JP3265868B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component, and more particularly to a method of holding a resin molded portion by holding terminals formed on a lead frame during resin molding. .

[0002]

2. Description of the Related Art Conventionally, when molding electronic parts with a resin, a large injection pressure cannot be applied, and thus a transfer molding method is widely used. At the time of transfer molding, a mold mold of a dam burr method may be used. FIG. 1 shows transfer molding using a mold die of a dam burr type, wherein 1 is a lead frame, and 2 is an electronic component element such as a piezoelectric component. The electronic component element 2 is connected and fixed to the lead terminals 1a to 1d formed on the lead frame 1 by a known method such as soldering. The lead frame 1 has a pair of wide holding terminals 1e and 1f in addition to the lead terminals 1a to 1d.
Are formed, and the inner end faces of the holding terminals 1 e and 1 f are joined to the outer face of the resin mold portion 3. In a state where the resin mold portion 3 is molded, a resin piece portion called a dam burr 4 is formed integrally with the resin mold portion 3 in a gap between the lead terminals 1a to 1d and the holding terminals 1e and 1f. The dam burr 4 is a thin resin piece having the same thickness as the lead frame 1.

After resin molding, a step of cutting and bending the lead terminals 1a to 1d is performed, and the dam burr 4 is removed during this step. Further, the holding terminals 1e and 1f have a function of holding the resin mold portion 3 on the lead frame 1 during processes such as a characteristic measuring process, a sorting process, and a display process that follow the lead terminal cutting / bending process. After the display step is completed, the resin mold part 3 is separated from the lead frame 1 by pushing up the resin mold part 3 from the lead frame 1.

[0004]

THE INVENTION Problems to be Solved] lead frame 1 but is obtained by pressing a metal plate, 0.1
When processing a thin lead frame having a thickness of about 0.3 mm, the punch-out sagging portion 5 as shown in FIG. 2 is likely to be generated on the end surfaces of the holding terminals 1e and 1f. Therefore, when molding is performed using such a lead frame 1, the cutting sag 5
The resin also goes around.

However, when the resin mold portion 3 is separated from the lead frame 1, the resin that has flowed into the pull-out sag portion 5 becomes a whisker-like burr 6 as shown in FIG.
There is a problem in that the resin e and 1f fall from the joint between the resin mold portion 3 and the resin mold portion 3. Although the burr 6 is very small, if the burr 6 falls on an automatic machine such as a characteristic measuring device or a display device, it causes a failure. For this reason, conventionally, the burr 6 has been removed by using a removing device such as a water jet. However, a special removing device and process are required.
There is a disadvantage that the cost is increased.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing an electronic component which eliminates resin burrs when separating a resin mold portion from a lead frame.

[0007]

In order to achieve the above object, the present invention provides a method in which a lead terminal and a holding terminal are integrally formed.
Electronic components to the lead terminals of the
Step of connecting a child, the periphery including the electronic component element,
The outer surface of the resin mold contacts the tip of the holding terminal
The resin molding process
At the time of loading, connect to the resin mold
The process of simultaneously molding the thin resin pieces
After the resin molding, connect the above lead terminals to the lead frame
And cutting the lead terminals
After that, the resin mold section is read by the holding terminals.
And holding by the holding terminal.
The resin mold part held by the lead frame
Holds by protruding from the back side of the lead frame
Terminal and the resin piece are separated from the resin mold
And It is desirable that the resin piece be used as a resin injection gate.

[0008] stamped lead of the lead frame
An electronic component element is connected to the terminal, and the periphery including the electronic component element is resin-molded. With the outer surface of the resin mold portion is molded so as to be in contact with the tip portion of the holding terminal formed on the lead frame during molding, the holding pins
A thin resin piece that is continuous with the resin mold
Sometimes mold. Therefore, the lead terminal was cut
After that, the resin mold part is retained by the retaining terminals.
It can be handled integrally with the lead frame. Next
Then, the resin mold portion is protruded from the back surface side of the lead frame, and the holding terminal and the resin piece portion are integrally separated from the resin mold portion. At this time, the resin that has flowed into the pull-out portion is separated from the resin mold portion in a state of being integrated with the holding terminal together with the resin piece portion, so that no whisker-like resin burrs are generated. Also, project the resin mold part
In this case, the back of the resin piece is supported by the holding terminals
The holding terminal plays the role of a die,
Separation from

[0009]

4 and 5 show an example of a molded article molded by the method of the present invention. The same parts as those in FIGS. 1 to 3 are denoted by the same reference numerals. A thin resin piece 7 continuous with the resin mold 3 is integrally molded on the back surface of the lead frame 1 and at the boundary between the holding terminals 1 e and 1 f and the resin mold 3. For this reason, the burr portion 6 wrapping around the cutting sag portion 5 at the tips of the holding terminals 1 e and 1 f is reinforced in the thickness direction by the resin piece portion 7. The resin piece 7 communicates with the adjacent resin mold 3, and a resin injection gate 8 is provided in the middle of the resin piece 7.

Next, the resin mold part 3 is separated from the lead frame 1. For separation, the upper surface of the lead frame 1 may be supported by a mold or the like, and the resin mold portion 3 may be pushed up from below. At this time, the holding terminals 1e and 1f of the lead frame 1 function as dies as shown in FIG.
The resin piece 7 and the resin mold 3 are easily separated.
Since the burr portion 6 wrapped around the sag portion 5 is reinforced in the thickness direction by the resin piece portion 7, the burr portion 6 is separated from the resin mold portion 3 integrally with the resin piece portion 7, and furthermore, the holding terminals 1e, It is separated from the resin mold part 3 in a state of being in close contact with 1f. For this reason, the conventional whisker-like resin burrs do not occur, and the operation of removing the burrs is not required.

When an epoxy resin is used as a molding material, the resin piece 7 is strongly adhered to the holding terminals 1e and 1f, so that the resin piece 7 falls off at the time of separation, or whisker-like resin burrs are generated. Can be more reliably prevented.

Further, after the resin piece 7 is molded,
It has a function of holding the resin mold portion 3 with the holding terminals 1e and 1f with respect to the lead frame 1 during the steps from cutting / bending of lead terminals to measurement of characteristics to selection and display. For this reason, the holding strength of the resin mold portion 3 with respect to the lead frame 1 is increased as compared with the conventional product, and the handling of the lead frame 1 during transportation is facilitated.

The resin piece 7 can be easily formed by forming a concave groove in a mold for supporting the back side of the lead frame 1. In this embodiment, the resin piece 7 also serves as a resin injection gate. However, the injection gate may be formed in the resin mold part 3 or may be provided in another part. However, in the case of the configuration as in the embodiment, there is an advantage that the injection gate mark does not remain in the final resin mold portion 3.

In the present invention, the back side of the lead frame is defined as a surface on which a sagging portion is formed at the tip end surface of the holding terminal, or a side opposite to the direction in which the resin mold portion is separated from the lead frame at the time of separation. Say a face. As the molding method, other known methods such as injection molding may be used in addition to transfer molding.

[0015]

As is apparent from the above description, according to the present invention, the periphery including the electronic component element is resin-molded.
At this time, the outer surface of the resin mold part contacts the tip of the holding terminal.
Mold so that the resin mold part is protected.
It can be held by the holding terminal and the back of the holding terminal
Since the thin resin piece that is continuous with the resin mold part is formed on the side at the same time, when the resin mold part is separated from the lead frame, the burr generated at the tip of the holding terminal is integrated with the resin piece. It is possible to prevent the resin burr from being separated from the portion.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conventional lead frame in which an electronic component is molded.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a cross-sectional view showing a step of separating a resin mold portion from a lead frame.

FIG. 4 is a rear view of the lead frame in a state where the electronic component according to the present invention is molded.

FIG. 5 is a sectional view taken along line BB of FIG. 4;

FIG. 6 is a sectional view showing a step of separating a resin mold portion from a lead frame according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 1e, 1f Terminal for holding 2 Electronic component element 3 Resin mold part 4 Dam burr 5 Drip part 6 Burr 7 Resin piece part 8 Gate

Claims (2)

(57) [Claims] The lead terminal and the holding terminal are integrally pressed.
Electronic component elements on the lead terminals of the processed lead frame
And connecting the periphery including the electronic component element to the outer surface of the resin mold portion.
To make contact with the tip of the holding terminal.
During the resin molding,
A thin resin piece that is continuous with the resin mold on the back side of the child
After the resin molding step and the resin terminal
A step of cutting the beam, after cutting the lead terminals, the resin mold portion
Work to hold the lead frame with the above holding terminals
The lead frame is held by the holding terminals.
Push the resin mold section from the back side of the lead frame.
The holding terminal and the resin piece
Separating from the mold part.
Manufacturing method of electronic components. 2. A Oite the production method according to claim 1, a method of manufacturing an electronic component, characterized in that the resin piece and the injection gate of the resin.