JP3230541B2 - Grinding / polishing whetstone and grinding / polishing method using this whetstone - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding wheel for grinding and polishing and a grinding and polishing method using the grinding wheel.

[0002]

2. Description of the Related Art Conventionally, as a grinding / polishing whetstone in which a grinding / polishing material is fixed with a resin, for example, Japanese Patent Application Laid-Open No. Sho 59-134 is disclosed.
A grinding wheel disclosed in Japanese Patent No. 647 is known. This whetstone is obtained by heating and forcibly drying a mixture of a phenol resin, cerium oxide, and a curing agent, crushing and solidifying the mixture.

[0003]

However, when the optical glass is polished by using the above-mentioned grinding wheel, the tip of the abrasive material is excessively worn and flattened on the polished surface. Phenomena such as clogging where chips are attached to the surface of the grindstone and cannot be discharged occur, resulting in a problem that the processing speed is reduced.

[0004] That is, when the conventional grinding and polishing grindstone is used, the processing speed is reduced as shown in FIG. In the figure, the horizontal axis indicates the cumulative number of polished workpieces, and the vertical axis indicates the processing speed (μm / min). According to the figure, it can be seen that the processing speed decreases as the cumulative polishing processing number increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a grinding / polishing whetstone in which the processing speed does not decrease even when the cumulative number of processing increases, and a grinding / polishing method using the whetstone. It is an object.

[0006]

Means for Solving the Problems To achieve the above object, a grinding wheel for grinding and polishing according to the present invention comprises an abrasive whose surface is coated with a coating material and an abrasive whose surface is coated with a coating material. Abrasive particles, the aqueous solution of which dissolves or decomposes the coating material, a water-soluble powder, and a bonding material that fixes the entirety thereof, and the bonding material decomposes or dissolves in the aqueous solution more than the coating material. It is characterized by being difficult to dissolve.

The above structure is shown in FIG. 1 as shown in FIG. That is, in the figure, 1a is an abrasive grain whose surface is covered with the coating material 4, and 1b is an abrasive grain whose surface is not worn. Reference numeral 2 denotes a water-soluble powder, and this aqueous solution has a property of dissolving or decomposing the coating material 4. Then, the entirety is fixed in a solid state by the bonding material 3. The grinding and polishing method using the whetstone of the present invention, when processing a work,
A grinding and polishing liquid is supplied to the grinding wheel to obtain the aqueous solution.

[0008]

The operation of the grinding / polishing grindstone of the present invention having the above-described structure will be described with reference to FIG. When the grinding / polishing process is performed using the grinding wheel for grinding / polishing of the present invention, the water-soluble powder 2 appearing on the grinding / polishing surface is dissolved by the grinding / polishing liquid 5, and the coating material 4 is decomposed or dissolved at the interface with the work 6. To provide an aqueous solution. This aqueous solution selectively erodes only the coating material 4. As a result, the strength of the portion of the coating material 4 on the grinding and polishing surface decreases, and the portion breaks during grinding and polishing. Thus, at the same time as the dressing is performed, the abrasive grains 1b held by the coating material 4 are released, and the bond material 3 is dressed by the mechanical polishing action of the released abrasive grains 1b. By these dressings, a crushed or clogged layer on the surface of the grinding wheel for grinding and polishing is removed, and a new ground and polished surface is generated.

Further, since only a part of the grindstone constituent member is selectively eroded, the shape of the ground and polished surface does not change due to the erosion, and the grindstone strength does not deteriorate. In addition, diamond, cerium oxide, zirconium oxide,
Iron oxide, boron nitride, or the like is used. In addition, as the water-soluble powder, besides a crystal of a hydroxide of an alkali metal or an alkaline earth metal, a powder of a substance whose liquidity is acidic can be used. Further, a polyimide resin is preferable as the coating material, and a phenol resin is preferable as the bonding material.

A description will now be given, with reference to the accompanying drawings, of several embodiments of the grinding and polishing grindstone according to the present invention, as well as examples of grinding and polishing using this grindstone. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description.

[0011]

Embodiment 1 First, Embodiment 1 of the present invention will be described. FIG.
1 is a cross-sectional view showing a grinding wheel for grinding and polishing in Example 1. FIG. In the figure, 1a and 1b are # 1200 diamond abrasive grains,
2 is a crystal of sodium hydroxide of # 325, 3 is a phenol resin as a bonding material, and 4 is a polyimide resin as a coating material. That is, this grinding and polishing whetstone has a structure in which diamond abrasive grains 1 b, diamond whetstone 1 a coated with polyimide resin 4, and sodium hydroxide crystal 2 are fixed by phenol resin 3.

Next, a method for manufacturing a grinding wheel for grinding and polishing according to this embodiment will be described with reference to FIG.
5 g, 8 g of sodium hydroxide and 20 g of phenol resin are uniformly mixed and stirred. And separately from this, 10 g of diamond abrasive grains were coated with 4 g of a polyimide resin and pulverized, and then both were uniformly mixed and cold-pressed.
Firing at 150 ° C. to obtain a grinding and polishing whetstone.

Next, the operation of this embodiment will be described. When grinding is performed by combining the grinding wheel for grinding and polishing of this embodiment with a water-soluble grinding fluid, sodium hydroxide 2 appearing on the grinding surface of the grinding wheel is dissolved in the grinding fluid, and a strong alkaline solution is supplied to the grinding interface. The Rukoto. This strong alkaline solution selectively erodes the polyimide resin 4 on the grindstone surface. The alkali resistance of the polyimide resin 4 is weak, and the strength is reduced by the alkali. Therefore, the polyimide resin 4 on the whetstone surface collapses during grinding, and dressing is performed. Further, the diamond abrasive grains 1a coated on the polyimide resin 4 are released and rolled, and the phenol resin 3 is dressed by mechanical action. As described above, a layer of blinding and clogging on the grinding wheel surface is removed, and a new ground surface is generated.

Next, FIG. 5 shows the result of grinding 100 blue glass sheets having a diameter of 20 mm using the grinding wheel for grinding and polishing of this embodiment. As shown in the figure, in the grinding and polishing whetstone of the present example, the processing speed did not decrease due to blinding or clogging during continuous processing.

As described above, according to the grinding / polishing whetstone of this embodiment, it is possible to remove the layer of the crushed or clogged surface of the grinding / polishing whetstone by dressing.
Moreover, it is possible to prevent a change in the surface shape of the grinding wheel and a decrease in the strength of the grinding wheel due to the dressing.

Although sodium hydroxide is used as the water-soluble powder in this embodiment, other alkali crystals such as calcium hydroxide, potassium hydroxide, barium hydroxide and cesium hydroxide may be used. Good. Further, the combination of the bonding material and the coating material may be as follows. [Bond material] [Coating material] (1) Phenol resin Polyimide resin (Example) (2) Polyamide imide resin Polyamide 66 (3) Polyamide imide resin Polybutylene terephthalate The above (1) is a combination of thermosetting resins. Yes, (2)
(3) is a combination of thermoplastic resins. In each case, a material having weaker alkali resistance and acid resistance than the bond material is used as the coating material.

[0017]

Second Embodiment Next, a second embodiment of the present invention will be described. FIG.
FIG. 2 is a sectional view showing a grinding wheel for grinding and polishing. As shown, in this example, only the diamond abrasive grains 1a coated on the polyimide resin 4 were changed to # 2000. In Example 1, the work may be damaged by cracks or the like due to the diamond abrasive grains 1a released after the erosion of the polyimide resin 4. In the present embodiment, while the grain size of the diamond abrasive grains 1a released after erosion is made finer, the grain size of the diamond abrasive grains 1b performing a normal grinding action is the same as that of the first embodiment. , And damage to the work can be suppressed.

[0018]

Third Embodiment Next, a third embodiment of the present invention will be described. FIG.
FIG. 2 is a sectional view showing a grinding wheel for grinding and polishing. As shown in the figure, in this embodiment, cerium oxide abrasive grains (average particle size: 1.5 μm) are used as the abrasive grains 1a and 1b, and # 1 is used as the water-soluble powder 2.
400 potassium hydroxide crystals were used. Further, a phenol resin was used for the bonding material 3 and a polyimide resin was used for the coating material 4.

Next, a method of manufacturing the grinding and polishing grindstone of this embodiment will be described with reference to FIG.
50g, potassium hydroxide 25g and phenol resin 40g
And uniformly mixed and stirred. Separately, 50 g of cerium oxide abrasive grains were coated with 10 g of a polyimide resin and pulverized, prepared, uniformly mixed and cold-compressed, and baked at 150 ° C. to obtain a grinding and polishing whetstone. obtain.

[0020] When polishing a silicate glass by grinding polishing wheels of this embodiment, a strong alkaline solution silicates silicate glass produced potassium hydroxide in polishing interface is dissolved in the polishing liquid (SiO ₂ ), Causing a dissolving effect. Therefore, together with the mechanical action of the cerium oxide abrasive,
Mechanochemical processing can be performed.

FIG. 5 shows the result of grinding 100 silicate glasses having a diameter of 20 mm using the grinding and polishing whetstone of this embodiment. As shown in the figure, in the grinding and polishing whetstone of the present example, the processing speed did not decrease due to blinding or clogging during continuous processing.

[0022]

Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a diagram illustrating a manufacturing process of the grinding wheel in the present embodiment. The grinding wheel of the present embodiment is different from the first embodiment in that Zn (zinc) 4 is used as a coating material, Sn (tin) 3 is used as a bonding material, and citric acid 2 is used as a water-soluble powder.
Hereinafter, the manufacturing process will be described with reference to FIG. First, Zn (zinc) plating 4 is applied to the abrasive grains 5 as a coating material. Then, 7% by volume of the abrasive grains 1a having been subjected to the Zn plating treatment and 15% of the abrasive grains 1b having not been subjected to the Zn plating treatment.
Volume%, Sn (tin) 3 powder 70% by volume as a bonding material, and citric acid 2 powder 8% by volume as a water-soluble powder were mixed and pressed at room temperature under pressure (400 kg / cm ² ). Form into a whetstone shape. After the forming, it is fired at a temperature of 145 ° C. to obtain a metal bond grinding wheel.

Using the grindstone of this embodiment, a blue sheet glass was ground into a predetermined shape in the same manner as in the first embodiment. Water was supplied as a grinding liquid between the grinding wheel and the soda lime glass. The citric acid 2 that appears on the grinding surface of the grindstone shows strong acidity when dissolved in water, dissolves the Zn plating 4 covering the abrasive grains 1a, and the abrasive grains 1a are dressed. The abrasive grains 1a are released from the grindstone and roll between the grindstone and the blue plate, and the Sn3 portion, which is the bonding material, is dressed by the mechanical action of the rolling of the grindstone. These dressings are repeatedly performed to remove a layer of blinding and clogging of the working surface of the grinding wheel and to create a new ground surface. Other operations are the same as those of the first embodiment, and the same effects as those of the first embodiment are obtained.

[0024]

As described above, according to the grinding and grinding wheel of the present invention and the grinding and polishing method using the grinding wheel, it is possible to remove the layer of the crushed or clogged surface of the grinding and grinding wheel by dressing. It is possible, and it is possible to prevent the change of the grinding wheel surface shape and the reduction of the grinding wheel strength due to the dressing. Therefore, the rapid processing is possible even if the cumulative number of processing increases while maintaining the shape accuracy of the workpiece (work). There is an effect that speed can be obtained.

[Brief description of the drawings]

FIG. 1 is a view showing a basic configuration of a grinding wheel for grinding and polishing according to the present invention.

FIG. 2 is a diagram illustrating the operation of a grinding wheel for grinding and polishing according to the present invention.

FIG. 3 is a cross-sectional view showing a grinding and polishing grindstone of Example 1 according to the present invention.

FIG. 4 is a view for explaining a method of manufacturing the grinding and polishing whetstone of Example 1.

FIG. 5 is a view for explaining an effect of the grinding wheel for grinding and polishing according to the first embodiment.

FIG. 6 is a sectional view showing a grinding wheel for grinding and polishing according to a second embodiment of the present invention.

FIG. 7 is a sectional view showing a grinding wheel for grinding and polishing according to a third embodiment of the present invention.

FIG. 8 is a view for explaining a method of manufacturing a grinding and polishing grindstone of Example 3.

FIG. 9 is a view for explaining a method of manufacturing a grinding and polishing grindstone of Example 4.

FIG. 10 is a diagram for explaining a problem of the related art.

[Explanation of symbols]

 1a, 1b Abrasive grains (such as diamond abrasive grains) 2 Water-soluble powder (such as sodium hydroxide crystals) 3 Bonding material (such as phenolic resin) 4 Coating material (such as polyimide resin) 5 Grinding and polishing liquid 6 Work

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B24D 3/00 330 B24D 3/02 310 B24D 3/28

Claims (2)

(57) [Claims] An abrasive whose surface is covered with a coating material, an abrasive whose surface is not covered with a coating material,
The aqueous solution is composed of a water-soluble powder that dissolves or decomposes the coating material, and a bonding material that fixes the whole, and the bonding material is less likely to decompose or dissolve in the aqueous solution than the coating material. Grindstone for grinding and polishing. 2. An abrasive grain whose surface is coated with a coating material, and an abrasive grain whose surface is not coated with a coating material,
The aqueous solution is composed of a water-soluble powder that dissolves or decomposes the coating material, and a bonding material that fixes the whole, and the bonding material is less likely to decompose or dissolve in the aqueous solution than the coating material. When processing a workpiece with the grinding wheel, a grinding and polishing liquid is supplied to the grinding wheel to dissolve the water-soluble powder, thereby obtaining an aqueous solution that decomposes or dissolves the coating material. Grinding and polishing a workpiece while dressing the workpiece.