JP3242130B2 - Electronic component holding method and electronic component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component holding method and an electronic component mounting apparatus, and more particularly to a technique for holding an electronic component by vacuum.

[0002]

2. Description of the Related Art There is an electronic component holding device which has a suction nozzle and suctions electronic components by vacuum.
The suction nozzle is brought into close contact with the end face of the electronic component, and a vacuum is supplied to the space inside the suction nozzle closed by the electronic component, thereby sucking the electronic component. When the electronic component is held by the suction nozzle as described above, it is desirable that the axis of the electronic component be positioned in the vertical direction and be held on the axis. This is because, when held in such a manner, the electronic component can be easily mounted on the member to be mounted, and can be stably held. For example, in the case of a connector that is formed in a container shape having a larger opening than the suction nozzle, and a pin is erected inside the connector and is mounted with the opening facing upward, even if an attempt is made to hold the upper part,
Because of the opening, the suction nozzle cannot be closed and cannot be suctioned by vacuum. Therefore, conventionally, in such a case, the electronic component is held by four claws or the flat side surface of the electronic component having no opening is sucked.

[0003]

However, when four claws are used, the claws are provided so as to be openable and closable.
A device for opening and closing the pawl is required, which complicates the structure of the device and increases the cost. Further, when the side surface of the electronic component is sucked, the electronic component is held in a cantilever shape, and the holding force is weak, unstable and not suitable for practical use. Claim
According to the invention of the first aspect, it is possible to stably suck an electronic component having no portion suitable for closing the suction nozzle on the upper surface to be sucked by the suction nozzle by vacuum , and
An object of the present invention is to provide an electronic component holding method capable of detecting a holding error of an electronic component due to an image by imaging . According to a second aspect of the present invention, there is provided an electronic component holding device capable of stably sucking, by vacuum, an electronic component having no portion suitable for closing the suction nozzle on an upper surface to be sucked by the suction nozzle. An object of the present invention is to provide an electronic component mounting apparatus having a function of detecting and correcting the holding error of the electronic component by imaging.

[0004]

According to a first aspect of the present invention, there is provided a method of holding an electronic component having a concave portion opened at the center of a flat upper surface by a suction nozzle. as was out extending radially outwardly from the tip portion of the suction nozzle and timber having optical transparency
Using those having a flat cover made of fees, the outer peripheral portion on the upper surface of the electronic component and the cover by adhesion in a state of projecting to the outer periphery than the upper surface, the opening of the recess is closed by a cover and vacuum pressure chamber communicating with the suction nozzle with, Rutotomoni to hold the electronic component by the suction nozzle by the vacuum of the vacuum chamber, the suction
Illuminates the electronic components held by the nozzle from the cover side
And the imaging device based on the illumination light transmitted through the cover.
By acquiring the projected image of the electronic component,
It is characterized by acquiring the holding error by the suction nozzle
Things. In addition, the invention of claim 2 provides (1) a suction nozzle provided with a suction tube which is in close contact with the electronic component on the front end surface and suctions the electronic component by vacuum supplied from the rear end side; and (2) the suction nozzle. A nozzle holding unit that detachably holds the electronic component, (3) a light emitting member that illuminates the electronic component sucked by the suction tube from behind, and (4) a light emitting member that is held by the suction tube with a light background as a bright background. (5) a moving device for relatively moving the nozzle holding unit and the printed circuit board to mount the electric component held by the suction nozzle on the printed circuit board; A) a rotating device that relatively rotates the nozzle holding unit and the printed circuit board around the axis of the nozzle holding unit; and (7) an electronic component held by the suction nozzle based on a projection image obtained by the imaging device. Center position error and angle A control device for mounting an electronic component on a printed circuit board after acquiring an error and correcting the center position error and the angular error by controlling the moving device and the rotating device. At the tip of the suction tube, the light emitting member is brought into close contact with a portion of the electronic component on the outer peripheral side from a portion facing the suction nozzle, so that the vacuum pressure communicates with the electronic component and the suction nozzle. A suction nozzle with a light emitting member provided in a state where a chamber is formed is provided.

[0005]

In the electronic component holding method according to the first aspect of the present invention, even if a portion of the electronic component to be sucked by the suction nozzle does not have a surface suitable for closing the suction nozzle, a surface on the outer peripheral side of the portion is not required. A vacuum pressure chamber is formed by the close contact of the cover with the cover, and the electronic components are sucked by the vacuum supplied to the vacuum pressure chamber. In addition, since the cover has optical transparency, it is possible to obtain a projection image of the electronic component by the imaging device without hindering irradiation of the electronic component with light from behind . Also in the electronic component mounting apparatus according to the second aspect of the present invention, the electronic component is sucked in the same manner, but since the light emitting member also serves as the cover, the electronic component is separated from the electronic component. The projection of the electronic component can be obtained by the imaging device without irradiating the cover with the light.

[0006]

As described above, according to the first and second aspects of the present invention, even if there is no portion suitable for closing the suction nozzle on the upper surface of the electronic component to be sucked by the suction nozzle, the portion is present. In the same manner as described above, the electronic component can be sucked by vacuum, the holding force is not insufficient, the electronic component can be stably held, and the device can be configured simply and inexpensively. Further, the holding position of the electronic component can be detected by acquiring the projected image of the electronic component, and the mounting position can be corrected.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings.

[0008] Figure 8, respectively 9 and 10, the connector 10, 12 and ball as an electronic component held by the electronic component holding apparatus of the electronic component mounting apparatus of this embodiment
The volume 14 is shown. Main body 1 of connector 10 shown in FIG.
Reference numeral 8 denotes a rectangular container, which is mounted on a printed circuit board with the opening 20 facing upward. A plurality of pins 22 are provided in the main body 18.
Is erected. These pins 22 have a length that does not protrude from the opening 20 to the outside of the main body 18. Also, the main body 1
A plurality of lead wires 24 are attached to each of two sides parallel to the longitudinal direction of the bottom of 8. The body 26 of the connector 12 shown in FIG. 9 is a hollow rectangular parallelepiped, and has a plurality of through holes 28 communicating with the inside on one surface, and is mounted with the through holes 28 facing upward. A plurality of lead wires 30 are attached to each of two sides parallel to the longitudinal direction of the bottom of the main body 26. The volume 14 shown in FIG. 10 has a cylindrical knob 34 rotatably mounted on a base plate 32. The concave spherical surface 3 is provided on the upper surface of the knob 34.
6 are formed.

Next, the electronic component holding device will be described. In FIG. 2, reference numeral 40 denotes a device main body of an electronic component mounting device having an electronic component holding device. This device body 40
Is moved in the X-axis direction perpendicular to the paper by a moving device (not shown). A through hole 42 penetrating in the vertical direction is formed in the apparatus main body 40, and a nut 44 and a spline member 46 are rotatably supported concentrically and at a distance in the vertical direction. A male thread 50 of the hollow rod 48 is screwed into the nut 44, and a spline 52 formed below the male thread 50 of the hollow rod 48 is fitted into the spline member 46. The nut 44 and the spline member 46 are a ball nut and a ball spline member holding a large number of balls for removing backlash and reducing friction. A gear 54 is fixed to an upper end portion of the nut 44 protruding from the apparatus main body 40, and is meshed with a gear 58 fixed to an output shaft of the servomotor 56 for raising and lowering the nozzle. The hollow rod 48 is moved up and down by being rotated. 60 is
This is an encoder that detects the rotation angle of the nozzle elevation servomotor 56. A gear 62 is fixed to a lower end of the spline member 46 protruding from the apparatus main body 40, and is meshed with a gear fixed to an output shaft of a nozzle rotation servomotor (not shown). By rotating 46,
Hollow rod 48 is rotated about its axis.

A chuck adapter 66 and a chuck 68 are attached to the lower end of the hollow rod 48, and these three parts constitute a holding portion 71 of the suction nozzle 70. As shown in FIGS. 1 and 3, the chuck adapter 66 has ear pieces 74 and 76 extending radially outward at two diametrically separated locations on one end of the cylindrical portion 72. The ear piece 76 is formed with a slit 78 extending in the axial direction of the cylindrical portion 72 and opening on the inner peripheral surface of the cylindrical portion 72. The inner peripheral surface of the cylindrical portion 72 has a stepped shape, and is fitted to the lower end of the hollow rod 48 in the large-diameter hole 80 on the side where the lugs 74 and 76 are provided. Is screwed, the slit 78 is reduced, and the large-diameter hole 80 is reduced in diameter, and is attached to the hollow rod 48 so as not to come out.

As shown in FIGS. 1 and 4, the chuck 68 has a cylindrical portion 82 similar to the chuck adapter 66.
And a pair of ear pieces 84 and 86 provided at one end thereof, and one ear piece 86 is formed with a slit 88. The chuck 68 has ear pieces 84 and 8 of the cylindrical portion 82.
6 is fitted into the cylindrical portion 72 of the chuck adapter 66 at the small-diameter hole portion 90 formed on the side where the
Are attached to the chuck adapter 66 by screwing screws (not shown). The lower end of the inner peripheral surface of the cylindrical portion 82 is formed as a large-diameter hole 92, and pins 94 project into the large-diameter hole 92 at two diametrically spaced locations on the peripheral wall of the large-diameter hole 92. It is fitted in the direction.

As shown in FIG. 1, the suction nozzle 70 includes a sleeve 100 and the suction tube 1 fitted to the sleeve 100.
02. The sleeve 100 has a stepped shape,
A compression coil spring 106 (hereinafter, simply referred to as a spring 106) is fitted to the small diameter portion 104, and one end is supported by a shoulder 110 between the small diameter portion 104 and the large diameter portion 108. The large diameter portion 108 of the sleeve 100
The end opposite to the small diameter portion 104 of FIG.
As shown in FIG. 1, a substantially rectangular engaging portion 112 is formed, and ear portions 114 are formed at both ends in the longitudinal direction of the engaging portion 112, respectively. As shown in FIG. 5, an inclined surface 116 is formed. These inclined surfaces 116 are inclined with respect to a plane parallel to the axis of the sleeve 100 and are located on the same plane. Further, a fitting portion 118 having a circular cross section is provided on the lower surface of the engaging portion 112, and a light emitting plate 120 as a light emitting member is fitted and fixed on an outer peripheral surface thereof, while the suction tube 102 is fitted on an inner peripheral surface thereof. And are projected downward through the light emitting plate 120. The light emitting plate 120 emits visible light in response to ultraviolet rays when the holding position of the electronic component is detected by the suction nozzle 70.

In the middle of the movement path of the electronic component holding device,
As shown in FIG. 7, an imaging device 122 is provided. The imaging device 122 includes a lens 124 and a camera 126. When the suction tube 102 is positioned right above the imaging device 122, the imaging device 122 faces the light emitting plate 120 with the electronic components held by the suction tube 102 therebetween. It is provided to be. Around the lens 124 of the imaging device 122,
A ring lamp 128 is provided and attached to a frame (not shown). The ring lamp 128 emits ultraviolet light, and has a ring-shaped first filter 130 that allows only the transmission of ultraviolet light on a side facing the light emitting plate 120.
And are supported by the frame. Therefore, the light emitting plate 120 is irradiated only with ultraviolet rays, and absorbs the ultraviolet rays and emits visible light. Light emitting plate 12
The wavelength of the light emitted to 0 and the wavelength of the light emitted by the light emitting plate 120 are different from each other.

Further, the imaging device 122 includes a lens 12
4 and the second filter 1 at a position facing the electronic component.
32 is provided to be supported by a frame that supports the first filter 130. The second filter 132 absorbs ultraviolet light while allowing visible light to pass therethrough, so that only visible light emitted by the light emitting plate 120 enters the imaging device 122.

A cover 140 is attached to the lower end of the suction tube 102 protruding from the light emitting plate 120 as shown in FIG. The cover 140 is connected to the connectors 10 and 12.
And has a square shape larger than the volume 14, and is made of a transparent and hard synthetic resin.

When attaching the suction nozzle 70 to the holding portion 71, the pair of ear portions 114 of the engaging portion 112 and the chuck 6
The small-diameter portion 104 of the sleeve 100 is fitted into the small-diameter hole 142 provided at the lower end of the cylindrical portion 72 of the chuck adapter 66 with the phase of the pin 94 shifted from that of the eighth pin 94. The sleeve 100 is further moved from a state where the other end of the spring 106 is in contact with the cylindrical portion 72 of the chuck adapter 66.
After the engagement portion 112 has reached the position beyond the pin 94 while being compressed, it is rotated to a position where the phase of the ear portion 114 and the pin 94 match.

In this state, if the force applied to the sleeve 100 is released, the sleeve 100
6, the inclined surface 116 is engaged with the pin 94, and can be moved relative to the chuck 68 in the axial direction. Due to the engagement with 94, it is attached so as not to rotate relatively. Since the inclined surface 116 is inclined in the same direction, the torque applied to the sleeve 100 is balanced based on the effect of the inclined surface, and the sleeve 100 does not rotate. Thus, the suction nozzle 70 attached to the chuck 68 sucks the electronic component by vacuum, and mounts the electronic component on the printed board 144 as a mounting target member. The suction nozzle 70
When removing from the holding portion 71, the spring 106
The sleeve 100 may be moved to the hollow rod 48 side while compressing, and the engagement between the inclined surface 116 and the pin 94 may be released, then rotated, and removed from the chuck adapter 66 with their phases shifted.

As shown in FIG. 2, the hollow rod 48 has
A pipe 146 is fitted on the inner peripheral surface so as to be relatively movable in the axial direction. As shown in FIG. 1, the suction nozzle 7 held by the holding unit 71
0 is in contact with the upper surface of the sleeve 100. The pipe 146 detects the start of the relative movement between the suction nozzle 70 and the hollow rod 48 as described in the specification of Japanese Patent Application No. Hei. This is for controlling the pressing force at the time of mounting on the 144 to an optimal magnitude, but has no direct relation to the present invention, and therefore the description is omitted.

When the connector 10 is mounted on the printed circuit board 144 by the electronic component mounting apparatus configured as described above, the electronic component holding device is moved to the electronic component supply position, and the suction tube 102 is moved to the position inside the component supply device. The suction nozzle 70 is lowered in a state where the suction nozzle 70 is positioned on the connector 10 to be received. The connector 10 is housed in the component supply device with the opening 20 facing upward at the time of mounting facing upward. When the suction nozzle 70 is lowered, the suction tube 102 faces the opening 20 and as shown in FIG. ,
The cover 140 is brought into contact with the upper surface of the main body 18. At this time, the suction nozzle 70 is slightly lowered even after the cover 140 abuts. However, when the sleeve 100 compresses the compression coil spring 106 and moves with respect to the hollow rod 48, the connector 10 and the cover The cover 140 is brought into close contact with the periphery of the opening 20 while avoiding damage to the 140.

The opening 20 is larger than the end face of the suction nozzle 70, and forms a quadrangle completely enclosing a circle which is a projected figure of the outer peripheral surface of the suction nozzle. Surface. Therefore, if the cover 140 comes into close contact with the periphery of the opening 20, the opening 2
0 is substantially airtightly closed, and the main body 18 and the cover 14 are closed.
With 0, a vacuum pressure chamber 150 communicating with the suction tube 102 is formed, and vacuum is supplied to the vacuum pressure chamber 150 to suck the connector 10. Since the cover 140 is made of a hard synthetic resin, the cover 140 is closely attached to the connector 10 and does not distort or deform when the connector 10 is sucked, so that an error may occur in the holding posture of the connector 10. Absent.

After the suction, the suction nozzle 70 is raised,
The apparatus main body 40 is moved, and the suction tube 102 is positioned right above the imaging device 122. Then, of the light emitted from the ring lamp 128, only the ultraviolet light passes through the first filter 130 and is emitted toward the light emitting plate 120.
The cover 1 is provided between the first filter 130 and the light emitting plate 120.
Although the cover 40 is present, the cover 140 is transparent, so that it does not prevent the ultraviolet light from reaching the light emitting plate 120, and the light emitting plate 120 absorbs the ultraviolet light and emits visible light toward the connector 10. The visible light passes through the cover 140 and irradiates the connector 10, further enters the lens 124, and forms a projected image of the connector 10 on the solid-state imaging element surface of the imaging device 122.

At this time, the ultraviolet light emitted by the ring lamp 128 hits the connector 10 and peripheral equipment, and the reflected light goes to the image pickup device 122. However, since the second filter 132 absorbs the ultraviolet light, the light emitted by the light emitting plate 120 is emitted. Forms a clear projected image without being affected by the reflected light from the connector 10 or the like. The imaging device 122 converts this projection image into a binary signal and outputs it to a control device (not shown). The control device compares the binarized signal with a binarized signal indicating the normal position of the connector 10 stored in advance in the memory of the control device itself, and determines the angular error Δθ about the center line of the connector 10 and the center position. The errors ΔX and ΔY are calculated.

After the component position detection is performed, the connector 10 is moved to the mounting position. At this time, the connector 10 is moved so that the center position error ΔX is eliminated, and the movement is performed. During this time, the nozzle rotation servomotor is driven, the suction tube 102 is rotated to rotate by an angle necessary to eliminate the angle error Δθ, and the printed circuit board 144 is moved to the center position error ΔY.
Is moved by the necessary distance to eliminate the problem. Therefore, when the suction tube 102 is positioned at the electronic component mounting position, the printed board 144 and the connector 10 are at a relative position suitable for mounting, and the suction nozzle 7
0 is lowered, and the connector 10 held by the suction tube 102 is pressed to a predetermined position on the printed circuit board 144 and fixed by bonding or the like. In this state, the connector 10 is released by switching the electromagnetic directional control valve to open the vacuum pressure chamber 150 to the atmosphere. Thereafter, when the suction tube 102 is raised, the printed circuit board 1 of the connector 10 is released.
Attachment to 44 is completed.

When the connector 12 is held by the electronic component holding device having the above-described structure , the cover 140 has the through-hole 28 formed in the connector 12 and is in close contact with the upper end face at the time of mounting. As a result, all the through holes 28 are closed, and the portion of the main body 26 where there is no through hole 28 and the cover 14
0, a vacuum pressure chamber is formed, or if a part of the through-hole 28 is
0, a vacuum pressure chamber is formed by the space in the main body 26, the through hole 28, and the cover 140. Then, the connector 12 is sucked by the vacuum supplied from the suction pipe 102 to the vacuum pressure chamber.

When holding the volume 14, the cover 140 abuts against the distal end face of the knob 34, and a vacuum pressure chamber is formed between the cover 140 and the concave spherical surface 36, and
Is adsorbed. Since the tip surface of the knob 34 is flat,
When the cover 140 contacts the knob 34, the knob
And the axis of the suction tube 102 are substantially concentric, and the volume 14 can be held without tilting.

In the above embodiment, the cover 140
Is transparent, but it is only necessary to allow the transmission of light emitted from the light emitting plate 120, and may be translucent. In addition, instead of manufacturing the cover with a hard material, it is possible to manufacture the cover with a somewhat flexible material, or to form a thin layer of a soft material on the surface of the hard material. The airtightness of the surface can be improved.

In the above embodiment, the cover 14
Although the light emitting member for emitting light to the electronic component is different from the light emitting member, the light emitting member may also serve as the cover.

Further, in the above-described embodiment, the light emitting member is configured to absorb ultraviolet rays and emit visible light. However, a diffuser for diffusing light emitted from a light source, a reflecting plate for reflecting light, A light emitting device constituted by a light emitting diode may be used. In addition, both the imaging device and the light emitting member,
It is also possible to provide the electronic component on the side opposite to the suction nozzle and form an image of the electronic component by reflected light and take an image.
You.

In addition, without departing from the scope of the claims, the present invention can be implemented in various modified and improved forms based on the knowledge of those skilled in the art.

[Brief description of the drawings]

FIG. 1 is a front sectional view showing an electronic component holding device of an electronic component mounting device according to an embodiment of the present invention .

FIG. 2 is a front sectional view showing the electronic component mounting apparatus.

FIG. 3 is a plan view showing a chuck adapter of a holding unit that holds a suction nozzle in the electronic component holding device.

FIG. 4 is a plan view of a chuck attached to the chuck adapter.

FIG. 5 is a front view showing a sleeve constituting the suction nozzle.

FIG. 6 is a bottom view of the sleeve.

FIG. 7 is a front view (partial cross section) showing the suction nozzle together with an imaging device.

FIG. 8 is a perspective view showing a connector held by the electronic component holding device.

FIG. 9 is a perspective view showing another connector held by the electronic component holding device.

FIG. 10 is a perspective view showing a volume held by the electronic component holding device.

FIG. 11 is a front view (partial cross section) showing a state where the connector shown in FIG. 8 is held by the electronic component holding device.

[Explanation of symbols]

 10 Connector 12 Connector 14 Volume 70 Suction Nozzle 120 Light Emitting Plate 122 Imaging Device 140 Cover 150 Vacuum Pressure Chamber

────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Seiichi Terui 19-chan, Usui, Yamamachi, Chiryu-shi, Aichi Prefecture Inside Fuji Machinery Manufacturing Co., Ltd. Address Fuji Machine Manufacturing Co., Ltd. (56) References JP-A-4-217400 (JP, A) JP-A-2-132306 (JP, A) JP-A-60-191785 (JP, A) JP-A-63 JP-A-261849 (JP, A) JP-A-2-60132 (JP, A) JP-A-51-118259 (JP, A) JP-A-2-125337 (JP, U) (58) Fields investigated (Int. . ^7, DB name) B25J 15/06 H05K 13/04

Claims (2)

(57) [Claims] 1. A method for holding the electronic component by the suction nozzle having a recess which opens in the center of the flat top, as the suction nozzle, and extend out radially outwardly from the tip portion of the suction nozzle, And from a material that has optical transparency
Using those having a flat cover made, adsorption with an outer peripheral portion on the upper surface of the electronic component and the cover by adhesion in a state of projecting to the outer periphery than the upper surface, the opening of the recess is closed by a cover and vacuum pressure chamber communicating with the nozzle, Rutotomoni to hold the electronic component by the suction nozzle by the vacuum of the vacuum chamber, the suction nozzle
Illuminate the electronic components held in the
Electronic components by the imaging device based on the illumination light transmitted through the
By acquiring the projected image of
An electronic component holding method characterized by acquiring a holding error caused by the electronic component. 2. A suction nozzle having a suction tube which is in close contact with an electronic component at a front end face and suctions an electronic component by vacuum supplied from a rear end side, and a nozzle holding portion which detachably holds the suction nozzle. A light emitting member that illuminates the electronic component sucked by the suction tube from behind; an imaging device that acquires a projection image of the electronic component held by the suction tube with the light emitting member as a bright background; Part and the printed circuit board are relatively moved,
A moving device that mounts the electric component held by the suction nozzle on the printed circuit board; a rotating device that relatively rotates the nozzle holding unit and the printed circuit board around the axis of the nozzle holding unit; and a projection acquired by the imaging device. Based on the image, the center position error and the angle error of the electronic component held by the suction nozzle are obtained, and the center position error and the angle error are corrected by the control of the moving device and the rotating device. A control device for mounting an electronic component on the electronic component mounting device, wherein the suction nozzle includes, at the tip of the suction tube, the light emitting member, a portion on the outer peripheral side of a portion of the electronic component facing the suction nozzle. by close contact with the light emitting member with suction with a state of forming a vacuum chamber communicating with the suction nozzle in conjunction with the electronic component An electronic component mounting apparatus characterized in that a nozzle.