JP3224896U - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JP3224896U
JP3224896U JP2019004304U JP2019004304U JP3224896U JP 3224896 U JP3224896 U JP 3224896U JP 2019004304 U JP2019004304 U JP 2019004304U JP 2019004304 U JP2019004304 U JP 2019004304U JP 3224896 U JP3224896 U JP 3224896U
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JP
Japan
Prior art keywords
polishing
island
polishing pad
abrasive grains
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019004304U
Other languages
English (en)
Japanese (ja)
Inventor
高木　大輔
大輔 高木
英作 吉永
英作 吉永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bando Chemical Industries Ltd
Original Assignee
Bando Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bando Chemical Industries Ltd filed Critical Bando Chemical Industries Ltd
Priority to JP2019004304U priority Critical patent/JP3224896U/ja
Application granted granted Critical
Publication of JP3224896U publication Critical patent/JP3224896U/ja
Priority to PCT/JP2020/041388 priority patent/WO2021095639A1/ja
Priority to JP2022600108U priority patent/JP3241813U/ja
Priority to CN202090000893.9U priority patent/CN218575955U/zh
Priority to TW109214874U priority patent/TWM609055U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2019004304U 2019-11-13 2019-11-13 研磨パッド Active JP3224896U (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019004304U JP3224896U (ja) 2019-11-13 2019-11-13 研磨パッド
PCT/JP2020/041388 WO2021095639A1 (ja) 2019-11-13 2020-11-05 研磨パッド
JP2022600108U JP3241813U (ja) 2019-11-13 2020-11-05 研磨パッド
CN202090000893.9U CN218575955U (zh) 2019-11-13 2020-11-05 研磨垫
TW109214874U TWM609055U (zh) 2019-11-13 2020-11-11 研磨墊

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019004304U JP3224896U (ja) 2019-11-13 2019-11-13 研磨パッド

Publications (1)

Publication Number Publication Date
JP3224896U true JP3224896U (ja) 2020-01-30

Family

ID=69182811

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019004304U Active JP3224896U (ja) 2019-11-13 2019-11-13 研磨パッド
JP2022600108U Active JP3241813U (ja) 2019-11-13 2020-11-05 研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022600108U Active JP3241813U (ja) 2019-11-13 2020-11-05 研磨パッド

Country Status (4)

Country Link
JP (2) JP3224896U (zh)
CN (1) CN218575955U (zh)
TW (1) TWM609055U (zh)
WO (1) WO2021095639A1 (zh)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6452295B2 (ja) * 2014-03-19 2019-01-16 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス基板の研磨方法
WO2016047535A1 (ja) * 2014-09-26 2016-03-31 バンドー化学株式会社 研磨パッド及び研磨パッドの製造方法
CN108472789B (zh) * 2016-01-08 2020-06-05 阪东化学株式会社 研磨材
KR101928085B1 (ko) * 2016-03-25 2018-12-12 엠.씨.케이(주) 연마체 및 이의 제조 방법
JP6970493B2 (ja) * 2016-09-30 2021-11-24 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに、研磨加工品の製造方法
KR101783406B1 (ko) * 2016-12-07 2017-10-10 엠.씨.케이 (주) 연마 패드 및 이의 제조방법
JP6605761B1 (ja) * 2017-12-19 2019-11-13 バンドー化学株式会社 研磨材
JP2019115966A (ja) * 2017-12-27 2019-07-18 バンドー化学株式会社 研磨材の製造方法及び研磨材

Also Published As

Publication number Publication date
JP3241813U (ja) 2023-05-10
CN218575955U (zh) 2023-03-07
WO2021095639A1 (ja) 2021-05-20
TWM609055U (zh) 2021-03-11

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