JP3226879U - Smart automatic mold change system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a smart automatic mold changing system. SOLUTION: A smart automatic mold change system is provided with a central control unit, a mold storage unit 1, a mold combination disassembling unit 2, and a mold, which are installed in the same production line and electrically connected to the central control unit. A temporary storage unit 3, a temporary storage mold pick and place unit 4, a plurality of processing devices 5a to 5c, a plurality of mold preparation position units 6a to 6c, and a mold exchange pick and place unit 7 are provided. A plurality of spare molds M1 are placed in the mold storage unit. The temporary storage mold pick and place unit is movably installed above the temporary mold storage unit. The plurality of processing equipments are adjacent to the temporary mold storage unit. The original processing die M2 is included in the processing equipment. Each of the plurality of mold preparation position units is installed beside one side of the processing equipment. The mold exchange pick-and-place unit is movably installed above the processing equipment and the mold preparation position unit. [Selection diagram] Fig. 3

Description

The present invention relates to mold replacement, and more particularly to a smart automatic mold replacement system.

Since the Industrial Revolution of the 18th century, the use of large amounts of equipment and the establishment of large-scale factories have become the source of human productivity, instead of the conventional human and animal power.

Nowadays, in the production of modernization industry, a large amount of equipment is used as a main source of productivity instead of the conventional human power and animal power, but raw materials and molds are still often transported manually. .. As a result, there is a problem that the production efficiency becomes low and the labor cost becomes high.

The problem to be solved by the present invention is to provide a smart automatic mold changing system in spite of the shortage of conventional techniques.

The smart automatic mold change system according to the present invention includes a mold storage unit, a mold combination disassembly unit, a mold temporary storage unit, a temporary storage mold pick and place unit, a plurality of processing equipment, and a plurality of mold preparation position units. And a die exchange pick and place unit. A plurality of spare molds are placed in the mold storage unit. The mold combination disassembling unit is disposed adjacent to the mold accommodating unit. The mold temporary storage unit is disposed adjacent to the mold combination disassembling unit. The temporary storage mold pick and place unit is movably installed above the mold temporary storage unit. The plurality of processing devices are arranged adjacent to the mold temporary storage unit, and each of the plurality of processing devices includes an original processing mold. Each of the plurality of mold preparation position units is installed beside one side of the processing equipment. The mold exchange pick-and-place unit is movably installed above the plurality of processing devices and the mold preparation position unit.

The beneficial effects of the present invention are listed below. The smart automatic mold changing system according to the present invention includes: "a plurality of spare molds are placed in a mold storing unit"; "a mold combination disassembling unit is arranged in the vicinity of the mold storing unit"; The mold temporary storage unit is placed near the mold combination disassembling unit", "The temporary storage mold pick and place unit is movably installed above the mold temporary storage unit", "Multiple processing equipment" Is located near the mold temporary storage unit, each of the multiple processing equipment includes the original processing mold," "each of the multiple mold preparation position units is installed next to one side of the processing equipment. And “the die change pick-and-place unit is movably installed above a plurality of processing equipments and the die preparation position unit” to improve the efficiency of die change and reduce the time cost. To reduce.

It is a schematic diagram which shows the flowchart of the smart automatic mold replacement method of the 1st Embodiment concerning this invention. 1 is a block diagram showing a smart automatic mold changing system according to a first embodiment of the present invention. It is a 1st schematic diagram which shows execution of step S100 in the smart automatic die change method of 1st Embodiment concerning this invention. It is a 2nd schematic diagram which shows execution of step S100 in the smart automatic die change method of 1st Embodiment concerning this invention. It is a 1st schematic diagram which shows execution of step S102 in the smart automatic mold replacement method of 1st Embodiment concerning this invention. It is a 2nd schematic diagram which shows execution of step S102 in the smart automatic mold replacement method of 1st Embodiment concerning this invention. It is a 3rd schematic diagram which shows execution of step S102 in the smart automatic mold replacement method of 1st Embodiment concerning this invention. It is a 1st schematic diagram which shows execution of step S104 in the smart automatic die change method of 1st Embodiment concerning this invention. It is a 2nd schematic diagram which shows execution of step S104 in the smart automatic die change method of 1st Embodiment concerning this invention. It is a schematic diagram which shows execution of step S106 in the smart automatic mold replacement method of the 1st Embodiment concerning this invention. It is a structure schematic diagram which shows the processing equipment and die preparation position unit of 1st Embodiment concerning this invention. It is a schematic diagram which shows the use condition in the metal mold|die preparation position unit of 1st Embodiment concerning this invention. It is a structure schematic diagram which shows the smart automatic die change system of 2nd Embodiment concerning this invention. It is a block diagram which shows the smart automatic die-change system of 2nd Embodiment concerning this invention.

For a better understanding of the features and technical contents of the present invention, reference will be made to the following detailed description and accompanying drawings. However, the attached drawings are provided for reference and explanation only, and are not intended to limit the scope of claims for utility model registration of the present invention.

Hereinafter, the "smart automatic mold changing system" disclosed by the present invention will be described with reference to specific embodiments. Those skilled in the art can understand the merits and effects of the present invention from the disclosure of this specification. The present invention can be implemented or applied by other different embodiments. Each subsection in this specification can be equivalently modified and changed based on various viewpoints or applications without departing from the spirit of the present invention. Further, the drawings of the present invention are for the purpose of simple and schematic illustration, and do not show actual dimensions. The technical matters of the present invention will be further described in the following embodiments, but the disclosed contents do not limit the present invention.

In this specification, various parts may be described by terms such as “first”, “second”, and “third”, but these parts are not limited by these terms. .. These terms are mainly used to distinguish one part from another part. Further, the term "or" used in the present specification may include any one or a combination of two or more of the related items depending on the actual situation.

[First Embodiment]
1 to 10, a first embodiment of the present invention provides a smart automatic die changing method.

First, the preliminary mold M1 is conveyed to the mold temporary storage unit 3 (step S100). For example, as shown in FIGS. 1, 3 and 4, first, the preliminary mold M1 is placed in the mold combination disassembling unit 2. Next, the spare mold M1 is carried to the mold temporary storage unit 3 by manpower or a machine.

Specifically, the mold temporary storage unit 3 includes a plurality of preliminary mold temporary storage areas 30 and a pick and place preparation area 31. The spare mold M1 is placed in the spare mold temporary storage area 30 or the pick and place preparation area 31. Among them, the preliminary mold M1 may be a die, but is not limited thereto. For example, as shown in FIGS. 1, 3 and 4, the mold temporary storage unit 3 according to the present invention includes a plurality of preliminary mold temporary storage areas 30 and a pick and place preparation area 31. The plurality of preliminary mold temporary storage areas 30 are adjacent to the mold combination disassembling unit 2. The pick and place preparation area 31 is located away from the plurality of preliminary mold temporary storage areas 30. Especially, the mold temporary storage unit 3 may be a temporary storage production line, for example, a general production line, but is not limited thereto. Therefore, when carrying the preliminary mold M1 to the temporary mold storage unit 3, first, the preliminary mold M1 can be placed in one arbitrary preliminary mold temporary storage region 30. Then, the spare mold M1 is transported from the arbitrary spare mold temporary storage area 30 to the pick and place preparation area 31 by the temporary storage mold pick and place unit 4. Among them, the temporary storage mold pick and place unit 4 is movably installed above the temporary mold storage unit 3. The temporary storage mold pick and place unit 4 may be an overhead traveling crane of a storage production line, but is not limited thereto.

More specifically, before transferring the spare mold M1 to the mold temporary storage unit 3, at least one spare mold M1 may be taken out from the mold storage unit 1 and transferred to the mold combination disassembling unit 2. .. For example, as shown in FIGS. 1, 3 and 4, the mold storage unit 1 according to the present invention can store a plurality of spare molds M1. Each preliminary mold M1 includes at least a first preliminary mold M10 and a second preliminary mold M11 which are combined with each other. Therefore, the mold storage unit 1 can store the spare mold M1 that has been assembled and completed, or the first spare mold M10 and the second spare mold M11 that are not combined. The mold storage unit 1 can be a mold holder or a mold holder. The first preliminary mold M10 may be a male mold and the second preliminary mold M11 may be a female mold, but is not limited thereto. The first spare mold M10 and the second spare mold M11 that have not been combined are conveyed to the mold combination disassembling unit 2 and combined with the spare mold M1 by the machine or manual operation in the mold combining disassembling unit 2. Among them, the mold combination disassembling unit 2 may be an automatic machine or a general work table capable of performing the function of combining or disassembling, but is not limited thereto.

More specifically, when the spare mold M1 is not used, the spare mold M1 is disassembled by the mold combination disassembling unit 2 into the first spare mold M10 and the second spare mold M11, and then the first spare mold M1. The mold M10 and the second spare mold M11 are placed in the mold storage unit 1, respectively. When using the spare mold M1, the first spare mold M10 and the second spare mold M11 are combined with the spare mold M1 by the mold combination disassembling unit 2 and then placed in the mold temporary storage unit 3. ..

Then, the mold replacement pick-and-place unit 7 conveys the preliminary mold M1 placed in the mold temporary storage unit 3 to the mold preparation position unit (step S102). For example, as shown in FIGS. 1 and 5 to 7, the present invention has a plurality of processing equipment 5a, 5b, 5c, and a mold preparation position unit beside each processing equipment 5a, 5b, 5c. 6a, 6b, 6c are installed. Among them, the processing devices 5a, 5b, 5c may be die casting machines, and the mold preparation position units 6a, 6b, 6c may be object rests, but are not limited thereto. Therefore, when the spare mold M1 is placed in the pick and place preparation area 31 of the mold temporary storage unit 3, the spare mold M1 placed in the pick and place preparation area 31 by the mold replacement pick and place unit 7. Can be conveyed to one mold preparation position unit in the mold preparation position units 6a, 6b, 6c, and the subsequent work can be continued. Among them, the mold exchange pick-and-place unit 7 is movably arranged above the plurality of processing devices 5a, 5b, 5c and the plurality of mold preparation position units 6a, 6b, 6c. Further, the mold replacement pick-and-place unit 7 may be a mold automatic correction production line, for example, a mold replacement overhead traveling crane, but is not limited thereto. Further, the mold storage unit 1, the mold combination disassembling unit 2, the mold temporary storage unit 3, the temporary storage mold pick and place unit 4, the plurality of processing devices 5a, 5b, 5c, and the plurality of mold preparation position units 6a. , 6b, 6c and the mold exchange pick-and-place unit 7 may be installed in the same production line.

More specifically, each mold preparation position unit 6a, 6b, 6c includes a first mold preparation position area 60 and a second mold preparation position area 61. The spare mold M1 is conveyed from the pick and place preparation area 31 to the first mold preparation position area 60 in the mold preparation position units 6a, 6b, 6c by the mold exchange pick and place unit 7. For example, as shown in FIGS. 5 to 7, it is possible to place a mold to be attached in the first mold preparation position area 60 in the mold preparation position units 6a, 6b, 6c, and the mold preparation position unit 6a. , 6b, 6c in the second mold preparation position area 61, the mold to be removed can be placed. In this way, the spare mold M1 placed in the pick-and-place preparation area 31 by the mold exchange pick-and-place unit 7 is the first of the mold preparation position units 6a, 6b, 6c. It is conveyed to the mold preparation position area 60 of.

Then, the mold exchanging pick-and-place unit 7 takes out the original machining mold M2 installed in the machining device 5a and places it in the mold preparation position unit 6a (step S104). For example, as shown in FIGS. 8 and 9, each of the processing devices 5a, 5b, and 5c includes the original processing die M2 inside. Thereby, after the spare mold M1 is placed in the first mold preparation position area 60, the original machining mold M2 installed in the machining equipment 5a by the mold exchanging pick and place unit 7 is taken out and the second mold is removed. It can be placed in the mold preparation position area 61.

Then, the spare mold M1 placed in the mold preparation position unit is placed in the processing equipment by the mold exchange pick-and-place unit 7 (step S106). For example, as shown in FIGS. 8 to 10, after the die replacement pick-and-place unit 7 takes out the original machining die M2 installed in the machining equipment 5a and places it in the second die preparation position area 61. , The preliminary die M1 placed in the first die preparation position area 60 is placed in the processing equipment 5a. Of these, the original working die M2 may be a die, but is not limited thereto.

Then, the original tooling mold M2 placed in the mold preparation position unit is conveyed to the mold temporary storage unit 3 by the mold replacement pick-and-place unit 7 (step S108). For example, as shown in FIG. 5, FIG. 6 and FIG. 10, the original processing mold M2 placed in the second mold preparation position area 61 is processed by the mold exchange pick and place unit 7 to temporarily store the mold. 3 is conveyed to the pick and place preparation area 31.

More specifically, the original machining die M2 is placed in the pick and place preparation area 31 and then transferred to any one preliminary die temporary storage area by the temporary storage die pick and place unit 4. Thereby, it can be conveyed to the mold combination disassembling unit 2 and the disassembling operation can be performed.

Further, as shown in FIGS. 2 to 10, the present invention further includes a central controller 8, which includes a mold storage unit 1, a mold combination disassembling unit 2, a mold temporary storage unit 3, It is electrically connected to the temporary storage mold pick and place unit 4, a plurality of processing devices 5a, 5b, 5c, a plurality of mold preparation position units 6a, 6b, 6c and a mold exchange pick and place unit 7. For example, the central controller 8 shown in FIG. 2 may be a terminal device, but is not limited to this. The central control device 8 is operated by a user, and the mold storage unit 1, the mold combination disassembling unit 2, the mold temporary storage unit 3, the temporary storage mold pick and place unit 4, the plurality of processing devices 5a, 5b, 5c. , At least one unit selected from the plurality of mold preparation position units 6a, 6b, 6c and the mold exchange pick-and-place unit 7 can be operated.

More specifically, the mold storage unit 1 according to the present invention, the mold combination disassembling unit 2, the plurality of preliminary mold temporary storage areas 30 and the pick and place preparation area 31 in the mold temporary storage unit 3, and the temporary storage metal. A mold pick-and-place unit 4, a plurality of processing devices 5a, 5b, 5c, and a first mold preparation position region 60 and a second mold preparation position region 61 in the plurality of mold preparation position units 6a, 6b, 6c. A sensor may be installed in the mold replacement pick-and-place unit 7 (not shown). The plurality of sensors are connected to the central controller 8 in a wired or wireless manner so that they can communicate with each other. Thereby, the central control unit 8 can receive the signals from the respective sensors and obtain the current operating state of each unit for the user's reference.

According to the above contents, the present invention further provides a smart automatic mold changing system Z. The smart automatic mold change system Z includes a mold storage unit 1, a mold combination disassembly unit 2, a mold temporary storage unit 3, a temporary storage mold pick and place unit 4, a plurality of processing devices 5a, 5b, 5c, and a plurality of processing devices. The mold preparation position units 6a, 6b and 6c, the mold exchange pick and place unit 7 and the central controller 8 are provided. A plurality of spare molds M1 are placed in the mold storage unit 1. The mold combination disassembling unit 2 is adjacent to the mold storing unit 1. The mold temporary storage unit 3 is adjacent to the mold combination disassembling unit 2. The temporary storage mold pick and place unit 4 is movably installed above the temporary mold storage unit 3. The plurality of processing devices 5a, 5b, 5c are adjacent to the mold temporary storage unit 3. The original processing die M2 is included in the processing equipment 5a, 5b, 5c. The plurality of mold preparation position units 6a, 6b, 6c are respectively installed beside one side of the processing equipment 5a, 5b, 5c. The mold exchange pick and place unit 7 is movably installed above the processing devices 5a, 5b, 5c and the mold preparation position units 6a, 6b, 6c. The central controller 8 includes a mold storage unit 1, a mold disassembly unit 2, a mold temporary storage unit 3, a temporary storage mold pick and place unit 4, a plurality of processing devices 5a, 5b, 5c, and a plurality of molds. It is electrically connected to the preparation position units 6a, 6b, 6c and the mold exchange pick and place unit 7. Mold storage unit 1, mold combination disassembly unit 2, mold temporary storage unit 3, temporary storage mold pick and place unit 4, a plurality of processing devices 5a, 5b, 5c, a plurality of mold preparation position units 6a, 6b. , 6c and the die change pick-and-place unit 7 are installed on the same production line.

Further, as shown in FIGS. 11 and 12, each of the processing devices 5a, 5b and 5c according to the present invention includes a base module 50, an injection module 51, a mold fixing module 52, an inspection module 53 and a transfer module 54. The injection module 51 is installed on the base module 50. The mold fixing module 52 is installed on the base module 50 and is connected to the injection module 51. The inspection module 53 is connected to the mold fixing module 52. The transfer module 54 is located on the base module 50 and is adjacent to the mold fixing module 52. As a result, the spare mold M1 (which may be the original working mold M2) is carried to the mold fixing module 52 by the mold replacement pick-and-place unit 7, and the spare mold M1 is detachable from the mold fixing module 52. After that, the molding material is injected into the preliminary mold M1 via the mold fixing module 52 by the nozzle (not shown) of the injection module 51. Next, by disassembling the preliminary mold M1 by the mold fixing module 52, the product or semi-finished product in the preliminary mold M1 is dropped onto the transport module 54, and is transported to another place by the transport module 54. Among them, when the spare mold M1 is opened, the inspection module 53 can confirm whether the product or the semi-finished product in the spare mold M1 has dropped from the spare mold M1. If it is determined that the product or semi-finished product is still present in the spare mold M1, the inspection module 53 issues a warning signal, or a warning message (eg sound, light, etc.), thereby alerting the operator.

Further, each of the mold preparation position units 6a, 6b, 6c is installed beside the corresponding processing equipment 5a, 5b, 5c. The mold preparation position units 6a, 6b, 6c can be stages or frames. Although the frame is illustrated in FIGS. 11 and 12, the present invention is not limited to this. Each of the mold preparation position units 6a, 6b, 6c includes a first mold preparation position area 60 and a second mold preparation position area 61, whereby the spare mold M1 and the original working mold M2 are placed. Is secured.

However, the embodiment described above is merely an example, and the present invention is not limited to this.

[Second Embodiment]
As shown in FIGS. 13 and 14, the second embodiment of the present invention provides a smart automatic mold changing system Z. The smart automatic mold change system Z includes a mold storage unit 1, a mold combination disassembly unit 2, a mold temporary storage unit 3, a temporary storage mold pick and place unit 4, a plurality of processing devices 5a, 5b, 5c, A plurality of mold preparation position units 6a, 6b, 6c, a mold exchange pick and place unit 7, a central controller 8 and a storage mold pick and place unit 9 are provided. Comparing FIG. 13 and FIG. 14 with FIG. 3 and FIG. 2, the biggest difference between the second embodiment and the first embodiment according to the present invention is that “the smart automatic mold according to the present invention is The exchange system Z further includes a storage mold pick-and-place unit 9, and the storage mold pick-and-place unit 9 is movably installed above the mold storage unit 1 and the mold disassembly unit 2. It turns out that Among them, the storage die pick-and-place unit 9 may be a die-conveying overhead traveling crane, but is not limited thereto.

For example, as shown in FIGS. 13 and 14, the combined first spare mold M10 and second spare mold M11 are disassembled by the mold combination disassembling unit 2 and then the storage mold pick and hold The place unit 9 conveys it to the mold storage unit 1. On the contrary, the first spare mold M10 and the second spare mold M11 are combined by the mold combination disassembling unit 2 and then conveyed to the mold temporary storage unit 3 by the storage mold pick and place unit 9. To be done.

More specifically, as shown in FIGS. 13 and 14, the original processing mold M2 placed in the preliminary mold temporary storage area 30 is transferred to the mold combination disassembling unit 2 by the storage mold pick and place unit 9. Can be transported. Further, the original mold combination M2 is decomposed into at least one first mold M20 and at least one second mold M21 by the mold combination disassembling unit 2. The first mold M20 and the second mold M21 are conveyed to the mold storage unit 1 by the storage mold pick and place unit 9. Among them, the first mold M20 may be a male mold and the second mold M21 may be a female mold, but the invention is not limited thereto.

However, the embodiment described above is merely an example, and the present invention is not limited to this.

[Beneficial effects of the embodiment]
The beneficial effects of the present invention are listed below. According to the smart automatic mold changing system of the present invention, "a plurality of spare molds M1 are placed in the mold storing unit 1", "the mold combination disassembling unit 2 is arranged in the vicinity of the mold storing unit 1". "The mold temporary storage unit 3 is arranged near the mold combination disassembling unit 2", "The temporary storage mold pick and place unit 4 is movably installed above the mold temporary storage unit 3"", the plurality of processing devices 5a, 5b, 5c are arranged in the vicinity of the mold temporary storage unit 3, and each of the plurality of processing devices 5a, 5b, 5c includes the original processing mold M2." , "Each of the plurality of mold preparation position units 6a, 6b, 6c is installed beside one side of the processing equipment 5a, 5b, 5c", "The mold exchange pick-and-place unit 7 is movable for a plurality of processings. It is installed above the devices 5a, 5b, 5c and the mold preparation position units 6a, 6b, 6c" to improve the efficiency of mold replacement and reduce the time cost.

Another beneficial effect of the present invention is as follows. The smart automatic die change method according to the present invention is "transport the spare die M1 to the die temporary storage unit 3" and "the die exchange pick and place unit 7 is placed on the temporary die storage unit 3". The spare mold M1 is conveyed to a mold preparation position unit located on one side of the processing equipment.", "The mold replacement pick-and-place unit 7 originally installed in the processing equipment 5a, 5b, 5c. Of the processing die M2 and placing it in the die preparation position unit", "Put the spare die M1 placed in the die preparation position unit by the die exchange pick and place unit 7 in the processing equipment", " The mold exchanging pick-and-place unit 7 conveys the original processed mold M2 placed in the mold preparation position units 6a, 6b, 6c to the mold temporary storage unit 3". Increase the efficiency of exchange and reduce the time cost.

Further, the smart automatic mold changing system Z and the smart automatic mold changing method according to the present invention are the mold storing unit 1, the mold combination disassembling unit 2, the mold temporary storing unit 3, and the temporary storing mold according to the above-described embodiment. The mold pick-and-place unit 4, the plurality of processing devices 5a, 5b, 5c, the plurality of mold preparation position units 6a, 6b, 6c, and the mold exchange pick-and-place unit 7 are installed on the same production line. In particular, the temporary storage die pick and place unit 4 and the die exchange pick and place unit 7 are adopted. This solves the problem of manual transportation and keeps labor costs low. Further, by installing the mold preparation position units 6a, 6b, 6c, it is possible to shorten the time required for mold replacement.

The contents disclosed above are only preferred embodiments of the present invention, and do not limit the scope of claims for utility model registration of the present invention. Therefore, all equivalent technical modifications made based on the contents of the specification and the attached drawings of the present invention shall be included in the scope of claims for utility model registration of the present invention.

DESCRIPTION OF SYMBOLS 1... Mold storage unit 2... Mold combination disassembly unit 3... Mold temporary storage unit 30... Spare mold temporary storage area 31... Pick and place preparation area 4... Temporary storage mold pick and place units 5a, 5b, 5c Processing equipment 50... Base module 51... Injection module 52... Mold fixing module 53... Inspection module 54... Conveying modules 6a, 6b, 6c... Mold preparation position unit 60... First mold preparation position area 61... Second Mold preparation position area 7... Mold replacement pick-and-place unit 8... Central control unit 9... Storage mold pick-and-place unit M1... Spare mold M2... Original working mold M10... First spare mold M11... Second spare mold M20...First mold M21...Second mold Z...Smart automatic mold changing system

Claims (8)

A mold storage unit in which multiple spare molds are placed,
A mold combination disassembling unit arranged in the vicinity of the mold storing unit,
A mold temporary storage unit arranged near the mold combination disassembling unit,
A temporary storage mold pick and place unit that is movably installed above the mold temporary storage unit;
A plurality of processing equipment arranged near the mold temporary storage unit, each of which includes an original processing mold,
A plurality of mold preparation position units, each of which is installed beside one of the processing equipment,
A smart automatic mold change system comprising: a plurality of processing devices and a mold change pick-and-place unit movably installed above the mold preparation position unit. Further comprising a storage mold pick and place unit movably installed above the mold storage unit and the mold combination disassembling unit,
Each of the preliminary molds includes at least a first preliminary mold and a second preliminary mold that are combined with each other,
The spare mold is disassembled into the first spare mold and the second spare mold by the mold combination disassembling unit, and then conveyed to the mold storing unit by the storing mold pick and place unit. The smart automatic mold changing system according to claim 1, which is performed. The first preliminary mold and the second preliminary mold are combined by the mold combination disassembling unit and then conveyed to the mold temporary storage unit by the storage mold pick and place unit. The smart automatic mold changing system described in 2. The mold temporary storage unit includes a plurality of preliminary mold temporary storage area, and a pick and place preparation area, the preliminary mold is placed in the preliminary mold temporary storage area or the pick and place preparation area,
When the spare mold is placed in the pick and place preparation area, the spare mold is transferred from the pick and place preparation area to the mold preparation position unit by the mold exchange pick and place unit. The smart automatic mold changing system according to claim 3. The mold preparation position unit includes a first mold preparation position region and a second mold preparation position region,
The smart mold according to claim 4, wherein the spare mold is conveyed from the pick and place preparation area to the first mold preparation position area in the mold preparation position unit by the mold exchange pick and place unit. Automatic mold changing system. The mold exchanging pick-and-place unit takes out the original processing mold installed in the processing device, places the original processing mold in the second mold preparation position area, and then, The smart automatic mold change system according to claim 5, wherein the mold change pick-and-place unit places the preliminary mold placed in the first mold preparation position area in the processing device. The original processing die placed in the second die preparation position area is conveyed to the pick and place preparation area by the die exchange pick and place unit,
The original processing mold placed in the pick and place preparation area is conveyed to the preliminary mold temporary storage area by the temporary storage mold pick and place unit,
The smart automatic mold change according to claim 5, wherein the original processing mold placed in the temporary mold temporary storage area is conveyed to the mold combination disassembling unit by the storage mold pick and place unit. system. The original processing mold is disassembled into at least a first mold and a second mold by the mold combination disassembling unit, and the first mold and the second mold are disassembled by the storage mold pick and place unit. The smart automatic mold changing system according to claim 7, which is conveyed to the mold storing unit.

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