JP3267148B2 - Multilayer printed wiring board and portable wireless communication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lessen a printed board in weight by a method wherein a large number of weight reduction holes are regularly provided in a conductor pattern which spreads wide. SOLUTION: A conductor pattern 82 which spreads over nearly all the surface of a printed wiring board 81, foot patterns 85 for connecting lead wires, and checkered patterns 86 which are regularly arranged are formed. In each checker of the checkered pattern 86, a trapezoidal weight reduction hole which is provided on each side of a first slant pattern 27 that is coincident with the diagonal line of each checker of the checkered pattern 86, and a right-angled triangular weight reduction hole which is demarcated with a second slant pattern 88 and each checker of the checkered pattern 86a and provided on each side of the trapezoidal weight reduction hole are regularly and symmetrically provided. The trapezoidal weight reduction hole and the right-angled triangular weight reduction hole provided in each checker of the checkered pattern 86 are combined so as to form a polygon. Weight reduction holes regularly arranged on a certain layer are made to deviate relatively in position from other weight reduction holes arranged on the other layer so as to stop a leakage electromagnetic waves from penetrating, whereby a printed wiring board can be improved in electromagnetic shielding effect.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a printed wiring board. In portable wireless communication devices, portable telephones, or portable information processing devices, information communication devices, etc., miniaturization, high density, and thinning are being promoted. The same is true.

In the case of a printed wiring board, which is a circuit board, appropriate insulation layers and thinner conductors, and appropriate thickness and thinner conductor layers have been studied. Almost at the limit.

For example, in a current portable telephone, a printed wiring board occupies 30% of the total weight of electrical components excluding a battery part. This printed wiring board is 6
It has a layered structure, and the conductor (Cu) of the printed wiring board is 60% of the weight of the printed wiring board. Therefore, if this conductor can be effectively reduced within a range that does not affect the electrical effect, it greatly contributes to weight reduction. Therefore, it is not easy to simply reduce the thickness of the conductor because it is a limit as described above.

FIG. 22 shows the structure of the upper and lower layers and the middle four layers.
FIG. 2 is a plan view of a main part of a multilayer printed wiring board 10 having a plurality of conductor layers, in which each layer is shifted to a separated state and seen from the top.

[0005] The conductor layer is made of, for example, a thin film obtained by attaching a conductor (Cu) foil to the surface of an insulating substrate obtained by impregnating a cloth made of glass fiber with an epoxy resin, forming a circuit pattern by etching, and performing Cu plating as necessary. Circuit board,
This is a so-called multi-layer printed wiring board made of a glass-epoxy board, in which a prepreg made of an epoxy resin is interposed, and the layers are formed by heating and compression so as to provide insulation and adhesion between layers. The circuit connection between the conductor layers between the respective layers is made by a through hole for connecting the layers or a conductor through hole formed by a through hole only between predetermined layers.

[0006] The conductor layers are, in order from the upper surface in the figure, a first layer 11,
The second layer 12, the third layer 13, the fourth layer 14, the fifth layer 15, and the sixth layer 16 are, for example, a high-frequency circuit including a radio frequency on the first layer 11 side, and a telephone function on the sixth layer 16 side. Circuit
The second layer 12 and the fifth layer 15 are power circuits, and the third layer 13 and the fourth layer 14 are ground circuits. In the drawing, the respective circuit patterns are not shown, and reference numeral 18 is a mounting hole.

[0007]

2. Description of the Related Art A conventional printed wiring board 20 corresponding to the structure shown in FIG. 22 is shown in FIG. 23 as an enlarged view of a first layer 21 to a third layer 23, and a fourth layer 24 to a sixth layer 26.
FIG. 24 is an enlarged view of FIG. These figures show circuit patterns of typical conductor layers, respectively.
The reference numerals 21 to 26 correspond to the reference numerals 11 to 16 in FIG.
These are the corresponding parts.

Referring to the first layer 21 on the surface, a frame-like ground conductor pattern 27 having a width which is relatively wide around the frame.
(The conductor pattern having a spread is shown in a hatched area, but the same is applied to other places, the places shown below), and the conductor through holes for ground connection are formed at small intervals. 28 are provided.

On the inner side, a QFP type lead connection foot pattern 29 for mounting an IC is formed in a frame shape in parallel, and a square ground conductor pattern 31 is formed at the center thereof. Are also provided with a large number of conductor through holes for ground connection.

[0010] In addition, a ground conductor pattern and a ground connection conductor through-hole, which are spread in important places, and a power supply conductor pattern and a power supply connection conductor through-hole are formed.

The lead connection foot pattern 29 is connected to the linear circuit connection pattern 32, the ground connection conductor through hole, the power supply connection conductor through hole, and the like.

Other large and small square conductive patterns 33
Is a conductor pattern for mounting an SMD (Surface Mount Component), which is connected to the main circuit by a linear circuit connection conductor pattern or a conductor through hole, respectively.

The second layer 22, which is the second intermediate layer, is a (solid) power supply conductor pattern 35 having a spread. A grounded conductor through hole 36 for connection and a power supply conductor through hole 37 connected to the first layer 21 are formed.

The third intermediate layer 23, which is a third intermediate layer, is a (solid) ground conductor pattern 41 having a spread, and a ground connection conductor through which is connected to the ground conductor pattern 41 is provided around and around the third layer 23. A power supply conductor through hole 43 connected to the hole 42 and the power supply conductor pattern 35 of the second layer 22 and insulated in a ring shape;
A linear independent circuit connection pattern 44 for bypass connection of one circuit pattern is formed to be connected by circuit connection conductor through holes at both ends.

Referring to FIG. 24, the fourth intermediate layer, ie, the fourth
The layer 24 has a spread (solid) ground conductor pattern 5.
5 and a conductor through hole 56 for ground connection connected to this ground conductor pattern 55
And a power supply conductor through hole 57 connected to the power supply conductor pattern of the fifth layer 25 and insulated in a ring shape.

A fifth intermediate layer 25, which is a fifth layer 25, is a (solid) power supply conductor pattern 61 having a spread. And a power supply connection conductor through hole 63 connected to the sixth layer 26 are formed.

On the lower surface of the sixth layer 26, a frame-like ground conductor pattern 65 having a relatively wide width around the periphery is formed, and ground connection conductor through holes 66 are provided at small intervals. On the inner side, a square conductor pattern 67 for circuit configuration, a linear circuit connection conductor pattern 68, a power supply connection conductor through hole 69, and other circuit patterns (not shown) are formed.

Around the first layer 21 to the sixth layer 26,
Through holes 2 for connecting ground conductors formed in rows
8, 36, 42, 56, 62 and 66 are all connected to the ground and the same potential as through through holes, and are shielded to prevent transmission of leakage electromagnetic waves from an internal circuit because of small intervals. It works.

Other conductor through holes for ground connection,
The conductor through-holes for power supply connection, the conductor through-holes for circuit connection, and the like are also formed by appropriately connecting the necessary conductor patterns between layers.

In FIG. 25, a circuit conductor pattern formed on an appropriate layer of the printed wiring board 20, for example, the first layer 21, includes a linear first conductor pattern 71, a band-shaped second conductor pattern 72, and a spread. The third conductive pattern 73 having a width and the similar fourth pattern 74 are formed.
These are set in a signal line pattern, a power supply line pattern, a ground conductor pattern, and the like.

As shown, the second conductor pattern 72, the third conductor pattern 73, and the fourth conductor pattern 74 have wide and narrow variations in the extending direction due to various factors, as shown. Is formed.

[0022]

SUMMARY OF THE INVENTION As described above,
A printed wiring board is formed by complexly combining conductor patterns of various shapes. Regarding the shape, the shape is various, such as a narrow conductor pattern, a conductor pattern having a spread, a conductor pattern which is a combination thereof, and the like.

Since such a shape is required to satisfy the electrical characteristics, it is set as such. The existence of the conductor is a considerable amount of the weight of the Cu foil layer, the Cu plating layer, and the like. If it is possible to reduce this, further weight reduction measures can be obtained.

However, as described above, the reduction of the thickness and the reduction of the width have already been technically studied to the limit state, and have been carried out. The feasibility of relying on such a method is hardly hopeful.

In view of the above problems, an object of the present invention is to further reduce the weight of a printed wiring board.

[0026]

Means for Solving the Problems The gist of the means of the present invention for solving the above-mentioned problems is that the first means is that a large number of regular weight reducing holes are provided in a spread conductive pattern. It is a printed wiring board.

Providing a large number of regular weight reduction holes results in a fine mesh-shaped conductor pattern, and therefore does not substantially reduce the electrical area. The weight of the board will be reduced. If necessary, a conductor through hole can be provided in the weight reducing hole so as to be disconnected from the conductor pattern.

The second means is a printed wiring board in which the weight reducing holes of the first means are polygonal. By forming a regular polygon, a fine mesh conductor pattern formed between adjacent sides of the polygon can be obtained, and an optimum conductor width can be arbitrarily set.

A third means is a printed wiring board in which the weight reducing holes of the second means are turtle-shaped. By making the regular polygon a turtle shape, it is possible to minimize the entire width of the fine mesh conductor pattern formed between adjacent sides of the turtle shape.

A fourth means is a printed wiring board in which the weight reducing holes of the first means are circular. The regular circular shape can be a fine mesh-shaped conductor pattern by appropriately selecting and setting a true circle, an ellipse, an oval, and the like, and an optimal conductor layer can be arbitrarily set. Can be.

A fifth means is a printed wiring board in which the weight reducing holes of the first means have a diagonal pattern passing through a diagonal line of the mesh pattern. Combination with a diagonal pattern of the grid pattern can form a regular fine mesh and maintain good electrical characteristics.

The sixth means is a printed wiring board in which a wide conductor pattern portion is provided with a weight reducing hole shaped in accordance with the outer shape of the conductor pattern. The weight reduction of the printed wiring board can be achieved by providing a weight reduction hole having a shape along the outer shape within the wide conductor pattern portion within a range that does not greatly affect the electrical characteristics. If necessary, it is also possible to provide a conductor through hole in a non-connected state to the conductor pattern in the weight reducing hole.

A seventh means is a printed wiring board in which the conductor pattern to which the first means to the sixth means is applied is a multilayer, and at least one of the conductor patterns is provided with a weight reducing hole. It is.

Since the printed wiring board is a multilayer printed wiring board, the more layers it is applied to, the more the weight reduction can be achieved. Eighth means is a printed wiring board formed by laminating a first conductor layer and a second conductor layer in which a large number of regular weight reducing holes are provided in a conductor pattern having a spread,
This is a printed wiring board in which the positions of the weight reduction holes of the first conductor layer and the second conductor layer are relatively shifted.

By shifting the positions of the regularly arranged lightening holes relatively between the layers, the lightening holes can
Since the conductor is covered with the conductor between the weight reduction holes adjacent to the other layers, the shielding action and the effect of preventing the transmission of the leaked electromagnetic wave are remarkable despite the existence of the weight reduction holes.

[0036]

BEST MODE FOR CARRYING OUT THE INVENTION The printed wiring board of the present invention will be described in detail below with reference to the accompanying drawings, based on embodiments based on the gist of the structure. It is to be noted that like parts are denoted by like reference numerals throughout the drawings.

FIG. 1 is a plan view of a printed wiring board according to a first embodiment of the present invention, showing an evaluation model of a conductor pattern having a spread in which a weight reducing hole is formed. The external dimensions of the printed wiring board 81 are the actual size, for example,
The width is set to about 45 mm and the length is set to about 100 mm. That is, a conductive pattern 82 having a spread is formed on almost the entire surface of the printed wiring board 81, and a QFP type IC mounting area 83 is provided at two locations inside the conductive pattern 82.

At the center of the IC mounting area 83, there is provided a frame-shaped conductor pattern 84 having a spread, and on the four surrounding sides, foot patterns 85 for connecting lead wires are arranged in parallel to form a frame. ing.

Each of the conductor pattern 82 having a spread and the frame-shaped conductor pattern 84 is a rectangular mesh pattern 86 in the vertical and horizontal directions in the drawing, and a first diagonal pattern passing through a diagonal line of the mesh pattern 86. A first weight reduction pattern 89 composed of a first oblique line pattern 87 and a second oblique line pattern 88 extending in parallel with the first oblique line pattern 87 and across the middle of each side of the mesh pattern 86 is regular. Is formed.

The conductor pattern 8 having such a spread
2 is a region corresponding to the power supply conductor pattern 35 or the ground conductor pattern 41 in the prior art, as shown in FIG. 23, for measuring the amount of weight reduction, and for measuring the shielding function of the electric electromagnetic shield; Are considered.

Incidentally, the size of the mesh is 2.5 m on each side.
m, the first oblique line pattern 8 extending diagonally is included in each of the mesh-shaped patterns 86.
7, trapezoidal weight reducing holes, and right triangular weight reducing holes formed by the second oblique line pattern 88 and the grid pattern 86 on both sides thereof are formed in a contrasting and regular manner. You. The mesh pattern 86, the trapezoidal weight reducing hole, and the right triangle triangular weight reducing hole are all formed by a combination of polygons.

The large-diameter hole is a hole 91 for attachment to a housing or the like, and the small-diameter hole is a conductor through hole 92. FIG. 2 is a plan view of a printed wiring board according to a second embodiment of the present invention, showing an evaluation model of a conductor pattern having a spread in which a weight reducing hole is formed. The external dimensions of the printed wiring board 93 are the actual size, for example, the width is about 4
The length is set to 5 mm and the length is set to about 100 mm.

A conductor pattern 94 having a spread over the entire area of the printed wiring board 93 is formed. The conductor pattern 94 is formed as a second weight reduction pattern 95. That is, in the second weight reduction pattern 95, a large number of turtle-shaped weight reduction holes 97 are regularly formed adjacent to each other in a certain direction.

That is, they are regularly arranged in a line in the width direction and in a staggered arrangement in the length direction. In the figure, the middle part of the formation region of the tortoise-shaped weight reduction hole 97 is not shown. This tortoise-shaped weight reducing hole 97 is a polygon, that is, a regular hexagon.

The conductor pattern 94 having such a large area is
As shown in FIG. 23, in a region corresponding to the power supply conductor pattern 35 or the ground conductor pattern 41 in the related art, measurement of a weight reduction amount, measurement of a shielding function of an electric electromagnetic shield, and the like are studied. Is what is done.

The conductor pattern width between adjacent portions of the tortoise-shaped weight reducing holes 97 is at least 0.3 mm, for example, the inscribed circle of the regular hexagon has a diameter of 1.47 mm, and the diameter of the circumscribed circle. Is about 1.7 mm, and is configured as a fine mesh as a whole.

In the drawing, a portion 98 where the weight reducing hole 97 is not continuous in the region where the weight reducing hole 97 is formed is a portion where a conductor through hole connected to the conductor pattern 94 is formed in a later step. Also in the present embodiment, the large-diameter hole is a hole 91 for attachment to a housing or the like.

FIG. 3 shows an enlarged view of only about half of a different conductor pattern 94 of the printed wiring board 93 of the embodiment shown in FIG. In this embodiment, the formation area of the large-area conductor pattern 94 is shown with diagonal lines, and the turtle-shaped weight reducing holes 97 extend over substantially the entire surface. Inside, the conductor pattern 9
4 indicates that a conductor through hole 99 in a non-connected state is provided. The diameter of the conductor through hole 99 is about 0.3 mm.

FIG. 4 is an enlarged view of the first to third layers of the printed wiring board of the present invention corresponding to the configuration 10 of the printed wiring board shown in FIG. An enlarged view is shown in FIG. These configurations can correspond to FIG.

The printed wiring board 100 of the present invention has a first layer 1
01, the second layer 102, the third layer 103, the fourth layer 104, the fifth layer 105, and the sixth layer 106. In these figures, the circuit patterns of typical conductor layers are shown for easy understanding. For the sake of simplicity, it is shown so as to correspond to the prior art shown in FIGS.

Therefore, reference numerals 101 to 106 seem to correspond to reference numerals 11 to 16 in FIG. 22, respectively.
Further, according to the present embodiment, the conductor pattern portion having the spread, which is applied to the evaluation model shown in FIGS. 1, 2, and 3, is effectively combined and applied to the conductor pattern portion having the spread. It is in.

Referring to the first layer 101 on the surface, a frame-shaped ground conductor pattern 11 having a relatively wide width around the periphery is provided.
1 are formed, and conductor through holes 1 for ground connection are formed at small intervals.
12 are provided.

A lead connection foot pattern 85 for mounting a QFP type IC is formed in a frame on the inner side, and a square ground conductor pattern 84 is formed at the center thereof. A large number of conductor through holes for ground connection are provided therein.

In addition, a ground conductor pattern and a ground connection conductor through-hole, which are spread at important points, and a power supply conductor pattern and a power supply connection conductor through-hole are formed.

The lead connection foot pattern 85 is connected to the linear circuit connection pattern 113, the ground connection conductor through hole, the power supply connection conductor through hole, and the like.

Other Large and Small Square Conductor Patterns 11
Reference numeral 4 denotes a conductor pattern for mounting an SMD (Surface Mount Component), which is connected to a main circuit by a linear circuit connection conductor pattern or a conductor through hole.

The grounding conductor patterns 111,
84, a first weight reduction pattern 89 composed of a rectangular grid pattern 86 having a rectangular shape in the vertical and horizontal directions and a first diagonal line pattern 87 extending diagonally to the grid pattern 86 is regularly arranged. Is formed.

This first weight reduction pattern 89 is the same as that shown in FIG.
Is basically the same as that described with reference to FIG. 1, and the first mesh pattern 86 has a first diagonal line in each mesh pattern 86.
On both sides of the oblique line pattern 87, a right triangle triangular weight reduction hole formed by the mesh pattern 86 is formed in a contrasting and regular manner. The mesh pattern 86 and the right triangle triangular weight reducing holes are all formed by a combination of polygons.

The second intermediate layer 102, which is a second intermediate layer, is a (solid) power supply conductor pattern 115 having a range and spread indicated by hatching.
15 is applied to a second weight reduction pattern 95 in which a turtle-shaped weight reduction hole 97 is regularly formed.

In the periphery and in the main part, the ground connection conductor through hole 11 penetrating through the center of the torso-shaped weight reduction hole 97 so as not to be connected to the power supply conductor pattern 115.
6 and a power supply connection conductor through hole 117 connected to the power supply conductor pattern 115 in the middle of the tortoise-shaped weight reducing hole 97 and connected to the first layer 101.

The size and arrangement of the turtle-shaped weight reducing holes 97 are the same as those described with reference to FIGS. The third intermediate layer 103, which is the third intermediate layer, is a (solid) ground conductor pattern 121 having a range and expansion indicated by hatching, and the ground conductor pattern 121 has a turtle-shaped weight reduction hole 97. Are formed regularly, and a second weight reduction pattern 95 is applied.

The conductor through hole 1 for ground connection connected to the ground conductor pattern 121 is provided around and around the main part.
23 and the second-layer power supply conductor pattern 102 so as not to be connected to the conductor through hole 123 for ground connection.
, And a power supply connection conductor through hole 124 penetrating the center of the tortoise-shaped weight reducing hole 97, and a linear independent circuit connection conductor pattern 125 bypassing the circuit pattern of the first layer 101. Are formed so as to be connected by circuit through conductor through holes at both ends.

Referring to FIG. 5, a fourth intermediate layer 104, which is a fourth intermediate layer, is a (solid) ground conductor pattern 126 having a range and spread indicated by hatching. The second weight reduction pattern 95 in which the turtle-shaped weight reduction holes 97 are regularly formed is applied.

In the periphery and in the main part, a ground connection conductor through hole 1 connected to this ground conductor pattern 126 is provided.
27, and connected to the power supply conductor pattern of the fifth layer 105,
A power supply connection conductor through hole 128 penetrating the center of the tortoise-shaped weight reduction hole 97 is formed.

The fifth intermediate layer 105, which is the fifth intermediate layer, is a (solid) power supply conductor pattern 131 having a range and expansion indicated by hatching.
A second weight reduction pattern 95 in which a turtle-shaped weight reduction hole 97 is regularly formed is applied to 31.

In the periphery and in the main part, a ground connection conductor through hole 132 penetrating through the center of the tortoise-shaped weight reducing hole 97 without being connected to the power supply conductor pattern 131, and a power supply connected to the sixth layer 106. Connection conductor through hole 1
33 are formed.

On the lower surface of the sixth layer 106, a frame-like ground conductor pattern 135 having a relatively wide width around the periphery is formed, and ground connection conductor through holes 136 are provided at small intervals. On the inner side, a square conductor pattern 137 for circuit configuration, a linear conductor pattern 138 for circuit connection, a conductor through hole 139 for power supply, and other circuit patterns (not shown) are formed.

The spread ground conductor pattern 135 and the like are all square mesh patterns 86 in the illustrated vertical and horizontal directions.
And a first diagonal line pattern 87 passing through the diagonal line of the mesh pattern 86, a first weight reduction pattern 89 is regularly formed.

The first weight reduction pattern 89 is the same as that shown in FIG.
Is basically the same as that described with reference to FIG. 1, and the first mesh pattern 86 has a first diagonal line in each mesh pattern 86.
On both sides of the oblique line pattern 87, a right triangle triangular weight reduction hole formed by the mesh pattern 86 is formed in a contrasting and regular manner. The mesh pattern 86 and the right triangle triangular weight reducing holes are all formed by a combination of polygons.

The ground connection conductor through holes 112, 116, 123, 127, 132 and 136 formed in rows around the first layer 101 to the sixth layer 106 are
When all are laminated as a multilayer printed wiring board, they are connected to the same potential as the ground through holes as through holes, and because of their small spacing, they function to prevent leakage of electromagnetic waves leaking from internal circuits and to shield. Is what you do.

Other conductor through holes for ground connection,
The conductor through-holes for power supply connection, the conductor through-holes for circuit connection, and the like are also formed by appropriately connecting the necessary conductor patterns between layers.

The first weight reduction pattern 89 and the second weight reduction pattern 95 are not limited to the present embodiment, but can be appropriately replaced or combined.

As described above, the weight of the printed wiring board can be reduced by about 30% as compared with the conventional one by applying the weight reducing pattern to the conductor pattern having the spread. , With no significant impact on the data.

FIG. 6 is a partially enlarged view showing a first embodiment of the second weight reduction pattern applied to the printed wiring board of the present invention. The weight reduction pattern 95-1 has a regular hexagonal (polygonal) shape in the area where the conductor pattern 94 having the spread and shaded area is formed, in the vertical and horizontal directions, and in the middle part thereof. Weight reduction hole 9
7 are provided in a large number of directions.

In order to provide a conductor through hole 99 in a state where it is not electrically connected to the conductor pattern 94,
As shown in the figure, a small-diameter through hole can be provided at the center of the tortoise-shaped weight reducing hole 97 to be formed.

The size of the tortoise-shaped weight reducing hole 97, the width of the conductor between adjacent ones, the diameter of the conductor through hole 99, and the like are set as described above. FIG. 7 is a partially enlarged view showing a second embodiment of the second weight reduction pattern applied to the printed wiring board of the present invention. Weight reduction pattern 95-2
Is a conductor pattern 94 having a diagonally shaded extension.
Are formed in the vertical and horizontal directions at intervals of P2 and P3, and a large number of regular hexagonal (polygonal) turtle-shaped weight reducing holes 97 at regular intervals. The relationship between P2 and P3 is (2 × P2 = P3)
It is.

According to the present embodiment, the width of the conductor 94 between the adjacent weight reducing holes 97 can be reduced uniformly, so that the residual ratio of the conductor 94 can be reduced and the weight can be further reduced. Can be.

In order to provide the conductor through hole 141 in an electrically connected state with the conductor pattern 94, as shown in the figure, a portion where the tortoise-shaped weight reducing hole 97 is not provided is formed. It can be formed by providing a through hole. This is the same in the embodiment of FIG.

The conductor pattern 94 can be provided with a conductor through hole in a state where it is not electrically connected by providing a through hole at the center of the tortoise-shaped weight reduction hole 97.

The size of the tortoise-shaped weight reducing hole 97, the width of the conductor between adjacent holes, the diameter of the conductor through hole, and the like are set as described above. FIG. 8 is a partially enlarged view showing a third embodiment of the second weight reduction pattern applied to the printed wiring board of the present invention. The weight reduction pattern 95-3 is
In the area where the conductive pattern 94 having the spread and shaded area is formed, the interval of P4 and the interval of P5 in the vertical and horizontal directions, and a hexagonal (polygonal) turtle-shaped weight reduction hole 97 in the middle between them. Are provided in a fixed direction. The relationship between P4 and P5 is that
The width between the respective sides of the conductor 94 is set to be constant or approximately constant.

According to the present embodiment, the residual ratio of the conductor 94 can be further reduced, so that the weight can be significantly reduced. In order to provide the conductor through hole 141 in an electrically connected state with the conductor pattern 94, as shown in the drawing, a portion where the tortoise-shaped weight reduction hole 97 is not provided is formed, and a through hole is formed here. It can be provided and formed.

In the state where the conductor pattern 94 is not electrically connected, it is possible to provide a conductor through hole by providing a through hole at the center of the tortoise-shaped weight reduction hole 97.

The size of the tortoise-shaped weight reducing hole 97, the width of the conductor between adjacent ones, the diameter of the conductor through hole, and the like are set as described above. FIG. 9 is a partially enlarged view showing a first embodiment of the third weight reduction pattern applied to the printed wiring board of the present invention. The weight reduction pattern 145 is a rectangular weight reduction hole formed of a regular quadrangle (polygon) at the interval of P1 in the vertical and horizontal directions and in the middle of the area where the conductor pattern 94 having the spread and shaded area is formed. Many 146 are provided with the direction being constant, with the diagonal direction being the vertical and horizontal directions.

According to this embodiment, the width of the conductor 94 between the sides of the adjacent weight reduction hole 146 can be set to be constant. By providing an appropriate curved surface (R surface) as shown in the figure at the corner of the square weight reducing hole 146, the diameter ratio between the circumscribed circle and the inscribed circle can be reduced.

In order to provide a conductor through hole 99 in a state where it is not electrically connected to the conductor pattern 94,
As shown in the figure, a small-diameter through hole can be provided at the center of the square weight reduction hole 146 to form the hole.

In order to provide a conductor through hole in a state of being electrically connected to the conductor pattern 94, it is necessary to form a portion where the square weight reducing hole 146 is not provided and provide a through hole there. it can.

The size of the rectangular weight reducing hole 146, the width of the conductor between adjacent holes, the diameter of the conductor through hole, and the like are set to be the same as or similar to those of the previously described turtle-shaped weight reducing hole 97. FIG. 10 shows a first embodiment applied to the printed wiring board of the present invention.
A first embodiment of the weight reduction pattern of the first embodiment is shown in a partially enlarged view. The weight reduction pattern 89-1 is provided in a region where the conductor pattern 82 having the spread and shaded area is formed, in the vertical and horizontal directions at an interval P1 in a square mesh pattern 86.
A first diagonal pattern 87 passing through a diagonal line of the grid pattern 86, and a second diagonal pattern passing through the middle of each side of the grid pattern 86 in parallel with the first diagonal pattern 87. The first weight reduction pattern 89-1 composed of the first and second weight reduction patterns 88 is regularly formed.

The first weight reduction pattern 89-1 has a size of one side of the grid of 2.5 mm, a grid-shaped pattern 86,
The conductor width of each of the first oblique line pattern 87 and the second oblique line pattern 88 is 0.3 mm.

Also, in one mesh pattern 86,
Each has a trapezoidal weight reducing hole 151 on both sides of the first oblique line pattern 87 and a second oblique line pattern 88 on both sides thereof.
And a right triangle triangular weight reduction hole 152 formed by the mesh pattern 86 and the square pattern 86 are formed in a contrasting and regular manner.

The mesh pattern 86, the trapezoidal weight reducing holes 151, and the right triangular weight reducing holes 152 are all combinations of polygons. FIG.
Next, a second embodiment of the first weight reduction pattern applied to the printed wiring board of the present invention is shown in a partially enlarged view. (A) is a plan view, and (b) is a side sectional view of only one layer. The weight reducing pattern 89-2 is formed in the region where the conductor pattern 82 having the hatched spread is formed.
A square mesh pattern 86 having an interval P1 in the vertical and horizontal directions, a first diagonal pattern 87 passing through a diagonal line of the mesh pattern 86, and each side of the mesh pattern 86 parallel to the first diagonal pattern 87 , A first weight reduction pattern 89-2 composed of a second oblique line pattern 88 crossing the middle of the pattern is regularly formed.

The above configuration is the same as that shown in FIG. 10, but the directions of the first oblique line pattern 87 and the second oblique line pattern 88 are different by 90 °. Further, a conductor through-hole 155 electrically connected to the mesh pattern 86, the first oblique line pattern 87, and the second oblique line pattern 88 is provided at an appropriate position where an enlarged pattern 156 surrounding the conductor through-hole 155 is provided. It is formed with.

Further, through conductor through holes 157 for connecting other layers which are not electrically connected to the mesh pattern 86, the first oblique pattern 87, and the second oblique pattern 88.
Is formed by providing a patterned conductor break portion 158 around the conductor through hole 157.

The weight reduction pattern 89-1 shown in FIG.
The first diagonal line pattern 87 and the second diagonal line pattern 88 have different inclination directions, so that these weight reduction patterns 89-1 and 89-2 are combined between adjacent layers, so that the first diagonal line in plan view is obtained. The pattern 87 and the second oblique line pattern 88 intersect with each other, so that transmission of the leaked electromagnetic wave can be largely prevented.

FIG. 12 is a partially enlarged view showing a third embodiment of the first weight reduction pattern applied to the printed wiring board of the present invention. The weight reduction pattern 89-3 includes a rectangular mesh pattern 86 with a space P1 in the vertical and horizontal directions, and a diagonal line of the square pattern 86 in a region where the conductor pattern 82 having a hatched spread is formed. Are formed, the two first diagonal lines 87 intersect at the center of the grid pattern 86. With this configuration, the first weight reduction patterns 89-3 are regularly formed.

In each mesh pattern 86, four right-angled triangles each composed of each side of the mesh pattern 86 and two sides of the two first oblique line patterns 87 are provided. The weight reduction holes 161 are formed symmetrically and regularly. The mesh pattern 86 and the right triangle triangular weight reduction hole 161 are all formed by a combination of polygons.

According to the weight reduction pattern 89-3,
The two first diagonal patterns 87 in the grid pattern 86
Is formed, the effect of preventing the transmission of the leaked electromagnetic wave is increased even by one layer. A conductor through hole can be formed in the same manner as in FIG.

FIG. 13 is a partially enlarged view of a first embodiment of the fourth weight reduction pattern applied to the printed wiring board of the present invention. The fourth weight reduction pattern 165 includes a conductor pattern 166 in which regular hexagons with a spacing P1 are continuously formed in a region where the conductor pattern 82 having a diagonally shaded spread is formed; The conductor pattern 166 is formed of three diagonal patterns 167 passing through each diagonal line, and is formed regularly.

Therefore, the conductor pattern 166 of the turtle shell shape
The three oblique line patterns 167 will intersect at the center of the inside, and within one turtle-shaped conductor pattern 166,
Six regular triangular weight reduction holes 168 each having one side of the conductor pattern 166 having a turtle-shape and each side of each of the adjacent oblique line patterns are formed in a contrasting and regular manner. These turtle-shaped conductor patterns 166 and equilateral triangular weight reduction holes 168 are all combinations of polygons.

The fourth weight reduction pattern 165 is adjacent to each side of the regular triangle weight reduction hole 168, and is respectively symmetrical with the symmetric regular triangle weight reduction hole 16 via the conductor width.
It can also be considered that 8 is continuously formed regularly.

The interval P1 is about 5.0 mm, and the conductor width is 0.1 mm.
It is about 3 mm, and since each oblique line pattern intersects at the apex of an equilateral triangle, it is difficult to transmit the leaked electromagnetic wave, the residual ratio of the conductor is small, and the weight reduction effect is large.

FIG. 14 is a partially enlarged view showing a first embodiment of the fifth weight reduction pattern applied to the printed wiring board of the present invention. The fifth weight reduction pattern 171 is formed by regularly forming circular weight reduction holes 173 in the vertical and horizontal directions at the interval where the conductor pattern 172 having the diagonally hatched extension is formed and at the middle thereof. Are provided in large numbers.

According to this embodiment, since the conductor width between the adjacent weight reduction holes 173 is such that only the vertex of the circular arc is closest, and both sides are widened, the amount of transmission of the leaked electromagnetic wave can be reduced. That is, the shielding effect is large.

In order to provide a conductor through hole 174 in a state where it is not electrically connected to the conductor pattern 171, a small through hole is provided at the center of the circular weight reducing hole 173 as shown in the figure. be able to.

In order to provide a conductor through hole in a state of being electrically connected to the conductor pattern 171, a portion where the circular weight reduction hole 173 is not provided may be formed and a through hole may be provided here. it can.

The size of the circular weight reducing hole 173, the width of the conductor between adjacent ones, the diameter of the conductor through hole, and the like are set to be the same as or similar to those of the previously described tortoise-shaped weight reducing hole 97.
FIG. 15 is a plan view and an enlarged view of a main part of one embodiment of a sixth weight reduction pattern applied to the printed wiring board of the present invention. The sixth weight reduction pattern 181 includes a lead wire pattern 183 extending from a rectangular lead wire connecting foot pattern 182 arranged in parallel, and an SMD arranged opposite to the lead wire pattern 183.
(Surface mount components) A lead wire pattern 185 extending from a rectangular conductor pattern 184 for connection is shown.
These foot patterns 182 and the square conductor pattern 1
Numeral 84 indicates that an electronic component, for example, a lead wire of a QFP type IC device, an electrode terminal of a chip resistor is mounted and soldered. In order to perform the soldering well, for example, Au plating is applied. .

For the reason described below, in order to limit the range of Au plating, a solder resist is applied on the printed wiring board instead of the plating resist, and a solder resist film 186 is formed to cover the surface. At this time, by forming window holes 187 as shown in the drawings, only the portions necessary for soldering are allowed to look through the foot pattern 182 and the square conductor pattern 184 on the surface, and Au plating is applied here. Do. In this manner, the pattern 182,
Plating is formed only on the 184 portion, so that the weight can be reduced and the usage amount of Au is correspondingly reduced.

FIG. 16 is an enlarged side sectional view of an essential part of one embodiment of the seventh weight reduction pattern applied to the printed wiring board of the present invention. This figure is an explanatory view of a method of forming a weight reduction pattern according to the present invention, and shows a multilayer printed wiring board 100 laminated in six layers.

First layer 101, second layer 102, third layer 10
Each of the third, fourth, fourth, fifth, and fifth layers 104, 105, and 106 is a patterned conductor layer, and an insulating layer is interposed between them.

After the above-mentioned layers 101 to 106 have undergone the steps of alignment between the layers and lamination hardening, through holes 191 for through holes are formed at predetermined positions. The diameter of the pilot hole 191 is, for example, 0.3 mm.
It is about.

On the surfaces of the first layer 101 and the sixth layer 106, for example, a solder resist film 192 is applied instead of the plating resist film, and the first layer 101 surrounding the lower hole 191 and the sixth layer 106 are formed.
The layer 106 is exposed in a ring shape. Also, the third layer 103
Only peeping around the inner surface of the pilot hole 191. First layer 10
The ring-shaped portion 193 on the surface of the first and sixth layers 106 is 0.6
The diameter is set to about mm.

Referring to FIG. 17, the first layer 101 and the sixth
The state where the Cu plating layer 195 is formed by the electrolytic plating method after the electroless plating is performed on the ring-shaped portion 193 and the prepared hole 191 of the layer 106 is shown. This allows
Since the first layer 101 is electrically connected to the third layer 103 and the sixth layer 106, a conductor through hole 196 having a sufficient thickness is obtained.

Since the other conductive pattern surfaces of the first layer 101 and the sixth layer 106 are covered with the solder resist film 192 and are not formed with Cu plating or the like, the weight of the printed wiring board 100 can be reduced. Can be planned.

FIG. 18 is an enlarged plan view of a main part of one embodiment of the eighth weight reduction pattern applied to the printed wiring board of the present invention. In the present embodiment, in order to facilitate understanding, the second weight reduction pattern 95 shown in FIGS. 6, 7, and 8 will be described as a representative example. In addition,
As an example, the layers have a relationship of two layers of an n-th layer and an (n + 1) -th layer.

In the region of the n-th layer shown by the solid line where the conductor pattern 94 (n) having the diagonally shaded spread is formed, the intervals P2 and P3 in the vertical and horizontal directions and the interval between them are regular hexagons. A large number of square (polygonal) tortoise-shaped weight reducing holes 97 (n) are provided in a fixed direction. The relationship between P2 and P3 is (2 × P2 = P3).
This is the same as FIG. Therefore, the size of the tortoise-shaped weight reduction hole 97, the width of the conductor between adjacent holes, and the like are as described above.

The (n + 1) th layer is the same as the (n) th layer with respect to the conductor pattern 94 (n + 1) and the weight reducing hole 97 (n + 1) having an extension, but as shown by the dotted line, the X (horizontal) direction in the drawing. The n-th layer and the n-th layer at a position that is half the pitch of P2,
The weight reduction holes 97 of the +1 layer are set to overlap.

By adopting such a configuration, electromagnetic waves that are to be transmitted and leaked through the weight reducing holes 97 work so as to be shielded by the conductor portions of the conductor patterns adjacent to each other in the conductor pattern of the weight reducing holes 97, which is effective. The electromagnetic shielding will be performed on the target.

By selecting and positioning the residual width of the conductor pattern between the weight reducing holes 97 effectively so as to cover the weight reducing holes 97 of the adjacent layer, a further shielding effect can be obtained.

The embodiment of the present invention employs a turtle-shaped weight reducing hole 9.
The present invention is not limited to 7, and can be applied to all the patterns formed by the other weight reducing holes described above.
Needless to say, it will be easily understood without explanation.

In FIG. 19, a circuit pattern formed on an appropriate layer of the printed wiring board 100, for example, the first layer 101 includes a linear first conductive pattern 201, a band-shaped second conductive pattern 202, , And a similar fourth conductive pattern 204 is formed. These are set in a signal line conductor pattern, a power line conductor pattern, a ground conductor pattern, and the like.

As shown, the second conductor pattern 202, the third conductor pattern 203, and the fourth conductor pattern 204 change in width in the extending direction due to various electrical factors. It is formed so as to have.

In the second conductor pattern 202, a portion 211 having a spread is formed along the outer shape of the portion.
A weight reducing hole 213 having a shape that is equivalent in width to the narrow portion 212 is provided.

The third conductive pattern 203 has weight portions 215, 216, and 217, each having a width, extending along the outer shape of each of the width portions 215, 216, and 217 so as to have a width necessary for forming a circuit. 218, 219, and 221 are provided.

In the fourth conductor pattern 204, weight reducing holes 224, each having a width necessary for circuit formation, are formed along the outer widths of the widened portions 222, 223, respectively. 225 are provided.

The weight of the printed wiring board is affected by providing regular weight reduction holes in the width portion having the spread of the conductor pattern as described above and having a shape along the outer shape of the conductor pattern. The conductor pattern can be effectively reduced without affecting the electrical pattern.

FIG. 20 shows an electrical evaluation / measurement method by forming a weight-reducing conductor pattern in a conductor pattern region having a spread of the printed wiring board of the present invention. That is, when the printed wiring board 101 is, for example, 2
The printed wiring board 10 is provided on the material substrate 231 formed by the number of sheets.
A conductor pattern 232 for measuring electrical characteristics is formed along 1.

By connecting a measuring instrument to the conductor pattern for measurement and measuring the characteristic impedance in the range of 50Ω ± 7.5Ω by the TDR method, the degree of reduction in the weight of the conductor pattern and its influence can be measured.

FIG. 21 shows the printed wiring board 235 of the present invention.
Shown for shape. A positioning reference hole 236 for attachment is formed at one end of the printed wiring board 235, and the other four mounting holes 237 and 238 are formed as U-shaped openings that open at the ends of the printed wiring board, thereby providing a circular shape. Rather than using holes, the substrate and the conductor pattern of the printed wiring board can be reduced, so that the weight can be reduced.

According to the present invention, it is possible to reduce the weight of the printed wiring board itself by as much as 30% as compared with the weight limit by the conventional means by combining the above various means. It is possible.

[0129]

As described in detail above, according to the printed wiring board of the present invention, first, a large number of regular weight reducing holes are provided in a widened conductor pattern, so that a fine mesh-shaped conductor is provided. Because of the pattern, the weight of the printed wiring board can be reduced while maintaining the electrical characteristics without substantially reducing the electrical area. By utilizing the inside of the weight reducing hole, a conductor through hole for connection between layers can be provided.

Second, by making the weight reduction holes polygonal, the parallel conductor width between adjacent weight reduction holes can be set arbitrarily. Third, by making the polygon of the weight reduction hole into a turtle shape, the width of the fine mesh-like conductor pattern formed between adjacent turtle shapes can be minimized.

Fourth, by making the weight reducing holes circular, it is possible to obtain a finer mesh-like pattern by making them into a perfect circle, an ellipse, an oval, or the like. It is also possible to combine such various types of circles, and it is possible to reduce the weight and effectively prevent the transmission of electromagnetic waves.

Fifth, the weight reduction hole is formed by combining the diagonal pattern of the mesh pattern with the diagonal pattern, thereby greatly reducing the weight of the printed wiring board and effectively preventing the transmission of electromagnetic waves. I can do it.

Sixth, by providing a weight reducing hole having a shape along the outer shape of the conductor pattern in the wide conductor pattern portion, the amount of weight reduction can be increased without affecting the electrical characteristics. it can.

Seventh, applying the weight reducing means to a multilayer printed wiring board can increase the weight reduction as a whole, so that the effect becomes more remarkable as the number of layers increases.

Eighth, by displacing the positions of the weight reduction holes of the printed wiring boards to be laminated, the opening portions of the mutual weight reduction holes are covered with the conductor pattern between the weight reduction holes, that is, the so-called covering effect is obtained. As a result, the function and effect of blocking the transmission of electromagnetic waves become remarkable.

As described above, according to the printed wiring board of the present invention, the present invention is applied to various portable wireless communication devices, portable telephones, portable information processing devices, information communication devices, and the like. The effect that contributes to weight reduction is extremely high.

[Brief description of the drawings]

FIG. 1 is a plan view of a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a plan view of a second embodiment of the printed wiring board of the present invention.

FIG. 3 is an enlarged view of a main part of a conductor pattern layer different from FIG. 2;

FIG. 4 is an enlarged plan view (part 1) of a main part of one embodiment of the printed wiring board of the present invention.

FIG. 5 is an enlarged plan view (part 2) of an essential part of one embodiment of the printed wiring board of the present invention.

FIG. 6 is a partially enlarged view (part 1) of a second weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 7 is an enlarged view (part 2) of a second weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 8 is a partially enlarged view (part 3) of a second weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 9 is a partially enlarged view of a third weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 10 is an enlarged view (part 1) of a first weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 11 is a partially enlarged view (part 2) of a first weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 12 is a partially enlarged view (part 3) of a first weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 13 is a partially enlarged view of a fourth weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 14 is a partially enlarged view of a fifth weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 15 is a partially enlarged view of a sixth weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 16 is an enlarged side sectional view (part 1) of a main part of a seventh weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 17 is an enlarged side sectional view (part 2) of a main part of a seventh weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 18 is a partially enlarged view of an eighth weight reduction pattern applied to the printed wiring board of the present invention.

FIG. 19 is an enlarged view of a main part of a circuit pattern of the printed wiring board of the present invention.

FIG. 20 shows a method for evaluating and measuring a printed wiring board according to the present invention.

FIG. 21 is an embodiment of a printed wiring board shape of the present invention.

FIG. 22 is a plan view of a main part of a multilayer printed wiring board.

FIG. 23 is an enlarged plan view (part 1) of a conventional main part of a multilayer printed wiring board.

FIG. 24 is an enlarged plan view (part 2) of a conventional main part of a multilayer printed wiring board.

FIG. 25 is an enlarged view of a main part of a circuit pattern of a conventional printed wiring board.

[Explanation of symbols]

 Reference Signs List 10 multilayer printed wiring board 11 to 16 first layer to sixth layer 81 printed wiring board 82 conductive pattern 83 IC mounting area 84 conductive pattern 85 foot pattern 86 mesh pattern 87 first oblique pattern 88 second oblique pattern 89 First Weight Reduction Pattern 91 Mounting Hole 92 Conductor Through Hole 93 Printed Wiring Board 94 Conductor Pattern 95 Second Weight Reduction Pattern 97 Tortoise Weight Reduction Hole 98 Part 99 Conductor Through Hole 100 Printed Wiring Board 101-106 1st to 6th layers 111 Ground conductor pattern 112 Ground connection conductor through hole 113 Circuit connection pattern 114 Conductor pattern 115 Power supply conductor pattern 116 Ground connection conductor through hole 117 Power supply connection conductor through hole 121 Ground conductor pattern 123 Contact Connection conductor through hole 124 Power supply connection conductor through hole 125 Circuit connection pattern 126 Grounding conductor pattern 127 Ground connection conductor through hole 128 Power supply connection conductor through hole 131 Power supply conductor pattern 132 Ground connection conductor through hole 133 Power supply connection Conductor through hole 135 Ground conductor pattern 136 Ground connection conductor through hole 137 Conductor pattern 138 Circuit connection conductor pattern 139 Power supply connection conductor through hole 141 Conductor through hole 145 Weight reduction pattern 146 Weight reduction hole 151 Trapezoidal weight reduction hole 152 Right triangle triangular weight reduction hole 155 Conductor through hole 156 Enlarged pattern 157 Conductor through hole 158 Conductor break 161 Right triangle triangular weight reduction hole 165 Weight reduction pattern 166 Tortoiseshell Conductor pattern 167 Diagonal line pattern 168 Weight reduction pattern of equilateral triangle 171 Weight reduction pattern, conductor pattern 172 Conductor pattern 173 Circular weight reduction hole 174 Conductor through hole 181 Weight reduction pattern 182 Foot pattern 183 Lead wire pattern 184 Conductor pattern 185 Lead wire Pattern 186 solder resist film 187 window hole 191 pilot hole 192 solder resist film 193 ring-shaped portion 195 Cu plating layer 196 conductor through hole 201 first conductor pattern 202 second conductor pattern 203 third conductor pattern 204 fourth conductor Pattern 211 Spreading part 212 Narrow part 213 Weight reducing hole 215, 216, 217 Spreading part 218, 219, 221 Weight reducing hole 222, 223 Widening 224, 225 Weight reduction hole 231 Material substrate 232 Conductive pattern 235 Printed wiring board 236 Reference hole 237, 238 Mounting hole

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-7-302979 (JP, A) JP-A-7-321463 (JP, A) JP-A-62-29697 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H05K 1/02 H05K 3/46

Claims (3)

(57) [Claims] 1. A high-peripheral device having a surface-mounted component mounted on a surface layer.
With a wave circuit and an inner layer with a ground conductor layer,
Multilayer having a conductor pattern for detour connection of the high-frequency circuit
In the printed wiring board, the surface layer is formed by the inner-layer ground conductor layer and the through hole.
A conductor pattern having an electrically connected conductor pattern;
Have a regular pattern of holes that do not reach other layers.
Multilayer printed wiring board. 2. A high-periphery mounting surface-mounted component on a surface layer.
With a wave circuit and an inner layer with a ground conductor layer,
Multilayer having a conductor pattern for detour connection of the high-frequency circuit
In portable wireless communication devices equipped with printed wiring boards
Te, the surface layer of the multilayer printed wiring board, the inner layer of the ground
Electrically connected conductors putter by a conductor layer and the through-hole
The conductor pattern has holes that do not reach other layers.
With the law manner, wherein the portable radio communication device. 3. A high-frequency circuit and a multilayer printed wiring board.
In the portable communication device, the multilayer printed wiring board has at least a ground conductor pattern.
And the ground conductor pattern of the inner layer.
Surface ground conductor pattern connected through through hole
A conductive pattern on which the surface mount component is mounted, and
A surface layer on which a circuit connection pattern is formed, and the surface ground conductor pattern formed on the surface layer,
It is large enough to hold the shielding function of the electric electromagnetic shield.
A portable wireless communication device, wherein a plurality of holes not reaching another layer are formed regularly .