output unit 95 writes an inspection file including the board number of the board to be inspected, the test time, the test data, the pass / fail judgment result, and the like to the floppy disk 96. Or output to the LAN cable 94.

On the other hand, in the solder state output device 93,
The data input unit 97 receives the inspection file output from the automatic solder inspection device 91 from the LAN cable 94 or reads the inspection file from the floppy disk 96.

The control unit 102 stores the inspection file obtained by the data input unit 97 in the storage unit 98, and inputs the inspection time and inspection data of the substrate to be inspected in the inspection file data to the data processing unit 101. The data processing unit 101 sequentially creates temporal transition information of the inspection data as shown in FIGS. 7 to 9 from the inspection time and the inspection data of each substrate.

When the operator operates the keyboard of the input unit 99 to input an output command of the temporal transition information of the inspection data, the control unit 102 transmits the temporal transition information according to the operator's request from the data processing unit 101. Is read out, and for example, the temporal transition information for each area of the cream solder amount as shown in FIG. 8 is read and displayed on the display of the display unit 100 or printed out by a printer.

When an output command of the board quality judgment result is input, the control unit 102 reads out the quality judgment result of the requested board number from the storage unit 99 and outputs it from the display unit 100.

As described above, according to the embodiment of the solder inspection system using the second embodiment of the solder status output device of the present invention, the solder status output device is connected to the production line 9 in the component mounting process.
2, the solder inspection system is configured as offline, and the data processing unit 101 of the solder status output device uses the inspection data of each board input from the automatic board inspection device to change the time transition of the state of the solder part. By producing time transition information of the inspection data to be shown and outputting this time transition information from the display unit 100 in response to an operator's request, the quality trend of the solder part can be monitored when necessary without stopping the production line 92. Since it can be grasped accurately, it is possible to prevent the deterioration of the quality of the solder part, and it is possible to efficiently control the quality.

[0101]

According to the present invention, as is apparent from the above-described embodiment, by producing time transition information of inspection data and outputting this time transition information, the quality trend of the solder portion on the substrate can be accurately determined. Therefore, it is possible to prevent the deterioration of the quality of the solder part, and to effectively control the quality.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a first embodiment of a solder state output device of the present invention.

FIG. 2 is a configuration diagram of a light projecting unit in the first embodiment of the solder state output device of the present invention.

FIG. 3 is a flowchart showing a board inspection procedure in the first embodiment of the solder state output device of the present invention.

FIG. 4 is an explanatory diagram showing an example of a color image of a cream solder surface.

FIG. 5 is an explanatory diagram showing a principle of detecting a solder surface by a blue light source.

FIG. 6 is an explanatory diagram illustrating an example of a color image of a solder surface.

FIG. 7 is an example of temporal transition information.

FIG. 8 is a display example of temporal transition information of a cream solder amount.

FIG. 9 is a display example of temporal transition information of glossiness of solder.

FIG. 10 is a system configuration diagram showing an embodiment of a solder inspection system of the present invention using a second embodiment of the solder state output device of the present invention.

FIG. 11 is an explanatory diagram showing a component mounting step.

[Description of Signs] 1 Projection unit 2 Imaging unit 3 X-axis table unit 4 Y-axis table unit 5 Control processing unit 6 Imaging controller 7 Image processing unit 8 Judgment unit 9, 98 Storage unit 10, 99 Input unit 11, 100 Display Unit 12, 101 Data processing unit 13, 102 Control unit 14 White light source 15, 16 Blue light source 17 Inspection substrate 91 Automatic solder inspection device 92 Manufacturing line 93 Solder condition inspection device 94 LAN cable 95 Data output unit 96 Floppy disk 97 Data input Department

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) G01B 11/00-11/30 102 G01N 21/84-21/958

Claims (15)

(57) [Claims] 1. A method of irradiating a substrate with light, calculating inspection data indicating a state of a solder part on the substrate from light reception data obtained by receiving the reflected light, and determining a state of the solder part on the basis of the inspection data. What is claimed is: 1. A solder state output device for outputting , comprising: a data processing means for creating and outputting information indicating a time transition of inspection data of a specific solder part on the substrate in the device. 2. A substrate is irradiated with light, and the reflected light is received.
The state of the solder part on the board from the received light data
The inspection data shown is calculated, and based on this inspection data,
This is a solder status output device that outputs the status of solder parts.
Te, in the apparatus, the upper substrate is divided into a plurality of regions, the solder-state output device having a data processing means for creating and outputting information indicating the temporal transition of the test data in the respective regions. Wherein said data processing means is a data processing means for creating and outputting information indicating the temporal transition of the inspection data amount of solder, solder-state output device according to claim 1 or claim 2, wherein. 4. The method according to claim 1, wherein the data processing means includes a gloss level of the solder .
A data processing means for creating and outputting information indicating the temporal transition of the test data, the solder state output device according to claim 1 or claim 2, wherein. 5. The method according to claim 1, wherein the data processing means includes a cream solder.
A data processing means for creating and outputting information indicating the temporal transition of the amount of test data, according to claim 1 or solder state output device according to claim 2. 6. A substrate produced by a substrate inspection apparatus.
Based on the inspection data indicating the condition of the solder
This is a solder status output device that outputs the status of solder parts.
Te, within the device, <br/> solder-state output device having a data processing means for creating and outputting information indicating the temporal transition of the test data for a particular soldering site on the substrate. 7. created by board inspection apparatus, based on the inspection data indicating the state of the solder sites on the substrate, a solder-state output device for outputting the state of the solder site in the device, the substrate A solder state output device comprising: a data processing unit that divides an upper part into a plurality of regions and creates and outputs information indicating a temporal transition of inspection data in each region . 8. The method according to claim 1, wherein the data processing unit checks a solder amount.
8. The solder status output device according to claim 6, wherein the output device is a data processing unit that creates and outputs information indicating a time transition of data. Wherein said data processing means, solder gloss
8. The solder state output device according to claim 6 , wherein said data output means creates and outputs information indicating a time transition of said inspection data. Wherein said data processing means is a data processing means for creating and outputting information indicating the temporal transition of the inspection data cream solder <br/> da amount, claim 6 or claim 7
The described solder state output device. 11. A substrate is irradiated with light, and the reflected light is received.
Of the solder part on the board from the received light data obtained by
A board inspection apparatus for calculating inspection data indicating
Based on the inspection data from the inspection device,
And a solder status output device that outputs the status
A solder inspection system, wherein the solder status output device includes a specific solder portion on the substrate.
A solder inspection system including data processing means for creating and outputting information indicating a time transition of inspection data of a position . 12. A substrate is irradiated with light, and the reflected light is received.
Of the solder part on the board from the received light data obtained by
A board inspection apparatus for calculating inspection data indicating
Based on the inspection data from the inspection device,
And a solder status output device that outputs the status
A solder inspection system, wherein the state output device divides the substrate into a plurality of regions.
And a data processing means for generating and outputting information indicating a temporal transition of the inspection data in each area . Wherein said data processing means is a data processing means for creating and outputting information indicating the temporal transition of the test <br/>査data amount of solder, claim 11 or claim 12, wherein
Solder inspection system. 14. The method of claim 13, wherein the data processing means, solder gloss
11. A data processing means for creating and outputting information indicating a time transition of the degree inspection data.
2. The solder inspection system according to 2 . 15. The method of claim 14, wherein the data processing means, cream Han
A data processing means for creating and outputting information indicating the temporal transition of da amount of inspection data, according to claim 11 or claim 1 2 Solder inspection system according.