JP3274985B2 - Transistor - Google Patents
TransistorInfo
- Publication number
- JP3274985B2 JP3274985B2 JP19050897A JP19050897A JP3274985B2 JP 3274985 B2 JP3274985 B2 JP 3274985B2 JP 19050897 A JP19050897 A JP 19050897A JP 19050897 A JP19050897 A JP 19050897A JP 3274985 B2 JP3274985 B2 JP 3274985B2
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- heat sink
- conductive plate
- coating material
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明はトランジスタの形
状に係わり、特に、放熱板の取付時に発生する切りこで
ショートすることを防止したトランジスタに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the shape of a transistor, and more particularly to a transistor which is prevented from being short-circuited by a cut generated when a heat sink is attached.
【０００２】[0002]
【従来の技術】従来のトランジスの形状の例を図２
（ａ）に示す。図に示すように樹脂被覆材１の下面に導
電性プレート２が固着されている。導電性プレート２は
コレクタに接続されている。樹脂被覆材１と導電性プレ
ート２を通して放熱板締着用穴１ａが設けられている。2. Description of the Related Art FIG. 2 shows an example of a conventional transistor shape.
(A). As shown in the figure, a conductive plate 2 is fixed to a lower surface of a resin coating material 1. The conductive plate 2 is connected to the collector. A heat sink fastening hole 1 a is provided through the resin coating material 1 and the conductive plate 2.
【０００３】図２（ｂ）に上記トランジスタを放熱板３
に締着する状態を示す。放熱板３にはハーフパンチによ
り凹み３ａが設けられ、凹み３ａの底には貫通穴が設け
られている。トランジスタにマイカ板等で作られた絶縁
シート４を重ねタッピンねじ５をトランジスタの放熱板
締着用穴１ａを通して放熱板３の貫通穴にねじ込むこと
によりトランジスタを放熱板３締着する。そのとき発生
する切りこは凹み３ａに入る。[0003] FIG.
Shows the state of fastening. The heat sink 3 is provided with a recess 3a by half punching, and a through hole is provided at the bottom of the recess 3a. The transistor is fastened to the heat sink 3 by placing an insulating sheet 4 made of a mica plate or the like on the transistor and screwing a tapping screw 5 into the through hole of the heat sink 3 through the heat sink fastening hole 1a of the transistor. The cut generated at that time enters the recess 3a.
【０００４】[0004]
【発明が解決しようとする課題】上記した従来のトラン
ジスタを放熱板に締着する場合、放熱板３の平面度がで
ていないとか、放熱板とトランジスタの間に隙間がある
と、タッピンねじ５をねじ込むときに発生する切りこが
放熱板３と導電性プレート２の間に入り放熱板３と導電
性プレート２がショートすることがあった。When the above-mentioned conventional transistor is fastened to a heat sink, if the flatness of the heat sink 3 is not sufficient or if there is a gap between the heat sink and the transistor, the tapping screw 5 is not provided. In some cases, a notch generated when screwing is inserted between the heat radiating plate 3 and the conductive plate 2 to short-circuit the heat radiating plate 3 and the conductive plate 2.
【０００５】この発明は上記した点に鑑みてなされたも
のであって、その目的とするところは、放熱板の取付時
に発生する切りこでショートすることのないトランジス
タを提供することにある。The present invention has been made in view of the above points, and an object of the present invention is to provide a transistor that is not short-circuited by a cut generated when a heat sink is attached.
【０００６】[0006]
【課題を解決するための手段】この発明のトランジスタ
は、絶縁被覆材の下面に導電性プレートが固着され、前
記絶縁被覆材と導電性プレートを通して放熱板締着用の
穴が設けられたトランジスタにおいて、前記絶縁被覆材
に前記穴を囲む外形非円形のリング状の突起を導電性プ
レートの表面から突出するように設けたものである。According to a transistor of the present invention, a conductive plate is fixed to a lower surface of an insulating coating material, and a hole for fastening a heat sink through the insulating coating material and the conductive plate is provided. A ring-shaped projection having a noncircular outer shape surrounding the hole is provided on the insulating covering material so as to protrude from the surface of the conductive plate.
【０００７】[0007]
【発明の実施の形態】この発明の実施例であるトランジ
スタを図面に基づいて説明する。図１はこの発明の実施
例であるトランジスタに放熱板が取付けられた状態を示
す断面図である。トランジスタには従来の例で説明した
ものと同様に樹脂被覆材１の下面に導電性プレート２が
固着されている。導電性プレート２はコレクタに接続さ
れている。樹脂被覆材１の下面には外形が非円形の突起
１ｂが導電性プレート２の穴から突出するように設けら
れている。突起１ｂの中心に放熱板締着用穴１ａが設け
られている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A transistor according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a state in which a heat sink is attached to a transistor according to an embodiment of the present invention. The conductive plate 2 is fixed to the lower surface of the resin coating material 1 in the same manner as described in the conventional example. The conductive plate 2 is connected to the collector. On the lower surface of the resin coating material 1, a projection 1 b having a non-circular outer shape is provided so as to protrude from a hole of the conductive plate 2. A heat sink fastening hole 1a is provided at the center of the projection 1b.
【０００８】トランジスタに締着される放熱板３にはハ
ーフパンチにより突起１ｂの外形に合わせた凹み３ａが
設けられ、凹み３ａの底には貫通穴が設けられている。
上記トランジスタにマイカ板等で作られた絶縁シート４
を重ね、タッピンねじ５をトランジスタの放熱板締着用
穴１ａを通して放熱板３の貫通穴にねじ込むことにより
トランジスタを放熱板３に締着する。凹み３ａの底部と
突起１ｂの先端との間にある程度の隙間ができるように
設定されている。The heat sink 3 fastened to the transistor is provided with a recess 3a corresponding to the outer shape of the projection 1b by half punching, and a through hole is provided at the bottom of the recess 3a.
Insulation sheet 4 made of mica plate etc. for the above transistor
The transistor is fastened to the heat sink 3 by screwing the tapping screw 5 into the through hole of the heat sink 3 through the heat sink fastening hole 1a of the transistor. It is set so that a certain gap is formed between the bottom of the recess 3a and the tip of the projection 1b.
【０００９】トランジスタの締着時に発生する切りこは
凹み３ａに入る。凹み３ａは突起１ｂで覆われているの
で切りこが放熱板３と導電性プレート２の間に入りこむ
ことがなく、放熱板３と導電性プレート２がショートす
ることが防止される。また、突起１ｂを凹み３ａに合せ
ることにより、トランジスタを放熱板に取付けるときの
位置出しが簡単となる。なお、突起１ｂの外形を非円形
とし、凹み３ａを突起１ｂの外形に合せているので、タ
ッピンねじをねじ込むときにトランジスタが回転するこ
とを防止できる。The notch generated when the transistor is fastened enters the recess 3a. Since the recess 3a is covered with the projection 1b, the cut does not enter between the heat radiating plate 3 and the conductive plate 2, thereby preventing a short circuit between the heat radiating plate 3 and the conductive plate 2. In addition, by aligning the projection 1b with the recess 3a, the positioning when the transistor is mounted on the heat sink is simplified. Since the outer shape of the projection 1b is made non-circular and the recess 3a is matched with the outer shape of the projection 1b, the transistor can be prevented from rotating when the tapping screw is screwed.
【００１０】[0010]
【発明の効果】この発明のトランジスタによれば、放熱
板の取付時に、トランジスタの導電性プレートと放熱板
とがねじ締め時発生する切りこでショートする恐れがな
い。According to the transistor of the present invention, when the heat sink is mounted, there is no possibility that the conductive plate of the transistor and the heat sink are short-circuited by the cut generated when the screw is tightened.
【００１１】また、絶縁被覆材の突起の外形を非円形と
しているので、ねじで放熱板を締着するときにトランジ
スタが回転することを防止できる。Further, since the outer shape of the projection of the insulating coating material is made non-circular, it is possible to prevent the transistor from rotating when the heat sink is fastened with a screw.
【図１】この発明の実施例であるトランジスタに放熱板
が取付けられた状態を示す断面図である。FIG. 1 is a sectional view showing a state in which a heat sink is attached to a transistor according to an embodiment of the present invention.
【図２】図２（ａ）は従来のトランジスタの例を示す斜
視図、図２（ｂ）は同トランジスタに放熱板が取付けら
れた状態を示す断面図である。FIG. 2A is a perspective view showing an example of a conventional transistor, and FIG. 2B is a cross-sectional view showing a state where a heat sink is attached to the transistor.
１ 樹脂被覆材、１ａ 放熱板締着用穴、１ｂ 突起 ２ 導電性プレート ３ 放熱板、３ａ 凹み ４ 絶縁シート ５ タッピンねじ DESCRIPTION OF SYMBOLS 1 Resin coating material, 1a Heat sink fastening hole, 1b protrusion 2 Conductive plate 3 Heat sink, 3a recess 4 Insulating sheet 5 Tapping screw
Claims (1)
着され、前記絶縁被覆材と導電性プレートを通して放熱
板締着用の穴が設けられたトランジスタにおいて、前記
絶縁被覆材に前記穴を囲む外形非円形のリング状の突起
を導電性プレートの表面から突出するように設けたこと
を特徴とするトランジスタ。1. A transistor having a conductive plate fixed to a lower surface of an insulating coating material and a hole for fastening a heat sink through the insulating coating material and the conductive plate, wherein the insulating coating material surrounds the hole. A transistor characterized in that a non-circular ring-shaped protrusion is provided so as to protrude from a surface of a conductive plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19050897A JP3274985B2 (en) | 1997-07-01 | 1997-07-01 | Transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19050897A JP3274985B2 (en) | 1997-07-01 | 1997-07-01 | Transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1126644A JPH1126644A (en) | 1999-01-29 |
| JP3274985B2 true JP3274985B2 (en) | 2002-04-15 |
Family
ID=16259266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19050897A Expired - Fee Related JP3274985B2 (en) | 1997-07-01 | 1997-07-01 | Transistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3274985B2 (en) |
-
1997
- 1997-07-01 JP JP19050897A patent/JP3274985B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1126644A (en) | 1999-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2273474A1 (en) | Electronic circuit device and method of fabricating the same | |
| US6101092A (en) | Heat-dissipating structure of an electronic part | |
| JP3175584B2 (en) | Power control device | |
| JPH073674Y2 (en) | Electronic device | |
| JP4089300B2 (en) | Substrate storage box | |
| JP3274985B2 (en) | Transistor | |
| JP2574194Y2 (en) | Metal core board mounting structure | |
| KR100665215B1 (en) | A securing structure for an electric element to heat-sinks | |
| JPS5840613Y2 (en) | heat sink | |
| JPH10189803A (en) | Mounting structure of insulating substrate for heat dissipating plate | |
| JP2000068671A (en) | Head dissipating equipment | |
| JP4274340B2 (en) | Electronics | |
| JPS608444Y2 (en) | Printed circuit board heating element heat dissipation structure | |
| JP2546304Y2 (en) | Device for fixing semiconductor elements | |
| JPH1041602A (en) | Fixing structure of high frequency circuit board | |
| JPH0316314Y2 (en) | ||
| JPS598364Y2 (en) | Insulating case for electronic equipment | |
| JP3597004B2 (en) | Heatsink mounting structure | |
| JPH0429499Y2 (en) | ||
| JPS6141365U (en) | automotive alternator | |
| JP2541441Y2 (en) | Antenna mounting device | |
| JP2709973B2 (en) | Heat dissipation mechanism of transistor | |
| JP2558396Y2 (en) | Electronic component mounting structure | |
| JPH034038Y2 (en) | ||
| JPH0445279Y2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080201 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090201 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100201 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110201 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120201 Year of fee payment: 10 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120201 Year of fee payment: 10 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120201 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130201 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130201 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140201 Year of fee payment: 12 |
|
| LAPS | Cancellation because of no payment of annual fees |