JP3249835B2 - Chip part transfer device and transfer method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device and a transfer method used when a chip component such as a chip capacitor or a chip resistor is inserted into a holding hole of a holding plate. A device for placing a guide plate provided with a guide hole to be filled, flowing a large number of chip components on the guide plate, filling each guide hole of the guide plate with one chip component while performing vibration and vacuum suction, and About the method .

[0002]

2. Description of the Related Art Conventionally, in order to simultaneously apply electrodes to the ends of a large number of chip parts, a holding plate for elastically holding the chip parts has been used (Japanese Patent Publication No. 62-20675).
No.). This holding plate forms a large number of through holes in a thin flat plate formed at the center of the hard substrate, and embeds a rubber-like elastic body in a recess formed by the flat plate,
Further, a holding hole penetrating through the through hole portion of the elastic body is formed. In order to form external electrodes at both ends of a chip component using such a holding plate, the following method has conventionally been adopted.

First, a guide plate having a plurality of guide holes formed in the same arrangement as the holding holes is placed on the upper side of the holding plate, and each of the guide holes of the guide plate is filled with chip components one by one. Thereafter, the chip component is pushed into the holding hole by the press pin, and is elastically held in a state where the upper end of the chip component is exposed on the surface side of the holding plate. Next, turn over the holding plate holding the chip components,
An electrode is applied to one end of the chip component by pressing a part of the chip component protruding downward onto an electrode application plate coated with an electrode paste such as silver. After this electrode dries, another holding plate is placed under the holding plate holding the chip components via a frame spacer with a certain thickness,
The chip component is transferred from the holding plate to another holding plate using the same press pin as described above, and the chip component where no electrode is formed is held in a state where the other end is exposed. Thereafter, an electrode paste is applied to the other end of the chip component by the same operation as described above, and dried to form electrodes on both end portions of the chip component (Japanese Patent Application Laid-Open No. 60-1).
09204).

When a chip component is filled in a guide hole of a guide plate, a transfer device is used. Tokunosho 6
Japanese Patent Application Laid-Open No. 2-20686 discloses an example of a transfer device. The transfer device includes a base elastically supported by a spring, a holding plate, a guide plate, and a supply frame mounted on the base, and a vibration / suction device provided at an end of the base. The supply frame has a space for accommodating a large number of chip components. The method of using the transfer device is as follows. First, the supply frame is turned upside down, a predetermined number of chip components are accommodated in the space, and the opening surface of the space is covered with a guide plate and a holding plate. The two plates are positioned with alignment pins. next,
The supply frame and the plate are turned upside down and attached to the base. Then, suction is performed from below the holding plate while applying vibration to the base, so that the chip component housed in the empty space is filled in the hole of the guide plate.

[0005]

However, the above transfer apparatus has the following problems. The first is
Even if the apparatus is vibrated and suction is performed, the filling rate of the chip component into the hole of the guide plate is low. The reason is that the supply frame is elastically supported almost horizontally through the base, so that even if vibration and suction are performed, the chip components do not spread evenly to all the holes of the guide plate, and a defective filling occurs. That's why. The second problem is that the holes in the guide plate are not always filled with chip components one by one.
Extra chip components accumulate at the top of the hole. If excess chip components accumulate in the holes of the guide plate, when pressing the chip components from the holes of the guide plate into the holes of the holding plate with the press pins, a serious result is caused in that the press pins are broken. Therefore, in the related art, after the filling operation is completed, a troublesome operation of removing the supply frame and removing extra chip components accumulated on the holes of the guide plate one by one with tweezers has to be performed. Therefore,
SUMMARY OF THE INVENTION An object of the present invention is to provide a chip component transfer device capable of uniformly distributing chip components to all holes of a guide plate and improving a filling rate. Also,
Another object of the present invention is to provide a chip component transfer device that can easily remove excess chip components even when two or more chip components accumulate in holes in the guide plate.

[0006]

In order to achieve the above object, according to the first aspect of the present invention, a guide plate having a through hole corresponding to a holding hole is provided on a holding plate having a plurality of holding holes. In a transfer device for placing and filling each of the chip components into the guide holes of the guide plate, a tip box capable of accommodating a large number of chip components is provided at one end, and a holding plate and a guide plate are provided at the lower surface at the other end Transfer case having an opening closed by the transfer case and the holding plate and guide plate
Chuck means for holding tightly against the opening of the transfer case and the transfer case so that the horizontal position and the chip box side are downward
A stage rotatably supported between an upright position ,
The chip components in the chip box are separated on the guide plate.
In order to disperse , the swinging means for swinging the stage up and down and the chip components dispersed on the guide plate are
In order to perform the filling, the stage is provided with vibration / suction means for applying vibration to the stage and sucking the stage from below. Further, the invention described in claim 4 is
On the holding plate with holding holes,
Place a guide plate with a guide hole
Transfer to fill each chip hole into the guide hole of the plate
In the method, one end side can accommodate multiple chip components
It has a chip box and an opening on the lower surface on the other end side
Transfer case, and the transfer case
Provide an almost horizontal stage to accept and hold on stage
A process of placing the plate and the guide plate, and
Opening is closed by the holding plate and guide plate
So that the transfer case is in contact with the stage
The process of rotating horizontally and the stage with the transfer case
Swing up and down together to make chip components in the chip box
And the swinging process.
Sometimes, the stage is vibrated and the holding plate
Suction from underneath to guide the chip components to the guide plate
After the filling step and the filling step, hold the opening
With the transfer case closed with the sheet and guide plate.
Rotate so that the tip box side is down, and
Tip part left on the guide plate without filling the inner hole
After the process of collecting the products in the chip box and the collection process,
Transfer case integrated with holding plate and guide plate
To the horizontal position, and hold plate and guide play
And the process of placing the load on the stage and holding it from the transfer case
Separate plate and guide plate, only transfer case
And turning it upward.

[0007] First, the transfer case chip box side downward
And a predetermined number of chip components are accommodated in the chip box. On the other hand, at a predetermined position on the stage a holding plate and the guide plate, the guide play
Set so that the top is on top . Next, when the transfer case is rotated downward, the opening is closed by the holding plate and the guide plate. Then, by holding the holding plate and the guide plate in close contact with the transfer case by the chuck means, the chip component is prevented from falling outside. Here, the stage is vibrated by the vibration / suction means, and suction is performed from below the holding plate. At the same time, the stage is largely swung up and down. Then, a large number of chip components housed in the chip box are evenly distributed on the guide plate as they swing, and are filled in the respective guide holes by micro-vibration. Jumping of the filled chip components is prevented by suction, so that the once filled chip components do not pop out. In this way, the filling rate of chip components is significantly improved. When the filling is completed, the vibration / suction is stopped, and the swing is also stopped. Then, the holding plate and the guide plate are rotated upward while being held in close contact with the transfer case. As a result, excess chip components accumulated on the holes of the guide plate fall and are collected in the chip box. At this time, it is desirable to rotate the guide plate to about 90 °, that is, to rotate the guide plate to the upright position, so that even the necessary chip components filled in the holes do not drop. Next, the transfer case, the holding plate and the guide plate are again rotated together to a horizontal state, and the chuck means is opened to separate the transfer case from the two plates. When only the transfer case is rotated upward, the holding plate and the guide plate remain on the stage. At this time, the holes of the guide plate are filled with chip components one by one.

When the transfer case, the holding plate and the guide plate are rotated to the upright position, the thickness of the guide plate (the length of the hole) ) Is desirably slightly longer than the length of the chip component. In general, a mortar-shaped taper is formed at the upper end of the guide hole of the guide plate to increase the filling rate of the chip component, and this taper is also effective in dropping excess chip components on the guide plate. . Although the turning operation of the transfer case may be performed manually, it is desirable to provide a turning means for automatically turning the transfer case. The rotating means needs to rotate the transfer case at least 90 °, and a motor or a cylinder can be used. In order to hold the transfer case in contact with the stage, it is desirable to provide a means for locking the transfer case to the stage. Thus, when vibration is applied to the stage, the vibration is effectively transmitted to the transfer case, and the transfer case can be prevented from opening due to vibration or swing.

[0009]

1 shows a holding plate A used in the present invention.
The structure of the guide plate B and the jig frame D is shown. Holding the plate A are formed a number of holding holes a ₁ for holding a chip component C elastically, guide hole b in the holding plate A placed on the guide plate B on corresponding to the holding holes a _{1 1} is formed. The upper end portion of the guide hole b ₁ conical taper is formed. The thickness H of the guide plate B is slightly longer set than the length h of the chip component C, counterbore b ₂ is provided on the lower surface side of the guide plate B. Holding plate on both sides a plurality of pin holes a ₂ in different positions are provided in A, this pin hole a ₂ is inserted the pin b ₃ projecting from the lower surface of the guide plate B with both plates A, B Are positioned relative to each other. On the other hand, the jig frame D is not required to have a higher accuracy than the mutual positional relationship between the plates A and B, so that the jig frame D is set in accordance with the stopper 47 and the stopper 41, and the plate A and the plate B are mounted thereon. . At this time, the plates A and B are also
Set to match. The jig frame D has a total thickness T so that the jig frame D can be in close contact with an opening of a transfer case described later.
Has the function of keeping the constant.

2 to 6, a leg 2 is erected on a bottom plate 1, and a table 3 is attached to the upper end of the leg 2 so as to be swingable about a shaft 4 as a fulcrum. An elevating plate 5 is arranged below the table 3, and the table 3 and the elevating plate 5 are connected via two links 6. A pair of swinging cylinders 7 and 8 are fixed to an opposing portion of the bottom plate 1 and the elevating plate 5, and the piston rods of the cylinders 7 and 8 are connected to each other. Therefore, when the cylinders 7 and 8 are driven at the same time, the elevating plate 5 moves up and down at a stroke speed twice that of each cylinder, and the table 3 swings largely up and down with the shaft 4 as a fulcrum. A support rod 10 erected from the bottom plate 1 slidably penetrates the linear bush 9 attached to the elevating plate 5 to prevent the elevating plate 5 from tilting or rotating.

A stage 11 is elastically supported above the table 3 via a spring 12. Stage 1
A vibrator 13 is attached to the lower surface of the stage 1, and a transfer case rotating motor 15 is attached to one side of the stage 11. The rotation shaft 16 of the motor 15 is the chain 1
The shaft 19a rotatably supported by the bearing 18 of the stage 11 is driven via the. The shaft 19a is protruded from one side of the transfer case 20. When the motor 14 is driven, the transfer case 20
It rotates up and down with 9a as a fulcrum. A shaft 19b, which is symmetrical to the shaft 19a, protrudes from the other side of the transfer case 20 (see FIG. 3). The shaft 19b is also rotatably supported by the bearing 18 of the stage 11. A detection piece 21 is fixed to the shaft 19b, and the rotation angle of the transfer case 20 is set by detecting the position of the detection piece 21 with a detector 22 such as a photo sensor.

As shown in FIG. 5, the transfer case 20 has a chip box 2 which can accommodate a large number of chip components C at one end.
5, an inlet 26 is formed on the upper surface of the chip box 25, and a mesh 27 is attached to the lower surface. The mesh 27 is for dropping defective chips in the inputted chip components C into the space 28 and collecting them. An opening 29 that can be closed by the holding plate A and the guide plate B is formed on the lower surface of the transfer case 20 except for the chip box 25.
Are cut out at portions corresponding to the sum of the thicknesses of the holding plate A, the guide plate B, and the jig frame D.

A lock cylinder 30 is provided on the upper surface of the tip of the transfer case 20, and a lock lever 31 is rotatably attached to the tip of the transfer case 20. When the cylinder 30 is driven, the lower end of the lock lever 31 is engaged with the notch 40 of the stage 11, and the transfer case 20 can be locked on the stage 11. Transfer case 20
A pair of chuck cylinders 32 are provided on the upper surfaces of both sides of the transfer case 20, and these cylinders move a slidable slide plate 34 in the width direction along a guide shaft 33 projecting to both sides of the transfer case 20. . An inward chuck 35 is fixed to the lower surface of the slide plate 34. When the chuck 35 advances inward as shown on the right side of FIG. 1, the inclined surface 35 a at the tip becomes the inclined surface d _{2 of the} jig frame D. To bring the plates A and B and the jig frame D into close contact with the transfer case 20. The mounting plates 36, 37 for mounting the cylinders 30, 32 to the transfer case 20 are provided on the transfer case 20.
Projecting downward from the opening 29. For this reason, when the plates A and B and the jig frame D are held in the transfer case 20, the mounting plate 36 at the front end is fixed to the plates A and B and the jig frame D.
Is prevented from shifting forward, and the mounting plates 37 on both sides prevent shifting to the side.

On the other hand, the upper surface of the stage 11 is provided with a stopper 41 and a stopper 47 for positioning the holding plate A, the guide plate B and the jig frame D at predetermined positions. An opening 42 is formed at the center of the stage 11, and the suction sheet 4
6, connected to a suction blower 44 via a joint 45 and a hose 43. When the suction blower 44 is driven to suction the center of the stage 11, the space d _{3 in the} jig frame D is obtained.
The guide hole b ₁ of the guide plate B through the holding hole a ₁ of the holding plate A from sucking the chip parts C. At this time,
Since the plates A and B and the jig frame D are in close contact with the transfer case 20 by the chuck 35, and the transfer case 20 and the stage 11 are in close contact with the lock lever 31, air leakage is small and suction can be performed efficiently.

Here, the operation of the transfer device having the above-described configuration will be described with reference to FIG.
It will be described according to. First, as shown in FIG. 7A, the transfer case 20 is turned to the upright position, and a predetermined number of chip components C are put into the chip box 25. On the other hand, the jig frame D and the holding plate A
And an unfilled guide plate B are set in order. Next, the motor 15 is driven to move the transfer case 20 to the shaft 19a.
When the stage 11 is rotated downward with the fulcrum 19b as a fulcrum, the stage 11
The opening 29 is closed by the plates A, B and the jig frame D at a position where the opening 29 contacts (see FIG. 7B). Here, the cylinder 32 is driven, and the plates A and B are
And with adhering the jig frame D in the opening 29 of the transfer case 20, thus locking the lever to the cylinder 30 31
To lock the transfer case 20 and the stage 11. Thereby, the chip component C from the transfer case 20
Is prevented from falling. Here, when the vibrator 13 and the suction blower 44 are driven, a slight vibration is applied to the chip component C, and the chip component C is sucked from below the holding plate A, so that the chip component C fills the guide hole b ₁ of the guide plate B. Is done. At the same time, the cylinders 7 and 8 are driven to swing the table 3 up and down with the shaft 4 as a fulcrum, as shown by a two-dot chain line in FIG . As a result, the stage 11 and the transfer case 20 elastically supported via the spring 12 also swing together. Therefore, the chip components C accommodated in the chip box 21 are uniformly diffused on the guide plate B by repeating forward and backward tilts,
It is filled into the holding hole b ₁ efficiently guide plate B. When the filling is completed, the vibrator 13 and the blower 44 are stopped, and the cylinders 7 and 8 are also stopped at the initial position, that is, the position where the stage 11 is horizontal.

Next, the lock lever 31 is released, and the transfer case 20 and the stage 11 are separated. On the other hand, the chuck 35 maintains the operating state, and holds the plates A and B and the jig frame D in close contact with the transfer case 20. Here, when the motor 15 is driven to rotate the transfer case 20 upward, the plates A and B and the jig frame D also rotate integrally with the transfer case 20 and, when reaching the upright state, guide the guide plate B. extra chip component C accumulated on the hole b ₁ is dropped, it is recovered to the chip box 25 (see FIG. 7 (c)). At this time, as it is until the required chip component C filled in the guide hole b ₁ does not fall, it is desirable to slowly rotate the transfer case 20. After the excess chip components C are collected in the chip box 25, the motor 15 is driven again to return the transfer case 20 to the horizontal state (see FIG. 7D). Also at this time, it is desirable to rotate the transfer case 20 slowly to prevent the chip components C collected in the chip box 25 from flowing out onto the guide plate B. After rotating the transfer case 20 to the horizontal position, the chuck 35 is opened, and only the transfer case 20 is turned upward by 90 °.
When rotated, the guide plate B, the holding plate A, and the jig frame D, which are filled with the chip component C one by _one in each guide hole b1, remain on the stage 11. Thereafter, the holding plate A and the guide plate B are taken out of the stage 11 integrally, and transported to a pressing device (not shown) to carry
The performs an operation of pushing the guide plate B to the holding hole a ₁ of the holding plate A. Thereafter, another holding plate and an unfilled guide plate are set on the stage 11, and the operation after FIG. 7A is repeated.

In the above embodiment, the jig frame D is disposed below the holding plate A. However, if the sum of the thicknesses of the holding plate A and the guide plate B is constant, the jig frame D may be omitted. Can also. The stage 11 and the transfer case 20 are swung about the axis 4 parallel to the rotation shafts 19a and 19b of the transfer case 20, but the swing of the present invention is not parallel to the rotation shafts 19a and 19b. Includes rocking around a shaft and precession. Further, the lock lever 31 for locking the transfer case 20 to the stage 11 and the chuck 35 for holding the holding plate A and the guide plate B in close contact with the transfer case 20 are automatically operated by the cylinders 30 and 32. Lock lever 31
And the chuck 35 may be operated manually. Also,
It goes without saying that the lock means and the chuck means are not limited to those of the embodiment.

[0018]

As is apparent from the above description, according to the present invention, vibration and suction are performed while the transfer case, the holding plate and the guide plate are held on the stage, and the transfer case and the stage are integrated. since so as to greatly swung up and down, the chip components in the chip box spreads to evenly guide plates, the filling rate of the guide hole can be remarkably improved as compared with the prior art. Also, the guide hole is not filled,
Even if the chip components remain , by turning the transfer case and the plate integrally upward, excess chip components can be easily collected in the chip box. Therefore, the troublesome work of removing unnecessary chip components one by one with tweezers as in the related art can be eliminated, and the working time can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the structure of a holding plate A, a guide plate B and a jig frame D used in the present invention.

FIG. 2 is a left side view of the transfer device according to the present invention.

FIG. 3 is a plan view of the transfer device according to the present invention.

FIG. 4 is a rear view of the transfer device according to the present invention.

FIG. 5 is an exploded perspective view of a stage and a transfer case.

FIG. 6 is a sectional view of a transfer case.

FIG. 7 is an explanatory diagram of the operation of the transfer device according to the present invention.

[Explanation of symbols]

1 transfer device 11 Stage 15 transfer case rotating motor 20 transfer case 25 chip box 29 opening 30 lock cylinder 31 the lock lever 32 chuck cylinder 35 chucks A holding plate a ₁ holding hole B guide plate b ₁ guide hole C chip components

Claims (4)

(57) [Claims] 1. A transfer device for placing a guide plate having a through hole corresponding to a holding hole on a holding plate having a large number of holding holes, and filling each of the guide holes of the guide plate with a chip component. A transfer case having a chip box on one end side capable of accommodating a large number of chip components, and an opening closed by a holding plate and a guide plate on a lower surface on the other end side; and a transfer case having a holding plate and a guide plate . Opening
A chuck means for tightly held against part, the transfer case horizontal position and the chip box side faced downward
The stage that is rotatably supported between the upright position and the chip component in the chip box is separated on the guide plate.
A rocking means for rocking the stage up and down to disperse, and filling the guide holes with chip components dispersed on the guide plate
And a vibrating / suctioning means for applying vibration to the stage and sucking from below the holding plate. 2. The transfer device according to claim 1, wherein the transfer case is in a horizontal position where the transfer case is in contact with the stage, and the chip box side is about 90 ° downward with respect to the stage.
A device for transferring chip components, wherein a driving means for rotating between two positions of an upright position and a standing position is provided. 3. The chip component according to claim 1, further comprising means for locking the transfer case to the stage at a position where the transfer case is in contact with the upper surface of the stage. Transfer device. 4. A holding plate having a plurality of holding holes is provided.
Guide plate with penetrating guide holes corresponding to holding holes
And insert them into the guide holes of the guide plate.
Box that can accommodate a large number of chip components at one end in the transfer method for filling products
Transfer case having an opening at the lower surface on the other end side
And a substantially horizontal support that supports the transfer case
A stage is provided, and a holding plate and a guide plate are placed on the stage.
The transfer plate and the opening of the transfer case
The transfer case contacts the stage so that it can be closed
The stage to rotate horizontally until it is placed, and swing the stage up and down integrally with the transfer case,
Disperse the chip components in the box on the guide plate
The stage is vibrated at the same time as the
Suction from below the holding plate to guide the chip components
After filling the guide holes of the plate and after the filling process, the opening is
With the transfer case closed, place the transfer case on the tip box side.
Is turned downward, and the guide hole is not filled.
The chip components remaining on the id plate into the chip box
After the collection process and the collection process, hold the transfer case
Pivoted to the horizontal position with the
And place the holding plate and guide plate on the stage.
And separating the holding plate and guide plate from the transfer case
And turning only the transfer case upward.
A method for transferring chip components.