JP3223527B2 - Transparent conductive composite material - Google Patents

Transparent conductive composite material

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Publication number
JP3223527B2
JP3223527B2 JP17166491A JP17166491A JP3223527B2 JP 3223527 B2 JP3223527 B2 JP 3223527B2 JP 17166491 A JP17166491 A JP 17166491A JP 17166491 A JP17166491 A JP 17166491A JP 3223527 B2 JP3223527 B2 JP 3223527B2
Authority
JP
Japan
Prior art keywords
transparent conductive
composite material
polymer
hydrogenated polymer
conductive composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17166491A
Other languages
Japanese (ja)
Other versions
JPH04370121A (en
Inventor
弘信 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
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Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP17166491A priority Critical patent/JP3223527B2/en
Publication of JPH04370121A publication Critical patent/JPH04370121A/en
Application granted granted Critical
Publication of JP3223527B2 publication Critical patent/JP3223527B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、透明導電体や高周波回
路基板に好適に用いられる導電性複合材料に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive composite material suitably used for a transparent conductor or a high-frequency circuit board.

【0002】[0002]

【従来の技術】従来、透明電極や抵抗発熱体等に使用さ
れてきた透明導電性材料は、ガラス上に金属酸化物から
なる透明導電性膜を形成したものであったが、近年、加
工性、軽量性、生産性に優れ、さらに大面積化も可能な
ため、ガラスのかわりに高分子材料を使用したものが検
討されている。
2. Description of the Related Art Conventionally, a transparent conductive material used for a transparent electrode, a resistance heating element, or the like has been formed by forming a transparent conductive film made of a metal oxide on glass. Because of its excellent light weight, productivity, and the possibility of increasing the area, the use of a polymer material instead of glass is being studied.

【0003】[0003]

【発明が解決しようとする課題】現在、ガラスの代わり
となる高分子材料としては、ポリエステル、フッ素樹
脂、エポキシ樹脂、ポリイミド、ポリプロピレン、脂環
式ポリオレフィンなどが提案されている。しかしこれら
の高分子材料は加工性、軽量性などには優れるものの、
透明導電性材料として必要な耐酸性、耐アルカリ性、耐
熱性、透明導電性膜との密着性の全てを満足するもので
はなかった。
At present, polyester, fluororesin, epoxy resin, polyimide, polypropylene, alicyclic polyolefin and the like have been proposed as polymer materials which can substitute for glass. However, although these polymer materials are excellent in workability, lightness, etc.,
It did not satisfy all of the acid resistance, alkali resistance, heat resistance, and adhesion to the transparent conductive film required for the transparent conductive material.

【0004】本発明は、前記従来技術の課題を背景にな
されたもので、耐吸収性、耐アルカリ性、耐熱性および
高分子材料と透明導電性膜との密着性が良好な透明導電
性複合材料を提供することを目的とする。
The present invention has been made in view of the above-mentioned problems of the prior art, and is a transparent conductive composite material having good absorption resistance, alkali resistance, heat resistance and adhesion between a polymer material and a transparent conductive film. The purpose is to provide.

【0005】[0005]

【課題を解決するための手段】本発明は、下記式(I)
で表わされる少なくとも一種のノルボルネン誘導体より
なる単量体もしくはこの単量体およびこれと共重合可能
な共重合単量体を開環重合して得られる重合体をさらに
水素添加して得られる水素添加重合体の成形体の表面
に、透明導電性膜を形成して成り、かつ当該水素添加重
合体中に含まれるゲル含有量が5重量%以下であること
を特徴とする透明導電性複合材料を提供するものであ
る。
According to the present invention, there is provided the following formula (I):
Hydrogenation obtained by further hydrogenating a monomer comprising at least one norbornene derivative represented by or a polymer obtained by ring-opening polymerization of this monomer and a copolymerizable monomer copolymerizable therewith. A transparent conductive film is formed on the surface of a polymer molded body, and the hydrogenated
An object of the present invention is to provide a transparent conductive composite material, wherein the content of the gel contained in the union is 5% by weight or less .

【化2】 (式中、AおよびBは水素原子または炭素数1〜10の
炭化水素基であり、XおよびYは水素原子または一価の
有機基であって、XおよびYの少なくとも一つは、
(CH 2 n COOR 1 で表されるカルボン酸エステル基
を示し、ここで、R 1 は炭素数1〜20の炭化水素基、
nは0または1の整数である。)本発明において使用さ
れる水添重合体としては、例えば特開平1−24051
7号公報、特公昭57−8815号公報に記載されてい
る熱可塑性樹脂などを挙げることができる。
Embedded image (Wherein, A and B is a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, X and Y is a hydrogen atom or a monovalent organic group, at least one of X and Y, -
Carboxylic ester group represented by (CH 2 ) n COOR 1
Wherein R 1 is a hydrocarbon group having 1 to 20 carbon atoms,
n is an integer of 0 or 1. ) Examples of the hydrogenated polymer used in the present invention include, for example, JP-A-1-24051.
No. 7, JP-B-57-8815, and the like.

【0006】上記式(I)で表されるテトラシクロドデ
セン誘導体において、XおよびYのうちに極性基を含む
ことが透明導電性膜との密着性の点から必要である。
こで、この極性基は、−(CH 2 n COOR 1 で表され
るカルボン酸エステル基であり、これにより得られる水
添重合体が高いガラス転移温度を有するものとなる。
に、このカルボン酸エステル基よりなる極性置換基は、
式(I)のテトラシクロドデセン誘導体の1分子あたり
に1個含有されることが、得られる水添重合体の高い耐
熱性を保持したまま、吸湿性を低くできる点で好まし
い。
In the tetracyclododecene derivative represented by the above formula (I), it is necessary that X and Y contain a polar group from the viewpoint of adhesion to the transparent conductive film. This
Here, this polar group is represented by — (CH 2 ) n COOR 1.
Carboxylic acid ester group, and the water
The addition polymer has a high glass transition temperature. In particular, the polar substituent consisting of this carboxylic acid ester group,
It is preferable that one tetracyclododecene derivative of the formula (I) be contained per molecule, since the resulting hydrogenated polymer can have low hygroscopicity while maintaining high heat resistance.

【0007】また、−(CH2nCOOR1で表される
カルボン酸エステル基のうち、nの値が小さいものほ
ど、得られる水添重合体のガラス転移温度がさらに高く
なるので好ましい。前記式(I)において、R1は炭素
数1〜20の炭化水素基であるが、炭素数が多くなるほ
ど得られる水添重合体の吸湿性が小さくなる点では好ま
しいが、得られる水添重合体のガラス転移温度とのバラ
ンスの点から、炭素数1〜4の鎖状アルキル基または炭
素数5以上の(多)環状アルキル基であることが好まし
く、特にメチル基、エチル基、シクロヘキシル基である
ことが好ましい。
Further, among the carboxylic acid ester groups represented by — (CH 2 ) n COOR 1 , the smaller the value of n, the higher the glass transition temperature of the obtained hydrogenated polymer, which is preferable. In the above formula (I), R 1 is a hydrocarbon group having 1 to 20 carbon atoms, and it is preferable that the number of carbon atoms increases as the hygroscopicity of the obtained hydrogenated polymer decreases. From the viewpoint of the balance with the glass transition temperature of the union, a chain alkyl group having 1 to 4 carbon atoms or a (poly) cyclic alkyl group having 5 or more carbon atoms is preferable, and a methyl group, an ethyl group, and a cyclohexyl group are particularly preferable. Preferably, there is.

【0008】さらに、カルボン酸エステル基が結合した
炭素原子に、同時に炭素数1〜10の炭化水素基が置換
基として結合されている式(I)のテトラシクロドデセ
ン誘導体は、得られる水添重合体のガラス転移温度を低
下させずに、吸湿性を低下させるので好ましい。特に、
この置換基がメチル基またはエチル基である一般式
(I)のテトラシクロドデセン誘導体は、その合成が容
易な点で好ましい。これらのテトラシクロドデセン誘導
体、あるいはこれと共重合可能な不飽和環状化合物の混
合物は、例えば特開平4−77520号公報第4頁右上
欄第12行〜第6頁右下欄第6行に記載された方法によ
って、メタセシス重合、水素添加され、本発明に使用さ
れる水添重合体とすることができる。
Further, the tetracyclododecene derivative of the formula (I) wherein a hydrocarbon group having 1 to 10 carbon atoms is simultaneously bonded as a substituent to the carbon atom to which the carboxylate group is bonded, is obtained by hydrogenation. It is preferable because the hygroscopicity is reduced without lowering the glass transition temperature of the polymer. In particular,
The tetracyclododecene derivative of the general formula (I) in which the substituent is a methyl group or an ethyl group is preferable in that the synthesis is easy. These tetracyclododecene derivatives or a mixture of an unsaturated cyclic compound copolymerizable therewith are disclosed , for example, in JP-A-4-77520, page 4, upper right.
The hydrogenation polymer used in the present invention can be obtained by metathesis polymerization and hydrogenation by the method described in column 12, line 12 to page 6, lower right column, line 6 .

【0009】本発明において、水添重合体は、クロロホ
ルム中、30℃で測定される固有粘度
(〔η〕_i_n_h_ )が、0.3〜1.5dl/gの範囲で
あることが好ましい。また、本発明において、水添重合
体は、充分な強度を得るために、重量平均分子量は通
常、5000〜100万、好ましくは8000〜20万
である。また、水添重合体の水素添加率は、60MH
z、1H−NMRで測定した値が50%以上、好ましく
は90%以上、さらに好ましくは98%以上である。水
素添加率が高いほど、熱や光に対する安定性が優れたも
のとなる。本発明において使用される水添重合体は、該
水添重合体中に含まれるゲル含有量が5重量%以下であ
り、好ましくは1重量%以下である。本発明において使
用される水添重合体には、必要に応じて他の熱可塑性樹
脂を配合することもできる。
In the present invention, the hydrogenated polymer preferably has an intrinsic viscosity ([η] _i_n_h_ ) measured at 30 ° C. in chloroform in the range of 0.3 to 1.5 dl / g. In the present invention, the weight average molecular weight of the hydrogenated polymer is usually 5,000 to 1,000,000, preferably 8,000 to 200,000 in order to obtain sufficient strength. The hydrogenation rate of the hydrogenated polymer is 60 MH.
The value measured by z, 1 H-NMR is 50% or more, preferably 90% or more, and more preferably 98% or more. The higher the hydrogenation rate, the better the stability to heat and light. The hydrogenated polymer used in the present invention is
And a gel containing organic content in the hydrogenated during coalescence 5 wt%, preferably not more than 1 wt%. The hydrogenated polymer used in the present invention may optionally contain other thermoplastic resins.

【0010】上記水添重合体には、安定剤、酸化防止
剤、滑剤、帯電防止剤、紫外線吸収剤、蛍光増白剤、可
塑剤、離型剤などの添加剤や、石英ファイバー、ガラス
ファイバー、芳香族ポリアミド繊維、高強度高弾性ポリ
エチレン繊維などの補強材を配合することもできる。
発透明導電性複合材料は上記の特定の水素添加重合体を
押出、射出、圧縮、湿式キャストなどの公知の方法によ
って成形した成形体(以下単に成形体という)上に、透
明導電性膜を形成したものである。本発明において、こ
の成形体の形状は用途によって選択すればよいが、透明
電極や抵抗発熱体に使用する場合には、通常、厚さ0.
01〜10mmのシートまたはフィルム状に成形され
る。
The above-mentioned hydrogenated polymer includes additives such as a stabilizer, an antioxidant, a lubricant, an antistatic agent, an ultraviolet absorber, a fluorescent brightener, a plasticizer, a mold release agent, a quartz fiber and a glass fiber. A reinforcing material such as an aromatic polyamide fiber or a high-strength high-elasticity polyethylene fiber can also be blended . The transparent conductive composite material of the present invention is obtained by forming a transparent conductive film on a molded product (hereinafter simply referred to as a molded product) obtained by molding the above-mentioned specific hydrogenated polymer by a known method such as extrusion, injection, compression, or wet casting. It is formed. In the present invention, the shape of the molded body may be selected depending on the application. However, when the molded body is used for a transparent electrode or a resistance heating element, the molded body usually has a thickness of about 0.1 mm.
It is formed into a sheet or film of 01 to 10 mm.

【0011】本発明において、成形体は透明導電性膜と
の密着性に優れるので特に必要ではないが、成形体と透
明導電性膜との間に接着層を形成してもよい。この接着
層としては、エポキシ樹脂、ポリイミド、ポリブタジエ
ン、フェノール樹脂、ポリエーテルエーテルケトンなど
の耐熱樹脂を例示することができる。本発明において透
明導電性膜としては、ポリアセチレン、ポリピロール、
ポリピリジン、ポリアニリン、ポリパラフェニレン、ポ
リフェニレンビニレン、ポリチオフェン、ポリペリナフ
タレン、ポリアクリロニトリル、ポリビニルベンジルト
リメチルアンモニウムクロライド、オリゴ(ポリ)スチ
レンスルホン酸などの有機化合物や、銅、アルミニウ
ム、ニッケル、金、銀などの金属または金属化合物、
ンジウム−スズ酸化物、スズ−アンチモン酸化物、スズ
−鉄酸化物、酸化カドミウム、カドミウム−スズ酸化
物、酸化チタン、酸化ジルコニウム、ヨウ化銅などの半
導体、有機または無機の錯体化合物等などを挙げること
ができる。これらの透明導電性膜は、シート、フィルム
などに成形した後、成形体に接着したり、プラズマ重合
法、スパッタリング法、真空蒸着法、メッキ、イオンプ
レーティング法、スプレー法、電解析出法などによって
成形体上に形成される。これらの透明銅電性膜の厚さ
は、通常、10〜10000オングストローム、好まし
くは50〜5000オングストロームであり、透明導電
性膜の比抵抗は100オームcm以下であることが好ま
しい。本発明の透明導電性複合材料の光透過率は、40
0〜800nmの光を用いた場合で、通常、80%以上
である。
In the present invention, the molded article is not particularly required since it has excellent adhesion to the transparent conductive film, but an adhesive layer may be formed between the molded article and the transparent conductive film. Examples of the adhesive layer include heat-resistant resins such as epoxy resin, polyimide, polybutadiene, phenol resin, and polyetheretherketone. In the present invention, as the transparent conductive film, polyacetylene, polypyrrole,
Organic compounds such as polypyridine, polyaniline, polyparaphenylene, polyphenylenevinylene, polythiophene, polyperinaphthalene, polyacrylonitrile, polyvinylbenzyltrimethylammonium chloride, oligo (poly) styrenesulfonic acid, and copper, aluminum, nickel, gold, silver, etc. metal or metal compound, b
Semiconductors such as n-tin oxide, tin-antimony oxide, tin-iron oxide, cadmium oxide, cadmium-tin oxide, titanium oxide, zirconium oxide, and copper iodide, and organic or inorganic complex compounds and the like. be able to. After forming these transparent conductive films into sheets, films, etc., they are adhered to the formed bodies, plasma polymerization, sputtering, vacuum deposition, plating, ion plating, spraying, electrolytic deposition, etc. Formed on the molded body. The thickness of these transparent copper conductive films is usually 10 to 10000 angstroms, preferably 50 to 5000 angstroms, and the specific resistance of the transparent conductive films is preferably 100 ohm cm or less. The light transmittance of the transparent conductive composite material of the present invention is 40
When light of 0 to 800 nm is used, it is usually 80% or more.

【0012】本発明の透明導電性複合材料は液晶表示素
子、エレクトロルミネッセンス表示素子、電気泳動表示
などの各種表示素子、自動車・航空機などの防曇用窓ガ
ラスに用いる抵抗発熱体、サーモプラスチックレコーデ
ィング、強誘電体メモリーなどの光メモリー、透明タブ
レットなどの端末機器、光電変換素子、熱線反射用途、
TVブラウン管、メーター、クリーンルームなどの窓や
床などに好適に使用することができる。
The transparent conductive composite material of the present invention can be used for various display devices such as a liquid crystal display device, an electroluminescence display device, and an electrophoretic display, a resistance heating element used for an anti-fog window glass of an automobile or an aircraft, a thermoplastic recording, Optical memory such as ferroelectric memory, terminal equipment such as transparent tablet, photoelectric conversion element, heat ray reflection application,
It can be suitably used for windows and floors of TV cathode ray tubes, meters, clean rooms, and the like.

【0013】[0013]

【実施例】以下、実施例を挙げて本発明をさらに具体的
に説明するが、本発明は以下の実施例に限定されるもの
ではない。なお、実施例中、部および%は、特に断らな
いかぎり重量基準である。また、実施例中の各種の測定
は、次のとおりである。
EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to the following examples. In the examples, parts and% are based on weight unless otherwise specified. Various measurements in the examples are as follows.

【0014】参考例1 8−メチル−8−メトキシカルボニルテトラシクロ
〔4.4.0.12, 5 .17, 10〕ドデカ−3−エン1
00g、1,2−ジメトキシエタン60g、シクロヘキ
サン240g、1−ヘキセン25g、およびジエチルア
ルミニウムクロライド0.96モル/lのトルエン溶液
3.4mlを、内容積1リットルのオートクレーブに加
えた。一方、別のフラスコに、六塩化タングステンの
0.05モル/lの1,2−ジメトキシエタン溶液20
mlとパラアルデヒドの0.1モル/lの1,2−ジメ
トキシエタン溶液10mlを混合した。この混合溶液
4.9mlを、前記オートクレーブ中の混合物に添加し
た。密栓後、混合物を80℃に加熱して3時間撹拌を行
った。得られた重合体溶液に、1,2−ジメトキシエタ
ンとシクロヘキサンの2/8(重量比)の混合溶媒を加
えて重合体/溶媒が1/10(重量比)にしたのち、ト
リエタノールアミン20gを加えて10分間撹拌した。
[0014] Reference Example 1 8-methyl-8-methoxycarbonyltetracyclo [4.4.0.1 2, 5. 1 7, 10 ] dodeca-3-ene 1
00 g, 60 g of 1,2-dimethoxyethane, 240 g of cyclohexane, 25 g of 1-hexene, and 3.4 ml of a toluene solution of 0.96 mol / l of diethylaluminum chloride were added to a 1-liter autoclave. On the other hand, in another flask, a 0.05 mol / l solution of tungsten hexachloride in 1,2-dimethoxyethane 20 was added.
ml and 10 ml of a 0.1 mol / l 1,2-dimethoxyethane solution of paraaldehyde were mixed. 4.9 ml of this mixed solution was added to the mixture in the autoclave. After sealing, the mixture was heated to 80 ° C. and stirred for 3 hours. To the obtained polymer solution, a mixed solvent of 2/8 (weight ratio) of 1,2-dimethoxyethane and cyclohexane was added to make the polymer / solvent 1/10 (weight ratio), and then 20 g of triethanolamine was added. Was added and stirred for 10 minutes.

【0015】この重合溶液に、メタノール500gを加
えて30分間撹拌して静置した。2層に分離した上層を
除き、再びメタノールを加えて撹拌、静置後、上層を除
いた。同様の操作をさらに2回行い、得られた下層をシ
クロヘキサン、1,2−ジメトキシエタンで適宜希釈
し、重合体濃度が10%のシクロヘキサン−1,2−ジ
メトキシエタン溶液を得た。この溶液に20gのパラジ
ウム/シリカマグネシア〔日揮化学(株)製、パラジウ
ム量=5%〕を加えて、オートクレーブ中で水素圧40
kg/cm2 として165℃で4時間反応させたのち、水添
触媒をろ過によって取り除き、水添重合体溶液を得た。
また、この水添重合体溶液に、酸化防止剤であるペンタ
エリスリチル−テトラキス〔3−(3,5−ジ−t−ブ
チル−4−ヒドロキシフェニル)プロピオネート〕を、
水添重合体に対して0.1%加えてから、380℃で減
圧下に脱溶媒を行った。次いで、溶融した樹脂を、チッ
素雰囲気下で押し出し機によりペレット化し、固有粘度
0.5dl/g(30℃、クロロホルム中)、水添率9
9.5%、ガラス転移温度168℃の水添重合体を得
た。
To this polymerization solution, 500 g of methanol was added, stirred for 30 minutes and allowed to stand. The upper layer separated into two layers was removed, methanol was added again, and the mixture was stirred and allowed to stand, and then the upper layer was removed. The same operation was further performed twice, and the obtained lower layer was appropriately diluted with cyclohexane and 1,2-dimethoxyethane to obtain a cyclohexane-1,2-dimethoxyethane solution having a polymer concentration of 10%. 20 g of palladium / silica magnesia (manufactured by Nikki Chemical Co., Ltd., palladium amount = 5%) was added to this solution, and hydrogen pressure was set to 40 in an autoclave.
After the reaction at 165 ° C. for 4 hours at kg / cm 2 , the hydrogenation catalyst was removed by filtration to obtain a hydrogenated polymer solution.
Further, pentaerythrityl-tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] as an antioxidant was added to this hydrogenated polymer solution.
After 0.1% was added to the hydrogenated polymer, the solvent was removed at 380 ° C under reduced pressure. Next, the molten resin was pelletized by an extruder under a nitrogen atmosphere, and an intrinsic viscosity of 0.5 dl / g (30 ° C. in chloroform) and a hydrogenation rate of 9 were obtained.
A hydrogenated polymer having 9.5% and a glass transition temperature of 168 ° C. was obtained.

【0016】参考例2 6−エチリデン−2−テトラシクロドデセンを、参考例
1と同様にメタセシス開環重合したのち、水添し、ペレ
ット化して、固有粘度0.56dl/g(30℃、クロロ
ホルム中)、水添率99%、ガラス転移温度140℃の
熱可塑性樹脂を得た。
Reference Example 2 6-ethylidene-2-tetracyclododecene was subjected to metathesis ring-opening polymerization in the same manner as in Reference Example 1, then hydrogenated, pelletized, and had an intrinsic viscosity of 0.56 dl / g (30 ° C., A thermoplastic resin having a degree of hydrogenation of 99% and a glass transition temperature of 140 ° C. was obtained.

【0017】参考例3 エチレン55モル%と2−メチル−1,4,5,8−ジ
ヒドロナフタレン45モル%とを付加重合し、ペレット
化して、固有粘度0.64dl/g(35℃、デカリン
中)、ガラス転移温度140℃の熱可塑性樹脂を得た。
Reference Example 3 55 mol% of ethylene and 45 mol% of 2-methyl-1,4,5,8-dihydronaphthalene were subjected to addition polymerization and pelletized, and the intrinsic viscosity was 0.64 dl / g (decalin at 35 ° C.). Medium), a thermoplastic resin having a glass transition temperature of 140 ° C. was obtained.

【0018】実施例1 参考例1で得られた水添重合体のペレットを原料として
縦200mm、横200mm、厚さ0.1mmのシート
を成形した。得られたシート上にスパッター機(中外炉
工業)を用いて以下の条件でインジウム−スズ酸化物
(ITO)膜を形成した。 電源 MHzの高周波電源 基板温度 70℃ ターゲット In23/SnO2=90/10(重量比)の合金 雰囲気 アルゴンガス流入下 スパッター速度 270オングストローム/分 スパッター圧力 10-2Torr 得られたITO膜の厚さは2500オングストローム、
比抵抗は1.5×10-3オームcmであり、透明導電性
複合材料の400〜800nmにおける光透過率は84
%であった。得られた透明導電性複合材料の水添重合体
とITO膜との密着性についてJIS K−5400
(8.5.2盤番目試験)により試験したところ、全く
剥離は認められなかった。さらに得られた透明導電性複
合材料を温度90℃、湿度95%の条件下に一週間保持
した後の導電特性および外観には全く変化が認められな
かった。
Example 1 A sheet having a length of 200 mm, a width of 200 mm and a thickness of 0.1 mm was formed from the hydrogenated polymer pellets obtained in Reference Example 1 as a raw material. An indium-tin oxide (ITO) film was formed on the obtained sheet under the following conditions using a sputter machine (Chugai Furnace Industry). Power supply High frequency power supply of MHz Substrate temperature 70 ° C Target In 2 O 3 / SnO 2 = 90/10 (weight ratio) Alloy Atmosphere Under argon gas flow Sputter speed 270 Å / min Sputter pressure 10 -2 Torr The thickness is 2500 angstroms,
The specific resistance is 1.5 × 10 −3 ohm cm, and the light transmittance of the transparent conductive composite material at 400 to 800 nm is 84.
%Met. Regarding the adhesion between the hydrogenated polymer of the obtained transparent conductive composite material and the ITO film, JIS K-5400
As a result of the test according to (8.5.2 panel test), no peeling was observed. Furthermore, after the obtained transparent conductive composite material was kept at a temperature of 90 ° C. and a humidity of 95% for one week, no change was observed in the conductive characteristics and appearance.

【0019】比較例1 水添重合体として、参考例2で得られた熱可塑性樹脂を
用いた以外は、実施例1と同様にして、ITO膜の厚さ
2800オングストローム、比抵抗2×10-3オームc
m、透明導電性複合材料の400〜800nmにおける
光透過率79%の透明導電性複合材料を製造した。得ら
れた透明導電性複合材料の水添重合体とITO膜との密
着性を実施例1と同様にして試験したところ、30%が
剥離した。
[0019] Comparative Example 1 hydrogenated polymer, except for using a thermoplastic resin obtained in Reference Example 2, in the same manner as in Example 1, the thickness of 2800 Å ITO film, resistivity 2 × 10 - 3 ohm c
m, a transparent conductive composite material having a light transmittance of 79% at 400 to 800 nm of the transparent conductive composite material was manufactured. When the adhesion between the hydrogenated polymer and the ITO film of the obtained transparent conductive composite material was tested in the same manner as in Example 1, 30% was peeled off.

【0020】比較例2 水添重合体のかわりに参考例3で得られた重合体を用い
た以外は、実施例1と同様にして、ITO膜の厚さ25
00オングストローム、比抵抗1×10-2オームcm、
透明導電性複合材料の400〜800nmにおける光透
過率76%の透明複合材料を製造した。得られた透明導
電性複合材料の重合体とITO膜の密着性を実施例1と
同様にして試験したところ、28%が剥離した。
Comparative Example 2 An ITO film having a thickness of 25 was obtained in the same manner as in Example 1 except that the polymer obtained in Reference Example 3 was used instead of the hydrogenated polymer.
00 Å, specific resistance 1 × 10 -2 ohm cm,
A transparent composite material having a light transmittance of 76% at 400 to 800 nm of the transparent conductive composite material was manufactured. When the adhesion between the polymer of the obtained transparent conductive composite material and the ITO film was tested in the same manner as in Example 1, 28% was peeled off.

【0021】[0021]

【発明の効果】本発明の透明導電性複合材料は、耐熱性
に優れ、基板である水添重合体と透明導電性膜の密着性
が優れている。本発明の透明導電性複合材料は、ディス
プレー用透明タッチパネ ル、電卓用透明キー、車窓用
熱線遮断フィルム、防曇ミラー用テラロスター、冷凍シ
ョーケース用テラロスター、静電防止用包装袋、面発光
パネルなど各種の用途に好適に用いることができる。
The transparent conductive composite material of the present invention has excellent heat resistance and excellent adhesion between the hydrogenated polymer as the substrate and the transparent conductive film. The transparent conductive composite material of the present invention includes a transparent touch panel for a display, a transparent key for a calculator, a heat ray shielding film for a car window, a terraroster for an anti-fog mirror, a terraroster for a frozen showcase, an antistatic packaging bag, a surface emitting panel, and the like. It can be suitably used for various applications.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI B32B 27/06 B32B 27/06 C08F 8/04 C08F 8/04 32/08 32/08 C08G 61/06 C08G 61/06 ────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 7 Identification code FI B32B 27/06 B32B 27/06 C08F 8/04 C08F 8/04 32/08 32/08 C08G 61/06 C08G 61/06

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 下記式(I)で表わされる少なくとも一
種のノルボルネン誘導体よりなる単量体もしくはこの単
量体およびこれと共重合可能な共重合単量体を開環重合
して得られる重合体をさらに水素添加して得られる水素
添加重合体の成形体の表面に、透明導電性膜を形成して
成り、かつ当該水素添加重合体中に含まれるゲル含有量
が5重量%以下であることを特徴とする透明導電性複合
材料。 【化1】 (式中、AおよびBは水素原子または炭素数1〜10の
炭化水素基であり、XおよびYは水素原子または一価の
有機基であって、XおよびYの少なくとも一つは、
(CH 2 n COOR 1 で表されるカルボン酸エステル基
を示し、ここで、R 1 は炭素数1〜20の炭化水素基、
nは0または1の整数である。
1. A polymer obtained by ring-opening polymerization of a monomer comprising at least one kind of norbornene derivative represented by the following formula (I) or a copolymerizable monomer thereof. Is formed by forming a transparent conductive film on the surface of a molded article of a hydrogenated polymer obtained by further hydrogenating, and the gel content contained in the hydrogenated polymer.
Is 5% by weight or less . Embedded image (Wherein, A and B is a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, X and Y is a hydrogen atom or a monovalent organic group, at least one of X and Y, -
Carboxylic ester group represented by (CH 2 ) n COOR 1
Wherein R 1 is a hydrocarbon group having 1 to 20 carbon atoms,
n is an integer of 0 or 1. )
JP17166491A 1991-06-17 1991-06-17 Transparent conductive composite material Expired - Lifetime JP3223527B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17166491A JP3223527B2 (en) 1991-06-17 1991-06-17 Transparent conductive composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17166491A JP3223527B2 (en) 1991-06-17 1991-06-17 Transparent conductive composite material

Publications (2)

Publication Number Publication Date
JPH04370121A JPH04370121A (en) 1992-12-22
JP3223527B2 true JP3223527B2 (en) 2001-10-29

Family

ID=15927414

Family Applications (1)

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Country Status (1)

Country Link
JP (1) JP3223527B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08142263A (en) * 1994-11-14 1996-06-04 Mitsui Petrochem Ind Ltd Metal/cyclic olefinic resin laminate and production thereof
JPH08156200A (en) * 1994-12-12 1996-06-18 Nippon Zeon Co Ltd Thermoplastic norbornene resin molded product
JP3952560B2 (en) * 1997-10-31 2007-08-01 日本ゼオン株式会社 Composite film
JP2001354755A (en) * 2000-06-13 2001-12-25 Jsr Corp Resin film and its production process
JP4514392B2 (en) * 2002-02-26 2010-07-28 日東電工株式会社 Method for producing protective film for polarizing plate
JP2003300268A (en) * 2002-04-09 2003-10-21 Jsr Corp Laminated film
JP5213266B2 (en) * 2009-10-15 2013-06-19 日東電工株式会社 Protective film for polarizing plate, method for producing the same, and polarizing plate

Also Published As

Publication number Publication date
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