JP3223607B2 - How to attach fine particles - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting fine particles, and more particularly, to joining solder balls to connecting pads of a semiconductor element, in which holes for inserting solder balls in the same arrangement as the pads are formed. The present invention relates to a method and an apparatus for supplying and mounting solder balls to a jig.

[0002]

2. Description of the Related Art Conventionally, as a method of supplying and aligning solder balls at predetermined positions, there is Japanese Patent Laid-Open Publication No. Hei 3-225832. It is shown in FIG.

[0003] In this method, a separating section for separating the solder balls of the above-mentioned glass jig into an amount necessary for the solder balls to enter all the holes from a stocker into which solder balls for several hours enter, and an upper surface of the glass jig. A transfer head section having a mechanism that allows close contact and a hopper having a fixed volume, and a collection section having a container connected to a suction means to collect the solder balls remaining in the holes of the glass jig. And means for controlling the compressed air pressure used in each section, and a control system for electrically controlling each operation of each section.

[0004]

The above prior art is disclosed in FIG.
As shown in the figure, the dimensional tolerance between the stocker that stores solder balls for several hours and the push-up shaft that scoops up the amount of solder balls equivalent to one bump is the fitting tolerance without play. When sliding in the up and down direction, there is a disadvantage that the fine particles enter the small gap between the hole and the shaft and the shaft is worn, thereby causing backlash.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method and an apparatus for mounting microparticles which can be securely mounted without any mechanical sliding portion into which microparticles such as solder balls enter.

[0006]

In order to achieve the above-mentioned object, the present invention is directed to a method in which a stocker storing solder balls is blown up by a vacuum suction through a pipe to a mesh-like lid, and air is blown out of the mesh. Without using the escape mechanism,
An amount of solder balls corresponding to one bump is sent into the closed space by the all-air method and mounted on the glass jig, and the remaining solder balls not mounted on the glass jig are collected.

[0007]

As described above, since the present invention does not employ any mechanical mechanism, a solder ball having a small particle diameter enters a part that is precisely finished with a fitting tolerance, causing abrasion of the shaft and other causes of failure. Can be eliminated.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows an outline of an embodiment of the present invention.

The stocker 1 stores solder balls 2 for several hours, and has a straight track 4 for generating a vacuum by sending compressed air from a direction A through a pipe 3. Then, the solder balls 2 stored in the stocker 1 are sucked up, and the solder balls 2 are sprayed on the upper net 5 for a predetermined time by setting a timer.

From the straight track 4 to the solder ball 2
Compressed air blown out together with escapes from the net 5 to the outside, and the remaining solder balls 2 hit the net 5 and fall downward. Near the center of the supply unit shown on the left side of FIG. 1, a fixed quantity cup 6 in which an amount of solder balls 2 corresponding to one bump is inserted is attached. The solder ball 2 hitting the net 5 is connected to the fixed quantity cup 6. It is designed to enter a predetermined amount.

As shown in FIGS. 3 and 4, the solder balls 2 placed in the measuring cup 6 are put into the mounting holes 12 of the glass jig 11, and the glass jigs are mounted so that the solder balls 2 enter. It has a hole 12 and small suction holes 13 provided for sucking the solder balls 2, each of which is provided so as to match the arrangement of the connection pads of the semiconductor element.

Next, the solder ball 2 which has entered the fixed quantity cup 6 shown in FIG. 2 blows compressed air from the direction B, blows the solder ball 2 into the wrapper tube 23, and puts it into the transfer head portion 8. . However, before transferring the solder ball 2 to the transfer head 8 due to the structure of the apparatus, the glass jig 11 is placed on the work die 14 and the transfer head 8 is lowered (the lowering mechanism is omitted), and the glass jig 11 is moved to the work die. 14 and the transfer head unit 8.

The work die 14 has a mounting hole for the glass jig 11.
When solder ball 2 is mounted on 12, suction hole to prevent solder ball 2 from spilling out of mounting hole 12 due to small shock etc.
In order to apply vacuum suction from 13, the side of work die 14 has E
Vacuum suction can be performed in the direction.

Further, since the semiconductor element is a mass-produced product, a large number of glass jigs 11 having the same dimensions are required for forming a large number of bumps. Therefore, in particular, if the thickness t of the glass jig 11 has a variation in dimensions or poor parallelism, etc., when the glass jig 11 is sandwiched between the work die 14 and the transfer head 8, the glass jig 11 And a solder ball 2 inserted from the fixed quantity cup 6 is inserted into the transfer head portion 8.
In order to spread the solder balls 2 over the entire glass jig 11, compressed air is fed from the direction C of the transfer head 8, and the air scatters the solder balls 2 from the closed space 10 of the transfer head 8. Sometimes.

To solve these problems, the transfer head unit 8
Is composed of a convex spherical body 28 and a concave spherical body 29, and the convex spherical body 28 can be freely tilted because it is pulled by a spring 24 in order to make the contact of the spherical surface adhere with a constant force. 11
Even if the thickness dimension varies, the solder ball 2 does not scatter because the convex spherical body 28 follows.

Further, three pipes are connected to the transfer head section 8, and the first pipe is used to transfer the solder balls 2 contained in the above-described quantitative cup 6 to the convex spherical body of the transfer head section 8.
A second pipe 25 for transferring the solder ball 28 into the closed space 10 in the transfer head section 8
Compressed air is introduced from the C direction to disturb the solder ball 2 in the closed space 10 so as to enter all the holes of the glass jig 11.

Third, in order to recover the solder balls 2 which have been excessively supplied into the closed space 10, compressed air is sent into the straight track 4 from the direction D, and the glass is filled in the closed space 10. A stocker-1 which collects excess solder balls 2 scattered on the upper surface of the glass jig 11 without entering the mounting holes 12 of the jig 11 and stores the solder balls 2 for several hours. Return to

A method and an apparatus for automatically mounting the small-diameter solder ball 2 in the mounting hole 12 of the glass jig 11 by repeating the above-described operation.

[0020]

According to the present invention, the following effects can be obtained.

(1) Since the solder ball can be transferred to the mounting hole of the glass jig by all air without using a mechanical mechanism,
It is possible to eliminate the cause of troubles such as abrasion due to a narrow solder ball in a sliding portion in the stocker.

(2) The smaller the diameter of the solder ball is, the more the above-mentioned effect is obtained.

[Brief description of the drawings]

FIG. 1 is a front view showing one embodiment of the present invention.

FIG. 2 is a sectional view showing details of a metering cup.

FIG. 3 is a schematic view showing a glass jig having holes on both sides.

FIG. 4 is a partial cross-sectional view showing a state where a solder ball is mounted on a glass jig.

FIG. 5 is a front view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Stocker, 2 ... Solder ball, 3 ... Piping, 4 ... Straight track, 5 ... Net, 6 ... Metering cup, 7 ... Net, 8 ... Transfer head, 9 ... Spherical seat, 10 ... Closed space, 11 ... Glass treatment Tools, 12 mounting holes, 13 suction holes, 14 work dies, 15 hoppers, 16 containers, 17 supply units, 18 stockers, 19 ball push-up shafts, 20 transfer heads, 21 collection units, 22: vibrator, 23: trumpet tube, 24: spring, 25: transfer piping, 26: recovery piping, 27: disturbing piping, 28: convex spherical body, 29: concave spherical body.

────────────────────────────────────────────────── (5) References JP-A-3-225832 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 B23K 3/06 H05K 3 / 34

Claims (1)

(57) [Claims] 1. A method in which a solder ball is lifted from a stocker storing a large number of solder balls used for forming bumps of a semiconductor element to a mesh-shaped lid by a suction action using a vacuum generator or the like, and compressed air is applied. Escapes from the net, puts the solder balls necessary for one bump formation into a fixed quantity cup, and has a large number of through holes with different diameters on both sides using compressed air. A closed space is formed on a glass jig on which the solder ball can be mounted, the solder ball is supplied with compressed air, and the diameter of the glass jig is reduced by sucking through a small through hole. A method for mounting fine particles, characterized in that a solder ball is suction-mounted in a through hole having a large diameter, and compressed air is sent into the closed space, thereby recovering an excessively supplied solder ball in the closed space.