JP3242199B2 - Power cable coating stripper - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION This invention power cable coated release
The present invention relates to a device , and more particularly to a power cable stripping device for a power cable having an easy strip type semiconductive layer.

[0002]

2. Description of the Related Art Conventionally, CV cables (cross-linked polyethylene power cables) have been used as large power cables for transmitting high voltage current. As shown in FIG. 9, the CV cable is obtained by covering a conductor 32 with an insulator 34 made of cross-linked polyethylene via an inner semiconductive layer 33, and further covering it with a sheath 37 via an outer semiconductive layer 35 and a shielding copper 36. It is. The inner semiconductive layer 33 and the outer semiconductive layer 35 reduce the gradient of the potential between the surface of the conductor 32 and the inner wall of the outermost sheath 37 (insulating portion), and maintain a concentric cylindrical uniform electric field. I have. The sheath 37 wraps the outer semiconductive layer 35 with an insulating portion mainly made of plastic, and has a function of holding a voltage.

In order to connect such a CV cable 31, first, the sheath 37 and the shielding copper 36 are removed, and then the outer semiconductive layer 35 is peeled off to expose the insulator 34. In order to peel off the external semiconductive layer 35, an operation is performed using a peeling device or the like dedicated to peeling of the cable coating. As shown in FIG. 10A, the cutting operation of the outer semiconductive layer 35 is performed by cutting a slit S on a predetermined circumference of the outer semiconductive layer 35 with a cutting tool (blade) provided in a peeling device or the like. I do.
At this time, the slit S is cut so that the depth does not exceed the thickness of the external semiconductive layer 35, that is, the insulator 34 is not damaged. After the slit S is cut on the circumference of the external semiconductive layer 35, the slit S is cut spirally toward the end 35 a of the external semiconductive layer 35. Also at this time, the depth of the slit S is set so that the insulator 34 is not damaged.

[0004] A cutter knife or a screwdriver is inserted into the end of the outer semiconductive layer 35 having the spiral slit S, as shown in FIG.
As shown in (b), the outer semiconductive layer 35 is slowly and spirally peeled off. Further, a slit S is cut into the circumference of the insulator 34 to be removed, and the conductor 32 is exposed to remove the CV.
The cable 31 is connectable.

[0005]

However, when performing semiconductive molding with the CV cable 31, the remaining side end 35b of the external semiconductive layer 35 is an edge as shown in FIG. When the semiconductive tape for molding 38 was wound around the outer semiconductive layer 35, an air gap G was generated near the remaining side end 35b. Also, as shown in FIG. 11B, when the semiconductive tape for molding 38 is heated so as to be in close contact with the insulator 34, the residual side end 35b of the CV cable 31 of 66 KV or more bites into the insulator 34. was there.

[0006] As described above, the air gap G is generated, or the residual side end 35b bites into the insulator 34.
There is a problem that the electrical characteristics of the CV cable 31 are degraded.

[0007]

OBJECTIVE present invention has been made in order to solve such conventional problems, the primary coating layer of a power cable, electric
Performs stable cutting and cutting according to the shape of the force cable
To improve electrical properties after molding
It is an object of the present invention to provide a power cable coating peeling device that can be used .

[0008]

The power cable stripping apparatus of the present invention for achieving the above object is a power cable stripping apparatus for cutting one coating layer of a power cable having a plurality of coating layers. , and a frame, the frame
Fixed, and processing means for forming a cut groove on the circumference of the primary coating layer, in contact with the outer periphery of the primary coating layer, said frame
A pressing member arranged so as to face the
The pressing member is disposed so as to straddle both sides of the pressing member.
A support member for vertically supporting the pressure member, and the support portion
To adjust the distance between the frame and the pressing member.
And an elastic member to be adjusted .

[0009]

[Action] By the expansion and contraction of the elastic member mounted on the support member,
You can adjust the distance between the frame and the pressing member
In one coating layer of power cable, shape of power cable
Stable cutting and cutting can be performed along with
Can improve the electrical properties after molding
You .

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a power cable stripping apparatus according to an embodiment of the present invention.

FIG. 1 shows a power cable coating stripping apparatus according to the present invention.
As shown in FIG. 7, a frame 5 having a stopper hole 5a and a sliding hole 5b formed therein, and a taper cutting tool (cutting tool) for cutting the external semiconductive layer 35 which is inserted into the stopper hole 5a and forms the CV cable 31. ) 9 a tapered creation holder 2 is a processing unit for forming a concave groove with a external half
Abut on the outer periphery of the conductive layer 35 and face the frame 5
The pressing member 3, the both sides of the frame 5, and the pressing member
3 is disposed across both sides, and the pressing member 3 can be moved up and down.
A support member for supporting the frame, and a frame provided on the support member
5 and an elastic member for adjusting the interval between the pressing members 3 . Here, the outer semiconductive layer 3 of the CV cable 31
5 constitutes one coating layer of the power cable.

The stopper hole 5a of the frame 5 is
The sliding hole 5b is formed at a position symmetrical about the stopper hole 5a.

As shown in FIG. 2, the taper forming holder 2 has a cylindrical shape and is divided into two parts.
It is fixed at 2 and integrated. The taper cutting tool 9 fixed to the taper forming holder 2 is fixed by a set screw 13 while being sandwiched by a guide plate 10 in a recess provided in the taper forming holder 2. The tapered cutting tool 9 is formed in a symmetrical V-cut as shown in FIG. 3 in order to form a tapered surface on the circumference of the outer semiconductive layer 35. Is provided with a sharp projection so that it can be easily cut into the external semiconductive layer 35. On the other hand, the guide plate 10 is for adjusting the cutting amount of the taper cutting tool 9, and the height of the cutting edge of the taper cutting tool 9 is adjusted by a driver or the like from a cutting edge adjustment window 2 a provided in the taper holder 2. .

As shown in FIG. 4, a specific adjusting method is as follows. The guide plate 10 is provided on the upper surface 16a of the cutting edge adjusting jig 16 in accordance with the thickness of the external semiconductive layer 35 of the CV cable 31 to be cut.
And a taper cutting tool 9 is attached to the cutting edge adjusting jig 16 by using a screwdriver or the like from the cutting edge adjusting window 2a.
Adjust until the cutting edge of the taper cutting tool 9 contacts the bottom surface of b. After the adjustment, the taper cutting tool 9 and the guide plate 10 are fixed with the set screw 13.

On the other hand, as a processing means for cutting a circumferential slit or a spiral slit in the external semiconductive layer 35, a conventional slit making holder 20 as shown in FIG. 5 is used. Since the holder 20 for forming a slit is formed in a cylindrical shape having the same diameter as the holder 2 for forming a taper, it can be inserted into the stopper hole 5a similarly to the holder 2 for forming a taper. This slit making holder 2
A slit cutting blade 20b for cutting the slit is fixed to the leading end of the slit 0, and a cutting direction knob 20a for changing the direction of the cutting edge of the slit cutting blade 20b is provided at the rear end. .

Further, the holder 2 for forming a taper and the holder 20 for forming a slit are provided with notches so as to stop at a predetermined position when inserted into the stopper hole 5a. After the insertion, the taper forming holder 2 or a slit forming holder 20 described later is fixed to the frame 5 with the butterfly nut 8.

The pressing member 3 has horizontal portions on both sides,
Pressing plate 3a made of a thin plate bent in a U-shape
And the lower surface side of the center of the pressing plate 3a,
Contacts the outer periphery of the outer semiconductive layer 35 of the cable 31 at two points
Plate 3c fixed to the side and the horizontal portion of the pressing plate 3a
On the underside of the to fix this horizontal part
An inner member 3b, each horizontal portion and each guide member.
Each of 3b is provided with a through hole. In addition, sliding
The plate 3c is made of a sliding material such as Teflon resin.
By using the sliding plate 3c, the power cable coating peeling device
1 can slide on the CV cable 31 smoothly.
Wear.

The support member is provided at the opening of the sliding hole 5b of the frame 5.
The base is slightly smaller than the diameter, and
And a threaded part with a diameter smaller than the outer diameter of the base
The stepped shaft 4 includes a shaft 4.
Frame 5 is inserted into the sliding hole 5b,
It is fixed to the frame 5. This allows the stepped shaft
4, the screw portion is disposed upward as shown in FIG.
Will be.

The elastic member includes a coil-shaped spring 14
A cap that encloses the spring 14 and has a through hole in the closure
And a spring holder 15.

Thus, the upper part of the stepped shaft is shown in FIG.
As shown in FIG. 3, the guide members 3b and
And the horizontal part is inserted, whereby the pressing member 3
The member is supported so as to be vertically movable. Also horizontal
The threaded portion of the stepped shaft 4 protruding above the
The spring 14 and the spring holder 15 constituting the elastic member are fitted.
The spring holder 15 is inserted
The socket 6 is screwed. Screw this butterfly nut 6
By adjusting the spring force, the elasticity of the spring 14 can be adjusted.
By adjusting the elasticity of 14, the distance between the pressing member 3 and the frame 5
The distance can be adjusted, and the CV cable 31
The pressing force against the external semiconductive layer 35 can be adjusted.
You.

The working method of the thus configured cable coating stripping apparatus 1 will be described below.

In order to connect the CV cable 31 as shown in FIG. 9, first, the sheath 37 and the shielding copper 36 are removed, and the outer semiconductive layer 35 is exposed. After the exposure, as shown in FIG. 6A, a slit S is cut in a predetermined circumference of the external semiconductive layer 35 and spirally. To cut such a slit S, the holder 20 for forming a slit is inserted into the stopper hole 5a of the frame 5 of the cable coating and stripping device 1 until it stops, and is fixed to the frame 5 with the butterfly nut 8. The cutting direction knob 20a provided on the slit making holder 20 is set at a position where the slit S can be cut on a predetermined circumference.

At a predetermined position of the CV cable 31 where the external semiconductive layer 35 is exposed, the cable coating peeling device 1 to which the holder 20 for forming a slit is fixed is fitted. After the fitting, the outer semiconductive layer 35 is tightened while tightening the butterfly nut 6.
Into the slit cutting blade 20b provided in the slit making holder 20. At this time, the bottom surface of the guide member 3b and the stepped shaft 4 are secured so that a uniform pressing force can be secured.
The gap with the location of the step is provided at a predetermined interval.

While holding the slit making holder 20 lightly, the cable coating stripping apparatus 1 is rotated upward from the near side to cut the slit S on a predetermined circumference. At this time,
A stable slit depth can be obtained by the pressing force of the spring 14 provided on the spring holder 15.

After the cut is completed on the predetermined circumference, the cut
Rotate the direction knob 20a to adjust the direction of the slit cutting blade 20b.
Tilt it at an angle. Then, a slit S is formed on a predetermined circumference.
In the same way as when cutting
When the cable sheath peeling device 1 is rotated upward from the near side while holding lightly, the cable sheath peeling device 1 moves while performing spiral cutting in the direction of the end 35a of the external semiconductive layer 35, and the spiral cutting is completed. . Since the insulator 34 coated on the outer semiconductive layer 35 is required to have high insulating properties and low loss, when the slit S is cut into the outer semiconductive layer 35, the insulator 3 has a thickness of 1 μm. Do not hurt.

After cutting the spiral slit S, the butterfly nut 8 is loosened to remove the slit forming holder 20. The taper cutting tool 9 with the cut amount of the taper cutting tool 9 adjusted by the cutting edge adjusting jig 16 is inserted until it stops against the stopper hole 5 a of the frame 5, and is fixed to the frame 5 with the butterfly nut 8.

The cable coating stripping device 1 is fitted so that the sharp projections provided on the taper cutting tool 9 are aligned with the positions of the slits S on the circumference cut into the outer semiconductive layer 35. After fitting, while tightening the butterfly nut 6,
Until the guide plate 10 fixed to the taper forming holder 2 comes into contact with the external semiconductive layer 35, the taper cutting tool 9 is bitten. While holding the slit making holder 20 lightly, the cable coating peeling device 1 is rotated upward from the near side, and a V-cut tapered surface V as shown in FIG. 6B is cut over a certain range. At this time, the spring holder 1
A stable taper depth can be obtained by the pressing force of the spring 14 provided in the fifth embodiment.

A cutter knife or a driver is inserted into the terminal of the outer semiconductive layer 35 in which the slit S is spirally inserted.
As shown in (c), the outer semiconductive layer 35 is slowly and spirally peeled off. Further, a slit is cut in the circumference of the insulator 34 to remove the insulator 34 of a predetermined length, and semiconductive molding is performed.

As shown in FIG. 7, the semiconducting molding is performed by winding a semiconducting tape 38 around the remaining side end 35v of the external semiconductive layer 35 and the insulator 34. Is heated in order to make it adhere to the insulator 34. At this time, since the residual side end 35v is on the valley side of the V-cut tapered surface V, the external force during semiconductive molding is dispersed on the tapered surface V. Thereby, it is possible to prevent the residual side end 35v from biting into the insulator 34. Also, since the remaining side end 35v is formed very thin,
Even when the semiconductive tape for molding 38 is wound around the remaining side end 35v and the insulator 34, no air gap is generated.

In this embodiment, the convex shape which is the shape of the taper cutting tool 9 is formed in a symmetrical V-cut. However, the present invention is not limited to this, and the R- cut as shown in FIG.
9A and a left-right asymmetric V-shaped bracket as shown in FIG.
9B .

Further, since a sharp projection capable of cutting the slit S is formed at the tip of the taper cutting tool 9, the taper cutting tool 9 is fixed to the outside using the taper forming holder 2. A V-shaped tapered surface V is formed in the semiconductive layer 35, and at the same time a slit S is cut on the circumference, and then the spiral slit S is formed by the slit cutting blade 20b provided in the slit forming holder 20. May be cut.

[0032]

As is clear from the above embodiments, the power cable coating stripping apparatus of the present invention is mounted on a support member.
The distance between the frame and the pressing member
Can be adjusted so that one coating layer of power cable
And stable cutting and cutting along the shape of the power cable
Can be performed, and thus the electrical properties after molding
Can be improved .

[Brief description of the drawings]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a power cable coating peeling apparatus of the present invention, wherein (a) is a front view and (b) is a side view.

FIG. 2 is a detailed view showing parts of the power cable coating stripping apparatus of the present invention.

FIG. 3 is a detailed view showing a taper cutting tool used in the power cable coating stripping apparatus of the present invention.

FIG. 4 is an explanatory view showing adjustment of a cutting amount of a taper cutting tool.

FIG. 5 is a detailed view showing components used in the power cable coating stripping apparatus of the present invention.

6A and 6B are diagrams illustrating a method of peeling a coating layer of a power cable, wherein FIG. 6A is an explanatory diagram illustrating a method of cutting a spiral slit on a predetermined circumference, and FIG. 6B is a V-cut tapered surface; FIG. 4C is an explanatory view showing a method of cutting, and FIG. 4C is an explanatory view showing a method of cutting and removing the semiconductive layer after cutting.

FIG. 7 is an explanatory view showing a state of a semiconductive molding process.

8A and 8B are views showing another embodiment of a taper tool used in the power cable coating peeling apparatus of the present invention, wherein FIG. 8A is a detailed view of an asymmetric V-cut taper tool, and FIG.
Detailed view of a taper cutting tool for cutting.

FIG. 9 is a sectional view of a power cable.

10A and 10B are diagrams showing a conventional power cable coating peeling method, in which FIG. 10A is an explanatory diagram showing a method for cutting a predetermined slit and a spiral slit, and FIG. 10B is a diagram for peeling a semiconductive layer after cutting. FIG.

FIG. 11 is an explanatory view showing a state of semiconductive mold processing;
(A) is an explanatory view of a power cable on which a semiconductive tape for molding is wound, and (b) is an explanatory view showing a state of the power cable when the power cable on which the semiconductive tape for molding is wound is heated.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Power cable coating peeling apparatus 2 ... Taper making holder 2a ... Blade edge adjustment window 3 ... Pressing member 3a ... Pressing plate 3b ... Guide member 3c ... Sliding plate 4 ... Stepped shaft 5 ... Frame 5a ... Stopper hole 5b ... Sliding hole 6, 7, 8 ... butterfly nut 9 ... taper bite 10 ... guide plate 11, 12 ... bolt 13 ... set screw

Claims (1)

(57) [Claims] 1. A power cable stripping and stripping device for cutting one coating layer of a power cable having a plurality of coating layers, comprising: a frame; and a cutting groove fixed to the frame and formed on the circumference of the one coating layer. a processing means for forming a outer of the primary coating layer
A pusher that abuts the circumference and is arranged to face the frame.
Pressure member, between both sides of the frame and both sides of the pressing member
And support the pressing member so as to be vertically movable.
A supporting member, the frame provided on the supporting member,
And a resilient member for adjusting an interval between the pressing members .