JP3257785B2 - Manufacturing method of optical transceiver module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical component for optical communication, and more particularly, to a module for transmitting and receiving an optical signal as an optical terminal for an optical subscriber (for each home). And a method for producing the same.

[0002]

2. Description of the Related Art In recent years, construction of an optical fiber network in each home has been seriously studied in order to significantly reduce the cost of large-capacity communication such as video signals and personal computer data. One of the biggest problems confronted there is the price of the optical transmitting and receiving module to be arranged in each home. Conventionally, optical communication has been used in offices and the like that communicate large-capacity signals. In such applications, there was demand even if the price of the optical transceiver module was on the order of 1,000,000 yen. However, if the optical transceiver module were to be placed in each home, it would not spread widely unless the price fell to the order of 10,000 yen. Can't expect. Against this background, low-cost optical transmission / reception modules to be installed in homes are being vigorously developed.

[0003] Conventional optical transmission / reception modules mainly use micro optical components such as lenses. In that case, most of the cost was in the alignment process of each part.
Therefore, the present inventors have proposed a planar lightwave circuit (PlanarLightwave Cir) with a reduced number of components.
Unit: PLC) has been developed. FIG. 16 shows the optical transceiver module manufactured so far. For details, see “Optical Mod
ulle with a Silica-Based P
lanar Lightwave Circuit fo
r Fiber-Optical Subscriber
Systems, "H. Teruietal., IEEE.
E Photon. Technol. Lett. , Vo
l. 4,1992, pp. 660-662. Here, its configuration and principle will be briefly described.

In the planar lightwave circuit 1, an input-side single mode optical fiber 10A and an output-side single mode optical fiber 10B are fixed via glass blocks 9A and 9B, respectively. More specifically, the optical fiber 10
A and 10B are inserted and fixed in grooves provided in the glass block, and the glass blocks 9A and 9B are
The optical axes of A and 10B are adhered and fixed to the planar lightwave circuit 1 such that the optical axes of the optical waveguides 24 and 25 coincide with each other.
The light incident from the input port 24A is converted to a 1.3 μm band light to a through port by a Mach-Zehnder interferometer type wavelength multiplexer / demultiplexer using two directional couplers 24B and 24C.
Light in the 1.55 μm band is output to the cross port. The 1.55 μm band light output to the cross port is directly coupled to the single mode optical fiber 10B at the waveguide end and output to the outside. On the other hand, the 1.3 μm band light output to the through port of the wavelength multiplexer / demultiplexer is split into two by the Y branch 6 and coupled to the laser diode 7 and the photodiode 8, respectively. The laser diode 7 is used for transmitting a transmission signal from the receiver side, and the photodiode 8 is used for converting a received optical signal into an electric signal.

[0005] Here, the light in the 1.55 µm band is used for distributing multi-channel video signals from, for example, a telephone office to ordinary homes, and the light in the 1.3 µm band is used for bidirectional communication of various data signals. used. Therefore, the receiving module in the 1.55 μm band becomes expensive due to reception of a large-capacity signal. Since the optical transmission / reception module which is currently aimed at can transmit and receive various data signals, an expensive 1.55 μm band optical receiver is sent out to 1.3 μm.
Aim for a low-cost module that can transmit and receive only low-speed optical signals in the m-band. Here, it should be added that since 1.55 μm light transmits a large-capacity signal, a single-mode optical fiber must be used when output from the optical transceiver module. For the 1.3 μm band optical signal, the ping-pong system is used, in which the upstream and downstream are temporally separated, so that the restriction on the near-end reflection is loose.

[0006]

As described above, as described above, we have developed an optical transceiver module using a PLC as a low-cost optical terminal for each home. Therefore, the biggest issues are the size of the module and the cost of connecting the optical fiber to the PLC. In the configuration of FIG. 16, the input optical fiber 10A for 1.3 μm and 1.55 μm and the output fiber 10B for 1.55 μm are PLCs.
Since they are disposed on the opposite end faces, the size of the module as a whole increases. There is also a problem that the connection between the optical fiber and the PLC must be performed twice.

[0007]

Therefore, in the present invention, in order to reduce the size of the optical transmitting / receiving module, the two input / output fibers are arranged not on the opposing end faces but on the same end face. For this reason, the wavelength multiplexing / demultiplexing device of the PLC is configured to transmit light of 1.3 μm and reflect light of 1.55 μm. Specifically, a dielectric multilayer filter is inserted into the waveguide at an angle, and 1.3 μm light is transmitted through the filter, and 1.55 μm light is reflected by the filter to separate light of two wavelengths.

Conventionally, as a wavelength multiplexer / demultiplexer using reflection of a dielectric multilayer filter, a wavelength multiplexer / demultiplexer using a fiber or a waveguide has been reported. For example, "Filter-Embedde
dDesign and Its Applicati
ons to Passive Component
s, "H. Yanakawa et al., J. Li.
ghwave Technology. , Vol. 7,198
9, pp. 1646-1653. However, most of them receive reflected light with a multi-mode optical fiber or a multi-mode optical waveguide, and there are few reports on coupling the reflected light to a single-mode optical waveguide as in the present invention. . The reason is that it is very difficult to couple the light reflected by the dielectric multilayer filter with a single mode optical waveguide.
The present invention seeks experimentally optimal conditions for how to efficiently couple light reflected by a filter into a single-mode optical waveguide, and for an adhesive to be compatible with mounting of a laser diode or a photodiode. It is a thing.

That is, an optical transceiver module manufactured by the present invention is an optical transceiver module that transmits an optical signal having a wavelength of 1.55 μm and transmits and receives an optical signal having a wavelength of 1.3 μm. A planar optical waveguide circuit having a diode, a photodiode, a dielectric multilayer filter, and first and second optical fiber connecting portions, wherein the dielectric multilayer filter has a groove provided on a surface of the planar optical waveguide circuit. The single-mode optical waveguide is disposed substantially perpendicular to the reference plane of the planar waveguide circuit, and the single-mode optical waveguide has a first input / output optical waveguide connected at one end to the first optical fiber connection portion; At the point where the multi-end is connected to the second optical fiber connection portion and the multi-end is located on the surface of the dielectric multilayer filter or within 8 μm from the surface, the normal line of the dielectric multilayer filter is set Branching angle 15 ° to 25 ° as a line
And a second input / output optical waveguide branched from the first input / output optical waveguide, wherein the first input / output optical waveguide is provided on the side of the dielectric multilayer filter where the second input / output optical waveguide is not provided. And the laser diode or the photodiode is connected to each of the branched optical waveguides. The invention of the present application provides a step of forming such an optical transmitting and receiving module by depositing a metal thin film on the surface of the planar optical waveguide circuit at a position deviated from the center line of the groove by dicing a metal thin film, and dicing. A step of aligning the saw with the marker, a step of moving the dicing saw to the center line of the groove to form the groove, and inserting the dielectric multilayer filter into the groove and fixing it with an adhesive The manufacturing process is characterized by

The first and second optical fiber connecting portions may be integrated as a two-core optical fiber array connecting portion.

A groove may be provided on the surface of the planar optical waveguide circuit, and the dielectric multilayer filter may be fixed to the groove with a silicone-based adhesive.

At the intersection of the first input / output optical waveguide and the second input / output optical waveguide, there may be a gap of 1 μm to 5 μm between the two input / output optical waveguides.

[0013] A marker for processing the groove may be provided on the surface of the planar waveguide circuit at a position apart from the installation position of the groove.

[0014] The width of the first input / output optical waveguide and the width of the second input / output optical waveguide may be larger than the width of the other portion near the mutual branch point, and the Y-branch portion may be a dielectric. It may be on a body multilayer filter.

[0015] A dielectric multilayer filter for blocking light having a wavelength of 1.3 µm may be inserted in the second input / output optical waveguide.

In the optical transceiver module manufactured by the present invention, since the input and output optical fibers are arranged on the same end face of the PLC, the overall size is reduced and the connection between the PLC and the optical fiber is reduced. It can be completed in the work of the times. As a result, a compact optical transmission / reception module can be realized at a lower cost than before. Since a marker made of a metal thin film for groove processing is provided on the surface of the planar waveguide circuit at a position away from the installation position of the groove,
This solves the problem that the machining accuracy of the groove deteriorates due to the metal forming the marker adhering to the inner wall of the machined groove or the metal clogging between the teeth of the dicing saw.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

Embodiment 1 In this embodiment, a silica-based planar lightwave circuit (PLC) produced by depositing silica-based glass on a silicon substrate, a two-core optical fiber array in which two optical fibers are paired, and an output An optical transceiver module was fabricated by combining a laser diode and a waveguide photodiode designed so that the mode field at the end face coincided with the mode field of the single mode optical fiber. A quartz-based planar lightwave circuit is fabricated on a silicon substrate by a flame deposition method and a reactive ion etching method, and an optical waveguide circuit having low loss and good matching with a single mode optical fiber has been realized. For more information,
Masao Kawachi "Planar Lightwave Circuit" Electron Theory C, 113, 6
No. 1993. The optical connection between the PLC and the laser diode or photodiode is P
The test was performed using a silicon terrace which is an LC substrate. See Y. Yamada et al. , Electro
n. Lett. , Vol. 29, 444, 1993.

FIG. 1 shows a circuit configuration of the PLC 30 of this embodiment. FIG. 2 is an enlarged sectional view of AA 'in FIG.
3 is an enlarged sectional view of FIG.

On a silicon substrate 11, cores 2, 3 and 2 'are formed so as to be covered by a cladding 12, and constitute single mode optical waveguides 2, 3 and 2'. The relative refractive index difference between the core and the clad is 0.75%, and the core size is 7μ.
m square. A groove 4 is provided near the position where the optical waveguides 2 and 3 intersect, and a dielectric multilayer film 5 is inserted therein,
It is fixed with an adhesive 13. The optical axis of the optical waveguide 2 ′ formed on the side of the dielectric multilayer film 5 opposite to the optical waveguides 2 and 3 coincides with the optical axis of the optical waveguide 2, and the optical waveguide 2 ′ Part.

An input single-mode optical fiber 10A and an output optical fiber 10B are connected to the planar lightwave circuit 3 by a glass block 9B for fixation so that the optical axes of the optical waveguides 2 and 3 are aligned with each other. The distance between the input / output ports 2A and 3A was 250 μm.

The 1.3 μm and 1.55 μm wavelength multiplexed light from the optical fiber 10A is incident on the first input / output optical waveguide 2 from the first input / output port 2A, and
The 5 μm light is reflected by the dielectric multilayer filter 5 and
Input / output optical waveguide 3 to single mode optical fiber 10
B. The 1.3 μm light passes through the dielectric multilayer filter 5 and is divided into two by the Y branch 6 in the same manner as in the prior art shown in FIG. 16, and then coupled to the laser diode 7 and the photodiode 8, respectively.

The dielectric multilayer filter 5 is designed to transmit light of 1.3 μm and reflect light of 1.55 μm. Actually, SiO2 and TiO2 were alternately and multilayer-deposited on a 7 .mu.m thick polyimide thin film to a thickness of 9 .mu.m, and the entire filter thickness was 16 .mu.m. On the other hand, the groove for inserting the filter was processed by a dicing saw, and the groove width was 18 μm and the groove depth was 200 μm. Here, the reason why the groove width is set to 18 μm is to reduce the gap in order to set the filter having a thickness of 16 μm as perpendicular to the substrate as possible. When a filter having a thickness of 16 μm is used, a groove width of 17 μm to 20 μm is suitable. Also, as for the depth of the groove, if the depth is shallow, the filter is likely to be inclined. However, if the groove is made deeper, the entrance of the groove tends to be widened in processing, so that the groove depth is suitably 100 μm to 300 μm.

In the present embodiment, the filter was inserted after the groove was processed with a commercially available dicing saw, and the groove was fixed with a silicone-based adhesive. Here, the reason why a silicone-based adhesive, which is usually about two orders of magnitude weaker than an epoxy-based adhesive in fixing the filter, is used for the following reasons. In the optical transmitting and receiving module of the present embodiment, the temperature needs to be raised to about 300 ° C. in order to fix the laser diode and the photodiode with the AuSn solder after the filter is mounted. At this time, the epoxy adhesive deteriorates, and a large shrinkage occurs. Then, peeling of the adhesive occurs in the groove. As a result, the reflection increases and the standard for the optical transceiver module is not satisfied. Silicone adhesives, on the other hand, have a lower adhesive strength,
Since no change occurs at a temperature of about 0 ° C., no peeling of the adhesive occurs. Since the fixing of the filter to the groove is originally a portion to which no external force is applied, the strength may be weak. Therefore, in this embodiment, a silicone adhesive is used for fixing the filter. A groove is actually formed perpendicularly to the linear waveguide, and the dielectric multilayer filter is fixed with an epoxy adhesive and a silicone adhesive, respectively. It was measured before and after the heat treatment at 10 ° C. for 10 minutes. Table 1 shows the results. The reflection of the silicone-based adhesive does not change due to the heat treatment, whereas the reflection greatly increases when the epoxy-based adhesive is used. This is because the epoxy-based adhesive shrinks at a high temperature of 300 ° C. as described above.

[0025]

[Table 1]

The waveguide design in the vicinity of the filter insertion portion was experimentally determined because there are uncertain factors. FIG. 4 shows an enlarged view near the filter insertion portion. Here, a slit 17 having a width of 2 μm was provided between the first input / output optical waveguide 2 and the second input / output optical waveguide 3. This is to prevent bubbles or coarse portions of glass from being generated at the other ends of the two optical waveguides 2 and 3 in the step of embedding the core with upper clad glass after patterning the core. In the case where the slit 17 is not actually provided, bubbles may be generated at the other portions of the two optical waveguides. The probability is more remarkable when the intersection angle θ between the two waveguides 2 and 3 is as small as about 10 °. In this case, by providing a slit having a width of 2 μm, an escape path for bubbles was created, and the upper clad glass could be embedded neatly into a narrow gap. An appropriate width of the gap 17 is 1 to 5 μm, which is a region larger than the resolution of the mask when processing the core glass and in which the optical loss can be almost ignored.

Next, the intersection angle θ between the two input / output optical waveguides 2 and 3 and the groove 4 for inserting the dielectric multilayer filter 5
The optimal value was experimentally determined for the position. 1.55 μm transmitting from input / output port 2A to input / output port 3A
FIG. 5 is a graph in which the vertical axis represents the optical loss and the horizontal axis represents the distance x between the intersection of the center lines 14 and 15 of the two input / output optical waveguides 2 and 3 and the center line 16 of the groove 4. . Here, the intersection angle θ between the two input / output optical waveguides 2 and 3 was set to 20 °. From this graph, it can be seen that the optimal distance x between the intersection of the center lines 14 and 15 of the two input / output optical waveguides and the center line of the groove is 4 ± 4 μm. Here, since the position of the center line 16 of the groove 4 changes depending on the thickness of the filter 5 and the width of the groove 4, the intersection of the center line of the two input / output optical waveguides and the surface of the filter. -4 ± 4μm
(0-8 m). In this embodiment, the filter insertion groove is machined using this value.

As can be seen from FIG. 5, the position of the groove is 1.5
It greatly affects the loss of 5 μm light. Therefore, in order to process the groove position with good reproducibility, in this embodiment, the groove marker was formed by depositing a metal thin film on the upper clad glass surface. The reason why the marker is formed using the metal thin film is that it is easier to see than when the marker is formed using the core glass. Since the step of forming a metal thin film is also used for electric wiring of a laser diode or a photodiode, it is not necessary to increase the number of process steps by performing both simultaneously.
The emphasis here is that if a marker made of a thin metal film is on the surface of the waveguide, processing that part with a dicing saw will cause the metal to adhere to the inner wall of the processed groove, or the metal will stick to the teeth of the dicing saw. By clogging between
The problem is that the processing accuracy is degraded. Therefore, in order to solve these problems, in this embodiment, a marker made of a metal thin film is formed at a position shifted by -50 μm from the center line of the groove. Since a commercially available dicing saw has a function of accurately moving the cutting position, the dicing saw is positioned with a marker made of a metal thin film, and then the alignment is performed.
The groove was processed by moving the μm cutting position. FIG. 6 shows a diagram including the marker 18. In this embodiment, Au is used as the metal thin film for the marker.

The intersection angle θ between the two input / output optical waveguides 2 and 3
Is changed by changing the intersection angle θ with respect to 1.
The loss of 55 μm light was determined experimentally. FIG. 7 shows the results. The greater the intersection angle θ, the greater the excess loss with respect to the misalignment of the groove. From this result, it can be seen that it is effective to reduce the intersection angle θ in order to loosen the tolerance for the processing error of the groove position. FIG. 8 is a graph in which the vertical axis represents the positional deviation amount at which the excess loss due to the groove positional deviation is 0.5 dB, and the horizontal axis represents the intersection angle θ. Considering that the processing position accuracy of the groove of the dicing saw is about 3 μm, it is understood that the intersection angle θ is preferably 25 ° or less. Further, FIG. 9 is a graph in which the vertical axis indicates the return loss of 1.55 μm light at the first input / output port 2A, and the horizontal axis indicates the intersection angle θ. From this graph, the intersection angle θ
It can be understood that the value of the return loss increases as the value increases. When an analog signal is used for 1.55 μm light, since the return loss is required to be 30 dB or more, the crossing angle θ is preferably 15 ° or more. that's all,
From the viewpoint of filter insertion groove position accuracy and return loss,
The intersection angle θ between the input and output optical waveguides 2 and 3 is 15 ° to 25 °.
° is suitable.

The first input / output port 2 of 1.55 μm light of the optical transmitting / receiving module of the present embodiment thus created
The insertion loss from A to the second input / output port 3A was 1.5 dB including the connection loss with the single mode fiber. The return loss at that time was 38 dB. The insertion loss from the first input / output port 2A to the photodiode 8 was 3.8 dB including the 3 dB principle loss due to the Y branch 6.

Embodiment 2 As described in Embodiment 1, the excess loss of 1.55 μm light strongly depends on the positional accuracy of the filter insertion groove. In this embodiment, the width of the waveguide is increased in the vicinity of the waveguide intersection in order to reduce the positional accuracy. An enlarged view of the intersection is shown in FIG. 2B, 3B and 2'B are optical waveguides 2 and 3 respectively.
And 2 'widened portions. The waveguide width was 7 μm at locations other than the intersection, and the width was gradually changed immediately before the intersection, and was 6 μm to 12 μm at the intersection. The horizontal axis indicates the waveguide width at the intersection, and the vertical axis indicates the tolerance of positional deviation of the filter 5 when the insertion loss of 1.55 μm light increases by 0.5 dB. FIG. 11 shows a calculation result obtained by changing this at the intersection angle θ = 10 ° to 40 °. Obviously, by increasing the width of the waveguide at the intersection, the tolerance for the displacement of the filter is reduced. In an actual waveguide, if the width of the waveguide is too wide, higher-order modes are likely to be generated. Therefore, the waveguide width at the intersection is 10 μm.
m to 15 μm is appropriate.

Embodiment 3 Since the optical transmitting / receiving module of the present invention is aimed at low cost, it is necessary to reduce the required size of the PLC as much as possible and to increase the number of modules that can be produced from one PLC wafer. . For this purpose, in the present embodiment, the intersection of the two input / output optical waveguides described in the second embodiment and the Y branch located at the subsequent stage are integrated. Fig. 12 shows the overall view.
FIG. 13 shows an enlarged view of the intersection. As shown by 2B and 3B, the width of the first and second input / output optical waveguides 2 and 3 is widened by a taper just before the intersection. Thereafter, the 1.3 μm light passes through the filter 5 and is branched into two optical waveguides 21A and 21B of the Y branch 21. With this configuration, the Y branch that is independently formed after the conventional wavelength multiplexer / demultiplexer can be integrated with the wavelength multiplexer / demultiplexer. As a result, the area of the PLC can be reduced.
Specifically, when the intersection and the Y-branch as the wavelength multiplexer / demultiplexer are independently arranged, the size of the PLC is 3 mm × 20 mm, but by integrating them, the size of the PLC is 3 mm ×
It could be reduced to 15 mm. This makes one PLC
The number of modules that can be created from is increased by 1.3 times.

Embodiment 4 In the circuit configuration of Embodiment 1, light of 1.55 μm is completely reflected by the dielectric multilayer filter 5 and hardly leaks into the photodiode 8 for receiving light of 1.3 μm.
The result actually produced was crosstalk of -50 dB. On the other hand, the amount of 1.3 μm light leaking into the second input / output optical waveguide 3 is considerably large. In the actually prepared circuit, leakage light of about -20 dB at the maximum was observed. This is an imperfection of the dielectric multilayer filter 5, but it is essentially difficult to reduce this value. Therefore, in this embodiment, a dielectric multilayer filter for cutting 1.3 μm light is inserted into a part of the second input / output optical waveguide. Two types of filter insertion methods were created. One of them is shown in FIG.
The other is shown in FIG. In FIG. 14, the groove 4B was machined using a dicing saw as in the case of the intersection. At this time, the filter 21 for cutting 1.3 μm light crosses only the second input / output optical waveguide 3 so as not to cross the first input / output optical waveguide 2. Although the groove 4A crosses the first input / output optical waveguide 2, the groove is filled with an adhesive, and the loss due to the adhesive is very small.

On the other hand, in the embodiment shown in FIG. 15, the groove 4C for the 1.3 μm light cut filter 22 is processed by etching. In this case, unnecessary grooves are not generated in the first input / output optical waveguide 2. 14 and 15, the 1.3 μm crosstalk output from the second input / output optical waveguide is -2 when no cut filter is inserted.
It was able to remarkably reduce from 0 dB to -45 dB.

In the configuration shown in FIGS. 14 and 15, FIG.
As shown in FIG. 3, it is of course possible to integrate the Y branch.

Although the embodiments of the present invention have been described above using a silica-based waveguide, the circuit of the present invention is not limited to a silica-based waveguide, but may be a diffused glass waveguide, a polymer waveguide, or an L-shaped waveguide.
It can be applied to any waveguide such as an iNbO3 waveguide.

In the present invention, 1.3 μm light is transmitted and received,
Although the description has been given of the optical transmitting / receiving module that transmits 1.55 μm light, the optical multilayer module can be used as an optical transmitting module in other wavelength regions or an optical wavelength multiplexer / demultiplexer by exchanging the dielectric multilayer filter shown in the embodiment. Obviously it could be used.

[0038]

As described above, the optical transceiver module manufactured according to the present invention is inexpensive and compact, so that it can be widely used as a home optical terminal. Since the marker made of a metal thin film for groove processing is provided on the surface of the planar waveguide circuit at a position away from the installation position of the groove, the metal forming the marker adheres to the inner wall of the processed groove. The problem that the machining accuracy of the groove is deteriorated due to the metal clogging between the teeth of the dicing saw is solved.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of an optical transceiver module as a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along line AA ′ of FIG.

FIG. 3 is an enlarged sectional view taken along the line BB ′ of FIG. 1;

FIG. 4 is an enlarged view of the vicinity of a filter insertion portion according to the first embodiment.

FIG. 5 is a tolerance curve of the insertion loss of 1.55 μm light with respect to the filter groove, the vertical axis represents the loss of 1.55 μm light, and the horizontal axis represents the intersection of the center line of the two input / output optical waveguides and the filter groove. It is a graph which set it as the distance with the center line.

FIG. 6 is an enlarged view of the vicinity of a filter insertion portion including a marker for processing a filter groove.

FIG. 7 is a graph showing the tolerance of a 1.55 μm optical insertion loss with respect to a filter groove when the intersection angle θ between two input / output optical waveguides is changed.

FIG. 8 is a graph showing a tolerance amount at which an excess loss of 1.55 μm light increases by 0.5 dB when an intersection angle θ between two input / output optical waveguides is changed.

FIG. 9 is a graph showing the return loss of 1.55 μm light when the intersection angle θ between two input / output optical waveguides is changed.

FIG. 10 is an enlarged sectional view of the vicinity of a filter insertion portion according to a second embodiment.

FIG. 11 is a graph showing a change in a tolerance of a filter position shift when a waveguide width at an intersection of two input / output optical waveguides is increased.

FIG. 12 is a schematic plan view showing an overall view of a third embodiment.

FIG. 13 is an enlarged view of the vicinity of the filter insertion section in FIG.

FIG. 14 is an overall view of a fourth embodiment.

FIG. 15 is an overall view of another configuration example of the fourth embodiment.

FIG. 16 is a plan view showing a conventional optical transceiver module.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Conventional silica-based planar lightwave circuit (PLC) 2 1st input / output optical waveguide 3 2nd input / output optical waveguide 4,4B, 4C Groove for dielectric multilayer filter insertion 5 1.3. Dielectric multilayer film filter that reflects light of 55 μm 6, 21 Y branch 7 Laser diode 8 Photodiode 9 A, 9 B, 9 C Glass block for fixing optical fiber 10 A, 10 B Single mode optical fiber 11 Silicon substrate 12 Clad glass 13 Dielectric multilayer film Filter fixing adhesive 14 Center line of first input optical waveguide 15 Center line of second input optical waveguide 16 Center line of dielectric multilayer filter insertion groove 17 First input / output optical waveguide and second input Slit 18 at portion where output optical waveguide contacts 18 Au marker for groove processing 22 Dielectric material that reflects 1.3 μm light and transmits 1.55 μm light Silica-based planar lightwave circuit according to layer film filter 30 the invention

Continued on the front page (72) Inventor Ota Suzuki 2-3-1 Otemachi, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (72) Inventor Taisuke Oguchi 2-3-1 Otemachi, Chiyoda-ku, Tokyo Japan JP-A-6-123815 (JP, A) JP-A-6-123814 (JP, A) JP-A-4-81806 (JP, A) JP-A-6-281825 ( JP, A) JP-A-6-18733 (JP, A) JP-A-5-224036 (JP, A) JP-A-62-206502 (JP, A) JP-A-63-33713 (JP, A) IEEE Photonics Technology Letters, Vol. 4 No. 6 pp. 660−662 (58) Field surveyed (Int.Cl. ⁷ , DB name) G02B 6/12-6/14 G02B 6/42-6/43 G02F 1/00-1/035 G02F 1/29-7 / 00 H01L 27/14-27/15 H01L 31/0232 H01L 31/10 H01S 5/022 H04J 14/00-14/02

Claims (1)

(57) [Claims] 1. An optical transmitting and receiving module for transmitting an optical signal having a wavelength of 1.55 μm and transmitting and receiving an optical signal having a wavelength of 1.3 μm, comprising: a single mode optical waveguide, a laser diode, a photodiode, and a dielectric multilayer filter. And a planar optical waveguide circuit having first and second optical fiber connection portions, wherein the dielectric multilayer film filter has a reference plane of the planar optical waveguide circuit in a groove provided on a surface of the planar optical waveguide circuit. The single-mode optical waveguide is connected to the first input / output optical waveguide having one end connected to the first optical fiber connection part, and one end is connected to the second optical fiber connection part; When the other end is at the surface of the dielectric multilayer filter or at a point within 8 μm from the surface, the first input / output is formed at a branch angle of 15 ° to 25 ° about the normal line of the dielectric multilayer filter as a center line. A second input / output optical waveguide branched from the input optical waveguide, wherein the first input / output optical waveguide is Y-branched on the side where the second input / output optical waveguide is not located with respect to the dielectric multilayer filter, and is branched. In the method for manufacturing an optical transceiver module in which the laser diode or the photodiode is connected to each of the formed optical waveguides, a marker parallel to the groove is provided at a position shifted from a center line of the groove on the surface of the planar optical waveguide circuit. Forming a metal thin film by vapor deposition; aligning a dicing saw with the marker; moving the dicing saw to a center line of the groove to form the groove; Inserting a multi-layer body filter and fixing the same with an adhesive.