JP3227357B2 - Bonding method of board with lead - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining leads to a semiconductor mounting substrate in a resin-sealed semiconductor device.

[0002]

2. Description of the Related Art Conventionally, according to Japanese Patent Application Laid-Open No. 2-126647, a bonding apparatus for thermocompression bonding at a tip portion of a bonding tool tip in a state where a bump exists between an aluminum electrode of a semiconductor element and a lead of a TAB film carrier. Has proposed a method in which the chip portion of a bonding tool is divided into a plurality of portions to reduce the warpage of the chip portion due to thermal expansion and collectively join one side.

[0003] However, there is a problem of thermal deformation of the base itself on which the chip portion is mounted and thermal deformation within each chip, and the complete problem cannot be solved unless used together with gold bumps or thick plating of gold or tin.

[0004] As described above, variations in height can be absorbed by increasing the thickness of the gold bump or the plating thickness of gold or tin. However, in the case of the gold bump, the thickness of the gold plating is increased. On the other hand, when the thickness of tin plating for plating on the lead side is increased, the bonding is performed by a tin-rich compound layer, so that the bonding strength is reduced.

[0005]

SUMMARY OF THE INVENTION
It is conceivable that the circuit and the lead formed on the substrate are joined by a eutectic reaction without increasing the thickness of the gold plating and tin plating. In this case, bonding is performed by applying pressure from above the leads 3 by the heating tool 7 and transmitting heat through the leads 3 to an interface between the circuit of the substrate 1 and the leads 3 (hereinafter referred to as a bonding interface). However, when the circuit formed on the substrate 1 and the leads 3 are joined by eutectic reaction without forming the gold bumps, gold plating, and increasing the thickness of the tin plating, a plurality of leads 3 If the circuit provided on the substrate 1 is to be joined together,
Heating tool 7 pressing surface 4 is a flat surface as shown in FIG. 27 (a) is warped so as to be convex downward as for thermal expansion FIG 27 (b) at the time of joining, FIG. 27 (c) Thus, there are portions where the leads 3 and the heating tool 7 are not in contact at both ends of the substrate 1 as shown in FIG. Further, the pressing surface 4 of the heating tool 7
Are flat at the time of bonding, there are portions where the leads 3 do not come into contact with the circuit 2 formed on the substrate 1 due to variations in the thickness of the substrate 1 as shown in FIG . As a result, there is a problem in that heat is not transmitted to the bonding interface through the leads 3 and a non-bonded portion occurs.

The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object the purpose of not forming a gold bump or increasing the plating thickness of gold plating and tin plating. Accordingly, it is an object of the present invention to provide a method for bonding a substrate with leads, which can uniformly and collectively bond a plurality of leads and a circuit provided on the substrate without any unbonding.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned conventional problems and achieve the object of the present invention, a method for bonding a substrate with leads according to the present invention is formed on a substrate 1 having flexibility. When the circuit 2 and the plurality of leads 3 arranged are heated and press-bonded, the substrate support 5 formed of an elastic body is
It supports the plate 1 and cuts between the substrate 1 and the substrate support 5.
Interposed thermal material 8 is characterized in that the joining is deformed to follow the substrate 1 by the pressing surface 4 of the heating tool 7.

[0008] Then, the substrate is formed on a bendable substrate 1.
Thermocompression bonding of the arranged circuit 2 and the arranged leads 3
The substrate 1 by the substrate support 5 made of a fluid.
The substrate 1 is supported and changed so as to follow the pressing surface of the heating tool 7.
It is also preferable to form and join.

[0009] Further , the substrate is formed on a substrate 1 having flexibility.
To heat-press the circuit 2 and the plurality of leads 3
And the substrate 1 is supported by the substrate support 5 made of bimetal.
So that the substrate 1 follows the pressing surface of the heating tool 7
It is also preferable to be characterized by being deformed and joined.

[0010] In addition, formed on a substrate 1 having flexibility.
To heat-press the circuit 2 and the plurality of leads 3
Contact, one lead 3 from the bottom of the substrate 1 heating tool
The substrate 1 is pushed up to the pressing surface of the heating tool 7 and the pressing surface of the heating tool 7 is pressed.
It is characterized by being deformed and joined so as to follow
Is also preferred.

Further, the pressure correction amount may be detected by the sensor 10 and the pressing force may be controlled based on the pressure correction amount.
preferable.

Further, when the circuit 2 formed on the substrate 1 and the plurality of leads 3 arranged thereon are heated and pressed, the entire pressing surface 4 of the heating tool 7 is pressed by the heating tool 7 during heating. be those pressurize deformed to impinge uniformly on all leads 3 included in the column, heating tools
The tool 7 is rotatably supported, and the pressurization of the heating tool 7 is activated.
The correction may be performed by the heater 9 .

Further, when the circuit 2 formed on the substrate 1 and the plurality of leads 3 arranged are heated and pressed, the entire pressing surface 4 of the heating tool 7 is pressed by the heating tool 7 during heating. A temperature difference is generated between the center and both ends of the pressing surface 4 of the heating tool 7 so that the pressing surface 4 is deformed into a convex shape during heating so as to uniformly hit all the leads 3 included in the row. It may be characterized by pressing.

It is also preferable to measure the temperature at the center of the pressing surface 4 of the heating tool 7 and feed back the measured temperature at the center to compare it with the command temperature and heat the tool to the command temperature.

[0015] Further, the substrate is formed on a bendable substrate 1.
To heat-press the circuit 2 and the plurality of leads 3
Per one bonding the substrate 1 after deformed allowed to follow the substrate 1 is pressurized in the vicinity of the glass transition temperature of the substrate resin to the pressing surface 4 of the heating tool 7 with a heating tool 7 for joining
A is, board substrate 1 with a heating tool 7 for joining
The substrate 1 is heated by pressing around the glass transition temperature of the resin.
The pressing force when deforming so as to follow the pressing surface 4 of the
It is also preferable to make the pressure higher than the applied pressure .

Further , when the circuit 2 formed on the substrate 1 and the plurality of arranged leads 3 are heated and pressure-bonded, all the circuits 2 formed on the substrate 1 are deformed by plastically deforming the leads 3. The leads 3 of the heating tool 7 are joined by uniformly contacting all the leads 3 to be joined.
The contact surface with the lead 3 is sharpened, and the heating tool 7
The lead 3 is plastically deformed by
It may be a sign .

Then, the circuit 2 formed on the substrate 1 is arranged.
When heating and crimping a plurality of leads 3 in a row,
Formed on the substrate 1 by plastically deforming the substrate 3
All circuits 2 and all corresponding leads 3 are evenly distributed
It is to be brought into contact and joined, and in the thickness direction of the lead 3
Plastic deformation is possible in some parts, which is more likely to be plastically deformed than in other parts
That the lead 3 is plastically deformed
It may be a feature.

In any of the above methods, the heat of the heating tool 7 is transmitted to the bonding interface between each lead 3 and the circuit 2 formed on the substrate 1 through the plurality of leads 3 to form a gold bump and gold plating. Accordingly, the plurality of leads 3 and the circuit 2 formed on the substrate 1 can be uniformly and collectively joined without any unjoined portions without increasing the thickness of the tin plating.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on embodiments.

The substrate 1 for mounting a semiconductor is shown in FIGS.
As shown in FIG. 2, a plurality of circuits 2 for bonding to the leads 3 are formed side by side along the sides of the substrate 1 at the peripheral end of the surface, and the plurality of circuits 2 are mounted on the substrate 1. The semiconductor chip 15 is connected to the semiconductor chip 15 by wires 16 and the like. Leads 3 are connected to ends of the plurality of circuits 2 respectively.
Then, the entire substrate 1 on which the semiconductor chip 15 is mounted and the leads 3 are connected is sealed with a resin 17 as shown in FIG. Here, the lead 3 is plated with tin, and the circuit 2 made of copper is plated with nickel or gold. To join the lead 3 and the circuit 2 formed on the substrate 1, FIG. As shown, the lead 3 and the circuit 2 are heated and pressed by a heating tool 7 made of titanium, molybdenum, or the like, and joined by Au-Sn eutectic. In FIG. 3D, reference numeral 70 denotes a cylinder device. The heating tool 7 is attached to the tip of the rod 32 of the cylinder device 70, and the heating tool 7 moves up and down by operating the cylinder device 70. It has become. Reference numeral 71 denotes a transformer, and reference numeral 72 denotes a conductive portion. A heater is provided in the heating tool 7 and is heated when energized. In the present invention, when the leads 3 and the circuit 2 formed on the substrate 1 are joined by the heating tool 7, several to several hundred leads 3 and the circuit 2 are joined together. In this case, a feature of the present invention is a technique for uniformly joining the plurality of leads 3 and the circuit 2 by the heating tool 7 as described above. In each of the embodiments described below, an example of Au—Sn eutectic bonding is shown as an example of eutectic bonding.
It is needless to say that the invention is not limited only to the n-eutectic junction.

FIG. 1 shows an embodiment of the present invention. 1 5 Ri substrate under receiving der for supporting a lower surface of the substrate 1 having a bendable substrate in this embodiment
The lower support 5 is made of an elastic material such as rubber, and is made of rubber.
A heat insulating material 8 is interposed between the substrate support 5 and the substrate 1.
is there. The substrate is placed on the substrate support 5 made of an elastic material such as rubber.
1 is placed on the substrate 1 by the substrate support 5.
Only the pressurized part of the substrate 1 is heated via the heat insulating material 8 by the heating tool.
7 so as to be deformable so as to follow the pressing surface 4.
ing. In other words, it is the rubber
A base support 5 made of such an elastic body is interposed via a heat insulating material 8.
Both ends of the plate 1 are placed and supported. In this case,
Both ends of the substrate 1 parallel to the row of the plurality of leads 3 to be made
Are placed on the substrate lower supports 5 which are arranged opposite to each other.
It is. Then, the pressing surface 4 on the lower surface of the heating tool 7
Heating a plurality of parallel leads 3 to a plurality of parallel circuits 2
Crimp . When performing thermocompression bonding with the heating tool 7,
The rule 7 is deformed so as to be convex downward due to thermal expansion.
(That is, the pressing surface 4 is deformed so as to be convex downward.
However, in the present embodiment, only the end of the substrate 1 is elastic.
Since it is supported by the substrate support 5 made of a body, FIG.
The pressing surface 4 of the heating tool 7 is deformed so as to protrude downward as shown in FIG.
Also, the substrate support 5 made of an elastic body follows the deformation of the pressing surface 4.
Accordingly, the substrate 1 is also under the substrate made of an elastic body.
Following the deformation of the pressing surface 4 while the end is supported by the receiver 5,
And the heat of the heating tool 7 passes through the plurality of leads 3
At the joint interface between each lead 3 and the circuit 2 formed on the substrate 1
Transmitted, each lead 3 and each corresponding circuit 2 are not connected
It will be uniformly and collectively joined without any joints. here
Then, the entire lower surface of the substrate 1 is supported by a substrate support 5 made of an elastic body.
Although it is conceivable to support it, in this case,
The pressure portion is also supported by a substrate support 5 made of an elastic body.
For this reason, when heating and pressurizing with the heating tool 7,
Immediately below, the substrate support 5 is lowered, but immediately below the non-pressurized portion.
Means that the substrate support 5 does not descend, so that the substrate 1
Warpage at the boundary between
Is not possible, and there is a risk of poor bonding.
Only the pressurized portion of the substrate 1 is heated by the
7 so as to be deformable so as to follow the pressing surface 4,
When the substrate 1 is heated and pressed by the heating tool 7, the substrate 1
No warping at the boundary with the pressurized part
The touch is obtained and the connection is ensured.

In the above example, the substrate support 5 is made of rubber.
When formed by an elastic body such as
So that the receiver 5 is supported by the rigid substrate support 6
May be.

Thus, both ends of the flexible substrate 1 are
Substrate support made of an elastic material such as rubber via heat insulating material 8
Only it is supported by 5, then heat and pressure to a plurality of circuit 2 in parallel a plurality of leads 3 in parallel with the lower surface of the pressing surface 4 of the heating tool 7 heating tool 7 is lowered to. At the time of thermocompression bonding by the heating tool 7, the heating tool 7 is deformed so as to be convex downward due to thermal expansion (that is, the pressing surface 4 is deformed so as to be convex downward), but in the present embodiment, The substrate support 5 made of an elastic body is used to deform the pressing surface 4 .
Following this, the substrate 1 is also made of an elastic body.
Following the deformation of the pressing surface 4 with the end supported by the lower support 5
As a result, the pressing surface 4 of the heating tool 7 hits the plurality of leads 3 and presses the plurality of leads 3 against the corresponding plurality of circuits 2, and heat of the heating tool 7 passes through the plurality of leads 3. Transferred to the bonding interface between the lead 3 and the circuit 2 formed on the substrate 1, the tin plated on each lead 3 and the gold plated on each circuit 2 become Au-Sn eutectic alloy and melt. The leads 3 and the corresponding circuits 2 are uniformly and collectively joined without any unjoined portions. The joining conditions for the Au-Sn eutectic alloy include:
For example, the heating temperature (the temperature of the contact portion of the heating tool 7) is 350 ° C., and the energization time for heating (temperature holding time) is 2
sec, pressure is 150 gF / lead. Where
As described above, by making the substrate support 5 an elastic body, the substrate 1 can more reliably follow the deformation of the pressing surface 4 of the heating tool 7.

Further , in the present embodiment, when rubber is used as the substrate support 5 made of an elastic material, the heat insulating material 8 is interposed between the rubber substrate support 5 and the substrate 1.
There is a sign. That is, since rubber is generally affected by the heat conducted through the substrate 1 because the heat resistance temperature is low, the rubber lower support 5 and the substrate 1 are connected so that this thermal influence does not reach the lower support 5. The heat insulating material 8 is interposed between them. In the embodiment, the rubber substrate support 5
A heat insulating material 8 made of a resin film such as a polyimide film, which has heat resistance, heat insulating properties, and is easily deformed, is attached to the upper surface. In addition, the heat insulating material 8 is not limited only to the above-described embodiment.

FIGS. 4 and 5 show still another embodiment of the present invention. In this embodiment, the substrate support 5
Shows an example using a fluid 5d.

That is, in the embodiment shown in FIG. 4 , a fluid 5d such as air, water, oil or the like is sprayed from below the substrate 1 so that the pressure causes the substrate 1 to follow the warpage of the pressing surface 4 of the heating tool 7. ing.

In the embodiment shown in FIG. 5 , a deformable container 5e containing a fluid 5d such as air, water, oil or the like is used as the substrate support 5, and this fluid 5
the upper surface of the deformable container 5e which containment d while placing the substrate 1, is to heat pressed by the pressing surface 4 of the heating tool 7 as shown in FIG. In this case, the pressing surface 4 of the heating tool 7 is deformed by heat, but the upper surface portion of the deformable container 5e containing the fluid 5d is deformed following the pressing surface 4, whereby the substrate 1 is also deformed. Accordingly, the leads 3 can be uniformly pressed over the entire joining region, and the plurality of leads 3 are joined with uniform joining strength.

FIG . 6 shows an example in which the substrate support 5 is a bimetal 5f. That is, when heated and pressed by the heating tool 7, the bimetal 5 f is deformed in accordance with the deformation of the pressing surface 4 of the heating tool 7 by the heat passing through the substrate 1.
Is used as a substrate support 5, and the bimetal 5f is deformed according to the deformation of the pressing surface 4 at the time of heating and pressurization by the heating tool 7, thereby causing the substrate 1 to follow the deformation of the pressing surface 4.

In FIGS. 7 and 8 , each lead 3 is pushed up from below the substrate 1 to the pressing surface 4 of the heating tool 7 to deform the substrate 1 so as to follow the pressing surface 4 of the heating tool 7. Are joined together.

That is, in FIG. 7 , the roller 28 is disposed below the substrate 1, and the substrate 1 is pressed in the direction of arrow E by the roller 28, and the roller 28 is pressed to the arrow while pressing the substrate 1 against the pressing surface 4 of the heating tool 7. In the direction, and the plurality of leads 3 are pressed one by one against the pressing surface of the heating tool 7 one by one, whereby the pressure distribution becomes uniform over the entire bonding region and uniform bonding strength is obtained. In addition, a plurality of leads 3 can be uniformly and collectively joined.

In FIG. 8 , a thin rod 29b provided with an elastic body 29a such as a spring at the lower part is disposed below the substrate 1, and the lower part of all the leads 3 is connected via the substrate 1 to each thin rod 29b.
The substrate 1 is pushed up by b to press the substrate 1 against the pressing surface 4 of the heating tool 7.
, And at the same time, the plurality of leads 3 are surely pressed one by one against the pressing surface of the heating tool 7, whereby the pressure distribution is uniform over the entire bonding area, and the uniform bonding strength is achieved. And a plurality of leads 3 can be uniformly and collectively joined.

Incidentally, the pressure correction amount may be detected by a sensor 10 for detecting temperature, pressure, displacement, etc., and the pressure correction amount may be fed back to control the pressing force.

FIG . 9 shows an example. In FIG. 9 , the vertical direction is independent of each other below the substrate 1 .
The changing actuator 9 is arranged, and the actuator 9 is
So that the substrate 1 follows the deformation of the pressing surface 4 of the heating tool 7
Is to be deformed. Up and down independently
As means for pushing up the variable actuator 9,
, Water, oil, springs, magnets, and the like. Actue
The place where the data 9 is arranged is the same as that of the embodiment shown in FIG.
1 is not limited to the entire lower part,
It may be arranged below a part. As in this embodiment
Variable independently in the vertical direction for each actuator 9
With the configuration, the push-up amount for each actuator 9
Can be controlled, so pressurization is uniform over the entire bonding area
Is what you can do. In this manner, the actuators 9 that can be independently changed in the vertical direction are arranged below the substrate 1 and the actuator 9 deforms the substrate 1 so as to follow the deformation of the pressing surface 4 of the heating tool 7. A sensor 10 for detecting pressure is provided at the tip of the actuator 9, the pressure is detected by the sensor 10 at the tip of each actuator 9, and this pressure is fed back to the control unit, so that each actuator 9 is uniformly pressurized. 9 is controlled. FIG. 10 shows each actuator 9 in this embodiment .
Is shown, and as an example, a control example of the actuator 9 provided with the sensor 10 indicated by a is shown in this flow chart. That is, pressurization is started, the pressure is detected by the sensor 10 indicated by a, and
In the case of <P, the actuator 9 is controlled to be extended, and in the case of Pa> P, the actuator 9 is controlled to be contracted (where Pa is the pressure detected by the sensor indicated by a, and P is a This value is a design-specific value to be detected by the sensor indicated by, and is repeated until the pressurization is completed.
In this method, since conditions may change due to a temperature change or the like during pressurization, pressure is detected until pressurization is completed, and the appropriateness of the value is repeatedly checked. This makes it possible to apply an appropriate pressing force over the entire joining region.

FIG . 11 shows another example in which the sensor 10 is provided. In FIG. 11 , in the case where the substrate support 5 shown in FIG. 6 is a bimetal 5f, a plurality of sensors 10 for pressure detection are provided on the upper surface of the bimetal 5f, and the heater 30 is provided on the lower surface of the bimetal 5f. The bimetal 5f is deformed when heated and pressed by the heating tool 7. At this time, the pressure is detected by the sensor 10, and the pressure is fed back to the control unit so that the entire pressure is uniform. The heater 30 is controlled so that the warpage of the entire bimetal 5f is constant. FIG. 12 shows a flowchart of temperature control of the heater 30 for heating the bimetal 5f in the present embodiment. In this embodiment, the heater 30 is controlled in three stages of heater temperature 1, heater temperature 2, and heater temperature 3 (here, heater temperature 1: low, heater temperature 2: medium, heater temperature 3). : High). Then
When the pressurization is started and the heater 30 is heated, first, the heater 30 is controlled to the heater temperature 2. Next, in FIG.
The pressure is detected by each of the sensors 10 of b, c, d, and e,
When (a + e) / 2 <(b + c + d) / 3, the heater 30 is controlled so that the heater temperature becomes 3, and (a + e)
If / 2> (b + c + d) / 3, the heater 30 is controlled so that the heater temperature becomes 1, and this is repeated until the pressurization is completed. This is because the conditions may change due to temperature changes etc. during pressurization, and as a response, pressure is detected until pressurization is completed, and the appropriateness of the value is repeatedly checked. And a suitable pressing force can be applied over the range.

In each of the above-described embodiments, the substrate 1 is prevented from being deformed by heat when the pressing surface 4 of the heating tool 7 is heated.
Although the example in which the side or the substrate lower support 5 supporting the substrate 1 is designed to follow the deformation of the pressing surface 4 of the heating tool 7 has been described, The leads 3 may be collectively and uniformly joined. Hereinafter, this embodiment will be described.

In the embodiment shown in FIGS. 13 and 14 , a central portion of the heating tool 7 is rotatably supported by a rotating shaft 34 on a protruding piece 33 protruding from the rod 32 of the cylinder device 70. The rod 32 of the cylinder device 70 and the actuator 3
5a, 35b, the actuators 35a, 3b
The heating tool 7 is rotated by the operation 5b. Here, during heating, the actuator 35a,
35b is intended to displace alternately as shown in FIG. 14. Thus, when the heating tool 7 is heated and pressurized, the pressing surface 4 of the heating tool 7 is deformed along the convex shape by heat.
At the time of heating and pressurizing, the actuators 35a and 35b are operated to alternately displace as shown in FIG. 14 to rotate the heating tool 7, thereby compensating for insufficient pressurization of the leads 3 at both ends,
The leads 3 at both ends are also reliably pressurized, thereby uniformly joining all the leads 3 included in the row.

Here, the pressure correction amount by the actuators 35a and 35b may be detected by a sensor 36 that detects temperature, pressure and displacement, and feedback control may be performed. In the embodiment shown in FIG. 15 , sensors 36 for detecting pressure are provided at a plurality of locations on the board receiving table 6 (a, a in FIG. 15 ) .
The three sensors b and c are provided at both ends and the center. In FIG. 15 , reference numeral 90 denotes an A / D converter;
Denotes a CPU, 92 denotes a D / A converter, and 93 denotes an amplifier.
Then, in which the heating pressurizing operation by the heating tool 7 according to a flowchart shown in FIG. 16. That is, the actuator 35 is heated until the heating tool 7 is heated.
The displacements of a and 35b are made equal. Then, heating is started, and then the pressing force is measured and stored by the sensor 36 at the position b. Next, the measurement value of the sensor 36 at the position a is
The actuator 35a is extended so as to be equal to the measured value of the sensor 36 at the stored position b (at the same time, the actuator 35b is contracted). Next, the actuator 35b is extended so that the measured value of the sensor 36 at the position c becomes equal to the stored measured value of the sensor 36 at the position b (at the same time, the actuator 35a is contracted). In this way, the leads 3 at both ends are also reliably pressed. Then, the heating is completed, and the actuators 35a, 3a
5b is made equal. Thus, by rotating the heating tool 7 based on the value of the sensor 36 at the time of heating as described above, the pressing at the center and both ends of the pressing surface 4 is equalized, and all the leads 3 included in the row are made uniform. Is to be joined.

In the above embodiment, an example is shown in which a pressure sensor is used as the sensor 36. However, even if the actuators 35a and 35b are driven by using a temperature sensor so as to reliably input heat to the leads 3 at both ends. Good. Also,
An elastic body (rubber or the like) may be used as the substrate receiving surface of the substrate receiving table, and the displacement may be measured and fed back. Further, the sensor 36 may be arranged on the heating tool 7 side.

FIG . 17 shows still another embodiment of the present invention. In this embodiment, when the circuit 2 and the lead 3 formed on the substrate 1 are heat-pressed, the entire pressing surface 4 of the heating tool 7 during heating is included in a corresponding row pressed by the heating tool 7. A temperature difference is generated between the central portion and both end portions of the pressing surface 4 of the heating tool 7 so that the pressing surface 4 is uniformly heated and the thermal expansion of the central portion of the pressing surface 4 during heating is suppressed. Pressing is performed while suppressing deformation to a convex shape. That is, in this embodiment, the cooling unit 51 is provided at the center of the substrate support 6 supporting the substrate 1. As the cooling unit 51, a blowing hole 51a for blowing air toward the heating tool 7 side is provided at the center of the substrate receiving base 50, and air is blown toward the heating tool 7 side when the heating is performed by the heating tool 7, whereby the heating is performed. The temperature at the center of the pressing surface 4 of the tool 7 is lower than the temperature at both ends, which suppresses downward deformation of the pressing surface 4 due to the heat, and makes all the leads 3 included in the row uniform. Can be joined. Note that the solid line of the pressing surface 4 in FIG. 17C indicates the pressing surface 4 of the heating tool 7 during heating as in this embodiment.
A temperature difference is generated between the central portion and both ends of the heating tool, and the imaginary line in FIG. 3C is a pressure when no temperature difference is generated between the central portion and both ends of the pressing surface 4 of the heating tool 7. The deformation of the surface 4 is shown. FIG. 11D shows the temperature distribution of the heating tool 7 at the portions a, b, and c in FIG. 17C during heating according to the present embodiment.

In FIG . 18, a temperature sensor 55 such as a thermocouple is provided near the pressing surface 4 at the center of the heating tool 7 in the embodiment shown in FIG. The feedback control is performed based on the temperature information to control the heating of the heating tool 7. FIG. 19 shows a flowchart of this embodiment, in which heating of the heating tool 7 is started, and then the cooling unit 5 is started.
The heating tool 7 heats air from the blowing holes 51a constituting
The temperature of the center of the pressing surface 4 is measured by a temperature sensor 55 provided near the center of the pressing surface 4 of the heating tool 7, and the measured temperature is fed back to the command temperature. In comparison with the above, a heating current proportional to the temperature difference is caused to flow so that the temperature at the central portion of the heating tool 7 becomes the command temperature, so that the pressing surface 4 of the heating tool 7 can be cooled even if it is cooled by cooling air. Is controlled to be heated to a predetermined temperature. In FIG. 18 , 9
3 is an amplifier.

In each of the above embodiments, as shown in FIG. 20 , the surface of the substrate receiving table 6 supporting the substrate 1 in contact with the substrate 1 may be an elastic body 60. That is, a heat-resistant rubber (for example, trade name: Viton 0.5 mm thick) is provided as an elastic body 60 on the surface of the substrate receiving table 6 supporting the substrate 1, and the heating tool 7 is pressed and heated. When the surface 4 is to be deformed in a convex shape, the substrate 1 and the elastic body 60 are elastically deformed so as to follow the pressing surface 4 of the heating tool 7. Thereby, at the time of heating, the pressing surface 4 of the heating tool 7 can press all the leads 3 included in the row.

Next, still another embodiment of the present invention will be described with reference to FIG. In the present embodiment, the substrate 1 is pressed near the glass transition temperature of the substrate resin by using the bonding heating tool 7 to press the substrate 1 against the pressing surface 4 of the heating tool 7.
This is an example of joining after deforming so as to follow. That is, in the present embodiment, using the heating tool 7 for bonding, the substrate 1 such as a moldable resin is pressure-formed near the glass transition temperature at which the substrate resin starts to soften,
There is a pressure and heat forming step of causing the substrate 1 to follow the pressing surface 4 of the heating tool 7, and a joining step of joining thereafter.
FIG. 21 shows an example in which the substrate 1 has an uneven surface and the pressing surface 4 of the heating tool 7 is flat at the time of bonding. That is, as shown in FIG. 21 (a), the substrate 1 having the uneven surface is pressure-formed near the glass transition temperature at which the substrate resin begins to soften by the heating tool 7 for bonding to form the substrate 1 in FIG. The pressing surface 4 of the heating tool 7 as shown in FIG.
After this step, bonding is performed by the heating tool 7 as shown in FIG. 21 (c).

Here, the pressing force in the forming step of pressing and heating near the glass transition point using the heating tool 7 for bonding,
If the pressing force during the joining step is the same, the molding time can be shortened when the pressing force is high, but the substrate is damaged due to excessive pressurization at the time of bonding, and when the pressing force is low, The substrate 1 can be prevented from being damaged at the time of joining, but the molding time becomes longer. Therefore, the pressing force when the substrate 1 is deformed so as to follow the pressing surface 4 of the heating tool 7 by pressing the substrate 1 near the glass transition temperature of the substrate resin by using the bonding heating tool 7 is used. The pressure is higher than the pressure, which makes it possible to shorten the time of pressurized heat molding and prevent the substrate 1 from being damaged due to excessive pressurization during bonding. In addition, the substrate is heated near the glass transition point of the substrate resin during the press-heating molding as described above, but the heating temperature is increased to a temperature necessary for the bonding during the bonding. FIG.
(A) and (b) are graphs showing the relationship between the pressing force and the pressurizing time at the stage of (b) and (c) of FIG. 21 , respectively, and at the stage of (b) and (c) of FIG. 3) is a graph showing the relationship between the heating temperature and the heating time in the stage ()). Here, the temperature at the stage of FIG. 22B (that is, the pressing and heating molding step) is T1, the pressing force is P1, the holding time is t1, and the temperature at the stage of FIG. , The pressure is P2, and the holding time is t2.

In the embodiment shown in FIG. 21 described above, an example is shown in which the substrate 1 has an uneven surface and the pressing surface 4 of the heating tool 7 is flat at the time of joining. Similarly, when the tool 7 is convex downward at the time of joining, the substrate 1
May be pressed near the glass transition temperature of the substrate resin to deform the substrate 1 so as to follow the pressing surface 4 of the heating tool 7 and then join the substrates. In this case, the same procedure may be performed when the substrate 1 has an uneven surface and the heating tool 7 is convex downward during bonding.

Next, explaining still another embodiment of the present invention with reference to FIG. 23. In this embodiment, the substrate 1
When the circuit formed thereon and the plurality of arranged leads 3 are heated and pressed, the leads 3 are plastically deformed to uniformly contact all the circuits formed on the substrate 1 and all the corresponding leads 3. It is made to join.
That is, by plastically deforming the lead 3 in the thickness direction, the gap between the circuit of the substrate 1 and the lead 3 caused by the warpage of the heating tool 7 or the unevenness of the substrate 1 is absorbed, and all the parts formed on the substrate 1 are absorbed. The above circuit and all the leads 3 corresponding thereto are brought into uniform contact and joined. FIG. 23 shows an example in which the gap between the substrate circuit and the lead 3 caused by the unevenness of the substrate 1 is absorbed. FIG. 23A shows a state in which the surface of the substrate 1 has an uneven surface before bonding, and a gap G is generated between an arbitrary lead 3a of the plurality of leads 3 and the substrate 1;
FIG. 23 (b) shows that all the circuits formed on the substrate 1 and all the corresponding leads 3 are uniformly contacted by plastically deforming the other leads 3b other than the leads 3a at the time of joining . To join.

FIG. 24 shows an embodiment in which the lead 3 is plastically deformed. In this embodiment, means for plastically deforming the lead 3 is provided on the heating tool 7 side. That is, the pressing surface 4 of the normal heating tool 7 against the lead 3 is as shown in FIG. 46 (c) . Reference numeral 4a designates a means for plastically deforming the lead 3 using the saw-toothed uneven portion 4a. Then, for example, any lead 3a and if gaps G is formed between the substrate 1, leads 3b other than the lead 3a as shown in FIG. 24 (b) before joining as shown in FIG. 24 (a) ... Are cut into the saw blade-shaped irregularities 4a of the heating tool 7, and the leads 3b are plastically deformed.
All the circuits formed above and all the leads 3 corresponding thereto are uniformly contacted and joined.

Next,FIG. 25, FIG.Each lead
3 shows another embodiment in which 3 is plastically deformed.
thisFIG. 25, FIG.In the example shown in FIG.
Notches and protrusions are provided in a part of the thickness direction to compare with other parts
To provide a plastically deformable portion 99 which is easily plastically deformed.
The lead 3 is plastically deformed, and the heating tool 7 is warped or deformed.
The gap between the circuit of the substrate 1 and the lead 3 due to the unevenness of the plate 1
And absorbs all the circuits formed on the substrate 1
All the corresponding leads 3 are brought into uniform contact and joined.
Swelling. here,FIG.In lead 3
Notch in a part of the thickness direction of the plastic deformable portion 99
ExampleFIG.In, a protrusion is provided on the lead 3.
In this example, the protrusion is formed into a plastically deformable portion 99 by being cut.
You. And, for example,FIG.(A) andFIG.(A)
Before bonding, between any lead 3a and substrate 1
When the gap G occurs,FIG.(B) andFIG.
Leads 3b... Other than the lead 3a as shown in FIG.
Plastically deformable in the plastically deformable portion 99 (that is,FIG.
From (c)FIG.As in (d), orFIG.
From (c)FIG.(Plastically deforms as shown in (d)).
As a result, all the circuits formed on the substrate 1 and the corresponding circuits
All leads 3 are uniformly contacted and joined.
You.

In any of the above-described embodiments, the place where the collective joining is performed simultaneously is not limited to only one side of the substrate 1, and the places where the collective joining is performed simultaneously are two, three, or four sides of the substrate 1. Is also good.

[0049]

In the invention of claim 1, wherein the present invention, as described above, upon thermocompression bonding a plurality of leads which are arranged to a circuit formed on a substrate having a bendable, elastic Substrate is supported by substrate support formed by body
And heat insulating material between the board and the board support.
Since joined deformed so as to follow the substrate to the pressing surface of the heating tool, as in the prior art is not performed thickening of forming and gold plating thickness and the tin plating thickness of the gold bumps, arranged in a plurality of leads and the substrate The circuit can be uniformly joined together without any unjoined circuit. Therefore, according to the present invention, which has become possible to uniformly bonded collectively all the lead contained in the column bumpless, moreover the substrate
Because it is supported by the substrate support formed by the elastic body,
The simple configuration ensures that the substrate follows the pressing surface of the heating tool
It can be deformed and joined like
By interposing a heat insulator between the lower support and the lower support
Insulation material when rubber is used
Can prolong the service life by preventing
Also, rubber having a low heat-resistant temperature can be used.

[0050] Further, in the invention of claim 2, variable
A plurality of circuits arranged on a substrate having flexibility
A substrate made of a fluid when heating and pressing the lead
The substrate is supported by the lower support and the substrate is pressed by the pressing surface of the heating tool.
It is deformed and joined to follow the
Form bumps and increase the thickness of gold plating and tin plating.
Do not connect multiple leads to the circuit on the board without joining
Can be uniformly joined together without any
Thus, according to the present invention, all the
Leads can be joined uniformly all at once
And using a fluid as a substrate support
The pressure distribution can be made uniform over the entire joining area,
A uniform bonding strength can be obtained.

[0051] Further, in the invention of claim 3, wherein the variable
A plurality of circuits arranged on a substrate having flexibility
It is made of bimetal when heat-pressing the lead
The substrate is supported by the substrate support, and the substrate is pressed by the heating tool.
It is deformed and joined to follow the pressure surface,
Formation of gold bumps and thickening of gold plating and tin plating
Do not connect multiple leads to the circuit on the board.
They can be joined together in a batch without any joining.
Thus, according to the present invention, it is included in a row at bumpless
All leads can be joined together at once.
And use bimetal as a support for the substrate.
Use a simple configuration to securely press the substrate with the heating tool.
What can be deformed and joined to follow the pressure surface
It is.

[0052] Further, in the invention described in claim 4, variable
A plurality of circuits arranged on a substrate having flexibility
When heating and crimping the lead,
Each one is pushed up to the pressing surface of the heating tool to heat the substrate
Since it is deformed and joined to follow the pressing surface of the tool,
Gold bump formation, gold plating thickness, tin plating thickness
Provided on multiple leads and substrate without thickening
One that can be uniformly joined together with no unjoined circuit
And, according to the invention,
All leads included in the package at once
And lead from under the board
Each one is pushed up to the pressing surface of the heating tool, so joining
Uniform pressure distribution over the entire area for uniform bonding
Strength can be obtained, and multiple leads
Pressing against a single heating tool increases joint reliability
Things.

[0053] Further, in the invention of claim 5, wherein, above
Effect of the invention according to any one of claims 2 to 4
In addition, the sensor detects the amount of pressure
Since the pressing force is controlled based on the correction amount,
And a suitable pressurization can be applied.

In the invention according to claim 6, the base
Heats the circuit formed on the board and the multiple leads arranged
When pressing, the entire pressing surface of the heating tool during heating
Are all included in the corresponding row pressed by the heating tool.
Deformed and pressed so as to hit all leads uniformly
Wherein the heating tool is rotatably supported, and the heating tool is
Pressure is corrected by the actuator,
So as to form a gold bump or gold plating or tin plating thick film
The circuit provided on a plurality of leads and the substrate
Can be uniformly joined together without any unjoined parts.
You. Therefore, according to the present invention, the columns in the bumpless
All leads can be joined uniformly at once.
The heating tool can be rotated freely.
Support, and the pressurization of the heating tool is supplemented by an actuator.
Correct both ends of the pressing surface of the heating tool with a simple configuration
Of all leads in a row
Those that may be joined evenly one to.

Further, in the invention according to claim 7, the base
Heats the circuit formed on the board and the multiple leads arranged
When pressing, the entire pressing surface of the heating tool during heating
Are all included in the corresponding row pressed by the heating tool.
Pressing surface of heating tool so that all leads are evenly
Temperature difference between the center and both ends of the
Pressurizing the surface while suppressing it from deforming in a convex shape,
The convex deformation of the pressing surface of the heating tool during heating
All leads included can be joined together at once
You can do it.

[0056] Further, in the invention according to claim 8, above
In addition to the effect of the invention described in claim 7, the pressing of the heating tool is performed.
Measure the temperature at the center of the pressure surface and measure the temperature at this center.
Feedback and compare with command temperature to command temperature
The center of the pressing surface of the heating tool.
Be sure to heat up to the specified temperature even when cooling when hot
To make all leads in a row uniform at once
It can be joined.

[0057] Further, in the invention of claim 9, wherein, soluble
A plurality of circuits arranged on a substrate having flexibility
Heating tool for joining when heating and crimping the lead
Press the substrate near the glass transition temperature of the substrate resin using
After deforming the substrate to follow the pressing surface of the heating tool
To be bonded to each other using a heating tool for bonding.
Pressing the substrate around the glass transition temperature of the substrate resin
Pressing force when deforming to follow the pressing surface of the heating tool
Is higher than the pressing force at the time of joining.
The circuit of the substrate can be joined together in a lump without unjoining
It can be done by using a heating tool for bonding.
In order to shape the substrate, a process for forming the substrate is set in advance.
Pressing surface of the heating tool as part of the bonding process
Can be copied easily and reliably.
The substrate is made of glass using a heating tool for bonding
Pressing near the transition temperature to make the substrate follow the pressing surface of the heating tool
Force when deforming so that it
Since the height is higher, the molding time of the substrate can be shortened.
Can prevent substrate damage due to excessive pressurization
Things.

According to the tenth aspect of the present invention,
Adds the circuit formed on the board and the
The lead is plastically deformed during thermocompression bonding.
All circuits formed on the substrate and all corresponding circuits
Are joined by uniformly contacting the leads of
The contact surface of the heat tool with the lead is sharpened,
Plastically deform the lead by cutting it into the lead
Therefore, multiple leads and the circuit of the board can be uniformly
And can be joined together.
Prevents the heating tool from warping because it deforms itself
Or a mechanism that deforms the substrate becomes unnecessary.
Yes, and the contact surface with the lead of the heating tool is sharpened
And lead the heating tool into the lead
Since the metal is plastically deformed, it can be easily applied to the pressing surface of the heating tool.
The lead can be easily plastically deformed only by
You can do it.

According to the eleventh aspect of the present invention,
Adds the circuit formed on the board and the
The lead is plastically deformed during thermocompression bonding.
All circuits formed on the substrate and all corresponding circuits
The leads are uniformly contacted and joined.
Plastic deformation in some parts in the thickness direction of the
The lead can be plastically deformed by providing a plastically deformable part.
Shape, so that multiple leads and the circuit of the board can be
It can be joined all at once, and
In order to plastically deform the lead itself, warp the heating tool.
No need for a mechanism to prevent or deform the substrate
And another part in the thickness direction of the lead.
Provide a plastically deformable part that is more plastically deformable than
Leads to plastic deformation of the lead,
It is capable of plastically deforming the lead during processing.
You.

[Brief description of the drawings]

FIG. 1 is a sectional view for explaining an embodiment of the present invention.

2A is an exploded front cross-sectional view showing a lead and a substrate, FIG. 2B is an exploded plan view, and FIG. 2C is a cross-sectional view in a state where the leads are joined and then sealed with a resin. is there.

3A is a cross-sectional view of a state before a lead is bonded, FIG. 3B is a cross-sectional view at the time of bonding, FIG. 3C is a perspective view, and FIG. It is an overall view.

FIG. 4 is a cross-sectional view for explaining another embodiment of the present invention .
is there.

FIG. 5 is a sectional view for explaining still another embodiment of the present invention .
FIG.

FIG. 6 is a sectional view for explaining still another embodiment of the present invention .
FIG.

FIG. 7 is a cross-sectional view for explaining still another embodiment of the present invention.
FIG.

FIG. 8 is a cross-sectional view for explaining still another embodiment of the present invention.
FIG.

FIG. 9 is a cross-sectional view for explaining still another embodiment of the present invention.

FIG. 10 is a flowchart of the above.

FIG. 11 is a sectional view for explaining still another embodiment of the present invention.
FIG.

FIG. 12 is a flowchart of the above.

FIG. 13 is an explanatory diagram for explaining still another embodiment of the present invention.

FIG. 14 shows displacement and time of two actuators of the above .
6 is a graph showing the relationship of.

FIG. 15 is an explanatory diagram of still another embodiment of the present invention.

FIG. 16 is a flowchart of the above.

FIG. 17 shows still another embodiment of the present invention , wherein (a)
It is front explanatory drawing, (b) is a side explanatory drawing, (c)
Is when the center of the pressing surface is cooled during heating of the heating tool
FIG. 7 is an explanatory diagram showing deformation of the pressing surface when the cooling is not performed.
(D) is the temperature of the pressing surface of the heating tool during heating.
It is explanatory drawing which shows a distribution.

FIG. 18 is an explanatory view of still another embodiment of the present invention.

FIG. 19 is a flowchart of the above .

FIG. 20 is an explanatory diagram of still another embodiment of the present invention.

FIG. 21 shows yet another embodiment of the present invention, wherein (a)
It is explanatory drawing which shows the state before heat-pressure molding, (b) is a base.
Explanation of pressurizing stage near the glass transition temperature of plate resin
It is a figure and (c) is explanatory drawing at the time of joining.

FIG. 22 (a) shows the stage of FIG. 21 (b) and the stage of FIG. 21 (c).
FIG. 6 is a graph showing a relationship between a pressing force and a pressurizing time in a floor.
(B) corresponds to steps (b) and (c) in FIG.
4 is a graph showing the relationship between the heating temperature and the heating time during heating.

23 (a) and (b) show still another embodiment of the present invention.
FIG.

FIG. 24 shows yet another embodiment of the present invention , wherein (a)
(B) is an explanatory diagram showing a state at the time of joining before joining;
(C) is a pressing surface of a general heating tool, and (d) is the present embodiment.
It is explanatory drawing which shows the pressing surface of a state.

FIG. 25 shows yet another embodiment of the present invention, wherein (a)
(B) is an explanatory diagram showing a state at the time of joining before joining;
(C) is before plastic deformation and (d) is plastically deformed by pressing.
It is explanatory drawing which shows a state.

FIG. 26 shows yet another embodiment of the present invention , wherein (a)
(B) is an explanatory diagram showing a state at the time of joining before joining;
(C) Lead before plastic deformation of lead (d) Lead by pressurization
FIG. 4 is an explanatory view showing a state in which the metal is plastically deformed.

FIG. 27A is a cross-sectional view before a heating tool is heated.
Yes, (b) is the pressing surface when heating the heating tool
It is sectional drawing which shows a deformation | transformation.
FIG.

FIG. 28 illustrates a problem when the thickness of the substrate varies.
FIG. 3 is an explanatory diagram for explaining a title.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Circuit 3 Lead 4 Pressing surface 5 Substrate support 7 Heating tool 8 Insulation material 9 Actuator 10 Sensor

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tsukasa Hogami 1048, Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside (72) Inventor Hitoshi Kitano 1048 Kadoma, Kazuma Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72 Inventor Kazushi Kawamura 1048 Kadoma, Kazuma, Osaka Pref. Matsushita Electric Works, Ltd. (56) References JP-A-2-119152 (JP, A) JP-A-63-86530 (JP, A) (58) Survey Field (Int.Cl. ⁷ , DB name) H01L 21/60

Claims (11)

(57) [Claims] Upon 1. A thermocompression bonding a plurality of leads to the circuit and array formed on a substrate having a bendable, bullets
When the substrate is supported by the substrate support
Both the substrate and bonding method leaded substrate, characterized in that the joined interposed insulation is deformed so as to follow the pressing surface of the heating tool the substrate between the substrate under received. 2. A circuit formed on a substrate having flexibility.
When heating and crimping the multiple leads
The substrate is supported and supported by the substrate support
Deformation and bonding to follow the pressing surface of the thermal tool
A method for joining substrates with leads. 3. A circuit formed on a substrate having flexibility.
When heating and crimping multiple leads
The board is supported by the board support made of metal.
Is deformed so as to follow the pressing surface of the heating tool and is joined
A method for joining substrates with leads. 4. A circuit formed on a substrate having flexibility.
When heating and crimping multiple leads
Press each lead from below the plate against the pressing surface of the heating tool
Raise and deform the substrate to follow the pressing surface of the heating tool
A method for joining substrates with leads , characterized in that the substrates are joined together . 5. A pressure correction amount is detected by a sensor,
The pressurizing force is controlled based on the pressurizing correction amount.
The method for bonding a substrate with leads according to any one of claims 2 to 4 . 6. A plurality of arrays arranged on a circuit formed on a substrate.
When applying heat and pressure to the lead of
The entire pressing surface of the tool is pressed by the heating tool.
Deform so that all the leads in the row are hit evenly
Pressurizes and supports the heating tool rotatably
And correct the pressurization of the heating tool by the actuator.
A method for joining substrates with leads. 7. A plurality of circuits arranged on a circuit formed on a substrate
Heating Two Upon, upon heating to application of a lead heating pressure
The entire pressing surface of the tool is pressed by the heating tool.
Heat so that all leads in the row are evenly distributed
A temperature difference occurs between the center and both ends of the pressing surface of the tool.
And pressurize while suppressing the pressing surface from deforming convexly during heating
A method for joining substrates with leads. 8. The temperature of the center of the pressing surface of the heating tool is measured.
Measure and feed back the measured temperature at the center to command
Heating to the command temperature compared to the temperature
The method for bonding substrates with leads according to claim 7 . 9. A circuit formed on a bendable substrate
When heating and crimping multiple leads
Substrate to glass transition of substrate resin using joint heating tool
Pressing around the temperature will make the substrate follow the pressing surface of the heating tool
It is joined after being deformed like this.
Substrate near the glass transition temperature of substrate resin using thermal tool
To deform the substrate to follow the pressing surface of the heating tool
The pressing force at the time of making it higher than the pressing force at the time of joining
A method for joining substrates with leads. 10. A circuit array formed with a circuit formed on a substrate.
As the number of leads and thermocompression bonding, the leads deform plastically.
All the circuits formed on the substrate
All the corresponding leads are uniformly contacted and joined
The contact surface of the heating tool with the lead is sharpened
And lead the heating tool into the lead
A method for bonding a substrate with leads, wherein the substrate is plastically deformed . 11. A circuit arrayed with a circuit formed on a substrate.
As the number of leads and thermocompression bonding, the leads deform plastically.
All the circuits formed on the substrate
All the corresponding leads are uniformly contacted and joined
That is part of the lead thickness direction compared to other parts.
By providing a plastically deformable part that is easily plastically deformed
A method for joining substrates with leads, wherein the leads are plastically deformed .