JP3236330B2 - Cream solder quality judgment device - Google Patents

Cream solder quality judgment device

Info

Publication number
JP3236330B2
JP3236330B2 JP33651591A JP33651591A JP3236330B2 JP 3236330 B2 JP3236330 B2 JP 3236330B2 JP 33651591 A JP33651591 A JP 33651591A JP 33651591 A JP33651591 A JP 33651591A JP 3236330 B2 JP3236330 B2 JP 3236330B2
Authority
JP
Japan
Prior art keywords
camera
cream solder
height
projector
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33651591A
Other languages
Japanese (ja)
Other versions
JPH05164524A (en
Inventor
暢史 戸倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP33651591A priority Critical patent/JP3236330B2/en
Publication of JPH05164524A publication Critical patent/JPH05164524A/en
Application granted granted Critical
Publication of JP3236330B2 publication Critical patent/JP3236330B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Image Input (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、クリーム半田良否判定
装置に係り、詳しくは基板の上方にて、投光器の照射光
とカメラの視野が交わる範囲を、クリーム半田の高さ許
容範囲と一致させて、カメラの画像を得ることにより、
クリーム半田の体積を正確・迅速に測定できるようにし
た手段に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for judging the quality of cream solder, and more particularly, to a method in which a range where an irradiation light of a projector and a visual field of a camera intersects with a permissible range of cream solder height above a substrate. And by obtaining the image of the camera,
The present invention relates to means for accurately and quickly measuring the volume of cream solder.

【0002】[0002]

【従来の技術】基板に電子部品を搭載するに先立ち、基
板の回路パターンの電極上には、一般に、スクリーン印
刷装置によりクリーム半田が塗布される。このスクリー
ン印刷は、パターン孔が開設されたスクリーンマスクを
基板の上面に近接させ、スキージをスクリーンマスク上
で摺動させることにより、パターン孔を通してクリーム
半田を塗布し、次いでスクリーンマスクと基板とを離反
させることにより、パターン孔内のクリーム半田を電極
上に転写するようになっている。
2. Description of the Related Art Prior to mounting electronic components on a substrate, cream solder is generally applied to the electrodes of the circuit pattern on the substrate by a screen printing apparatus. In this screen printing, cream solder is applied through the pattern holes by moving a screen mask having a pattern hole close to the upper surface of the substrate and sliding a squeegee on the screen mask, and then separating the screen mask from the substrate. By doing so, the cream solder in the pattern hole is transferred onto the electrode.

【0003】ところが、パターン孔内のクリーム半田
は、必ずしも完全に転写されるわけではない。例えば、
パターン孔が目詰まりを生じたり、クリーム半田がスク
リーンマスクの裏面へにじみ出たりすることにより、電
極上のクリーム半田の体積が不足することもあるし、逆
に過剰になることもある。
[0003] However, the cream solder in the pattern hole is not always completely transferred. For example,
When the pattern holes are clogged or the cream solder oozes to the back surface of the screen mask, the volume of the cream solder on the electrode may be insufficient, or may be excessive.

【0004】したがって、このクリーム半田について、
その体積を正確・迅速に測定し、半田の塗布状態の良否
を判定することが必要となる。ところが現状では、この
測定は目視によることが一般であり、正確を欠く。そこ
で、目視によらない測定手段として、レーザ三角測量に
よる手段が知られている。
Therefore, regarding this cream solder,
It is necessary to measure the volume accurately and quickly to determine the quality of the solder application. However, at present, this measurement is generally performed by visual observation and lacks accuracy. Then, as a measuring means without visual observation, a means by laser triangulation is known.

【0005】[0005]

【発明が解決しようとする課題】しかし、レーザ三角測
量は、基本的に1点のみの高さしか測定できない。した
がって、表面に凹凸を有するクリーム半田の表面全点の
高さを十分な精度で測定するには、例えばクリーム半田
の長手方向に沿う走査を、その直角方向に非常に多数回
繰り返す必要がある。よって、この手段では測定に多大
の時間を要し、実用に供しづらいという問題点がある。
However, laser triangulation can basically only measure the height of one point. Therefore, in order to measure the height of all points on the surface of the cream solder having irregularities on the surface with sufficient accuracy, for example, scanning along the longitudinal direction of the cream solder needs to be repeated very many times in a direction perpendicular to the longitudinal direction. Therefore, there is a problem that this method requires a lot of time for the measurement and is difficult to put to practical use.

【0006】そこで本発明は、迅速にクリーム半田の良
否判定を行うことができる手段を提供することを目的と
する。
SUMMARY OF THE INVENTION It is an object of the present invention to provide means for quickly determining the quality of cream solder.

【0007】[0007]

【課題を解決するための手段】本発明は、投光器の照射
光とカメラの視野が、基板の上方にて交差するように、
投光器とカメラを設け、この投光器とこのカメラのそれ
ぞれに絞りを設けて、この投光器の照射光の上限とこの
カメラの視野の上限との交点を、クリーム半田の高さ上
限と一致させ、この投光器の照射光の下限とこのカメラ
の視野の下限との交点を、クリーム半田の高さ下限と一
致させたものである。
SUMMARY OF THE INVENTION According to the present invention, an illumination light of a projector and a visual field of a camera intersect above a substrate.
A floodlight and a camera are provided, and apertures are provided for each of the floodlight and the camera.The intersection between the upper limit of the irradiation light of the floodlight and the upper limit of the field of view of the camera matches the upper limit of the height of the cream solder. The intersection point between the lower limit of the irradiation light of (1) and the lower limit of the field of view of the camera is made to coincide with the lower limit of the height of the cream solder.

【0008】[0008]

【作用】上記構成によれば、クリーム半田の表面が、ク
リーム半田の高さ下限よりも下方にあり、クリーム半田
の体積が不足している場合には、投光器からの照射光は
クリーム半田の表面に当たっても、その反射光はカメラ
の視野に入らないので、、カメラの視野にこの反射光が
取り込まれることはない。したがって、カメラの画像が
暗く、半田の状態不良と判定される。
According to the above construction, when the surface of the cream solder is below the lower limit of the height of the cream solder and the volume of the cream solder is insufficient, the irradiation light from the light emitter is applied to the surface of the cream solder. , The reflected light does not enter the visual field of the camera, so that the reflected light is not taken into the visual field of the camera. Therefore, the image of the camera is dark and the state of the solder is determined to be defective.

【0009】また、クリーム半田の表面の高さが、その
下限と上限との間にあり、クリーム半田の体積が適切で
ある場合には、投光器からの照射光はクリーム半田の表
面に当たり、その反射光がカメラの視野に入るので、こ
の反射光がカメラに取り込まれる。したがって、カメラ
の画像が明るく、半田の状態良と判定される。
When the height of the surface of the cream solder is between the lower limit and the upper limit and the volume of the cream solder is appropriate, the irradiation light from the light projector hits the surface of the cream solder and its reflection occurs. As the light enters the field of view of the camera, this reflected light is captured by the camera. Therefore, the image of the camera is bright, and it is determined that the state of the solder is good.

【0010】また、クリーム半田の表面が、クリーム半
田の高さの上限よりも上方にあり、クリーム半田の体積
が過剰である場合には、投光器からの照射光がクリーム
半田の表面に当たっても、その反射光はカメラの視野に
入らないので、カメラにこの反射光が取り込まれること
はない。したがって、カメラの画像が暗く、半田の状態
不良と判定される。
When the surface of the cream solder is above the upper limit of the height of the cream solder and the volume of the cream solder is excessive, even if the irradiation light from the light projector hits the surface of the cream solder, Since the reflected light does not enter the field of view of the camera, the reflected light is not captured by the camera. Therefore, the image of the camera is dark and the state of the solder is determined to be defective.

【0011】[0011]

【実施例】次に、図面を参照しながら、本発明の実施例
を説明する。図1は本装置の正面図、図2は拡大図、図
3はカメラ画像の例を示す。
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of the apparatus, FIG. 2 is an enlarged view, and FIG. 3 shows an example of a camera image.

【0012】図1において、1は基板、2は基板1の上
面に形成された電極、3は電極2の上面にスクリーン印
刷装置により塗布されたクリーム半田である。この基板
1は、支持フレームFR上に載置されたXテーブル4及
びYテーブル5により支持される。またMX,MYはX
テーブル4、Yテーブル5のそれぞれの駆動用モータで
ある。
In FIG. 1, 1 is a substrate, 2 is an electrode formed on the upper surface of the substrate 1, and 3 is a cream solder applied to the upper surface of the electrode 2 by a screen printing apparatus. The substrate 1 is supported by an X table 4 and a Y table 5 placed on a support frame FR. MX and MY are X
These are drive motors of the table 4 and the Y table 5, respectively.

【0013】また、6は支持フレームFRの上部に昇降
自在に設けられるZテーブル、MZはその駆動用モータ
である。このZテーブル6の下部左方には、基板1を向
く投光器7とレーザ照射器8がブラケット6aにより取
り付けられる。またZテーブル6の下部右方には、基板
1を向くカメラ9と受光器10が、ブラケット6bによ
り取付けられる。そして、投光器7の照射光(X方向に
幅広のスリット光)とカメラ9の視野は、基板1の上方
にて交差するようになっている。
Reference numeral 6 denotes a Z table provided on the upper part of the support frame FR so as to be able to move up and down, and MZ denotes a motor for driving the Z table. On the lower left side of the Z table 6, a light projector 7 and a laser irradiator 8 facing the substrate 1 are attached by a bracket 6a. On the lower right side of the Z table 6, a camera 9 and a light receiver 10 facing the substrate 1 are mounted by a bracket 6b. The irradiation light (slit light wide in the X direction) of the light projector 7 and the field of view of the camera 9 intersect above the substrate 1.

【0014】ここで、レーザ照射器8から照射されたレ
ーザ光Bは、基板1のクリーム半田3の直前位置Qで反
射して、受光器10に取込まれ、基板1の上面の高さが
測定される。基板1にそりなどがあり、この高さが所定
高さと相違する場合には、この高さを補正すべくZテー
ブル駆動用モータMZを駆動して、Zテーブル6の高
さ、すなわち、基板1の上面に対する、投光器7及びカ
メラ9の高さが、一定になるようにしてある。
Here, the laser beam B emitted from the laser irradiator 8 is reflected at the position Q immediately before the cream solder 3 on the substrate 1 and is taken into the light receiver 10, and the height of the upper surface of the substrate 1 is reduced. Measured. If the substrate 1 has a warp or the like and the height is different from the predetermined height, the Z-table driving motor MZ is driven to correct the height, and the height of the Z-table 6, The height of the projector 7 and the camera 9 with respect to the upper surface of the camera is made constant.

【0015】また投光器7及びカメラ9は、XY方向に
移動しないようにしてあり、この投光器7及びカメラ9
に対して、基板1がXY方向に移動するようになってい
る。具体的には、モータMX,MYを駆動することによ
り、投光器7及びカメラ9に対し、基板1をXY方向に
移動させることができる。
The light projector 7 and the camera 9 are not moved in the X and Y directions.
The substrate 1 moves in the X and Y directions. Specifically, by driving the motors MX and MY, the substrate 1 can be moved in the XY directions with respect to the projector 7 and the camera 9.

【0016】このように、投光器7は基板1の上方から
照射光を照射し、カメラ9は基板1側からの反射光を、
この基板1の上方において入射する。また、投光器7、
カメラ9には、それぞれ絞り7a、9aが設けられてい
る。
As described above, the light projector 7 emits irradiation light from above the substrate 1, and the camera 9 emits reflected light from the substrate 1 side.
The light enters above the substrate 1. Also, the floodlight 7,
The camera 9 is provided with apertures 7a and 9a, respectively.

【0017】そして図2に示すように、投光器7の照射
光の上限a1と、カメラ9の視野の上限b1との交点P
1を、クリーム半田3の高さ許容範囲の上限(基板1の
上面からの高さHmax)に一致させる。また、投光器
7の照射光の下限a2と、カメラ9の視野の下限b2と
の交点P2を、クリーム半田3の高さ許容範囲の下限
(基板1の上面からの高さHmin)に一致させる。具
体的には、図2に示すような位置関係にあるときは、 θ1=arctan (Y7/ (H7−Hmax)) −arctan (Y7/(H7−Hmin)) θ2=arctan (Y9/ (H9−Hmax)) −arctan (Y9/ (H9−Hmin)) の関係式を満たすように、投光器7及びカメラ9のYZ
方向の位置及び絞り7a、9aを調節すればよい。ただ
し、Y7,Y9は投光器7,カメラ9のそれぞれから上
記交点P1,P2までのY方向の距離、H7,H9は基
板1の上面から投光器7、カメラ9のそれぞれまでの高
さ、θ1は投光器7の照射光の上限a1と下限a2がな
す角、θ2はカメラ9の視野の上限b1と下限b2がな
す角である。
As shown in FIG. 2, an intersection P between the upper limit a1 of the irradiation light of the projector 7 and the upper limit b1 of the field of view of the camera 9 is obtained.
1 is made equal to the upper limit of the allowable height of the cream solder 3 (the height Hmax from the upper surface of the substrate 1). Further, the intersection P2 between the lower limit a2 of the irradiation light of the projector 7 and the lower limit b2 of the field of view of the camera 9 is made to coincide with the lower limit of the allowable height of the cream solder 3 (the height Hmin from the upper surface of the substrate 1). Specifically, when the positional relationship is as shown in FIG. 2, θ1 = arctan (Y7 / (H7−Hmax)) − arctan (Y7 / (H7−Hmin)) θ2 = arctan (Y9 / (H9− Hmax)) − arctan (Y9 / (H9−Hmin)), so that the YZ of the projector 7 and the camera 9 are satisfied.
The position in the direction and the apertures 7a and 9a may be adjusted. Here, Y7 and Y9 are distances in the Y direction from the respective projectors 7 and 9 to the intersections P1 and P2, H7 and H9 are heights from the upper surface of the substrate 1 to the respective projectors 7 and the camera 9, and θ1 is a projector. 7, the angle formed by the upper limit a1 and the lower limit a2 of the irradiation light, and θ2 is the angle formed by the upper limit b1 and the lower limit b2 of the field of view of the camera 9.

【0018】本装置は上記のような構成よりなり、次に
本装置によるクリーム半田の良否判定について説明す
る。まず、判定対象であるクリーム半田3の直前位置Q
(基板1の上面)の高さを、レーザ照射器8及び受光器
10で測定し、基板1にそりがあるような場合には、モ
ータMZを駆動して、投光器7及びカメラ9が基板1の
上面から所定高さH7,H9の位置にあるようにZ方向
で補正する。同時に、モータMX,MYを駆動して、投
光器7及びカメラ9に対し、基板1を相対的にXY方向
に移動させ、カメラ9に画像を取り込んでゆく。
The present apparatus is configured as described above. Next, the determination of the quality of the cream solder by the present apparatus will be described. First, the position Q immediately before the cream solder 3 to be determined.
The height of the (upper surface of the substrate 1) is measured by the laser irradiator 8 and the light receiver 10, and if the substrate 1 is warped, the motor MZ is driven so that the projector 7 and the camera 9 Is corrected in the Z direction so as to be located at the predetermined heights H7 and H9 from the upper surface of. At the same time, the motors MX and MY are driven to move the substrate 1 relatively in the XY directions with respect to the projector 7 and the camera 9, and the camera 9 captures an image.

【0019】図3は、3つのクリーム半田3をカメラ9
に取り込んだ画像を示す。なお、H0 はクリーム半田3
の高さ許容範囲の下限Hminよりも小なる高さ、H1
は同上限Hmaxと同下限Hminの間にある高さ、H
2 は同上限Hmaxよりも大である高さである。また図
3中、斜線部は画像が暗いことを示し、斜線が付されて
いない部分は明るいことを示す。なお、これら3つのク
リーム半田3のそれぞれの画像中の位置及び形状は既知
である。
FIG. 3 shows three cream solders 3
Shows the captured image. H0 is cream solder 3
Height H1 that is smaller than the lower limit Hmin of the allowable height range
Is a height between the upper limit Hmax and the lower limit Hmin, H
2 is a height that is larger than the upper limit Hmax. In FIG. 3, a hatched portion indicates that the image is dark, and a portion without the hatched portion indicates that the image is bright. Note that the positions and shapes of these three cream solders 3 in the image are known.

【0020】高さH1 のクリーム半田3について、画像
が明るくなっている。これは、この高さH1 は上記上限
Hmaxと下限Hminの間にあるので、投光器7の照
射光がこのクリーム半田3の表面に当たり、その反射光
がカメラ9の視野内を通過できたためであり、このクリ
ーム半田3の体積Vは、SHmin≦V≦SHmax
(ただし、Sはクリーム半田3の面積であり、このSは
既知)の範囲内にあり、塗布状態が良と判定される。
The image of the cream solder 3 having the height H1 is bright. This is because the height H1 is between the upper limit Hmax and the lower limit Hmin, so that the irradiation light of the projector 7 hits the surface of the cream solder 3 and the reflected light can pass through the visual field of the camera 9. The volume V of this cream solder 3 is SHmin ≦ V ≦ SHmax
(Where S is the area of the cream solder 3 and this S is known), and the application state is determined to be good.

【0021】また高さH0、H2の2つのクリーム半田
3について、画像が暗くなっている。これは、高さH0
の場合は低すぎ、高さH2 の場合は高すぎて、投光器7
の照射光がこれらのクリーム半田3の表面に当たって
も、その反射光はカメラ9の視野に入らず、カメラ9に
この反射光が取り込まれなかったためである。これらの
場合には、クリーム半田3の体積がSHmin≦V≦S
Hmaxの範囲になく、塗布状態が不良(否)と判定さ
れる。
The images of the two cream solders 3 having the heights H0 and H2 are dark. This is the height H0
Is too low, and height H2 is too high.
This is because even if the irradiated light hits the surface of the cream solder 3, the reflected light does not enter the visual field of the camera 9, and the reflected light is not taken into the camera 9. In these cases, the volume of the cream solder 3 is SHmin ≦ V ≦ S
It is not in the range of Hmax, and the application state is determined to be defective (no).

【0022】上記のように本手段によれば、幅広のスリ
ット光を用いたので、多数回走査を繰り返す必要がな
く、カメラ9の画像のみにより、クリーム半田3の塗布
良否を判定することができるので、迅速な良否判定を実
現することができる。
As described above, according to this means, since the wide slit light is used, it is not necessary to repeat scanning many times, and it is possible to judge the quality of the application of the cream solder 3 only by the image of the camera 9. Therefore, quick quality judgment can be realized.

【0023】[0023]

【発明の効果】本発明は、投光器の照射光とカメラの視
野が、基板の上方にて交差するように、投光器とカメラ
を設け、この投光器とこのカメラのそれぞれに絞りを設
けて、この投光器の照射光の上限とこのカメラの視野の
上限との交点を、クリーム半田の高さ上限と一致させ、
この投光器の照射光の下限とこのカメラの視野の下限と
の交点を、クリーム半田の高さ下限と一致させたので、
少数回の走査により得られたカメラの画像の明暗が、直
ちにクリーム半田の体積が所定範囲内にあるか否かを示
すことになり、この画像の明暗のみにより、迅速に半田
の良否を判定することができる。
According to the present invention, a projector and a camera are provided so that the irradiation light of the projector and the field of view of the camera intersect above the substrate, and apertures are provided for each of the projector and the camera. The intersection of the upper limit of the irradiation light of the above and the upper limit of the field of view of this camera is matched with the upper limit of the height of the cream solder,
Since the intersection of the lower limit of the irradiation light of this projector and the lower limit of the field of view of this camera was matched with the lower limit of the height of the cream solder,
The brightness of the image of the camera obtained by a small number of scans immediately indicates whether the volume of the cream solder is within a predetermined range, and the quality of the solder is quickly determined only by the brightness of the image. be able to.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の装置の正面図FIG. 1 is a front view of the apparatus of the present invention.

【図2】同拡大図FIG. 2 is an enlarged view of the same.

【図3】同カメラ画像の説明図FIG. 3 is an explanatory view of the camera image.

【符号の説明】[Explanation of symbols]

1 基板 3 クリーム半田 7 投光器 7a 絞り 9 カメラ 9a 絞り a1 照射光の上限 a2 照射光の下限 b1 視野の上限 b2 視野の下限 Hmax クリーム半田の高さ上限 Hmin クリーム半田の高さ下限 Reference Signs List 1 board 3 cream solder 7 projector 7a aperture 9 camera 9a aperture a1 upper limit of irradiation light a2 lower limit of irradiation light b1 upper limit of field of view b2 lower limit of field of view Hmax upper limit of cream solder Hmin lower limit of cream solder

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】投光器の照射光とカメラの視野が、基板の
上方にて交差するように、投光器とカメラを設け、この
投光器とこのカメラのそれぞれに絞りを設けて、この投
光器の照射光の上限とこのカメラの視野の上限との交点
を、クリーム半田の高さ上限と一致させ、この投光器の
照射光の下限とこのカメラの視野の下限との交点を、ク
リーム半田の高さ下限と一致させたことを特徴とするク
リーム半田良否判定装置。
A projector and a camera are provided so that the irradiation light of the projector and the visual field of the camera intersect above the substrate, and apertures are provided for each of the projector and the camera so that the irradiation light of the projector is The intersection of the upper limit with the upper limit of the field of view of this camera is matched with the upper limit of the height of the cream solder, and the intersection of the lower limit of the irradiation light of this projector and the lower limit of the field of view of the camera is matched with the lower limit of the cream solder height An apparatus for judging the quality of a cream solder.
JP33651591A 1991-12-19 1991-12-19 Cream solder quality judgment device Expired - Fee Related JP3236330B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33651591A JP3236330B2 (en) 1991-12-19 1991-12-19 Cream solder quality judgment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33651591A JP3236330B2 (en) 1991-12-19 1991-12-19 Cream solder quality judgment device

Publications (2)

Publication Number Publication Date
JPH05164524A JPH05164524A (en) 1993-06-29
JP3236330B2 true JP3236330B2 (en) 2001-12-10

Family

ID=18299929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33651591A Expired - Fee Related JP3236330B2 (en) 1991-12-19 1991-12-19 Cream solder quality judgment device

Country Status (1)

Country Link
JP (1) JP3236330B2 (en)

Also Published As

Publication number Publication date
JPH05164524A (en) 1993-06-29

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