JP3261073B2 - Resin composition for printed wiring board, varnish, prepreg and laminated board for printed wiring board using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition used for producing printed wiring boards and the like having excellent dielectric properties and heat resistance, and to varnishes, prepregs and laminates for printed wiring boards using the same.

[0002]

2. Description of the Related Art In recent years, a resin material having a low relative dielectric constant and a low dielectric loss tangent has been desired as a material for a printed wiring board used for high-frequency equipment in the communication field and the like. On the other hand, thermoplastic resins such as fluororesins and polyphenylene ethers with low relative permittivity and dielectric loss tangent have been used, but these are expensive, and they require high temperatures and high pressures during molding and have dimensional stability problems. However, there is a disadvantage that the adhesiveness to metal plating is poor. On the other hand, among thermosetting resin materials, resin materials such as a cyanate ester resin known as a resin having a low relative dielectric constant and a low dielectric loss tangent, and a BT (bismaleimide triazine) resin based on the same have been proposed. However, when these resin materials are used alone, in addition to the problem that the flame resistance and the heat resistance after moisture absorption are inferior, the cured product is brittle due to the rigid skeleton, and cracks are easily generated at the time of drilling a through hole. For this reason, there has been a defect that metal migration (electrolytic corrosion) easily occurs from this crack, and high electrical insulation reliability cannot be satisfied.

In order to improve these problems, a method of using a glycidyl etherified product of phenol novolak described in JP-A-63-54419 in combination with a BT (bismaleimide triazine) resin or a cyanate ester resin has been proposed. Japanese Patent Application Laid-Open No. 3-84040 discloses a method of using a glycidyl etherified product of a phenol-added dicyclopentadiene polymer described in JP-A-2-214474.
And phenol-added butadiene polymers described in JP-A-5-310673, and polyvalent compounds such as bisphenol A described in JP-B-7-47637. Phenol compound, or Japanese Patent Publication No. 4-24370
Patent Document 2: Brominated bisphenol A and hydroxyl etherified product of brominated bisphenol A described in
Glycidyl etherified product of brominated phenol novolak described in JP-A-286723, JP-A-5-339342
Glycidyl etherified product of brominated bisphenol A disclosed in JP-A-7-207022, and BT (bismaleimide triazine) resin or cyanate ester resin such as a brominated maleimide compound described in JP-A-7-207022. A method of using a flame retardant in combination has been proposed.

[0004]

However, Japanese Patent Application Laid-Open No.
In the method of using an epoxy resin in combination with a cyanate ester resin as disclosed in JP-A-54419, JP-A-2-214474, and JP-A-3-84040, curability at low temperatures, processability, and after absorption of moisture. Although the drawbacks relating to heat resistance, electrolytic corrosion resistance and the like are improved, Tg (glass transition temperature) is lowered and dielectric properties in the GHz band are deteriorated, so that they are insufficient for high frequency applications. Japanese Patent Laid-Open No. 5-
In the method of using a polyhydric phenol compound as disclosed in JP-A-310673 and JP-B-7-47637, the curability and processability are improved, but the Tg is lowered, the adhesiveness, and the moisture absorption are reduced. The problem of poor heat resistance, GH
There has been a problem that the dielectric characteristics in the z band are deteriorated, so that it cannot be used for high frequency applications. In addition, Japanese Patent Publication 4-2437
0, JP-A-2-286723, JP-A-5-
In the method in which a flame retardant is used in combination as disclosed in JP-A-339342 and JP-A-7-207022, although the flame resistance can be added, the Tg is lowered, the heat resistance at the time of moisture absorption and the dielectric property in the GHz band are reduced. There is a problem that characteristics are deteriorated. As described above, in the method of using the epoxy resin, the polyhydric phenol compound and the reactive flame retardant in combination, all of them are GH.
The dielectric properties in the z band are not sufficient, and the Tg also decreases.

[0005] The present invention has been made in view of such a situation, and without reducing Tg or impairing properties such as curability, workability, adhesion, flame resistance, and heat resistance after moisture absorption,
Provided are a resin composition for a printed wiring board, which has excellent dielectric properties in a high frequency band, suppresses the occurrence of metal migration, and imparts high electrical insulation reliability, and a varnish, prepreg, and laminate for the printed wiring board using the same. Aimed at.

[0006]

The present invention comprises (A) a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof, (B) a phenol compound, and (C) a phenol compound.
A resin composition for a printed wiring board, comprising a flame retardant having no reactivity with a cyanate compound and (D) a phenolic antioxidant or an organic sulfur compound antioxidant as essential components. Further, the present invention is a resin varnish for a printed wiring board in which the resin composition for a printed wiring board is dissolved or dispersed in a solvent, further impregnating the substrate with the varnish for a printed wiring board,
It is a prepreg for a printed wiring board obtained by drying at 80 to 200 ° C. Furthermore, the present invention can also use this prepreg for printed wiring boards as a prepreg for interlayer connection of a multilayer printed wiring board, and also stacking a plurality of prepregs for a laminated board and further laminating a metal foil on the outside thereof. It is a laminate for printed wiring boards obtained by heating and pressing.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The material of (A) a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof used in the resin composition for a printed wiring board of the present invention is not particularly limited. Is preferably a compound represented by the formula (1), and specific examples thereof include 2,2-bis (4-cyanatephenyl) propane, bis (4-cyanatephenyl) ethane, and bis (3,5-dimethyl-4).
-Cyanatephenyl) methane, 2,2-bis (4-cyanatephenyl) -1,1,1,3,3,3-hexafluoropropane, α, α′-bis (4-cyanatephenyl) -m-diisopropyl Examples include benzene, cyanate esterified products of phenol-added dicyclopentadiene polymers, and prepolymers thereof. In this,
2,2-bis (4-cyanatephenyl) propane, bis (3,5-dimethyl-4-cyanatephenyl) methane, 2,2-bis (4-cyanatephenyl) -1,
1,1,3,3,3-hexafluoropropane, α,
α′-Bis (4-cyanatephenyl) -m-diisopropylbenzene is more preferred because the cured product has particularly good dielectric properties.

[0008]

Embedded image

The above-mentioned monomer (A) of a cyanate compound having two cyanate groups in the molecule has high crystallinity, and when these monomers are varnished with a solvent, the varnish may vary depending on the solid content concentration. May crystallize. Therefore, it is preferable to use the above-mentioned cyanate compound monomer in the form of a prepolymer. Although the conversion of the cyanate group of the prepolymer is not particularly limited, it is usually 20 to
It is desirable to use a prepolymer converted within the range of 60% by weight. Further, (A) a cyanate compound having two cyanate groups in the molecule or a prepolymer thereof may be used alone or in combination of two or more.

Specific examples of the phenolic compound (B) used in the resin composition for a printed wiring board of the present invention include p-nonylphenol, p-tert-butylphenol, p-tert-amylphenol, and p-ter.
Examples thereof include an alkyl group-substituted phenol compound such as t-octylphenol and a monohydric phenol compound represented by the formula (2). Examples of the monohydric phenol compound represented by the formula (2) include p- (α-cumyl) phenol, and p- (α-cumyl) phenol is preferable. Further, the monohydric phenol compound (B) may be used alone or in combination of two or more.

[0011]

Embedded image (Wherein, R ₄ and R ₅ represent a hydrogen atom or a methyl group, and may be the same or different, and m is 1 to 2
Represents an integer of

The amount of the phenolic compound (B) used in the present invention ranges from 5 to 30 parts by weight based on 100 parts by weight of (A) a cyanate compound having two cyanate groups in the molecule or a prepolymer thereof. It is preferable to mix them. More preferably, it is 7 to 30 parts by weight. If the amount is less than 5 parts by weight, the dielectric properties tend to deteriorate, which is not desirable. If the amount exceeds 30 parts by weight, the storage stability of the varnish when varnished tends to decrease, which is not desirable.

The flame retardant having no reactivity with the cyanate compound (C) used in the resin composition for a printed wiring board of the present invention is limited as long as it does not have a functional group which reacts with a cyanate group. However, as a specific example, 1,
Aliphatic flame retardants such as 2-dibromo-4- (1,2-dibromoethyl) cyclohexane, tetrabromocyclooctane and hexabromocyclododecane, and heterocyclic flame retardants represented by the formula (3). . As the heterocyclic flame retardant represented by the formula (3), 2,4,6-tris (tribromophenoxy) -1,3,5-triazine is preferable.

[0014]

Embedded image (Where l, m, and n represent integers of 1 to 5 and may be the same or different, respectively)

The flame retardant (C) having no reactivity with the cyanate compound is (A) a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof.
It is preferable to mix in a range of 5 to 200 parts by weight with respect to 0 parts by weight. Preferably, it is 5 to 100 parts by weight.
If it is less than 5 parts by weight, the flame retardant effect is poor, and if it exceeds 200 parts by weight, the heat resistance is undesirably reduced.

As the antioxidant (D) used in the resin composition for a printed wiring board of the present invention, a phenolic antioxidant and an organic sulfur compound antioxidant are used alone or in combination. However, specific examples of the phenolic antioxidant include monophenols such as pyrogallol, butylated hydroxyanisole, and 2,6-di-t-butyl-4-methylphenol, and 2,2′-methylene-bis- ( Bisphenols such as 4-methyl-6-t-butylphenol) and 4,4′-thiobis- (3-methyl-6-t-butylphenol);
5-trimethyl-2,4,6 tris (3,5-di-t-
Butyl-4-hydroxybenzyl) benzene, tetrakis- [methylene-3- (3'-5'-di-t-butyl-
4′-hydroxyphenyl) propionate], and high molecular phenols such as methane. Specific examples of the organic sulfur compound-based antioxidant include dilauryl thiodipropionate, distearyl thiodipropionate, and the like. Some of these antioxidants may be used in combination.

The compounding amount of the phenolic antioxidant (D) or the organic sulfur compound antioxidant is based on 100 parts by weight of (A) a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof. , 0.1 to 30 parts by weight. If the amount is less than 0.1 part by weight, no improvement in the insulating properties is observed, and if it exceeds 30 parts by weight, the insulating properties tend to decrease.

In the resin composition for printed wiring boards of the present invention, a curing accelerator for accelerating the curing reaction is used. Specific examples of the curing accelerator include organic metal salt compounds and organic metal complexes such as cobalt, manganese, tin, nickel, zinc, and copper. In particular, organic cobalt salt compounds such as cobalt 2-ethylhexanoate and cobalt naphthenate are preferred. The organometallic salt compounds may be used alone or in combination of two or more. The compounding amount of the curing accelerator is as follows: (A) a cyanate compound having two cyanate groups in the molecule or a prepolymer thereof.
The amount is 0.01 to 3 parts by weight, more preferably 0.1 to 3 parts by weight, within a range that does not deteriorate the mixing effect and the physical properties of the cured product.
02 to 0.5 parts by weight.

The resin composition for a printed wiring board of the present invention may further contain, if necessary, a filler and other additives. As the filler, usually, an inorganic filler is suitably used, and specific examples thereof include fused silica, glass, alumina, titania, zircon, calcium carbonate, and the like.
Examples thereof include calcium silicate, magnesium silicate, aluminum silicate, silicon nitride, boron nitride, beryllia, zirconia, barium titanate, potassium titanate, and calcium titanate.

The resin composition for a printed wiring board of the present invention is subjected to heat curing to provide a laminate having excellent dielectric properties and heat resistance. That is, the resin composition for a printed wiring board of the present invention is dissolved in a solvent to form a varnish once, impregnated into a substrate such as a glass cloth, and dried to prepare a prepreg. Next, a desired number of the prepregs are laminated with a metal foil on the upper and lower sides or on one side and heat-molded to form a printed wiring board or a metal-clad laminate. Here, drying means removing the solvent when a solvent is used, or eliminating fluidity at room temperature when a solvent is not used.

When the resin composition for a printed wiring board of the present invention is varnished, the solvent is not particularly limited, but specific examples include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, and the like. Aromatic hydrocarbons such as xylene, methoxyethyl acetate, ethoxyethyl acetate, butoxyethyl acetate, esters such as ethyl acetate, N-methylpyrrolidone, formamide, N-methylformamide;
Amides such as N, N-dimethylformamide, N, N-dimethylacetamide, methanol, ethanol, ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol, triethylene glycol Alcohols such as monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monopropyl ether, and dipropylene glycol monopropyl ether are used. These solvents may be used alone or in combination of two or more.

The above-mentioned resin varnish for printed wiring boards is impregnated into a base material used for a laminated board such as a glass woven fabric, a glass nonwoven fabric, a plastic woven fabric, a plastic nonwoven fabric, and paper, and then dried at 80 to 200 ° C. To make a prepreg for printed wiring boards. When used as a prepreg for interlayer bonding of a multilayer printed wiring board, the resin content in the prepreg is increased. In addition, when a laminated board for a printed wiring board is required, depending on the required dielectric properties, if a value of a dielectric constant or a dielectric loss tangent is required to be small, the printed wiring board of the present invention having excellent dielectric properties is required. In order to increase the resin composition, the resin content is increased.

A plurality of prepregs for printed wiring boards are stacked, and a metal foil is further laminated on the outside of the prepreg, and heated and pressed to form a laminated board for printed wiring boards.

In general, the dielectric properties of a cured resin are affected by the molecular structure, that is, the amount and strength of polar groups in the molecule, the mobility of the molecular skeleton, and the like. Originally, a cured product of a cyanate ester has a low dielectric constant and a low dielectric loss tangent because it has a triazine skeleton having a low polarity, rigid and symmetric structure. But,
In order to improve heat resistance during moisture absorption, add flame resistance, and reduce cracking during drilling, use a cyanate ester with a reactive flame retardant that has reactivity with epoxy resin, polyhydric phenolic compound and cyanate group. In the conventional resin composition used in combination, a reaction with a cyanate group may produce a structure other than a triazine ring and a high polar group, or a loss of fluidity due to the progress of the curing reaction, resulting in a functional residue that cannot be completely reacted. Since the number of groups increases, Tg and heat resistance decrease, and the relative dielectric constant and the dielectric loss tangent increase. On the other hand, the resin composition for a printed wiring board of the present invention is a phenolic compound having high reactivity with a cyanate group and promoting the formation of a triazine ring among phenolic compounds. In addition, the flame retardant used in the present invention is a flame retardant having a low polarity structure and having no reactivity to a cyanate group. Can be added. Furthermore, by using a phenolic antioxidant or an organic sulfur compound antioxidant, the occurrence of metal migration can be suppressed without impairing properties such as dielectric properties and heat resistance, and a laminate having high electrical insulation reliability can be obtained. The cured product is excellent in curability and has a high Tg, has excellent moldability, workability, adhesiveness, water absorption, heat resistance and flame resistance, and has a low dielectric constant and a low dielectric loss tangent.

[0025]

EXAMPLES The present invention will be described below in more detail, but the present invention is not limited thereto. Example 1 (A) As a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof, bis (3,5-
Prepolymer of dimethyl-4-cyanatephenyl) methane (Arocy M-30, trade name, manufactured by Asahi Ciba Co., Ltd.), flame retardant having no reactivity with (B) p-nonylphenol and (C) cyanate compounds as phenolic compounds As 1,2-dibromo-4- (1,2-dibromoethyl) cyclohexane (SAYTEX BCL
-462, trade name of Albemarle Co., Ltd.) in toluene at the compounding amounts shown in Table 1, and 0.1 part by weight of cobalt naphthenate with respect to 100 parts by weight of a cyanate compound as a curing accelerator, (D ) As phenolic antioxidants, 4,4'-butylidenebis (3-methyl-6-t
tert-butylphenol) was blended at a ratio of 0.5 part by weight to prepare a resin varnish for printed wiring boards having a nonvolatile content of 65% by weight.

Example 2 A prepolymer of 2,2-bis (4-cyanatephenyl) propane (ArocyB-30, trade name of Asahi Ciba Co., Ltd.) and p-tert-butylphenol and tetrabromocyclooctane (SAYTEX BC-48, (Trade name, manufactured by Albemarle Co., Ltd.) in toluene at the compounding amounts shown in Table 1, and further, as a curing accelerator, a cyanate compound 10
0.1 parts by weight of cobalt naphthenate and 0.1 parts by weight of pyrogallol as a phenolic antioxidant are added to 0 parts by weight.
A resin varnish for printed wiring boards was prepared by mixing 5 parts by weight and having a nonvolatile content of 65% by weight.

Example 3 Prepolymer of α, α′-bis (4-cyanatephenyl) -m-diisopropylbenzene (RTX-366, trade name of Asahi Ciba Co., Ltd.), p-tert-octylphenol and hexabromocyclododecane ( CD-75
P, trade name, manufactured by Great Lakes Co., Ltd.) in toluene at the compounding amounts shown in Table 1, 0.1 parts by weight of cobalt naphthenate per 100 parts by weight of a cyanate compound as a curing accelerator, and an organic sulfur compound Dilauryl thiodipropionate was added in an amount of 0.5 part by weight as an antioxidant to prepare a resin varnish for printed wiring boards having a nonvolatile content of 65% by weight.

Example 4 In Example 1, p-nonylphenol was converted to p- (α-
Cumyl) phenol is added to 1,2-dibromo-4- (1,1
Same as Example 1 except that 2-dibromoethyl) cyclohexane was dissolved in toluene at the compounding amount shown in Table 1 in place of brominated triphenylcyanurate (Pyroguard SR-245, trade name of Daiichi Kogyo Seiyaku Co., Ltd.) And non-volatile content 6
A 5% by weight resin varnish for printed wiring boards was prepared.

Comparative Example 1 A resin varnish for a printed wiring board was prepared in the same manner as in Example 1 except that 4,4'-butylidenebis (3-methyl-6-tert-butylphenol) was omitted.

Comparative Example 2 In Comparative Example 1, the prepolymer of bis (3,5-dimethyl-4-cyanatephenyl) methane was replaced with the prepolymer of 2,2-bis (4-cyanatephenyl) propane.
1,2-Dibromo-4- (1,2-dibromoethyl) cyclohexane is converted to a brominated bisphenol A type epoxy resin (ESB400T, trade name of Sumitomo Chemical Co., Ltd.)
A resin varnish for a printed wiring board was prepared in the same manner as in Comparative Example 1, except that the resin varnish was dissolved in toluene in the amounts shown in Table 1 in place of the above.

Comparative Example 3 Comparative Example 2 was the same as Comparative Example 2 except that the brominated bisphenol A type epoxy resin was replaced with brominated bisphenol A (TBA) in toluene at the compounding amount shown in Table 1 except for p-nonylphenol. In the same manner as in 2, a resin varnish for a printed wiring board was produced.

Comparative Example 4 In Comparative Example 2, p-nonylphenol was added to phenol-added butadiene polymer (PP700-300, trade name of Nippon Petrochemical Co., Ltd.) to obtain brominated bisphenol A.
Printed wiring in the same manner as in Comparative Example 2, except that brominated phenol novolak type epoxy resin (BREN-S, trade name of Nippon Kayaku Co., Ltd.) was used and dissolved in toluene at the compounding amount shown in Table 1. A resin varnish for plates was prepared.

[0033]

[Table 1]

The resin varnish for a printed wiring board obtained in each of Examples and Comparative Examples was impregnated into a glass cloth (E glass, basis weight 210 g / m ² ) having a thickness of 0.2 mm, and heated at 140 ° C. for 10 minutes. Thus, a prepreg for a printed wiring board was obtained. Next, four pieces of the obtained prepregs for printed wiring boards were stacked, and copper foil having a thickness of 18 μm was stacked on both sides of the prepreg.
After press-molding under the conditions of Pa, heat treatment was performed at 230 ° C. for 120 minutes to produce a laminate for a printed wiring board.

The obtained laminate for a printed wiring board was measured for dielectric properties, solder heat resistance, Tg (glass transition temperature), flame resistance, copper foil peeling strength, and electrolytic corrosion resistance. Table 2 shows the results.

The test method is as follows. 1 MHz relative dielectric constant (εr) and dielectric loss tangent (tan)
δ): Measured according to JIS C-6481. A relative dielectric constant (εr) of 1 GHz and a dielectric loss tangent (tan)
δ): Measured by a triplate structure straight line resonator method. Tg (glass transition temperature): The copper foil was removed by etching and measured by TMA (thermomechanical analysis).・ Solder heat resistance: PCT is removed by etching, PCT
(121 ° C., 0.22 MPa) and then 260
It was immersed in a molten solder at 20 ° C. for 20 seconds, and the appearance was examined. The number of abnormalities in the table means that there is no occurrence of measling and blistering, and the number for the test number (denominator) is (numerator). -Flame resistance: Measured according to the UL-94 vertical test method. -Copper foil peel strength: Measured in accordance with JIS C-6481.・ Electrolytic corrosion resistance: A test pattern was prepared using each copper-clad laminate with a through-hole hole wall interval of 350 μm, and the test pieces were subjected to 100 V application treatment at 85 ° C. and 90% RH atmosphere, and then the insulation resistance of 400 holes was measured. Was measured over time until conduction breakdown occurred.

[0037]

[Table 2]

As is clear from Table 2, the laminates for printed wiring boards using the resin compositions of Examples 1 to 4 were all Tg.
It has good solder heat resistance at the time of moisture absorption, copper foil peeling strength and electric corrosion resistance, and low relative dielectric constant and dielectric loss tangent at 1 GHz.

On the other hand, the laminate for a printed wiring board of each comparative example in which no phenolic or organic sulfur compound-based antioxidant was blended was inferior in corrosion resistance. In addition, the laminates for printed wiring boards of Comparative Examples 2 to 4 in which a brominated epoxy resin or a brominated phenol compound was blended with a flame retardant had a high relative dielectric constant and dielectric loss tangent of 1 GHz, solder heat resistance when absorbing moisture, and copper foil. Low peel strength.

[0040]

The resin composition for printed wiring boards of the present invention has excellent adhesiveness, flame resistance and heat resistance at the time of moisture absorption when formed into a printed wiring board, suppresses the occurrence of metal migration, and has a high performance. It is suitable as a resin composition for a printed wiring board which maintains electrical insulation reliability and has a low relative dielectric constant and a low dielectric loss tangent in a high-frequency band and is suitable for a device which handles a high-frequency signal.

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁷ Identification code FI C08K 5/3477 C08K 5/3477 5/36 5/36 C09D 179/00 C09D 179/00 H05K 1/03 610 H05K 1/03 610H (72) Inventor Hiroyuki Kuritani 1500 Ogawa, Shimodate-shi, Ibaraki Pref. Hitachi Chemical Co., Ltd. Shimodate Research Laboratory (56) References JP-A-10-273532 (JP, A) JP-A-10-273533 (JP, A JP-A-11-12463 (JP, A) JP-A-11-21452 (JP, A) JP-A-11-21453 (JP, A) JP-A-11-21503 (JP, A) 21504 (JP, A) JP-A-11-124450 (JP, A) JP-A-11-124451 (JP, A) JP-A-11-124452 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08L 79/00-79/08 C08G 73/00-73/26

Claims (12)

(57) [Claims] (A) a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof, (B) a monohydric phenol compound, (C) a flame retardant having no reactivity with the component (A), and (D) A resin composition for printed wiring boards containing a phenolic antioxidant or an organic sulfur compound-based antioxidant. 2. The component (B) is 5 to 30 parts by weight, the component (C) is 5 to 200 parts by weight, and the component (D) is 100 parts by weight of the component (A). The resin composition for a printed wiring board according to claim 1, wherein the component is 0.1 to 30 parts by weight. 3. The material of (A) a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof is 2,2-bis (4-cyanatephenyl) propane or bis (3,5-dimethyl-4). -Cyanate phenyl) methane, 2,2-bis (4-cyanate phenyl)
3. The method according to claim 1, wherein the compound is at least one selected from -1,1,1,3,3,3-hexafluoropropane and α, α′-bis (4-cyanatephenyl) -m-diisopropylbenzene. 4. A resin composition for printed wiring boards. 4. The material of (A) a cyanate compound having two cyanate groups in a molecule or a prepolymer thereof is represented by the formula (1): The resin composition for a printed wiring board according to claim 1, wherein the resin composition is at least one compound represented by the formula: 5. The component (B) is one or more alkyl-substituted monohydric phenol compounds selected from p-nonylphenol, p-tert-butylphenol, p-tert-amylphenol and p-tert-octylphenol. The resin composition for a printed wiring board according to claim 1. 6. The component (B) is represented by the formula (2): (Wherein R ₄ and R ₅ represent a hydrogen atom or a methyl group, and may be the same or different, and m is 1 to 2
Which is a monohydric phenol compound represented by the following formula:
The resin composition for a printed wiring board according to any one of the above. 7. The method according to claim 1, wherein the component (C) is 1,2-dibromo-
The aromatic ring-type flame retardant selected from 4- (1,2-dibromoethyl) cyclohexane, tetrabromocyclooctane and hexabromocyclododecane is at least one kind of the flame retardant according to any one of claims 1 to 6. A resin composition for a printed wiring board. 8. The component (C) is represented by the formula (3): (Wherein, l, m, and n each represent an integer of 1 to 5 and may be the same or different), and are at least one heterocyclic flame retardant represented by the following formula:
7. The resin composition for a printed wiring board according to any one of items 1 to 6. 9. The resin composition for a printed wiring board according to claim 1, wherein the component (D) is a bisphenol-based antioxidant. 10. A resin varnish for printed wiring boards, wherein the resin composition for printed wiring boards according to claim 1 is dissolved or dispersed in a solvent. 11. A prepreg for a printed wiring board obtained by impregnating a substrate with the resin varnish for a printed wiring board according to claim 10 and drying the resin at 80 to 200 ° C. 12. A printed wiring board laminate obtained by laminating a plurality of printed wiring board prepregs according to claim 11, further laminating a metal foil on the outside thereof, and applying heat and pressure.