JPH06209510A - Tool and method for finishing cable end - Google Patents

Abstract

PURPOSE:To easily provide a tap part at an outer semiconducting layer in cable-end finishing by providing a guide part wherein one end is fixed to a handle part, a cable insulating layer is surrounded on the other end side and the revolution orbit of the handle part is decided. CONSTITUTION:A cable-end finishing tool is composed of a handle part 11, of a cutter 14 which is attached to its tip 12 and of a guide part 15 which has been formed by bending a metal sheet. When it is used, a cable 10 is sandwiched between the tip 1 2 of the handle part 11 and the other end 15-2 of the guide part 15, and, at the same time, the cutter 14 is arranged so as to come into contact with the outer circumferential face of the cable 10. When the handle part 11 revolves while the cutter 14 is being pressed to the outer circumferential face of the cable, a nearly V-shaped groove 20 is formed in an outer semiconducting layer 1 on the cable. The groove 20 is formed so as to have a depth by which the outer semiconducting layer 1 is removed nearly completely and divided into two right and left parts. As a result, the outer semiconducting layer 1 on the terminal side can be stripped easily only by forming a break in the longitudinal direction, and a tapered part is formed in the outer semiconducting layer 1 which has been left at the outer circumference of an insulating layer 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cable terminating tool and a terminating method for terminating a cable when forming a connecting portion or a terminating portion of the cable.

[0002]

2. Description of the Related Art When forming a connecting portion or a terminating portion of a cable, a sheath or a shield at the end of the cable is peeled off, and a terminal treatment for conductor connection or electrical protection is performed. FIG. 7 is an explanatory diagram of a CV cable terminal processing procedure in such a case. (A)-(d) of a figure is a cable end perspective view in the terminal treatment process. In the figure, the cable shown in (a) is one in which the outer semiconductive layer 1 is exposed by peeling off the sheath and the shielding layer. This cable has a structure in which the outer periphery of the conductor 2 is covered with the inner semiconductive layer 3 and the outer side thereof is covered with the insulating layer 4 and the outer semiconductive layer 1 when viewed from the cut end surface.

When such a cable end treatment is performed, it is necessary to peel off the outer semiconductive layer 1 for a predetermined length. In this case, as shown in FIG. 2B, a knife or the like (not shown) is applied to the outside of the outer semiconductive layer 1 to scrape the outer semiconductive layer 1 from the surface of the insulating layer 4. Figure (c) shows
It is an appearance when the peeling process is completed. In the case of a CV cable, for example, both the insulating layer 4 and the outer semiconductive layer 1 are made of crosslinked polyethylene. These are manufactured by a three-layer coextrusion method, and in the bonding type, the insulating layer 4 and the outer semiconductive layer 1 are adhered and integrated. Therefore, a great deal of skill is required for the work of peeling the outer semiconductive layer 1 without damaging the insulating layer 4.

Therefore, a CV cable of 33 kV class or less employs a free stripping type structure in which the adhesive force between the insulating layer 4 and the outer semiconductive layer 1 is weakened. For such a cable, see FIG.
As shown in FIG. 4, if a cut is made in the circumferential direction at a predetermined portion of the outer semiconductive layer 1 in advance, the outer semiconductive layer 1 can be easily peeled off from the outer peripheral surface of the insulating layer 4 as shown in the figure. it can.

[0005]

By the way, the above-mentioned free stripping type has been conventionally used exclusively for low voltage cables of about 33 kV or less due to problems in electrical characteristics. It has also been adopted for high voltage cables. However, in the high-voltage cable, the following problems have occurred during this terminal treatment. FIG. 8 shows a cross-sectional view of a main part of a cable showing problems in terminal processing. Figure 8
As shown in (a), when the terminal portion of the outer semiconductive layer 1 is stripped from the outer periphery of the insulating layer 4, a step is formed in the stripped portion. Further, the outer semiconductive layer 1 thus peeled off is then covered with a stress cone or the like, and the semiconductive tape 5 as shown in the figure is wound for electrical connection with the shielding layer.

However, such a semiconductive tape 5
In some cases, triangular voids 6 as shown in the figure may be formed in the gap between the outer semiconductive layer 1 and the outer semiconductive layer 1. When such a triangular void 6 is generated, corona discharge is generated inside this, which causes an accident. Therefore, as shown in (b), the end portion of the outer semiconductive layer 1 is processed into a tapered shape. This taper processing is performed by an expert who scrapes off the outer semiconductive layer 1 using a knife or the like.

However, in the above-mentioned free stripping type, as shown in FIG.
There is a problem that an end portion of the outer semiconductive layer 1 is lifted up and a gap 7 is generated during the work of peeling off a part of the outer semiconductive layer 1. In such a state, taper processing is not performed well, and this gap 7 is also formed after winding the semiconductive tape.
There is a possibility that it may be an electric weak point similar to the triangular void 6 shown in (a). The present invention has been made in view of the above points, and an object of the present invention is to provide a cable terminal treatment tool and a terminal treatment method that facilitate such tapering of the outer semiconductive layer.

[0008]

A cable end treatment tool according to a first aspect of the present invention is provided with a handle portion that revolves around the cable insulating layer with the tip facing the outer surface of the cable, and is attached to the tip of the handle portion. A cutter having a tip that bites into the outer semiconductive layer formed on the outer circumference of the cable insulating layer,
One end is fixed to the handle part, and the other end side surrounds the cable insulating layer, and the guide part determines the revolution trajectory of the handle part.

According to a second aspect of the present invention, after forming an annular V-shaped groove, which does not reach the outer surface of the cable insulating layer, with respect to the outer semiconductive layer formed of the free stripping structure, on the outer periphery of the cable insulating layer. The present invention relates to a cable terminal treatment method, characterized in that the outer semiconductive layer on the terminal side is peeled off from the cable insulating layer while tearing the portion of the substantially V-shaped groove.

According to a third aspect of the invention, the substantially V-shaped groove formed in the outer semiconductive layer has a surface which is separated and removed from the cable end when viewed from the side surface of the cable, the surface being perpendicular to the cable axis. On the other hand, the surface on the side forming the cable end after the terminal treatment has an acute angle with respect to the surface perpendicular to the cable axis, and has an inclination close to an obtuse angle.

[0011]

In the tool of the first aspect of the present invention, the cutter is pressed against the outer surface of the cable, and the guide part revolves the handle part in the direction of the arrow while pressing the tip of the cutter against the outer semiconductive layer of the cable. The tip of the cutter forms a generally V-shaped groove circumferentially in the outer semiconductive layer of the cable. Therefore, the end of the outer semiconducting layer left on the outer periphery of the insulating layer of the cable is automatically tapered, and the other outer semiconducting layer separated by this substantially V-shaped groove is easy in the case of the free stripping type. Can be peeled off. When the second invention is carried out by the tool as shown in the first invention, the terminal treatment is facilitated without impairing the adhesion of the end portion of the outer semiconductive layer left on the insulating layer. As shown in the third invention, when a substantially V-shaped groove is formed on the outer semiconductive layer so that the surface on the side peeled off from the cable end and removed is an obtuse angle with respect to the surface perpendicular to the cable axis, When tearing, it is easy to make a spiral cut, and the taper shape of the surface forming the cable end is adjusted.

[0012]

The present invention will be described in detail below with reference to the embodiments shown in the drawings. [First Invention] FIG. 1 is a perspective view showing an embodiment of a cable end processing tool of the first invention. As shown in the figure, the cable end treatment tool of the present invention comprises a handle portion 11, a cutter 14 attached to the tip 12 thereof, and a guide portion 15 formed by bending a metal plate. The handle portion 11 is a cable 10
The cable 10 revolves around the cable 10 with the tip 12 facing the outer surface of the cable.

FIG. 2 shows an external view of the cutter 14.
(A) is a side view, (b) is a plan view, and (c) is a perspective view. As shown in the figure, the cutter 14 is formed by bending the center of the cutter 14 into a chevron shape and providing a blade portion 14-1 there. Further, screw holes 14-2 are provided at both ends, and are configured to be attached to the tip 12 of the handle portion 11 shown in FIG. 1 with screws. In addition, as shown in FIG.
A tip 14-3 is formed at the center of -1 and is configured to bite into the semiconductive layer of the cable to form a substantially V-shaped groove. In addition, the guide unit 1 shown in FIG.
5 has one end 15-1 fixed to the handle portion 11 and the other end 1
5-2 is bent so as to surround the cable 10. Depending on the bending angle of the other end 15-2,
The orbit of the handle 11 is determined. It should be noted that one end 15-1 of the guide portion 15 is attached to the handle portion 11 so as to be slidable in the longitudinal direction as necessary, and the radius of the revolution trajectory can be adjusted.

The cable end processing tool of the present invention having the above-mentioned structure is used as follows. FIG. 3 shows an example of use of the cable end processing tool of the present invention. (A) of a figure is a side view of the cable terminal processing tool in a use state. As shown in the figure, the cable 10 is sandwiched between the tip 12 of the handle portion 11 and the other end 15-2 of the guide portion 15. at the same time,
The cutter 14 is arranged so as to contact the outer peripheral surface of the cable 10. As shown by the arrow 17 in the figure, the guide portion 1
The cable 5 is configured to expand and contract according to the outer diameter of the cable 10. This allows the cutter 14 to be connected to the cable 1
The pressure applied to the outer periphery of 0 is adjusted, and the orbit of the handle 11 is adjusted.

As shown in (b), when viewed from the side of the cable 10, the handle portion 11 is revolved by pressing the cutter 14 against the outer peripheral surface of the cable in the state shown in the figure. As a result, as shown in (c), a substantially V-shaped groove 20 is formed in the outer semiconductive layer 1 of the cable. The substantially V-shaped groove 20 has a depth such that the outer semiconductive layer 1 is just completely scraped off so as not to reach the outer surface of the cable insulator and divided into two right and left. Thereby, in the case of a free-stripping type cable, the outer semiconductive layer 1 on the left side, that is, on the terminal side of the cable, can be easily peeled off only by making a vertical cut. (D) shows the state after the peeling. As shown in this figure, the outer semiconductive layer 1 left on the outer periphery of the insulating layer 4 has a taper formed by the cable terminal treatment tool of the present invention, and peeling or the like occurs in this portion as in the conventional case. Absent. Therefore, the semiconductive tape winding or the like can be applied immediately thereafter.

[Second Invention] According to the second invention, after forming an approximately V-shaped groove in an annular shape in the outer semiconductive layer formed in the free stripping structure on the outer periphery of the cable insulating layer as described above, The outer semiconductive layer on the terminal side is peeled off from the cable insulating layer, and the substantially V-shaped groove portion is torn off. That is, irrespective of the shape of the tool used, if the substantially V-shaped groove as described above is formed and the terminal treatment is performed, the automatically taper end portion which is the object of the second invention is obtained. It becomes possible to form an external semiconductive layer that has.

The following example shows a method capable of forming the best taper portion in the case of tearing as described above. Figure 4
6 to 6 show states in which the substantially V-shaped annular groove as described above is formed by using cutters having various shapes. FIG. 4 (a) is a front view of the cutter, and FIG. 4 (b) is a cross-sectional view of the cable in a state where the cutter forms a substantially V-shaped groove 20. As shown in this figure, the cutter 31 has a roof-shaped blade, and revolves while biting its tip on the outer peripheral surface of the cable.

In (c), the cutter as described above is processed to make the angle of its tip sharp. Such a portion is called a clearance angle of the cutter. By sharpening the clearance angle, the substantially V-shaped groove can be cut better than that shown in the example (a). As described above, one semiconductive layer sandwiching the substantially V-shaped groove is stripped off, and the semiconductive layer is separated at the center of the substantially V-shaped groove 20. Therefore, it is preferable that the cutting is performed well, and it is preferable that the deepest portion of the substantially V-shaped groove 20 is thin and easily cut.

FIG. 5 shows an example in which a cutter having another structure is used. (A) is a front view of such a cutter 33, (b) is a cross-sectional view of a cable at the time of cutting a groove using the cutter 33, and (c) is a side view of the substantially V-shaped groove thus formed. . In this example, a sharp edge 33 </ b> B is provided at a portion of the cutter 33 that is in contact with the deepest portion of the substantially V-shaped groove 20. As a result, the semiconductive layer can be easily separated at the deepest portion of the substantially V-shaped groove 20.

Here, in order to easily peel off one outer semiconductive layer 1 of the substantially V-shaped groove 20 from the insulating layer 4, FIG.
It is preferable to provide a spiral cut 38 as shown in (c). In this way, the outer semiconductive layer 1 can be peeled off like an apple. However, such cuts 38 must, of course, not damage the cable insulation layer 4. Therefore, the break 38
As shown in FIG. 5C, it is difficult to form up to the center of the substantially V-shaped groove 20, and an unbroken portion of width D remains in the outer semiconductive layer 1 to be stripped. If the outer semiconductive layer 1 is peeled off in this state, the outer semiconductive layer 1 may be torn at the portion of the width D, and the shape of the cut end portion of the semiconductive layer may be disturbed.

[Third Invention] In the third invention shown in FIG. 6, a cutter 34 having a different shape from the conventional one is used in order to prevent such disturbance. That is, FIG. 6 (a)
As shown in (c), the surface 21A of the substantially V-shaped groove 20 on the side peeled off and removed from the cable end is approximately parallel to the surface 42 perpendicular to the cable axis 40 in this example. It is formed to a degree. On the other hand, the surface 22 </ b> A on the side forming the cable end has an inclination close to an obtuse angle with respect to the surface 42 perpendicular to the cable axis 40. By doing so, when the spiral cut 38 is formed in the outer semiconductive layer 1 as shown in FIG. 7C, the cut 38 can be made up to the vicinity of the center of the substantially V-shaped groove 20. When the outer semiconducting layer 1 is peeled off like an apple, the outer semiconducting layer 1 is properly separated right and left at the deepest portion of the groove 20 having a substantially V-shape. By the method as described above, the outer semiconductive layer 1 having a good tapered surface as shown in FIG. 3D is completed at the same time when the unnecessary portion is peeled off.

The present invention is not limited to the above embodiments. The shapes and the like of the handle portion 11, the cutter 14, and the guide portion 15 of the tool shown in the above embodiment can be modified into various shapes having similar functions. For example, the guide portion 15 may be formed by a roller or the like so as not to damage the outer circumference of the cable, and the cutter 14 adjusts the depth of the substantially V-shaped groove according to the thickness of the outer semiconductive layer. For example, it may be embedded in the tip 12 of the handle portion 11 and the tip of which is adjustably projected. Further, the handle portion 11 may be variously devised in terms of shape so that the outer circumference of the cable can be easily revolved.

Further, in the embodiment of FIG. 6, the surface of the substantially V-shaped groove on the side removed from the cable end is formed so as to substantially coincide with the surface perpendicular to the cable axis, but a spiral cut is formed. When formed, if the width D of the outer semiconductive layer where the cut edge remains, as shown in FIG. 5C, is so small as to be negligible, the inclination may be freely selected within that range.

[0024]

According to the cable end treatment tool of the first invention described above, the tip bites into the outer semiconductive layer of the cable and the handle portion that revolves around the cable insulating layer with the tip facing the outer peripheral surface of the cable. Since it is composed of a cutter attached like this and a guide part that determines the orbit of the handle part, when the cable having a free-stripping type outer semiconductive layer is terminated, the remaining part is removed by stripping the outer semiconductive layer. The outer semiconductive layer does not rise or the like. Further, the taper treatment of the outer semiconductive layer is completed by forming the substantially V-shaped groove, and the unnecessary portion of the outer semiconductive layer can be stripped off and the next treatment can be immediately performed.
The efficiency of cable terminal processing work can be improved.

Further, according to the second aspect of the present invention, for example, by using the cutter having the above-described structure, the substantially V-shaped groove is formed in the annular shape in advance and the portion is torn, so that the outer semiconductive layer is torn. At the same time, it is possible to obtain a semiconductive layer that is favorably tapered. Further, according to the third invention, the surface on the side that is peeled off and removed from the cable end is made an acute angle with respect to the surface perpendicular to the cable axis, and the surface on the side forming the cable end is opposed to the surface perpendicular to the cable axis. Since the outer semiconducting layer has an inclination close to an obtuse angle, when the outer semiconducting layer is peeled off, the outer semiconducting layer is torn cleanly at the deepest part of the substantially V-shaped groove, and good terminal treatment can be performed. .

[Brief description of drawings]

FIG. 1 is a perspective view showing a cable end processing tool embodiment of the present invention.

FIG. 2 shows a cutter of the tool of the present invention, (a) is a side view, (b) is a plan view, and (c) is a perspective view.

FIG. 3 shows an example of using the cable end treatment tool of the present invention,
(A) is a front view of the tool in use, (b) is a side view, (c) is a side view showing a substantially V-shaped groove of the cable being processed, (d) is a cable terminal side surface after terminal processing It is a figure.

FIG. 4 shows a modified example of a cutter for carrying out the present invention, in which (a) is a front view, (b) is a side view, (c) is a front view of a cutter having another structure, and (d) is a side view. It is a figure.

FIG. 5 shows yet another embodiment of the cutter,
(A) is a front view, (b) is a side view, (c) is a side view of the processed cable.

FIG. 6 shows an embodiment of a cutter for carrying out the third invention, (a) is a front view, (b) is a side view, and (c) is a side view of a processed cable.

FIG. 7 shows a conventional cable terminal processing method, including (a) to
(D) is a cable terminal perspective view in the processing process.

FIG. 8 is a vertical cross-sectional view of a cable terminal main portion for explaining a conventional problem.

[Explanation of symbols]

 10 cable 11 handle part 12 tip 14 cutter 15 guide part 15-1 one end of guide part 15-2 the other end of guide part

Claims (3)

[Claims] 1. A handle portion that revolves around the cable insulating layer with the tip facing the outer surface of the cable, and an outer semiconductive layer formed on the outer periphery of the cable insulating layer, which is attached to the tip of the handle portion. A cable terminal, comprising: a cutter having a biting tip; and a guide portion having one end fixed to the handle portion and surrounding the cable insulating layer on the other end side to determine a revolution trajectory of the handle portion. Processing tool. 2. A substantially V-shaped groove that does not reach the outer surface of the cable insulating layer is formed in an annular shape on the outer periphery of the cable insulating layer with respect to the outer semiconductive layer formed in a free stripping structure, and then the terminal side is formed. A method of treating a cable end, characterized in that the outer semiconductive layer is peeled off from the cable insulating layer while the substantially V-shaped groove portion is torn. 3. The substantially V-shaped groove formed in the outer semiconductive layer has a surface on the side which is peeled and removed from the cable end when viewed from the side surface of the cable, with respect to a surface perpendicular to the cable axis. 3. The cable terminal processing method according to claim 2, wherein the surface on the side that constitutes the cable terminal after the terminal processing has an acute angle with an angle close to an obtuse angle with respect to the surface perpendicular to the cable axis.